JP4090387B2

JP4090387B2 - Heating medium header for floor heating panel

Info

Publication number: JP4090387B2
Application number: JP2003137504A
Authority: JP
Inventors: 幸司安平; 靖中川
Original assignee: 株式会社ハーマンプロ
Priority date: 2003-05-15
Filing date: 2003-05-15
Publication date: 2008-05-28
Anticipated expiration: 2023-05-15
Also published as: JP2004340484A

Description

【０００１】
【発明の属する技術分野】
本発明は、板状のブロック体からなるヘッダ本体の外周部に、熱源からの熱媒受入用接続部、熱源への熱媒戻し用接続部、床暖房パネルの熱媒入口に接続される熱媒供給部、および、床暖房パネルの熱媒出口に接続される熱媒排出部が備えられ、
前記ヘッダ本体の内部には、前記熱媒受入用接続部と前記熱媒供給部とを連通接続する熱媒供給用連通路と、前記熱媒戻し用接続部と前記熱媒排出部とを連通接続する熱媒戻し用連通路とが前記ヘッダ本体の上下方向にずらした状態で区画形成されている床暖房パネル用熱媒ヘッダに関する。
【０００２】
【従来の技術】
上記のような床暖房パネル用熱媒ヘッダは、熱媒受入用接続部に熱源からの熱源用往き管を接続し、熱媒戻し用接続部に熱源への熱源用戻し管を接続し、熱媒供給部に床暖房パネルにおける熱媒流通管の熱媒入口を接続し、熱媒排出部に床暖房パネルにおける熱媒流通管の熱媒出口を接続して使用され、熱源からの熱源用往き管を通して供給される熱媒を分流させて床暖房パネルにおける熱媒流通管に供給するとともに、床暖房パネルにおける熱媒流通管を通過してから戻ってくる熱媒を合流させて熱源への熱源用戻し管を通して熱源に戻すためのものである。
【０００３】
上記のような床暖房パネル用熱媒ヘッダにおいて、従来では、ヘッダ本体が角筒状に形成され、その角筒状のヘッダ本体の内部に板状体を備えることによって、ヘッダ本体の内部に、熱媒供給用連通路と熱媒戻し用連通路とをヘッダ本体の上下方向にずらした状態で区画形成するようにしている（例えば、特許文献１参照。）。
【０００４】
また、他の従来の床暖房パネル用熱媒ヘッダでは、ブロック体の内部をドリルにて加工することによって、ヘッダ本体の内部に、熱媒供給用連通路と熱媒戻し用連通路とをヘッダ本体の上下方向にずらした状態で区画形成するようにしている（例えば、特許文献２参照。）。
【０００５】
【特許文献１】
特開平１１−１０８３８２号公報
【特許文献２】
特開平９−２６９１３５号公報
【０００６】
【発明が解決しようとする課題】
上記特許文献１に示されている床暖房パネル用熱媒ヘッダでは、角筒状のヘッダ本体の内部に板状体を備えることにより、熱媒供給用連通路と熱媒戻し用連通路とを区画形成するようにしているので、熱媒供給用連通路を通流する熱媒と熱媒戻し用連通路を通流する熱媒とが混ざり合うことを防止するために、板状体の外周縁をその全周にわたってヘッダ本体の内面に熱媒の漏れがないように接合しなければならず、ヘッダ本体の製作が手間のかかるものとなっている。
【０００７】
ちなみに、熱媒戻し用連通路を通流する熱媒が、床暖房パネルを通過することにより温度低下した熱媒であるので、その温度低下した熱媒戻し用連通路を通流する熱媒と床暖房パネルに供給される熱媒供給用連通路を通流する熱媒とが混ざり合うと、床暖房パネルに供給される熱媒の温度が低くなって、暖房能力が低下する虞がある。
【０００８】
上記特許文献２に示されている床暖房パネル用熱媒ヘッダでは、ブロック体の内部をドリルにて加工することによって、熱媒供給用連通路と熱媒戻し用連通路とを区画形成しているので、そのドリルによる加工を行うだけで、熱媒供給用連通路を通流する熱媒と熱媒戻し用連通路を通流する熱媒とが混ざり合わないように、熱媒供給用連通路と熱媒戻し用連通路とを区画形成できることになる。
しかしながら、ドリルにて加工することによって、熱媒供給用連通路と熱媒戻し用連通路を形成する作業自体が手間のかかるものであるので、ヘッダ本体の製作が手間のかかるものとなっている。
【０００９】
また、ドリルにて加工することによって、熱媒供給用連通路と熱媒戻し用連通路とを区画形成するものでは、熱媒供給用連通路と熱媒戻し用連通路の通路面積が小さくなるので、熱媒供給用連通路と熱媒戻し用連通路の通路抵抗が大きくなり、床暖房パネル用熱媒ヘッダから床暖房パネルに供給される熱媒の量が少なくなる。
したがって、床暖房パネル用熱媒ヘッダから床暖房パネルに供給される熱媒の量が少なくなるのを防止するために、熱媒供給用連通路の本数を複数にするなどの加工が必要となり、複数の熱媒供給用連通路を形成するようにドリルにて加工することとなって、この点からも、ヘッダ本体の製作が手間のかかるものとなる。
【００１０】
ちなみに、床暖房パネル用熱媒ヘッダから床暖房パネルに供給される熱媒の量が少なくなると、熱源から床暖房パネル用熱媒ヘッダに対して床暖房パネルにて要求されている量の熱媒を供給しているにもかかわらず、床暖房パネルには要求されている量の熱媒が供給されないことになるので、暖房能力が低下する虞がある。
【００１１】
本発明は、かかる点に着目してなされたものであり、その目的は、ヘッダ本体の製作の容易化を図ることができる床暖房パネル用熱媒ヘッダを提供する点にある。
【００１２】
【課題を解決するための手段】
〔請求項１記載の発明〕
この目的を達成するために、請求項１に記載の発明によれば、板状のブロック体からなるヘッダ本体の外周部に、熱源からの熱媒受入用接続部、熱源への熱媒戻し用接続部、床暖房パネルの熱媒入口に接続される熱媒供給部、および、床暖房パネルの熱媒出口に接続される熱媒排出部が備えられ、
前記ヘッダ本体の内部には、前記熱媒受入用接続部と前記熱媒供給部とを連通接続する熱媒供給用連通路と、前記熱媒戻し用接続部と前記熱媒排出部とを連通接続する熱媒戻し用連通路とが前記ヘッダ本体の上下方向にずらした状態で区画形成されている床暖房パネル用熱媒ヘッダにおいて、
前記ヘッダ本体の外側面部のうち、対向する一対の外側面部には、前記熱媒供給部と前記熱媒排出部とが前記ヘッダ本体の外周方向に交互に並ぶ状態で配設され、前記ヘッダ本体が、それの上下方向に分割形成された複数の板状構成体を積層状態で接合して構成され、
前記ヘッダ本体における前記熱媒供給用連通路を形成する部分が、平板状の供給用平板構成体と内部を繰り抜いた中空状の供給用中空構成体と平板状の中間平板構成体とから構成され、
前記ヘッダ本体における前記熱媒戻し用連通路を形成する部分が、前記中間平板構成体と内部を繰り抜いた中空状の戻し用中空構成体と平板状の戻し用平板構成体とから構成され、
前記ヘッダ本体が、前記供給用平板構成体と前記中間平板構成体との間に前記供給用中空構成体を挟み込み、かつ、前記中間平板構成体と前記戻し用平板構成体との間に前記戻し用中空構成体を挟み込む状態で、前記供給用平板構成体と前記供給用中空構成体と前記中間平板構成体と前記戻し用中空構成体と前記戻し用平板構成体とを積層状態で接合して構成されていることを特徴とする。
【００１３】
すなわち、ヘッダ本体が、それの上下方向に分割形成された複数の板状構成体を積層状態で接合して構成されているので、例えば、内部を繰り抜いた中空状、断面が凹入状や平板状の板状構成体を組み合わせて積層状態で接合することにより、熱媒供給用連通路と熱媒戻し用連通路とをヘッダ本体の上下方向にずらした状態で区画形成して、ヘッダ本体を構成することができることになる。
そして、複数の板状構成体を積層状態で接合するので、大きな接合面を備えて、その接合面にて複数の板状構成体の接合を行うことができることになる。
したがって、大きな接合面にて板状構成体を積層状態で接合することができるので、熱媒の漏れがないように容易に接合することができることとなって、ヘッダ本体の製作の容易化を図ることができることになる。
【００１４】
また、複数の板状構成体は、板状のヘッダ本体の上下方向に分割形成されているので、ヘッダ本体の横方向に分割形成されているものと比べて、少ない枚数の板状構成体にてヘッダ本体を構成することができることになり、この点からも、ヘッダ本体の製作の容易化を図ることができることになる。
【００１５】
そして、熱媒供給用連通路の形状、および、熱媒戻し用連通路の形状は、板状構成体の形状に応じて決まるので、板状構成体の形状を調整することによって、熱媒供給用連通路の形状、および、熱媒戻し用連通路の形状を、ヘッダ本体の上下方向に薄くて横幅が広い偏平な形状として、熱媒供給用連通路および熱媒戻し用連通路の通路面積を大きなものとすることができることになる。
したがって、熱媒供給用連通路と熱媒戻し用連通路の通路抵抗を小さくすることができて、あらたな加工を施さなくても、床暖房パネル用熱媒ヘッダから床暖房パネルに供給される熱媒の量が少なくなるのを防止することができることとなって、この点からも、ヘッダ本体の製作の容易化を図ることができることになる。
