JP4093067B2 - Manufacturing method of ceramic multilayer substrate - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a method for manufacturing a ceramic multilayer substrate, and more particularly, to a method for efficiently manufacturing a ceramic multilayer substrate by a non-shrinking method without impairing the characteristics of the elements included in the substrate or the appearance of the substrate.
[0002]
[Prior art]
  As a manufacturing method of the ceramic multilayer substrate, as shown in FIGS. 7A and 7B, a green sheet laminate 101 in which ceramic green sheets are laminated is made of the same material or at the same ratio as the green sheet laminate 101 at the time of firing. There has been proposed a method of firing in a state of being held between first and second firing jigs (setters) 103a and 103b through a support (spacer) 102 made of a shrinking material (for example, Patent Document 1). reference).
[0003]
[Patent Document 1]
          Japanese Patent Laid-Open No. 10-242645
[0004]
  According to the method of this patent document 1, the height of the support (spacer) 102 is set to the height of the green sheet laminate according to the allowable value of the warp standard of the ceramic multilayer substrate 101a (green sheet laminate 101 after firing) as a product. By making the thickness greater than 101, the shrinkage rate in the firing step of the green sheet laminate 101 and the support (spacer) 102 becomes the same. Therefore, as shown in FIG. The gap G between the firing jigs (setters) 103a and 103b and the green sheet laminate 101 does not become particularly large, and the warp of the obtained ceramic multilayer substrate 101a can be suppressed within the standard. Further, the green sheet laminate 101 has a feature that problems such as deformation and cracking are less likely to occur compared to pressure firing because no force other than the reaction of the warping force is applied.
[0005]
[Problems to be solved by the invention]
  However, in the method of Patent Document 1, the support (spacer) 102 is the same as or larger than the thickness of the green sheet laminate 101 and has the same material or the same firing shrinkage characteristics as the green sheet laminate 101. Since it is necessary to use it, it is necessary to separately prepare a support (spacer) 102 separately from the green sheet laminated body 101 to be a product, resulting in a problem that production efficiency is reduced and manufacturing cost is increased. is there.
[0006]
  Further, when the first and second firing jigs (setters) 103a and 103b are not air permeable, the degreasing property is deteriorated, and a resistance element and a capacitance element disposed on the ceramic multilayer substrate are used. If firing is performed in a state in which the (not shown) is close to the setter, there is a problem that variation in characteristic values becomes large and a desired characteristic value cannot be obtained.
[0007]
  The present invention solves the above-mentioned problems, and does not require the production of a separate spacer, and it is reliable without impairing the characteristics of the mounted elements and the appearance of the product by a non-shrinkage construction method. An object of the present invention is to provide a method for producing a ceramic multilayer substrate capable of efficiently producing a highly functional ceramic multilayer substrate.
[0008]
[Means for Solving the Problems]
  In order to achieve the above object, a method for producing a ceramic multilayer substrate according to the present invention (Claim 1) includes:
  (a) forming a green substrate having a multilayer structure including at least one of a conductor, a resistor, and a dielectric;
  (b) forming a laminate by disposing a shrinkage suppression layer made of a material that does not sinter at the temperature when firing the unfired substrate on both upper and lower surfaces of the unfired substrate;
  (c) cutting the outer peripheral side unnecessary portion of the laminate to form a molded laminate of a predetermined shape;
  (d) The unnecessary portion (cut laminate) of the outer periphery of the laminate cut in the step (c) is used as a spacer, and between the lower setter made of a porous material and the upper setter made of a porous material. A step of holding the molded laminate through the spacer;
  (e) firing the molded laminate together with the lower setter, the upper setter, and the spacer in the state of (d);
  WithWith
Each of the outer peripheral side unnecessary portion used as the spacer and the molded laminated body is obtained by crimping the laminated body and then cutting the outer peripheral side unnecessary portion, and
The planar area of the outer peripheral side unnecessary portion used as the spacer is smaller than the planar area of the molded laminate.It is characterized by that.
[0009]
  In the method for producing a ceramic multilayer substrate according to claim 1 of the present invention, an unnecessary portion on the outer peripheral side of a laminate in which a shrinkage suppression layer is provided on both upper and lower surfaces of an unfired substrate is cut to form a molded laminate having a predetermined shape. The molded laminate is held between the lower setter and the upper setter made of a porous material via an outer peripheral side unnecessary portion (cut laminate) as a spacer, and the molded laminate is fired in that state. Therefore, it is possible to efficiently manufacture a ceramic multilayer substrate having a small appearance and a good appearance shape without requiring a separate spacer.