【００１６】
以上のことから、請求項１に記載の発明によれば、単に、複数の板状構成体を積層状態で接合するだけで、熱媒供給用連通路を通流する熱媒と熱媒戻し用連通路を通流する熱媒とが混ざり合わないように、熱媒供給用連通路と熱媒戻し用連通路とを区画形成し、かつ、熱媒供給用連通路および熱媒戻し用連通路の通路面積を大きくしながら、ヘッダ本体を製作することができることとなって、ヘッダ本体の製作の容易化を図ることができる床暖房パネル用熱媒ヘッダを提供できるに至った。
【００１８】
又、請求項１に記載の発明によれば、供給用平板構成体と中間平板構成体との間に供給用中空構成体を挟み込む状態で、供給用平板構成体と供給用中空構成体と中間平板構成体とを積層状態で接合することにより、供給用中空構成体における中空空間を利用して熱媒供給用連通路を形成することができ、その熱媒供給用連通路の形状をヘッダ本体の上下方向に薄くて横幅が広い偏平な形状とすることができることになる。
また、中間平板構成体と戻し用平板構成体との間に戻し用中空構成体を挟み込む状態で、中間平板構成体と戻し用中空構成体と戻し用平板構成体とを積層状態で接合することにより、戻し用中空構成体における中空空間を利用して熱媒戻し用連通路が形成され、その熱媒戻し用連通路の形状をヘッダ本体の上下方向に薄くて横幅が広い偏平な形状とすることができることになる。
【００１９】
このように、熱媒供給用連通路の形状、および、熱媒戻し用連通路の形状を、ヘッダ本体の上下方向に薄くて横幅が広い偏平な形状とすることができるので、ヘッダ本体をその上下方向に薄くしながらも、熱媒供給用連通路および熱媒戻し用連通路の通路面積を大きくすることができることになる。
そして、ヘッダ本体をその上下方向に薄くすることによって、ヘッダ本体の上下方向での厚みが薄い床暖房パネルであっても、その床暖房パネルよりも上方側に突出しない薄型の床暖房パネル用熱媒ヘッダを製作することができることになり、ヘッダ本体の上下方向での厚みが薄い床暖房パネルにも対応可能な床暖房パネル用熱媒ヘッダを製作することができることになる。
【００２０】
したがって、供給用平板構成体と供給用中空構成体と中間平板構成体と戻し用中空構成体と戻し用平板構成体とを積層状態で接合するだけで、熱媒供給用連通路の形状、および、熱媒戻し用連通路の形状を、ヘッダ本体の上下方向に薄くて横幅が広い偏平な形状として、ヘッダ本体の上下方向での厚みが薄い床暖房パネルにも対応可能な床暖房パネル用熱媒ヘッダを製作することができながら、ヘッダ本体の製作の容易化を図ることができることになる。
【００２１】
請求項２に記載の発明によれば、前記ヘッダ本体における前記熱媒受入用接続部を接続する熱媒受入用接続箇所に、前記供給用中空構成体における中空空間と連通しかつ前記戻し用中空構成体における中空空間と仕切られている状態で、前記供給用中空構成体と前記中間平板構成体と前記戻し用中空構成体との積層方向に延びる熱媒受入用中継路を形成すべく、熱媒受入用中継路形成部分が、前記供給用中空構成体と前記中間平板構成体と前記戻し用中空構成体とに備えられ、
前記ヘッダ本体における前記熱媒供給部を接続する熱媒供給用接続箇所に、前記供給用中空構成体における中空空間と連通しかつ前記戻し用中空構成体における中空空間と仕切られている状態で、前記供給用中空構成体と前記中間平板構成体と前記戻し用中空構成体との積層方向に延びる熱媒供給用中継路を形成すべく、熱媒供給用中継路形成部分が、前記供給用中空構成体と前記中間平板構成体と前記戻し用中空構成体とに備えられ、
前記ヘッダ本体における前記熱媒戻し用接続部を接続する熱媒戻し用接続箇所に、前記戻し用中空構成体における中空空間と連通しかつ前記供給用中空構成体における中空空間と仕切られている状態で、前記供給用中空構成体と前記中間平板構成体と前記戻し用中空構成体との積層方向に延びる熱媒戻し用中継路を形成すべく、熱媒戻し用中継路形成部分が、前記供給用中空構成体と前記中間平板構成体と前記戻し用中空構成体とに備えられ、
前記ヘッダ本体における前記熱媒排出部を接続する熱媒排出用接続箇所に、前記戻し用中空構成体における中空空間と連通しかつ前記供給用中空構成体における中空空間と仕切られている状態で、前記供給用中空構成体と前記中間平板構成体と前記戻し用中空構成体との積層方向に延びる熱媒排出用中継路を形成すべく、熱媒排出用中継路形成部分が、前記供給用中空構成体と前記中間平板構成体と前記戻し用中空構成体とに備えられていることを特徴とする。
【００２２】
すなわち、供給用中空構成体における中空空間が、熱媒供給用連通路として利用され、戻し用中空構成体における中空空間が、熱媒戻し用連通路として利用されることになるので、熱媒受入用中継路が、熱媒供給用連通路と連通しかつ熱媒戻し用連通路と仕切られることになる。
また、熱媒供給用中継路は、熱媒供給用連通路と連通しかつ熱媒戻し用連通路と仕切られ、熱媒戻し用中継路は、熱媒供給用連通路と仕切られかつかつ熱媒戻し用連通路と連通し、熱媒排出用中継路は、熱媒供給用連通路と仕切られかつかつ熱媒戻し用連通路と連通することになる。
【００２３】
そして、供給用平板構成体と供給用中空構成体と中間平板構成体と戻し用中空構成体と戻し用平板構成体とを積層状態で接合することにより、熱媒受入用接続箇所には、熱媒供給用連通路と連通しかつ熱媒戻し用連通路と仕切られている熱媒受入用中継路が形成される。
また、熱媒供給用接続箇所には、熱媒供給用連通路と連通しかつ熱媒戻し用連通路と仕切られている熱媒供給用中継路が形成され、熱媒戻し用接続箇所には、熱媒戻し用連通路と連通しかつ熱媒供給用連通路と仕切られている熱媒戻し用中継路が形成され、熱媒排出用接続箇所には、熱媒戻し用連通路と連通しかつ熱媒供給用連通路と仕切られている熱媒排出用中継路が形成されることになる。
【００２４】
したがって、熱媒受入用接続部、熱媒戻し用接続部、熱媒供給部、および、熱媒排出部を接続するに当たって、供給用平板構成体と供給用中空構成体と中間平板構成体と戻し用中空構成体と戻し用平板構成体とを積層状態で接合したのち、熱媒受入用中継路、熱媒供給用中継路、熱媒戻し用中継路、および、熱媒排出用中継路に、例えば、ドリルにて孔加工することにより、熱媒受入用接続部と熱媒供給用連通路と熱媒供給部とを連通しかつ熱媒受入用接続部と熱媒供給用連通路と熱媒供給部とを連通することができることになる。
【００２５】
したがって、例えば、ドリルにて孔加工するという簡素な加工を行うだけで、熱媒受入用接続部と熱媒供給用連通路と熱媒供給部とを連通しかつ熱媒受入用接続部と熱媒供給用連通路と熱媒供給部とを連通する状態で、熱媒受入用接続部、熱媒戻し用接続部、熱媒供給部、および、熱媒排出部を接続することができることとなって、熱媒受入用接続部、熱媒戻し用接続部、熱媒供給部、および、熱媒排出部の接続を容易に行うことができることになる。
【００２９】
請求項３に記載の発明によれば、前記ヘッダ本体は、前記熱媒供給用連通路と前記熱媒戻し用連通路との間を断熱するように構成されていることを特徴とする。
【００３０】
すなわち、床暖房パネルに供給される熱媒供給用連通路を通流する熱媒と、床暖房パネルの通過により温度低下した熱媒戻し用連通路を通流する熱媒との間での熱の授受を防止することができることになるので、熱媒供給用連通路を通流する熱媒が熱媒戻し用連通路を通流する熱媒にて冷却されることを防止することができることになる。
したがって、床暖房パネルに供給される熱媒の温度が低くなるのを防止することができることとなって、暖房能力が低下するのを防止できることになる。
【００３１】
【発明の実施の形態】
本発明にかかる床暖房パネル用熱媒ヘッダを適応した床暖房パネルを図面に基づいて説明する。
〔第１実施形態〕
この床暖房パネルは、図１に示すように、熱媒流通管１が埋入状態で配管されている板状基材２からなる床暖房パネル本体３から構成され、その床暖房パネル本体３に蛇行状に配管されている熱媒流通管１に床暖房パネル用熱媒ヘッダ４を介して図外の熱源機から熱媒としての温水を流通させることにより、暖房対象の床を暖房するように構成されている。
そして、床暖房パネル用熱媒ヘッダ４には、４本の熱媒流通管１が接続され、板状基材２に形成された溝部に熱媒流通管１を嵌め込むことにより、熱媒流通管１を埋入状態で配管するように構成されている。
【００３２】
前記熱媒流通管１は、一般的に架橋ポリエチレン管やポリブテン樹脂管などが使用され、接続部のない管から構成され、配管の信頼性を高めるようにしている。
そして、熱媒流通管１の両端は、床暖房パネル用熱媒ヘッダ４に接続され、図外の熱源機から熱媒が床暖房パネル用熱媒ヘッダ４を介して４本の熱媒流通管１の夫々に分流して供給され、４本の熱媒流通管１を通過した熱媒が床暖房パネル用熱媒ヘッダ４を介して合流して熱源機に戻されるように構成されている。
【００３３】
前記床暖房パネル本体３は、板状基材２と、熱媒流通管１が配管された状態で板状基材２の上面に設けられる均熱用の表面板５とから構成されている。
そして、板状基材２の材質は、発泡樹脂製のもの、木質製のものや、樹脂製のものなどが適応可能であり、発泡樹脂製のものでは、例えば、硬質のポリスチレン発泡体やポリエスチレン発泡体など各種の発泡体が適応可能であり、発泡体の上面に合成樹脂製の樹脂シート成型体を積層する構成としてもよい。
また、均熱用の表面板５としては、アルミ箔や熱伝導率がよい可撓性の薄い金属などで構成するようにしている。
【００３４】
以下、床暖房パネル用熱媒ヘッダ４の構成について説明を加える。
前記床暖房パネル用熱媒ヘッダ４は、図２に示すように、板状のブロック体からなるヘッダ本体６から構成され、そのヘッダ本体６の外周部に、熱源機からの熱媒受入用接続部７、熱源機への熱媒戻し用接続部８、床暖房パネルの熱媒入口に接続される熱媒供給部９、および、床暖房パネルの熱媒出口に接続される熱媒排出部１０が備えられている。
そして、ヘッダ本体６の内部には、図３に示すように、熱媒受入用接続部７と熱媒供給部９とを連通接続する熱媒供給用連通路１１と、熱媒戻し用接続部８と熱媒排出部１０とを連通接続する熱媒戻し用連通路１２とがヘッダ本体６の上下方向にずらした状態で区画形成されている。
【００３５】
説明を加えると、ヘッダ本体６の外側面部のひとつには、図２に示すように、熱媒受入用接続部７と熱媒戻し用接続部８とが、ヘッダ本体６の外周方向に並ぶように配設されている。
そして、熱媒受入用接続部７に熱源機からの熱源用往き管を接続し、熱媒戻し用接続部８に熱源機への熱源用戻し管を接続するように構成されている。
【００３６】
また、ヘッダ本体６の外側面部のうち、熱媒受入用接続部７と熱媒戻し用接続部８とが設けられている側面部に隣接する側面部には、熱媒供給部９の配設位置と熱媒排出部１０の配設位置とが対向する状態で、熱媒供給部９と熱媒排出部１０とがヘッダ本体６の外周方向に交互に並ぶように熱媒供給部９の２つと熱媒排出部１０の２つが配設されている。
このようにして、ヘッダ本体６の外側面部のうち、対向する一対の外側面部には、熱媒供給部９と熱媒排出部１０とがヘッダ本体６の外周方向に交互に並ぶ状態で配設され、熱媒供給部９に熱媒流通管１の熱媒入口側の端部を接続し、熱媒排出部１０に熱媒流通管１の熱媒出口側の端部を接続するように構成されている。
【００３７】
前記ヘッダ本体６の構成について説明を加えると、ヘッダ本体６が、図２〜図５に示すように、それの上下方向に分割形成された複数の板状構成体２６を積層状態で接合して構成されている。
ちなみに、図２は、床暖房パネル用熱媒ヘッダ４の斜視図であり、図３は、床暖房パネル用熱媒ヘッダ４の縦断面図であり、図４は、ヘッダ本体６の分解斜視図であり、図５は、複数の板状構成体２６の平面図である。
また、図３の（イ）は、床暖房パネル用熱媒ヘッダ４の縦断正面図であり、図３の（ロ）は、熱媒受入用接続部７を示す床暖房パネル用熱媒ヘッダ４の縦断側面図であり、図３の（ハ）は、熱媒戻し用接続部８を示す床暖房パネル用熱媒ヘッダ４の縦断側面図である。
【００３８】
説明を加えると、ヘッダ本体６における熱媒供給用連通路１１を形成する部分が、図５に示すように、平板状の供給用平板構成体２７と内部を繰り抜いた中空状の供給用中空構成体２８と平板状の中間平板構成体２９とから構成されている。
また、ヘッダ本体６における熱媒戻し用連通路１２を形成する部分が、中間平板構成体２９と内部を繰り抜いた中空状の戻し用中空構成体３０と平板状の戻し用平板構成体３１とから構成されている。
ちなみに、図５の（イ）は、供給用平板構成体２７を示し、図５の（ロ）は、供給用中空構成体２８を示し、図５の（ハ）は、中間平板構成体２９を示し、図５の（ニ）は、戻し用中空構成体３０を示し、図５の（ホ）は、戻し用平板構成体３１を示している。
【００３９】
そして、ヘッダ本体６が、図４に示すように、供給用平板構成体２７と中間平板構成体２９との間に供給用中空構成体２８を挟み込み、かつ、中間平板構成体２９と戻し用平板構成体３１との間に戻し用中空構成体３０を挟み込む状態で、供給用平板構成体２７と供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０と戻し用平板構成体３１とを積層状態で接合して構成されている。
【００４０】
このようにして、供給用平板構成体２７と供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０と戻し用平板構成体３１との複数の板状構成体２６を積層状態で接合することによって、供給用中空構成体２８における中空空間２８ａを利用して熱媒供給用連通路１１を形成し、その熱媒供給用連通路１１の形状をヘッダ本体６の上下方向に薄くて横幅が広い偏平な形状とするように構成されている。
また、熱媒戻し用連通路１２についても、戻し用中空構成体３０における中空空間３０ａを利用して熱媒戻し用連通路１２を形成し、その熱媒戻し用連通路１２の形状をヘッダ本体６の上下方向に薄くて横幅が広い偏平な形状とするように構成されている。
【００４１】
そして、供給用平板構成体２７と供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０と戻し用平板構成体３１との複数の板状構成体２６は、いずれも真鍮製の薄板体にて構成されている。
また、供給用平板構成体２７と戻し用平板構成体３１とは、例えば、その厚みが１ｍｍ程度に構成され、供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０とは、例えば、その厚みが２ｍｍ程度に構成されている。
【００４２】
そして、供給用中空構成体２８、中間平板構成体２９、戻し用中空構成体３０における加工は、例えば、プレス加工やエッチング加工により施されている。
また、供給用平板構成体２７と供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０と戻し用平板構成体３１との接合については、供給用平板構成体２７と供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０と戻し用平板構成体３１とを積層状態として、大きな接合面を備えて、例えば、ロウ付けにより接合するように構成されている。
【００４３】
前記ヘッダ本体６における熱媒受入用接続部７を接続する熱媒受入用接続箇所３２に、図３の（ロ）に示すように、供給用中空構成体２８における中空空間２８ａと連通しかつ戻し用中空構成体３０における中空空間３０ａと仕切られている状態で、供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０との積層方向に延びる熱媒受入用中継路３３を形成すべく、熱媒受入用中継路形成部分３４が、図５の（ロ）〜（ニ）に示すように、供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０とに備えられている。
【００４４】
説明を加えると、供給用中空構成体２８に備えられる熱媒受入用中継路形成部分３４は、図５の（ロ）に示すように、中空空間２８ａにて兼用され、中間平板構成体２９に備えられる熱媒受入用中継路形成部分３４は、図５の（ハ）に示すように、上下方向に貫通する貫通孔にて構成され、戻し用中空構成体３０に備えられる熱媒受入用中継路形成部分３４は、図５の（ニ）に示すように、中空空間３０ａと仕切られた状態で上下方向に貫通する貫通孔にて構成されている。
そして、図３の（ロ）に示すように、供給用平板構成体２７と供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０と戻し用平板構成体３１とを積層状態で接合することにより、熱媒受入用中継路形成部分３４にて熱媒受入用中継路３３が形成されるように構成されている。
このようにして、熱媒受入用中継路３３は、供給用平板構成体２７と供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０と戻し用平板構成体３１とを積層状態で接合することにより、熱媒供給用連通路１１と連通しかつ熱媒戻し用連通路１２と仕切られている状態で、複数の板状構成体２６の積層方向に沿って延びるように形成される。
【００４５】
そして、ヘッダ本体６における熱媒受入用接続箇所３２だけでなく、図３に示すように、ヘッダ本体６における熱媒供給部９を接続する熱媒供給用接続箇所３５、ヘッダ本体６における熱媒戻し用接続部８を接続する熱媒戻し用接続箇所３６、および、ヘッダ本体６における熱媒排出部１０を接続する熱媒排出用接続箇所３７にも、上述のような中継路を形成すべく、中継路形成部分が、図５の（ロ）〜（ニ）に示すように、供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０とに備えられている。
【００４６】
すなわち、熱媒供給用接続箇所３５に、図３の（イ）に示すように、供給用中空構成体２８における中空空間２８ａと連通しかつ戻し用中空構成体３０における中空空間３０ａと仕切られている状態で、供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０との積層方向に延びる熱媒供給用中継路３８を形成すべく、熱媒供給用中継路形成部分３９が、図５の（ロ）〜（ニ）に示すように、供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０とに備えられている。