Furthermore, by cutting the laminated body after the pressure bonding, the laminated body is divided into a molded laminated body and an outer peripheral side unnecessary portion (cut laminated body), and as a spacer, the planar area is larger than the planar area of the molded laminated body Since the small unnecessary part on the outer peripheral side is used, the upper setter and the molded laminate in the initial state where the molded laminate is held via the spacer (cut laminate) between the lower setter and the upper setter. There is no gap between the two, but they are in close contact with each other, but because of the difference in the shrinkage characteristics in the firing process due to the difference in the shape of the spacer and the molded laminate, there is a gap between the upper setter and the molded laminate in the firing process. Can be generated.
That is, the unnecessary portion on the outer peripheral side serving as a spacer usually has a smaller area (planar area) on the front and back surfaces than the molded laminate, and by using the unnecessary portion on the outer peripheral side as a spacer, the planar area is smaller than the molded laminate. The ratio of the spacer (unnecessary portion on the outer peripheral side) sandwiched between the shrinkage suppression layers in the thickness direction of the spacer (unnecessary portion on the outer peripheral side) is greatly reduced in the plane direction compared to the molded laminate. Can be made smaller than the molded laminate, and a gap can be formed between the upper setter and the molded laminate in the firing step.
Therefore, it is possible to suppress and prevent the load from being applied to the molded laminate in the firing step, and to manufacture a ceramic multilayer substrate having a desired characteristic value.
  Also,Since the outer peripheral side unnecessary part (cut laminated body) generated when the outer peripheral side of the laminate is cut and the molded laminate is formed is used as a spacer, it is arranged between the lower setter and the upper setter. It is possible to produce a spacer, which is preferably made of a material having the same thickness as or larger than the thickness of the molded laminate, and having the same or very close firing shrinkage characteristics as the molded laminate, in a separate step. It becomes unnecessary, and it becomes possible to manufacture a ceramic multilayer substrate efficiently.
  In addition, since the shrinkage suppression layers are provided on the upper and lower surfaces of the laminate, it is possible to suppress shrinkage in the firing process, and the lower setter and the upper setter are formed on the ceramic substrate and its surface. Since there is no direct contact with the conductor or the like, the reaction with the constituent materials of the lower setter and the upper setter does not become a problem, and the degree of freedom in selecting the material of the setter can be improved.
  In addition, since a setter made of a porous material is used as the lower setter and the upper setter, a ceramic multilayer substrate having good degreasing properties, small variation in characteristic values of mounted elements, and a desired characteristic value is provided. It becomes possible to obtain.
[0010]
  In the present invention, as a setter made of a porous material, a porous ceramic produced by impregnating a ceramic with a porous organic material having continuous pores represented by foamed urethane, etc., and alumina powder After adding organic matter, plastic structure is formed into a molded body with multiple through-holes, then dried and sintered, honeycomb structure manufactured by punching out ceramic sheets or forming plastic dough It is possible to use a material manufactured by a method of mechanically forming a simple hole. Furthermore, it is also possible to use, for example, a metal plate in which fine holes are mechanically formed on an inconel flat plate used for a muffle of a firing furnace, a so-called wire netting plate, or the like.
[0011]
  Further, the method for producing a ceramic multilayer substrate of the present invention (Claim 2) is as follows.
  (a) forming a green substrate having a multilayer structure including at least one of a conductor, a resistor, and a dielectric;
  (b) forming a laminate by disposing a shrinkage suppression layer made of a material that does not sinter at the temperature when firing the unfired substrate on both upper and lower surfaces of the unfired substrate;
  (c) cutting the outer peripheral side unnecessary portion of the laminate to form a molded laminate of a predetermined shape;
  (d) The unnecessary part (cut laminated body) on the outer periphery side of the laminate cut in the step (c) is used as a spacer, a main part is formed from a plurality of rod-like members, and a gap is provided between the rod-like members. The molded laminate is interposed between the lower setter having the structure and the upper setter having a structure in which a main part is formed from a plurality of rod-shaped members and a gap is provided between the rod-shaped members. A process of maintaining the state;
  (e) firing the molded laminate together with the lower setter, the upper setter, and the spacer in the state of (d);
  WithWith
Each of the outer peripheral side unnecessary portion (cut laminate) used as the spacer and the molded laminate is obtained by crimping the laminate and then cutting the outer peripheral unnecessary portion, and ,
The planar area of the outer peripheral side unnecessary portion (cut laminate) used as the spacer is smaller than the planar area of the molded laminate.It is characterized by that.
[0012]
  As a lower setter and an upper setter, a main part is formed from a plurality of rod-shaped members, and by using a rod-shaped setter having a structure with a gap between each rod-shaped member, a porous material is used as a constituent material of the setter. Therefore, it is possible to ensure a sufficiently good degreasing property, and to reliably manufacture a ceramic multilayer substrate having a desired characteristic value with small variations in characteristic values.