そして、熱媒戻し用接続箇所３６に、図３の（ハ）に示すように、戻し用中空構成体３０における中空空間３０ａと連通しかつ供給用中空構成体２８における中空空間２８ａと仕切られている状態で、供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０との積層方向に延びる熱媒戻し用中継路４０を形成すべく、熱媒戻し用中継路形成部分４１が、図５の（ロ）〜（ニ）に示すように、供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０とに備えられている。
また、熱媒排出用接続箇所３７に、図３の（イ）に示すように、戻し用中空構成体３０における中空空間３０ａと連通しかつ供給用中空構成体２８における中空空間２８ａと仕切られている状態で、供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０との積層方向に延びる熱媒排出用中継路４２を形成すべく、熱媒排出用中継路形成部分４３が、図５の（ロ）〜（ニ）に示すように、供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０とに備えられている。
【００４７】
そして、熱媒供給用中継路形成部分３９、熱媒戻し用中継路形成部分４１、および、熱媒排出用中継路形成部分４３については、熱媒受入用中継路形成部分３４と同様に、中空空間にて兼用したり、上下方向に貫通する貫通孔にて構成したり、中空空間と仕切られた状態で上下方向に貫通する貫通孔にて構成されている。
説明を加えると、供給用中空構成体２８に備えられる、熱媒供給用中継路形成部分３９、熱媒戻し用中継路形成部分４１、および、熱媒排出用中継路形成部分４３については、図５の（ロ）に示すように、中空空間２８ａにて兼用したり、あるいは、中空空間２８ａと仕切られた状態で上下方向に貫通する貫通孔にて構成されている。
そして、中間平板構成体２９に備えられる、熱媒供給用中継路形成部分３９、熱媒戻し用中継路形成部分４１、および、熱媒排出用中継路形成部分４３については、図５の（ハ）に示すように、上下方向に貫通する貫通孔にて構成されている。
また、戻し用中空構成体３０に備えられる、熱媒供給用中継路形成部分３９、熱媒戻し用中継路形成部分４１、および、熱媒排出用中継路形成部分４３については、図５の（ニ）に示すように、中空空間３０ａと仕切られた状態で上下方向に貫通する貫通孔にて構成したり、あるいは、中空空間３０ａにて兼用されている。
【００４８】
このようにして、供給用平板構成体２７と供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０と戻し用平板構成体３１とを積層状態で接合することにより、熱媒受入用中継路３３、熱媒供給用中継路３８、熱媒戻し用中継路４０、および、熱媒排出用中継路４２を形成するように構成されている。
【００４９】
そして、供給用平板構成体２７と供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０と戻し用平板構成体３１とを積層状態で接合したのち、熱媒受入用中継路３３、熱媒供給用中継路３８、熱媒戻し用中継路４０、および、熱媒排出用中継路４２に、例えば、ドリルにて孔加工することにより、熱媒受入用接続部７、熱媒戻し用接続部８、熱媒供給部９、および、熱媒排出部１０を接続するように構成されている。
【００５０】
以下、熱媒受入用接続部７、熱媒戻し用接続部８、熱媒供給部９、および、熱媒排出部１０の接続について説明を加えるが、基本的には同様であるので、熱媒受入用接続部７を接続する場合を例に挙げて説明を加える。
図６の（イ）に示すように、供給用平板構成体２７と供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０と戻し用平板構成体３１とを積層状態で接合することにより、熱媒受入用接続箇所３２に熱媒受入用中継路３３が形成される。
そして、図６の（ロ）に示すように、熱媒受入用接続箇所３２において、供給用中空構成体２８と中間平板構成体２９と戻し用中空構成体３０とにわたる円形状の大径孔部４４をドリルにて孔加工したのち、その大径孔部４４の中央部分に、大径部４４と熱媒受入用中継路３３とを連通する円形状の小径孔部４５をドリルにて孔加工する。
その後、図６の（ハ）に示すように、大径孔部４４に熱媒受入用接続部７における円形状の鍔部７ａを嵌め込んだ状態で、ロウ付けにより熱媒受入用接続部７を熱媒受入用接続箇所３２に接続する。
【００５１】
そして、熱媒戻し用接続部８、熱媒供給部９、および、熱媒排出部１０の接続についても、熱媒受入用接続部７の接続と同様にして、ドリルにて大径孔部および小径孔部を孔加工して、ロウ付けすることにより行うようにしている。
【００８０】
〔別実施形態〕
（１）上記第１実施形態において、例えば、中間平板構成体２９を３枚の板体を積層して構成し、上下の板体の間に位置する真中の板体の内部を繰り抜いて、熱媒供給用連通路１１と熱媒戻し用連通路１２との間に中空空間を形成させて、熱媒供給用連通路１１と熱媒戻し用連通路１２との間を断熱するように構成して実施することも可能である。
【００８６】
（２）上記第１実施形態では、ヘッダ本体６の上下方向において、熱媒供給用連通路１１が熱媒戻し用連通路１２よりも上方側になるように、複数の板状構成体２６を積層状態で接合するようにしているが、熱媒戻し用連通路１２が熱媒供給用連通路１１よりも上方側になるように、複数の板状構成体２６を積層状態で接合して実施することも可能である。
【００８７】
（３）上記第１実施形態では、熱媒供給部９と熱媒排出部１０を４つずつ設けているが、熱媒供給部９と熱媒排出部１０の数については適宜変更が可能である。
【００８８】
（４）上記第１実施形態では、複数の板状構成体２６のいずれもが、真鍮製の薄板体にて構成されているが、複数の板状構成体２６の材質をステンレス製としてもよく、板状構成体２６の材質については適宜変更が可能である。
【図面の簡単な説明】
【図１】床暖房パネルの平面図
【図２】第１実施形態における床暖房パネル用熱媒ヘッダの斜視図
【図３】第１実施形態における床暖房パネル用熱媒ヘッダの縦断面図
【図４】第１実施形態におけるヘッダ本体の分解斜視図
【図５】第１実施形態における板状構成体の平面図
【図６】第１実施形態におけるヘッダ本体の要部を示す縦断面図
【符号の説明】
６ヘッダ本体
７熱媒受入用接続部
８熱媒戻し用接続部
９熱媒供給部
１０熱媒排出部
１１熱媒供給用連通路
１２熱媒戻し用連通路
２６板状構成体
２７供給用平板構成体
２８供給用中空構成体
２９中間平板構成体
３０戻し用中空構成体
３１戻し用平板構成体
３２熱媒受入用接続箇所
３３熱媒受入用中継路
３４熱媒受入用中継路形成部分
３５熱媒供給用接続箇所
３６熱媒戻し用接続箇所
３７熱媒排出用接続箇所
３８熱媒供給用中継路
３９熱媒供給用中継路形成部分
４０熱媒戻し用中継路
４１熱媒戻し用中継路形成部分
４２熱媒排出用中継路
４３熱媒排出用中継路形成部分[0001]
BACKGROUND OF THE INVENTION
The present invention provides a heat medium connected to a heat medium receiving connection from a heat source, a heat medium return connection to a heat source, and a heat medium connected to a heat medium inlet of a floor heating panel on the outer periphery of the header body composed of a plate-like block body. A medium supply part, and a heat medium discharge part connected to the heat medium outlet of the floor heating panel,
In the header body, a heat medium supply communication passage that connects the heat medium receiving connection portion and the heat medium supply portion, a heat medium return connection portion, and the heat medium discharge portion communicate with each other. The present invention relates to a heating medium header for a floor heating panel, which is partitioned in a state in which the connecting passage for returning the heating medium is shifted in the vertical direction of the header body.