  In other words, the rod-shaped setter with voids has low heat loss and good degreasing efficiency (removal efficiency of organic matter) during firing, realizing uniform dispersion of atmospheric gas in the setter and easy movement to the outside It becomes possible to improve the quality of the product. In particular, when an element such as a resistor or a capacitor is built in the vicinity of the surface in contact with the setter, it is possible to stabilize the product characteristics and reduce variations compared to the case of using a normal plate-shaped setter. Become. For example, when firing using a plate-shaped setter, a ceramic multi-layer substrate having a resistance value variation of resistance built in a position close to the setter is about 50% at 3 CV is fired using a rod-shaped setter. In such a case, it is possible to reduce it to 15% or less at 3 CV.
  Further, in other respects, the same effects as those of the method for manufacturing a ceramic multilayer substrate according to the first aspect can be obtained.
  In addition, as a constituent material of the rod-shaped setter, for example, various ceramic materials having excellent heat resistance such as alumina can be used, and metal materials having good heat resistance can be used.
[0013]
  The method for producing a ceramic multilayer substrate according to claim 3 is characterized in that a gap is interposed between the upper setter and the molded laminate in the step of firing the molded laminate.
[0014]
  When a gap is interposed between the upper setter and the molded laminate during the molding laminate firing process, it is possible to prevent unnecessary external stress from being applied to the molded laminate during the firing process. It is possible to more reliably manufacture a ceramic multilayer substrate having a desired characteristic value without causing generation.
  In the step of firing the molded laminate, it is possible to suppress a large deformation (warp) from occurring in the molded laminate even if there is a minute gap between the upper setter and the molded laminate. The characteristics of the ceramic multilayer substrate are not adversely affected.
[0015]
  Claims4This ceramic multilayer substrate manufacturing method is characterized in that the lower setter and the upper setter have a honeycomb structure mainly composed of alumina and having a plurality of through holes.
[0016]
  A setter having a honeycomb structure mainly composed of alumina and having a plurality of through-holes as a lower setter and an upper setter has good degreasing properties and excellent mechanical strength. Such a setter is used as a lower setter. And by using it as an upper setter, the present invention can be made more effective.
[0017]
【Example】
  Hereinafter, the present inventionExamples of the invention related to the present invention (reference example) and the present inventionThe features of this embodiment will be described in more detail.
[0018]
[Of the invention to which the present invention relatesExample(Reference example)]
  (1) First, as shown in FIG. 1A, a conductor (via hole electrode 4 for connecting the internal electrode 2 disposed through the surface electrode 1, the internal electrode 2 and the ceramic layer 3), An unfired substrate 10 having a multilayer structure including a resistor (thick film resistor 5), a dielectric (ceramic dielectric layer 6) and the like is formed, and the unfired substrate 10 is fired on both upper and lower surfaces thereof. Shrinkage suppression layer made of material that does not sinter at temperature (thisReference exampleThen, a laminate 12 having a thickness of 1000 μm is formed by disposing a green sheet 11 containing alumina as a main component.
[0019]
  (2) Next, as shown in FIGS. 1B and 1C, the outer peripheral side unnecessary portion 13 of the laminated body 12 is cut along a cutting line L (FIG. 1B) to form a predetermined shape. A laminate 14 is obtained.
[0020]
  (3) Then, the molded laminated body (part which becomes a product after firing) 14 after the outer peripheral side unnecessary portion 13 is cut and removed is pressure-bonded (FIG. 1 (c)).
  Thereby, the thickness of the pressure-bonded molded laminate 14 becomes 900 μm, which is thinner than the thickness 1000 μm of the outer peripheral side unnecessary portion 13 that is not pressure-bonded.
[0021]
  (4) Next, as shown in FIG. 1 (d), the molded laminate 14 is placed on the lower setter 15a having a honeycomb structure mainly composed of alumina and having a plurality of through-holes. Around the body 14, an outer peripheral side unnecessary portion (cut laminated body) 13 is disposed as a spacer, and an upper setter 15b is disposed so as to cover the upper surface of the molded laminated body 14 from above. At this time, since the thickness of the molded laminated body 14 is thinner than the thickness of the spacer (outer peripheral side unnecessary portion) 13 that is not pressure-bonded, the lower surface of the upper setter 15b supported by the spacer 13 and the upper surface of the molded laminated body 14 A gap (gap) G1 having a thickness of 100 μm is formed between them.
[0022]
  (5) Then, in the state of (4), the molded laminate 14 is integrally fired together with the lower setter 15a, the upper setter 15b, and the spacer 13 (FIG. 2).
  In this firing step, the gap (gap) G2 (FIG. 2) between the upper surface of the molded laminate (ceramic multilayer substrate) 14 including the shrinkage suppression layer 11 and the upper setter 15b is a gap G1 (100 μm) before firing (FIG. 1 (d)) was confirmed (about 125 μm).
  Although the molded laminate 14 and the spacer 13 are made of the same material and in the same laminated state, the upper surface of the molded laminate (ceramic multilayer substrate) 14 including the fired shrinkage suppression layer 11 and the upper setter 15b. The reason why the gap G2 (125 μm) is larger than the gap G1 (100 μm) before firing is that both have different shapes and that only the molded laminate 14 is crimped (different crimping history) It is thought that this is due to
[0023]
  (6) Thereafter, the shrinkage suppression layer 11 is removed. Thereby, a ceramic multilayer substrate having a multilayer structure including a conductor (surface electrode 1, internal electrode 2, via hole electrode 4), resistor (thick film resistor 5), dielectric (ceramic dielectric layer 6), and the like is obtained. can get.
[0024]
  thisReference exampleAccording to the method, as a result of ensuring a minute gap G1 (G2) between the upper surface of the molded laminate (ceramic multilayer substrate) 14 and the upper setter 15b, the molded laminate is obtained from the beginning to the end of the firing step. 14 can be prevented from being subjected to external stress, and generation of cracks and chips can be suppressed and prevented while preventing large warpage during firing.
[0025]
  Moreover, since the setter (porous setter) which has the honeycomb structure provided with the several through-hole is used as the lower setter 15a and the upper setter 15b, it becomes possible to ensure favorable degreasing | defatting property, and desired It is possible to form a resistor (thick film resistor 5) having a resistance value of 15% or less at 3 CV.
[0026]
  In addition, it is possible to secure desired characteristics for the conductor (surface electrode 1, internal electrode 2, via hole electrode 4) and dielectric (ceramic dielectric layer 6), and the target characteristics as a whole are provided. It becomes possible to obtain a ceramic multilayer substrate.
  Moreover, since the outer peripheral side unnecessary portion 13 generated during the formation of the molded laminated body 14 is used as a spacer, it is not necessary to separately prepare a spacer, so that the cost can be reduced. Become.
[0027]
[Of the present inventionExample1]
  (1) First, as shown in FIG. 3A, a conductor (via hole electrode 4 for connecting the surface electrode 1, the internal electrode 2 and the internal electrode 2 disposed via the ceramic layer 3), When forming the unfired substrate 10 having a multilayer structure including a resistor (thick film resistor 5) and a dielectric (ceramic dielectric layer 6), and firing the unfired substrate 10 on both upper and lower surfaces thereof A shrinkage suppression layer made of a material that does not sinter at a temperature of (this example1Then, a green sheet (mainly alumina) 11 is provided to form a laminate 12 having a thickness of 1000 μm. Then, the entire laminate 12 is crimped to form a crimp laminate 12a having a thickness of 900 μm.
[0028]
  (2) Next, as shown in FIG. 3B, the outer peripheral side unnecessary portion 13 of the pressure-bonded laminate 12a is cut to obtain a molded laminate 14 having a predetermined shape.
[0029]
  (3) Next, as shown in FIG. 3 (c), the molded laminate 14 is placed on the lower setter 15a having a honeycomb structure mainly composed of alumina and having a plurality of through holes. Around the body 14, a spacer (the outer peripheral side unnecessary portion (cut laminate)) 13 is provided as a spacer, and an upper setter 15 b is provided from above to cover the upper surface of the molded laminate 14. . At this time, since the thickness of the molded laminate 14 and the thickness of the spacer (outer peripheral side unnecessary portion) 13 are the same, the lower surface of the upper setter 15b supported by the spacer 13 and the upper surface of the molded laminate 14 are in close contact with each other. Thus, no gap is formed between them.
[0030]
  (4) Then, in the state of (3) above, the molded laminate 14 is integrally fired together with the lower setter 15a, the upper setter 15b, and the spacer 13 (FIG. 3 (d)).
  In this firing step, a gap (gap) G3 having a thickness of about 100 μm is formed between the upper surface of the molded laminate (ceramic multilayer substrate) 14 including the shrinkage suppression layer 11 and the upper setter 15b.