[0002]
[Prior art]
The heating medium header for a floor heating panel as described above has a heat source receiving pipe connected to the heat medium receiving connection section, and a heat source return pipe to the heat source connected to the heat medium returning connection section. The heating medium inlet of the heating medium distribution pipe in the floor heating panel is connected to the heating medium supply section, and the heating medium outlet of the heating medium distribution pipe in the floor heating panel is connected to the heating medium discharge section. The heat medium supplied through the pipe is divided and supplied to the heat medium flow pipe in the floor heating panel, and the heat medium that returns after passing through the heat medium flow pipe in the floor heating panel is joined to the heat source. It is for returning to a heat source through a return pipe.
[0003]
In the heating medium header for the floor heating panel as described above, conventionally, the header body is formed in a rectangular tube shape, and by providing a plate-like body inside the rectangular tube-shaped header body, The heat medium supply communication path and the heat medium return communication path are partitioned in the vertical direction of the header body (see, for example, Patent Document 1).
[0004]
Further, in other conventional heating medium headers for floor heating panels, the inside of the block body is processed by a drill, whereby the heating medium supply communication path and the heating medium return communication path are provided in the header body. The partition is formed in a state shifted in the vertical direction of the main body (see, for example, Patent Document 2).
[0005]
[Patent Document 1]
JP-A-11-108382 [Patent Document 2]
JP-A-9-269135 [0006]
[Problems to be solved by the invention]
In the heating medium header for a floor heating panel shown in Patent Document 1, a heating medium supply communication path and a heating medium return communication path are provided by providing a plate-like body inside a rectangular tube-shaped header body. In order to prevent the heat medium flowing through the heat medium supply communication path and the heat medium flowing through the heat medium return communication path from being mixed with each other, The peripheral edge must be joined to the inner surface of the header body over the entire circumference so that there is no leakage of the heat medium, which makes it difficult to produce the header body.
[0007]
Incidentally, since the heat medium flowing through the heat medium return communication passage is a heat medium whose temperature is lowered by passing through the floor heating panel, the heat medium flowing through the heat medium return communication passage whose temperature has decreased If the heat medium flowing through the heat medium supply communication path supplied to the floor heating panel is mixed, the temperature of the heat medium supplied to the floor heating panel is lowered, and the heating capacity may be reduced.
[0008]
In the heating medium header for a floor heating panel shown in the above-mentioned Patent Document 2, the inside of the block body is processed by a drill to partition the heating medium supply communication path and the heating medium return communication path. Therefore, just by processing with the drill, the heating medium supply station is connected so that the heating medium flowing through the heating medium supply path and the heating medium flowing through the heating medium return path do not mix. The passage and the heat medium return communication passage can be partitioned.
However, since the work itself for forming the heat medium supply communication path and the heat medium return communication path is time consuming by machining with a drill, the header body is time consuming to manufacture. .
[0009]
Further, in the case where the heating medium supply communication path and the heat medium return communication path are partitioned by drilling, the area of the heat medium supply communication path and the heat medium return communication path is reduced. Therefore, the passage resistance of the communication passage for supplying the heat medium and the communication passage for returning the heat medium is increased, and the amount of the heat medium supplied from the heat medium header for the floor heating panel to the floor heating panel is reduced.
Therefore, in order to prevent the amount of the heating medium supplied from the heating medium header for the floor heating panel to the floor heating panel from being reduced, processing such as multiple heating medium supply communication paths is required, Processing is performed with a drill so as to form a plurality of communication passages for supplying a heat medium, and from this point, the production of the header body is troublesome.
[0010]
By the way, when the amount of the heat medium supplied from the floor heating panel heat medium header to the floor heating panel decreases, the amount of heat medium required by the floor heating panel from the heat source to the floor heating panel heat medium header. In spite of the supply of heat, the required amount of heat medium is not supplied to the floor heating panel, which may reduce the heating capacity.
[0011]
This invention is made paying attention to this point, and the objective is to provide the heating-medium header for floor heating panels which can attain manufacture of a header main body easily.
[0012]
[Means for Solving the Problems]
[Invention of Claim 1]
In order to achieve this object, according to the first aspect of the present invention, the outer periphery of the header body made of a plate-like block body is connected to the connecting portion for receiving the heat medium from the heat source, for returning the heat medium to the heat source. A connecting part, a heating medium supply part connected to the heating medium inlet of the floor heating panel, and a heating medium discharge part connected to the heating medium outlet of the floor heating panel;
In the header body, a heat medium supply communication passage that connects the heat medium receiving connection portion and the heat medium supply portion, a heat medium return connection portion, and the heat medium discharge portion communicate with each other. In the heating medium header for a floor heating panel that is partitioned and formed in a state in which the connecting passage for returning the heating medium is shifted in the vertical direction of the header body,
Of the outer surface portions of the header body, a pair of opposed outer surface portions are provided with the heat medium supply portion and the heat medium discharge portion alternately arranged in the outer peripheral direction of the header body, Is formed by joining a plurality of plate-like structures divided and formed in the vertical direction thereof in a laminated state ,
The portion of the header body that forms the heating medium supply communication passage is composed of a flat plate-shaped supply plate structure, a hollow supply hollow structure that has been pulled out, and a flat intermediate plate structure. And
The portion of the header body that forms the heat medium return communication passage is composed of the intermediate flat plate structure, a hollow return hollow structure body that has been pulled out inside, and a flat plate-shaped return flat plate structure.
The header body sandwiches the supply hollow structure between the supply flat plate structure and the intermediate flat plate structure, and the return body between the intermediate flat plate structure and the return flat plate structure. In the state where the hollow structure for sandwiching is sandwiched, the supply flat structure, the supply hollow structure, the intermediate flat structure, the return hollow structure, and the return flat structure are joined in a laminated state. It is configured .
[0013]
That is, since the header body is configured by joining a plurality of plate-like structures divided and formed in the vertical direction of the header body in a laminated state, for example, a hollow shape in which the inside is pulled out, a cross-sectional shape is recessed, By combining flat plate-like structures and joining them in a stacked state, the heat medium supply communication path and the heat medium return communication path are partitioned in the vertical direction of the header body to form a header body. Can be configured.
And since a some plate-shaped structure is joined in a lamination | stacking state, a large joining surface is provided and a some plate-shaped structure can be joined by the joining surface.
Therefore, since the plate-like structure can be joined in a laminated state with a large joining surface, it can be joined easily without leaking of the heat medium, and the header body can be easily manufactured. Will be able to.
[0014]
Further, since the plurality of plate-like structures are divided and formed in the vertical direction of the plate-like header body, the number of plate-like structures is smaller than that formed in the horizontal direction of the header body. Thus, the header main body can be configured. From this point, the header main body can be easily manufactured.
[0015]
Since the shape of the communication path for supplying the heat medium and the shape of the communication path for returning the heat medium are determined according to the shape of the plate-like structure, the heat medium supply is adjusted by adjusting the shape of the plate-like structure. The shape of the communication passage for heating and the shape of the communication passage for returning the heat medium are flat and thin in the vertical direction of the header main body, and the passage area of the communication passage for supplying the heat medium and the communication passage for returning the heat medium Can be made large.
Accordingly, the passage resistance of the heat medium supply communication path and the heat medium return communication path can be reduced, and the heat medium header for the floor heating panel is supplied to the floor heating panel without any further processing. Since the amount of the heat medium can be prevented from being reduced, the header body can be easily manufactured from this point.
[0016]
As described above, according to the first aspect of the present invention, the heat medium and the heat medium return flow that flow through the communication path for supplying the heat medium simply by joining a plurality of plate-like structures in a laminated state. The heat medium supply communication path and the heat medium return communication path are partitioned so that the heat medium flowing through the communication path is not mixed, and the heat medium supply communication path and the heat medium return communication path are formed. As a result, the header body can be manufactured while increasing the passage area, and a heating medium header for a floor heating panel that can facilitate the manufacture of the header body can be provided.
[0018]
According to the first aspect of the present invention, in the state in which the supply hollow structure is sandwiched between the supply flat structure and the intermediate flat structure, the supply flat structure, the supply hollow structure, and the intermediate By joining the flat plate structure in a laminated state, a heat medium supply communication path can be formed using the hollow space in the supply hollow structure, and the shape of the heat medium supply communication path is defined as the header body. Thus, a flat shape that is thin in the vertical direction and wide in width can be obtained.