  As described above, the upper surface of the molded laminate (ceramic multilayer substrate) 14 including the shrinkage suppression layer after firing and the upper setter 15b, although the molded laminate 14 and the spacer 13 are made of the same material and in the same laminated state. The gap G3 having a thickness of 100 μm was formed between the spacer (outer peripheral side unnecessary portion) 13 because the area of the front and back surfaces of the spacer (outer peripheral side unnecessary portion) 13 is smaller than the area of the front and back surfaces of the molded laminate 14. As a result of the portion sandwiched between the shrinkage suppression layers 11 constituting the side unnecessary portion) 13 being greatly contracted in the plane direction as compared with the molded laminate 14, the spacer (outer peripheral side unnecessary portion) is compared with the molded laminate 14. ) 13 shrinkage in the thickness direction is considered to be small. It should be noted that the unnecessary portion on the outer peripheral side serving as the spacer 13 is usually lower in the proportion of the internal electrodes and the like than the molded laminate 14 and is crimped at a low pressure in the crimping process, so that the shrinkage is suppressed. The restraining force by the layer 11 is weak and tends to shrink more easily in the planar direction.
[0031]
  (5) Thereafter, the shrinkage suppression layer 11 is removed. Thereby, a ceramic multilayer substrate having a multilayer structure including a conductor (surface electrode 1, internal electrode 2, via hole electrode 4), resistor (thick film resistor 5), dielectric (ceramic dielectric layer 6), and the like is obtained. can get.
  This example1According to this method, as described above, no gap is formed between the upper surface of the molded laminate 14 and the upper setter 15b before firing, but the spacer ( Since the amount of contraction in the thickness direction of the outer peripheral side unnecessary portion) 13 is reduced, a gap G3 is formed between the upper surface of the molded laminate 14 and the upper setter 15b. As a result, it is possible to suppress or prevent the occurrence of cracks or chips during firing by suppressing external stress applied to the molded laminate 14 in the firing step.
  In other respects, the aboveReference exampleThe same effect as in the case of can be obtained.
[0032]
[Of the present inventionExample2]
  This example2Then, as shown in FIGS. 4A and 4B, as the lower setter 15a and the upper setter 15b, a plurality of round bar-like rod-like members 21a and 21b arranged in parallel and the rod-like members 21a and 21b are arranged. A rod-shaped setter having a pair of connecting members 22a and 22b that hold both ends and integrate the whole is used. The lower setter 15a and the upper setter 15b (bar-shaped setter) have a structure in which a gap 23 is provided between the bar-shaped members 21a and 21b. This example2Then, alumina is used as a constituent material of the lower setter 15a and the upper setter 15b.
[0033]
  Other configurations and procedures in the manufacturing process of the ceramic multilayer substrate are as described above.Reference exampleIn this case, the molded laminate 14 is crimped, and the spacer (outer peripheral side unnecessary portion) 13 is not crimped.
[0034]
  And this example2In FIG. 1, the molded laminated body 14 is placed on the lower setter (bar-shaped setter) 15a, and the laminated body 12 (FIG. 1 (FIG. 1 (A)) is formed on both ends of the pair of connecting members 22a constituting the lower setter (bar-shaped setter) 15a. a), a total of four spacers 13 obtained by cutting the unnecessary portion on the outer peripheral side are disposed, and the upper setter (bar-shaped setter) 15b is disposed via the spacer 13 and the bar-shaped member 21b is disposed on the lower setter. The molded laminate 14 is held by being arranged in a posture orthogonal to the rod-shaped member 21a of 15a (FIGS. 4A, 4B and 5A).
  Therefore, since the thickness of the molded laminate 14 is thinner than the spacer (unnecessary portion on the outer peripheral side) 13, a gap G 1 having a thickness of 100 μm is formed between the upper setter 15 b supported by the spacer 13 and the upper surface of the molded laminate 14. Will be formed.
[0035]
  In this state, the molded laminated body 14 is integrally fired together with the lower setter 15a, the upper setter 15b, the spacer 13, and the like (FIG. 5B).
  In this firing step, a gap G2 (FIG. 5B) between the upper surface of the molded laminate (ceramic multilayer substrate) 14 including the shrinkage suppression layer 11 and the upper setter 15b is a gap G1 (100 μm) before firing (FIG. 5). 5 (a)) and aboveReference exampleAs in the case of, it is about 125 μm.
[0036]
  Thereafter, the shrinkage suppression layer 11 is removed. Thereby, a ceramic multilayer substrate having a multilayer structure including a conductor (surface electrode 1, internal electrode 2, via hole electrode 4), resistor (thick film resistor 5), dielectric (ceramic dielectric layer 6), and the like is obtained. can get.
[0037]
  This example2According to the above methodReference exampleIt is possible to obtain the same effect as in the case of the above, and the rod-shaped setter as described above is used as the lower setter and the upper setter. Therefore, it is possible to improve the quality of the product because it is possible to achieve a uniform dispersion of the atmospheric gas in the setter and an easy movement to the outside. In particular, when an element such as a resistor or a capacitor is built in the vicinity of the surface in contact with the setter, it is possible to stabilize the product characteristics and reduce variations compared to the case of using a normal plate-shaped setter. Become. Therefore, it is possible to efficiently manufacture a highly reliable ceramic multilayer substrate having desired characteristics and small variations in characteristics.
[0038]
[Of the present inventionExample3]
  FIG. 6 shows still another embodiment (embodiment) of the present invention.3(A) is a figure which shows the state before baking which hold | maintained the shaping | molding laminated body 14 with the lower setter 15a and the upper setter 15b via the spacer 13, (b) is a figure after baking. It is a figure which shows a state.
[0039]
  This example3Then, as the lower setter 15a and the upper setter 15b, the above embodiment2As in the case of the above, a plurality of round bar-like rod-like members 21a, 21b arranged in parallel, and a pair of connecting members 22a, 22b that hold both ends of each of the rod-like members 21a, 21b and integrate them as a whole, And a setter (rod-like setter) having a structure in which a gap 23 is provided between the rod-like members 21a and 21b.
[0040]
  Also this example3The above example1As in the case of the above, the unnecessary portion on the outer peripheral side of the pressure-bonded laminate having a thickness of 900 μm obtained by pressure-bonding the entire laminate 12 is cut, and the molded laminate 14 having a predetermined shape is inserted through the spacer 13 having the same thickness. The lower setter (bar-shaped setter) 15a and the upper setter (bar-shaped setter) 15b are configured to be held. The lower setter 15a and the upper setter 15b are arranged in such a posture that the rod-like members 21a and 21b are orthogonal to each other.
[0041]
  This example3Then, in the stage before firing, as shown in FIG. 6A, since the thickness of the molded laminate 14 and the spacer (outer peripheral side unnecessary portion) 13 is the same, the upper setter 15b supported by the spacer 13 and The upper surface of the molded laminate 14 is in contact with the gap, and no gap is formed between the two. In this state, the molded laminate 14 is integrally fired together with the lower setter 15a, the upper setter 15b, and the spacer 13. In addition, since the molded laminate 14 shrinks more in the thickness direction than the spacer 13, as shown in FIG. 6B, the molded laminate (ceramic multilayer substrate) 14 including the shrinkage suppression layer 11, and the upper setter A gap (gap) G3 having a thickness of about 100 μm is formed between the gap 15b. Other configurations, procedures in the manufacturing process of the ceramic multilayer substrate, etc.1Since this is the same as the case of, the description is omitted here to avoid duplication.
[0042]
  This example3According to the method, as described above, no gap is formed between the upper surface of the molded laminate 14 and the upper setter 15b in the stage before firing, but the spacer is more than the molded laminate 14 in the firing step. Since the amount of contraction in the thickness direction of the (outer peripheral side unnecessary portion) 13 is reduced, a gap G3 is formed between the upper surface of the molded laminated body 14 and the upper setter 15b. As a result, in the firing process, it is possible to suppress external stress from being applied to the molded laminate 14, and to suppress or prevent the occurrence of cracks or chips during firing. It is possible to efficiently manufacture a highly reliable ceramic multilayer substrate with a small variation in the above.
[0043]
  The above example2, 3The lower setter (bar-shaped setter) 15a and the upper setter (bar-shaped setter) 15b are arranged in such a posture that the bar-shaped members 21a and 21b are orthogonal to each other, but the bar-shaped members 21a and 21b face the same direction. It is also possible to arrange in such a posture (become parallel).
[0044]
  In addition, the above embodiment2, 3Then, as the lower setter 15a and the upper setter 15b, a rod-shaped setter having a configuration including a plurality of rod-shaped members 21a and 21b arranged in parallel is used. It is possible to use various structures formed by using rod-shaped members. Further, the rod-shaped member is not limited to a round rod-shaped member, and a rod-shaped member having a square bar shape such as a square cross-section can be used.
[0045]
  The invention of the present application is not limited to the above embodiments in other respects as well, but the specific configuration of the ceramic multilayer substrate (construction material, lamination mode, element arrangement mode, etc.), lower setter, upper setter In addition, various applications and modifications can be made within the scope of the invention with respect to the specific structure and constituent materials of the spacer and the shape and constituent materials of the shrinkage suppression layer.
[0046]
【The invention's effect】
  As described above, the method for manufacturing a ceramic multilayer substrate according to the present invention (Claim 1) cuts unnecessary portions on the outer peripheral side of the laminate in which the shrinkage suppression layers are disposed on the upper and lower surfaces of the unfired substrate, and has a predetermined shape. A molded laminate is formed, and this molded laminate is held between the lower setter and the upper setter made of a porous material as a spacer via an unnecessary portion on the outer peripheral side (cut laminate), and in that state the molded laminate is molded. Since the body is fired, it is possible to efficiently produce a ceramic multilayer substrate with less warpage in the firing process and having a good appearance shape without the need for separately preparing a spacer.