Also, the intermediate flat plate structure, the return hollow structure, and the return flat plate structure are joined in a stacked state with the return hollow structure sandwiched between the intermediate flat plate structure and the return flat plate structure. Thus, the heat medium return communication path is formed using the hollow space in the return hollow structure, and the shape of the heat medium return communication path is made flat and thin in the vertical direction of the header body and wide in width. Will be able to.
[0019]
As described above, the shape of the communication path for supplying the heat medium and the shape of the communication path for returning the heat medium can be formed into a flat shape that is thin in the vertical direction of the header body and wide in width. While being thin in the vertical direction, the passage areas of the heat medium supply communication path and the heat medium return communication path can be increased.
And by thinning the header body in the vertical direction, the heat for a thin floor heating panel that does not protrude upward from the floor heating panel even if the header body is thin in the vertical direction is thin. A medium header can be manufactured, and a heating medium header for a floor heating panel that can be applied to a floor heating panel having a thin header body in the vertical direction can be manufactured.
[0020]
Therefore, the shape of the communication passage for supplying the heat medium can be obtained by simply joining the supply plate structure, the supply hollow structure, the intermediate plate structure, the return hollow structure, and the return plate structure in a laminated state, and The heating medium return communication passage has a flat shape that is thin in the vertical direction of the header body and wide in width, and can be used for floor heating panels that are thin in the vertical direction of the header body. While the medium header can be manufactured, the header body can be easily manufactured.
[0021]
According to invention of Claim 2, it connects with the hollow space in the said hollow structure for supply, and the said return hollow is connected to the connection place for heat-medium reception which connects the said connection part for heat-medium reception in the said header main body. In order to form a heat medium receiving relay path extending in the stacking direction of the supply hollow structure, the intermediate flat plate structure, and the return hollow structure in a state of being partitioned from the hollow space in the structure. A medium receiving relay path forming portion is provided in the supply hollow structure, the intermediate flat plate structure, and the return hollow structure.
In a state where the heating medium supply connecting portion for connecting the heating medium supply section in the header body communicates with the hollow space in the supply hollow structure and is partitioned from the hollow space in the return hollow structure, In order to form a heat medium supply relay path extending in the stacking direction of the supply hollow structure, the intermediate flat plate structure, and the return hollow structure, the heat medium supply relay path forming portion is provided with the supply hollow. Provided to the structure, the intermediate plate structure and the return hollow structure,
The heat medium return connection portion connecting the heat medium return connection portion in the header body communicates with the hollow space in the return hollow structure and is partitioned from the hollow space in the supply hollow structure In order to form a heat medium return relay path extending in the stacking direction of the supply hollow structure, the intermediate flat plate structure, and the return hollow structure, the heat medium return relay path forming portion includes the supply A hollow structural body, the intermediate plate structural body and the return hollow structural body,
In a state where the heating medium discharge connecting portion for connecting the heat medium discharging portion in the header body communicates with the hollow space in the return hollow structure and is partitioned from the hollow space in the supply hollow structure, In order to form a heat medium discharge relay path extending in the stacking direction of the supply hollow structure, the intermediate flat plate structure, and the return hollow structure, the heat medium discharge relay path forming portion is formed of the supply hollow. It is provided in the structure, the intermediate flat plate structure, and the return hollow structure.
[0022]
That is, the hollow space in the supply hollow structure is used as a heat medium supply communication path, and the hollow space in the return hollow structure is used as a heat medium return communication path. The relay passage communicates with the heat medium supply communication path and is partitioned from the heat medium return communication path.
The heating medium supply relay path communicates with the heating medium supply communication path and is partitioned from the heating medium return communication path, and the heating medium return relay path is partitioned from the heating medium supply communication path and extends from the heating medium. The heat medium discharge relay path communicates with the return communication path, is partitioned from the heat medium supply communication path, and communicates with the heat medium return communication path.
[0023]
Then, by joining the supply flat plate structure, the supply hollow structure body, the intermediate flat plate structure body, the return hollow structure body, and the return flat plate structure in a laminated state, the heat medium receiving connection portion has a heat A relay passage for receiving the heat medium is formed which communicates with the communication passage for supplying the medium and is partitioned from the communication passage for returning the heat medium.
In addition, a heat medium supply connecting passage is formed in the heat medium supply connecting portion and communicated with the heat medium supplying communication passage and partitioned from the heat medium returning communication passage. A relay path for returning the heat medium is formed which communicates with the communication path for returning the heat medium and is partitioned from the communication path for supplying the heat medium, and communicates with the communication path for returning the heat medium at the connection point for discharging the heat medium. In addition, a relay passage for discharging the heat medium that is partitioned from the communication passage for supplying the heat medium is formed.
[0024]
Therefore, in connecting the connection part for receiving the heat medium, the connection part for returning the heat medium, the heat medium supplying part, and the heat medium discharging part, the supply plate structure, the supply hollow structure, the intermediate plate structure, and the return After joining the hollow structure for return and the flat plate structure for return in a laminated state, the relay path for receiving the heat medium, the relay path for supplying the heat medium, the relay path for returning the heat medium, and the relay path for discharging the heat medium, For example, by drilling with a drill, the connection part for receiving the heat medium, the communication path for supplying the heat medium, and the heat medium supply part are communicated, and the connection part for receiving the heat medium, the communication path for supplying the heat medium, and the heat medium It is possible to communicate with the supply unit.
[0025]
Therefore, for example, the heat medium receiving connection portion, the heat medium supplying communication path, and the heat medium supplying portion are communicated and the heat medium receiving connection portion and the heat are simply formed by drilling with a drill. In a state where the communication path for supplying the medium and the heating medium supplying section are in communication, the connecting section for receiving the heating medium, the connecting section for returning the heating medium, the heating medium supplying section, and the discharging medium for the heating medium can be connected. Thus, the connection of the heat medium receiving connection section, the heat medium returning connection section, the heat medium supply section, and the heat medium discharge section can be easily performed.
[0029]
According to a third aspect of the present invention, the header main body is configured to insulate between the heat medium supply communication path and the heat medium return communication path.
[0030]
That is, the heat between the heat medium flowing through the heat medium supply communication path supplied to the floor heating panel and the heat medium flowing through the heat medium return communication path whose temperature has decreased due to passage through the floor heating panel. Therefore, it is possible to prevent the heat medium flowing through the heat medium supply communication path from being cooled by the heat medium flowing through the heat medium return communication path. Become.
Accordingly, the temperature of the heat medium supplied to the floor heating panel can be prevented from being lowered, and the heating capacity can be prevented from being lowered.
[0031]
DETAILED DESCRIPTION OF THE INVENTION
A floor heating panel to which a heating medium header for a floor heating panel according to the present invention is applied will be described with reference to the drawings.
[First Embodiment]
As shown in FIG. 1, this floor heating panel is composed of a floor heating panel main body 3 composed of a plate-like base material 2 in which a heat medium flow pipe 1 is piped in an embedded state. Heating the floor to be heated by circulating hot water as a heating medium from a heat source unit (not shown) through a heating medium header 4 for a floor heating panel to the heating medium circulation pipe 1 piped in a meandering manner. It is configured.
And the four heating medium distribution pipes 1 are connected to the heating medium header 4 for the floor heating panel, and the heating medium distribution pipe 1 is fitted into the groove portion formed in the plate-like base material 2 to thereby distribute the heating medium. The pipe 1 is configured to be piped in an embedded state.
[0032]
The heat medium flow pipe 1 is generally a crosslinked polyethylene pipe, a polybutene resin pipe, or the like, and is composed of a pipe having no connection portion so as to increase the reliability of the pipe.
And both ends of the heat medium flow pipe 1 are connected to the heat medium header 4 for the floor heating panel, and the heat medium flows from the heat source machine (not shown) through the heat medium header 4 for the floor heating panel. 1 is divided and supplied, and the heat medium that has passed through the four heat medium flow pipes 1 joins via the floor heating panel heat medium header 4 and is returned to the heat source unit.
[0033]
The floor heating panel main body 3 is composed of a plate-like base material 2 and a surface plate 5 for heat equalization provided on the upper surface of the plate-like base material 2 in a state where the heat medium flow pipe 1 is piped.
The material of the plate-like substrate 2 can be made of foamed resin, wood, resin, etc. In the case of foamed resin, for example, a hard polystyrene foam or polyester is used. Various foams such as a styrene foam can be applied, and a synthetic resin resin sheet molded body may be laminated on the upper surface of the foam.
The soaking surface plate 5 is made of aluminum foil or a flexible thin metal having good thermal conductivity.
[0034]
Hereinafter, the configuration of the heating medium header 4 for a floor heating panel will be described.
As shown in FIG. 2, the heating medium header 4 for the floor heating panel is composed of a header body 6 made of a plate-like block body, and a connection for receiving a heat medium from a heat source device is provided on the outer periphery of the header body 6. Part 7, heat medium return connection part 8 to the heat source machine, heat medium supply part 9 connected to the heat medium inlet of the floor heating panel, and heat medium discharge part 10 connected to the heat medium outlet of the floor heating panel Is provided.