Furthermore, by cutting the laminated body after the pressure bonding, the laminated body is divided into a molded laminated body and an outer peripheral side unnecessary portion (cut laminated body), and as a spacer, the planar area is larger than the planar area of the molded laminated body Since the small unnecessary part on the outer peripheral side is used, the upper setter and the molded laminate in the initial state where the molded laminate is held via the spacer (cut laminate) between the lower setter and the upper setter. There is no gap between the two, but they are in close contact with each other, but because of the difference in the shrinkage characteristics in the firing process due to the difference in the shape of the spacer and the molded laminate, there is a gap between the upper setter and the molded laminate in the firing process. Can be generated.
That is, the unnecessary portion on the outer peripheral side serving as a spacer usually has a smaller area (planar area) on the front and back surfaces than the molded laminate, and by using the unnecessary portion on the outer peripheral side as a spacer, the planar area is smaller than the molded laminate. The ratio of the spacer (unnecessary portion on the outer peripheral side) sandwiched between the shrinkage suppression layers in the thickness direction of the spacer (unnecessary portion on the outer peripheral side) is greatly reduced in the plane direction compared to the molded laminate. Can be made smaller than the molded laminate, and a gap can be formed between the upper setter and the molded laminate in the firing step.
Therefore, it is possible to suppress and prevent the load from being applied to the molded laminate in the firing step, and to manufacture a ceramic multilayer substrate having a desired characteristic value.
  Also,Since the outer peripheral side unnecessary part (cut laminated body) generated when the outer peripheral side of the laminate is cut and the molded laminate is formed is used as a spacer, it is arranged between the lower setter and the upper setter. It is possible to produce a spacer, which is preferably made of a material having the same thickness as or larger than the thickness of the molded laminate, and having the same or very close firing shrinkage characteristics as the molded laminate, in a separate step. This eliminates the need for the ceramic multilayer substrate.
  In addition, since a setter made of a porous material is used as the lower setter and the upper setter, a ceramic multilayer substrate having good degreasing properties, small variation in characteristic values of mounted elements, and a desired characteristic value is provided. Be able to get.
[0047]
  Moreover, the manufacturing method of the ceramic multilayer substrate of the present invention (Claim 2) is a setter having a structure in which a main part is formed from a plurality of rod-shaped members as a lower setter and an upper setter, and a gap is provided between the rod-shaped members. (Bar-shaped setter) is used, so that a sufficiently good degreasing property is ensured without using a porous material as a constituent material of the setter, characteristic value variation is small, and a desired characteristic value is provided. A ceramic multilayer substrate can be reliably manufactured.
  Further, in other respects, the same effects as those of the method for manufacturing a ceramic multilayer substrate according to the first aspect can be obtained.
[0048]
  Further, when a gap is interposed between the upper setter and the molded laminate in the firing process of the molded laminate as in the method for manufacturing a ceramic multilayer substrate according to claim 3, the use is unnecessary in the molded laminate in the firing process. Thus, it is possible to more reliably manufacture a ceramic multilayer substrate having desired characteristic values without incurring the occurrence of cracks and chips.
[0049]
  Claims4As in the ceramic multilayer substrate manufacturing method, a setter having a honeycomb structure mainly composed of alumina and having a plurality of through holes as a lower setter and an upper setter has good degreasing properties and mechanical strength. It is excellent, and by using such a setter as a lower setter and an upper setter, the present invention can be made more effective.
[Brief description of the drawings]
FIG. 1 (a) is the present invention.Of the related inventionExample(Reference example)) Is a cross-sectional view showing a laminate formed in one step of the method for producing a ceramic multilayer substrate, (b) is a perspective view showing the laminate, and (c) is a state where unnecessary portions on the outer peripheral side of the laminate are cut. (D) is a cross-sectional view showing a state in which a molded laminate is held by a lower setter and an upper setter via a spacer.
FIG. 2 is a cross-sectional view showing a state in which a molded laminated body held by a lower setter and an upper setter via a spacer is baked.
FIG. 3 (a) is the present invention.The fruitExamples (Examples)1) Is a cross-sectional view showing a pressure-bonded laminate formed in one step of the method for manufacturing a ceramic multilayer substrate according to FIG. 5B, FIG. 5B is a cross-sectional view showing a state where unnecessary portions on the outer peripheral side of the pressure-bonded laminate are cut, and FIG. Sectional drawing which shows the state which hold | maintained the body via the spacer by the lower setter and the upper setter, (d) is sectional drawing which shows the state which baked the shaping | molding laminated body hold | maintained via the spacer by the lower setter and the upper setter.