As shown in FIG. 3, the header body 6 has a heat medium supply communication passage 11 for connecting the heat medium receiving connection portion 7 and the heat medium supply portion 9, and a heat medium return connection portion. A heat medium return communication passage 12 that communicates and connects 8 and the heat medium discharge portion 10 is partitioned in a state shifted in the vertical direction of the header body 6.
[0035]
In other words, on one of the outer side surfaces of the header body 6, as shown in FIG. 2, the heat medium receiving connection portion 7 and the heat medium returning connection portion 8 are arranged in the outer peripheral direction of the header body 6. It is arranged.
A heat source forward pipe from the heat source machine is connected to the heat medium receiving connection part 7, and a heat source return pipe to the heat source machine is connected to the heat medium return connection part 8.
[0036]
Further, among the outer side surfaces of the header body 6, the heat medium supply unit 9 is disposed on the side surface adjacent to the side surface on which the heat medium receiving connection unit 7 and the heat medium return connection unit 8 are provided. 2 of the heat medium supply unit 9 so that the heat medium supply unit 9 and the heat medium discharge unit 10 are alternately arranged in the outer peripheral direction of the header body 6 in a state where the position and the arrangement position of the heat medium discharge unit 10 face each other. Two heating medium discharge portions 10 are disposed.
In this way, the heat medium supply section 9 and the heat medium discharge section 10 are alternately arranged in the outer peripheral direction of the header body 6 on the pair of opposed outer surface sections of the header body 6. The heat medium supply pipe 9 is connected to the end of the heat medium flow pipe 1 on the heat medium inlet side, and the heat medium discharge section 10 is connected to the end of the heat medium flow pipe 1 on the heat medium outlet side. Has been.
[0037]
The structure of the header body 6 will be further described. As shown in FIGS. 2 to 5, the header body 6 is formed by joining a plurality of plate-like structures 26 divided in the vertical direction in a stacked state. It is configured.
2 is a perspective view of the heating medium header 4 for the floor heating panel, FIG. 3 is a longitudinal sectional view of the heating medium header 4 for the floor heating panel, and FIG. 4 is an exploded perspective view of the header body 6. FIG. 5 is a plan view of the plurality of plate-like structures 26.
3A is a longitudinal front view of the heating medium header 4 for the floor heating panel, and FIG. 3B is a heating medium header 4 for the floor heating panel showing the connection portion 7 for receiving the heat medium. FIG. 3C is a vertical side view of the heating medium header 4 for the floor heating panel showing the heating medium return connection portion 8.
[0038]
In addition, as shown in FIG. 5, the portion of the header body 6 that forms the heat medium supply communication path 11 has a flat supply plate structure 27 and a hollow supply hollow formed inside. It is comprised from the structure 28 and the flat intermediate | middle flat plate structure 29. FIG.
Moreover, the part which forms the communication path 12 for heat-medium return in the header main body 6 has the intermediate | middle flat plate structure 29, the hollow return hollow structure 30 which pulled out the inside, and the flat plate-shaped return flat plate structure 31. It is composed of
Incidentally, (a) in FIG. 5 shows the supply flat plate structure 27, (b) in FIG. 5 shows the supply hollow structure 28, and (c) in FIG. 5 shows the intermediate flat plate structure 29. 5 (D) shows the return hollow structural body 30, and FIG. 5 (E) shows the return flat structural body 31.
[0039]
As shown in FIG. 4, the header body 6 sandwiches the supply hollow structure 28 between the supply flat plate structure 27 and the intermediate flat plate structure 29, and the intermediate plate structure 29 and the return flat plate. In a state where the return hollow structural body 30 is sandwiched between the structural bodies 31, the supply flat structural body 27, the supply hollow structural body 28, the intermediate flat structural body 29, the return hollow structural body 30, and the return flat structural body. 31 is joined in a laminated state.
[0040]
In this way, a plurality of plate-like structures 26 of the supply plate structure 27, the supply hollow structure 28, the intermediate plate structure 29, the return hollow structure 30 and the return plate structure 31 are laminated. The heating medium supply communication path 11 is formed using the hollow space 28a in the supply hollow structure 28, and the shape of the heat medium supply communication path 11 is made thin in the vertical direction of the header body 6. And a flat shape with a wide lateral width.
In addition, for the heat medium return communication path 12, the heat medium return communication path 12 is formed using the hollow space 30a in the return hollow structure 30, and the shape of the heat medium return communication path 12 is changed to the header body. 6 is configured to have a flat shape that is thin in the vertical direction and wide in width.
[0041]
Each of the plurality of plate-like components 26 of the supply flat plate member 27, the supply hollow member 28, the intermediate flat plate member 29, the return hollow member 30 and the return flat plate member 31 is made of brass. It is comprised by the thin-plate body.
Further, the supply flat plate structure 27 and the return flat plate structure 31 are configured to have a thickness of about 1 mm, for example, and the supply hollow structure 28, the intermediate flat plate structure 29, and the return hollow structure 30 are For example, the thickness is configured to be about 2 mm.
[0042]
The processing in the supply hollow structure 28, the intermediate flat plate structure 29, and the return hollow structure 30 is performed, for example, by pressing or etching.
In addition, regarding the joining of the supply flat plate structure 27, the supply hollow structure 28, the intermediate flat plate structure 29, the return hollow structure 30, and the return flat plate structure 31, the supply flat plate structure 27 and the supply flat plate structure 31. The hollow structure 28, the intermediate plate structure 29, the return hollow structure 30 and the return plate structure 31 are laminated so as to have a large joining surface and are joined by, for example, brazing. .
[0043]
As shown in FIG. 3B, the heat medium receiving connection portion 32 connecting the heat medium receiving connection portion 7 in the header body 6 communicates with the hollow space 28a in the supply hollow structure 28 and returns. A heat medium receiving relay path 33 extending in the stacking direction of the supply hollow structure 28, the intermediate flat plate structure 29, and the return hollow structure 30 in a state of being partitioned from the hollow space 30 a in the hollow structure 30. As shown in FIGS. 5 (B) to 5 (D), the heating medium receiving relay path forming portion 34 includes a supply hollow structure 28, an intermediate flat plate structure 29, and a return hollow structure 30. Is provided.
[0044]
In addition, as shown in FIG. 5B, the heating medium receiving relay path forming portion 34 provided in the supply hollow structure 28 is also used in the hollow space 28a, and is connected to the intermediate plate structure 29. As shown in FIG. 5C, the heat medium receiving relay passage forming portion 34 is provided with a through-hole penetrating in the vertical direction, and the heat medium receiving relay provided in the return hollow structure 30. As shown in FIG. 5D, the path forming portion 34 is configured by a through-hole penetrating in the vertical direction while being partitioned from the hollow space 30a.
Then, as shown in FIG. 3B, the supply flat plate structure 27, the supply hollow structure 28, the intermediate flat plate structure 29, the return hollow structure 30, and the return flat plate structure 31 are laminated. Thus, the heat medium receiving relay path 33 is formed in the heat medium receiving relay path forming portion 34.
In this manner, the heat medium receiving relay path 33 is formed by laminating the supply flat plate structure 27, the supply hollow structure 28, the intermediate flat plate structure 29, the return hollow structure 30, and the return flat plate structure 31. By joining in a state, it is formed so as to extend along the laminating direction of the plurality of plate-like structures 26 in a state where it communicates with the heat medium supply communication path 11 and is partitioned from the heat medium return communication path 12. Is done.
[0045]
As shown in FIG. 3, not only the heat medium receiving connection portion 32 in the header body 6, but also the heat medium supply connection portion 35 for connecting the heat medium supply section 9 in the header body 6, and the heat medium in the header body 6. A relay path as described above should also be formed at the connection point 36 for returning the heat medium connecting the connection part 8 for return and the connection point 37 for discharging the heat medium connecting the heat medium discharging part 10 in the header body 6. As shown in FIGS. 5B to 5D, the relay path forming portion is provided in the supply hollow structure 28, the intermediate flat plate structure 29, and the return hollow structure 30.
[0046]
That is, as shown in FIG. 3A, the heating medium supply connection portion 35 communicates with the hollow space 28a in the supply hollow structure 28 and is partitioned from the hollow space 30a in the return hollow structure 30. In order to form the heat medium supply relay path 38 extending in the stacking direction of the supply hollow structure 28, the intermediate flat plate structure 29, and the return hollow structure 30, the heat medium supply relay path forming portion 39 is formed. However, as shown in (b) to (d) of FIG. 5, the supply hollow structure 28, the intermediate flat plate structure 29, and the return hollow structure 30 are provided.