FIG. 4 (a) is the present invention.OtherExample (Example2) Is an exploded perspective view showing a method of holding the molded laminated body via the spacer with the lower setter and the upper setter in one step of the method for producing the ceramic multilayer substrate according to FIG. It is a perspective view which shows the state holding the molded laminated body.
FIG. 5 (a) is an example.2Sectional drawing which shows the state which hold | maintained the molding laminated body in the lower setter and the upper setter via the spacer in (b) is sectional drawing which shows the state which baked the molding laminated body hold | maintained through the spacer by the lower setter and the upper setter It is.
FIG. 6A shows still another embodiment (embodiment) of the present invention.3) Is a cross-sectional view showing a state where the molded laminate is held by the lower setter and the upper setter via the spacer, and (b) is a cross section showing a state where the molded laminate held by the lower setter and the upper setter via the spacer is baked FIG.
7A and 7B are diagrams showing a conventional method for producing a ceramic multilayer substrate, wherein FIG. 7A is a cross-sectional view showing a state of a green sheet laminate before firing, and FIG. 7B is a state showing a green sheet laminate after firing. It is sectional drawing.
[Explanation of symbols]
  1 Surface electrode
  2 Internal electrodes
  3 Ceramic layer
  4 Via hole electrodes
  5 Thick film resistance
  6 Ceramic dielectric layer
  10 Unbaked substrate
  11 Shrinkage suppression layer
  12 Laminate
  12a Crimp laminate
  13 Unnecessary part on outer peripheral side (spacer)
  14 Molded laminate
  15a Lower setter
  15b Upper setter
  21a, 21b Bar-shaped member
  22a, 22b connecting member
  23 Air gap
  G1, G2, G3 Gap between upper setter and molded laminate
  L cutting line

Claims (4)

(a) forming a green substrate having a multilayer structure including at least one of a conductor, a resistor, and a dielectric;
(b) forming a laminate by disposing a shrinkage suppression layer made of a material that does not sinter at the temperature when firing the unfired substrate on both upper and lower surfaces of the unfired substrate;
(c) cutting the outer peripheral side unnecessary portion of the laminate to form a molded laminate of a predetermined shape;
(d) The unnecessary portion (cut laminate) of the outer periphery of the laminate cut in the step (c) is used as a spacer, and between the lower setter made of a porous material and the upper setter made of a porous material. A step of holding the molded laminate through the spacer;
(e) the state of (d), the lower setter, said upper setter, and with and a step of firing the shaped laminate with the spacer,
Each of the outer peripheral side unnecessary portion used as the spacer and the molded laminated body is obtained by crimping the laminated body and then cutting the outer peripheral side unnecessary portion, and
A method for producing a ceramic multilayer substrate, wherein a planar area of the outer peripheral side unnecessary portion used as the spacer is smaller than a planar area of the molded laminate . (a) forming a green substrate having a multilayer structure including at least one of a conductor, a resistor, and a dielectric;
(b) forming a laminate by disposing a shrinkage suppression layer made of a material that does not sinter at the temperature when firing the unfired substrate on both upper and lower surfaces of the unfired substrate;
(c) cutting the outer peripheral side unnecessary portion of the laminate to form a molded laminate of a predetermined shape;
(d) The unnecessary part (cut laminated body) on the outer periphery side of the laminate cut in the step (c) is used as a spacer, a main part is formed from a plurality of rod-like members, and a gap is provided between the rod-like members. The molded laminate is interposed between the lower setter having the structure and the upper setter having a structure in which a main part is formed from a plurality of rod-shaped members and a gap is provided between the rod-shaped members. A process of maintaining the state;
(e) the state of (d), the lower setter, said upper setter, and with and a step of firing the shaped laminate with the spacer,
Each of the outer peripheral side unnecessary portion used as the spacer and the molded laminated body is obtained by crimping the laminated body and then cutting the outer peripheral side unnecessary portion, and
A method for producing a ceramic multilayer substrate, wherein a planar area of the outer peripheral side unnecessary portion used as the spacer is smaller than a planar area of the molded laminate .   3. The method for manufacturing a ceramic multilayer substrate according to claim 1, wherein a gap is interposed between the upper setter and the molded laminate in the step of firing the molded laminate. The method for producing a ceramic multilayer substrate according to any one of claims 1 to 3 , wherein the lower setter and the upper setter have a honeycomb structure mainly composed of alumina and provided with a plurality of through holes. .

Images