Then, as shown in FIG. 3C, the heat medium return connection portion 36 communicates with the hollow space 30a in the return hollow structure 30 and is partitioned from the hollow space 28a in the supply hollow structure 28. In order to form the heat medium return relay path 40 extending in the stacking direction of the supply hollow structure 28, the intermediate flat plate structure 29, and the return hollow structure 30, the heat medium return relay path forming portion 41 is formed. However, as shown in (b) to (d) of FIG. 5, the supply hollow structure 28, the intermediate flat plate structure 29, and the return hollow structure 30 are provided.
Further, as shown in FIG. 3A, the heating medium discharge connection portion 37 communicates with the hollow space 30a in the return hollow structure 30 and is partitioned from the hollow space 28a in the supply hollow structure 28. In order to form the heat medium discharge relay path 42 extending in the stacking direction of the supply hollow structure 28, the intermediate flat plate structure 29, and the return hollow structure 30, the heat medium discharge relay path forming portion 43. However, as shown in (b) to (d) of FIG. 5, the supply hollow structure 28, the intermediate flat plate structure 29, and the return hollow structure 30 are provided.
[0047]
The heating medium supply relay path forming portion 39, the heat medium returning relay path forming portion 41, and the heat medium discharging relay path forming portion 43 are hollow as in the case of the heat medium receiving relay path forming portion 34. It is composed of a through-hole that is used in a space, is formed by a through-hole penetrating in the vertical direction, or is penetrated in a vertical direction in a state of being partitioned from the hollow space.
When the explanation is added, the heating medium supply relay path forming portion 39, the heat medium returning relay path forming portion 41, and the heat medium discharging relay path forming portion 43 provided in the supply hollow structure 28 are illustrated in FIG. As shown in (b) of FIG. 5, it is configured by a through hole that is used in the hollow space 28a or penetrates in the vertical direction while being partitioned from the hollow space 28a.
Then, the heat medium supplying relay path forming portion 39, the heat medium returning relay path forming portion 41, and the heat medium discharging relay path forming portion 43 provided in the intermediate flat plate structure 29 are shown in FIG. As shown in FIG. 4, the through hole penetrates in the vertical direction.
Further, the heating medium supply relay path forming portion 39, the heat medium returning relay path forming portion 41, and the heat medium discharging relay path forming portion 43 provided in the return hollow structural body 30 are shown in FIG. As shown in (d), it is constituted by a through-hole penetrating in the vertical direction in a state of being partitioned from the hollow space 30a, or is shared by the hollow space 30a.
[0048]
In this way, the supply flat plate structure 27, the supply hollow plate structure 28, the intermediate flat plate structure 29, the return hollow plate structure 30, and the return flat plate structure 31 are joined in a laminated state, so that The receiving relay path 33, the heat medium supply relay path 38, the heat medium return relay path 40, and the heat medium discharge relay path 42 are formed.
[0049]
Then, the supply flat plate structure 27, the supply hollow plate structure 28, the intermediate flat plate structure 29, the return hollow plate structure 30, and the return flat plate structure 31 are joined in a laminated state, and then a heat medium receiving relay path 33, for example, by drilling a hole in the heat medium supply relay path 38, the heat medium return relay path 40, and the heat medium discharge relay path 42 with a drill, The return connection portion 8, the heat medium supply portion 9, and the heat medium discharge portion 10 are configured to be connected.
[0050]
Hereinafter, the connection of the heat medium receiving connection section 7, the heat medium returning connection section 8, the heat medium supply section 9, and the heat medium discharge section 10 will be described. The case of connecting the receiving connection portion 7 will be described as an example.
As shown in FIG. 6A, the supply flat plate structure 27, the supply hollow structure 28, the intermediate flat plate structure 29, the return hollow structure 30, and the return flat plate structure 31 are joined in a laminated state. As a result, the relay passage 33 for receiving the heat medium is formed at the connection portion 32 for receiving the heat medium.
Then, as shown in FIG. 6B, a circular large-diameter hole extending over the supply hollow structure 28, the intermediate flat plate structure 29, and the return hollow structure 30 at the heat medium receiving connection portion 32. After drilling 44 with a drill, a circular small-diameter hole 45 communicating with the large-diameter portion 44 and the heat medium receiving relay path 33 is drilled with a drill at the center of the large-diameter hole 44. To do.
Thereafter, as shown in FIG. 6C, the heat medium receiving connection portion 7 is brazed by brazing in a state where the circular flange portion 7a of the heat medium receiving connection portion 7 is fitted into the large-diameter hole portion 44. Is connected to the connection point 32 for receiving the heat medium.
[0051]
And about the connection of the connection part 8 for heat-medium return, the heat-medium supply part 9, and the heat-medium discharge part 10, it is the same as the connection of the connection part 7 for heat-medium reception, and a large-diameter hole part and The small diameter hole is drilled and brazed.
[0080]
[Another embodiment]
(1) In the first embodiment, for example, the intermediate flat plate member 29 is configured by stacking three plate members, and the inside of the middle plate member positioned between the upper and lower plate members is pulled out, A hollow space is formed between the heat medium supply communication path 11 and the heat medium return communication path 12, and the heat medium supply communication path 11 and the heat medium return communication path 12 are insulated. It is also possible to carry out.
[0086]
(2) In the first implementation embodiment, in the vertical direction of the header body 6, so that the heat medium supply communication passage 11 is the upper side than the communication path 12 for returning heat transfer medium, a plurality of plate-like structure 26 Are joined in a laminated state, but a plurality of plate-like structures 26 are joined in a laminated state so that the heat medium return communication path 12 is located above the heat medium supply communication path 11. It is also possible to implement.
[0087]
(3) In the first implementation embodiment, is provided with the heat medium supply unit 9 and the heat medium discharging portion 10 by four, it can be appropriately changed on the number of the heat medium supply unit 9 and the heat medium discharging portion 10 It is.
[0088]
(4) In the first embodiment, any of the plurality of plate-like structure 26, are constituted by brass of the sheet body, the material of multiple plate-like structure 26 as made of stainless In addition , the material of the plate- like structure 26 can be appropriately changed.
[Brief description of the drawings]
FIG. 1 is a plan view of a floor heating panel. FIG. 2 is a perspective view of a heating medium header for a floor heating panel in the first embodiment. FIG. 3 is a longitudinal sectional view of a heating medium header for a floor heating panel in the first embodiment. FIG. 4 is an exploded perspective view of the header body in the first embodiment. FIG. 5 is a plan view of the plate-like structure in the first embodiment. FIG. 6 is a longitudinal sectional view showing the main part of the header body in the first embodiment . Explanation of symbols]
6 communicating path for header body 7 heating medium return receiving connecting portions 8 heat medium return connection portions 9 heating medium supply unit 10 heat medium discharge unit 11 heating medium supply communication passage 12 heat transfer
2 6 Plate-shaped structure 27 Supply flat structure 28 Supply hollow structure 29 Intermediate flat structure 30 Return hollow structure 31 Return flat structure 32 Heat medium receiving connection point 33 Heat medium receiving relay path 34 Heat medium receiving relay path forming part 35 Heat medium supplying connection part 36 Heat medium returning connection part 37 Heat medium discharging connection part 38 Heat medium supplying relay path 39 Heat medium supplying relay path forming part 40 Heat medium returning part Relay path 41 Heat medium return relay path forming part 42 Heat medium discharging relay path 43 Heat medium discharging relay path forming part

Claims

On the outer periphery of the header body composed of a plate-shaped block body, a connection part for receiving a heat medium from a heat source, a connection part for returning a heat medium to a heat source, a heat medium supply part connected to a heat medium inlet of a floor heating panel, And a heat medium discharge part connected to the heat medium outlet of the floor heating panel,
In the header body, a heat medium supply communication passage that connects the heat medium receiving connection portion and the heat medium supply portion, a heat medium return connection portion, and the heat medium discharge portion communicate with each other. A heating medium header for a floor heating panel that is partitioned in a state in which the connecting passage for returning the heating medium is shifted in the vertical direction of the header body,
Of the outer surface portions of the header body, a pair of opposed outer surface portions are arranged with the heat medium supply portion and the heat medium discharge portion alternately arranged in the outer peripheral direction of the header body,
The header body is configured by joining a plurality of plate-like structures formed in the vertical direction of the header body in a stacked state ,
The portion of the header body that forms the heating medium supply communication passage is composed of a flat plate-shaped supply plate structure, a hollow supply hollow structure that has been pulled out, and a flat intermediate plate structure. And
The portion of the header body that forms the heat medium return communication passage is composed of the intermediate flat plate structure, a hollow return hollow structure body that has been pulled out inside, and a flat plate-shaped return flat plate structure.
The header body sandwiches the supply hollow structure between the supply flat plate structure and the intermediate flat plate structure, and the return body between the intermediate flat plate structure and the return flat plate structure. In the state where the hollow structure for sandwiching is sandwiched, the supply flat structure, the supply hollow structure, the intermediate flat structure, the return hollow structure, and the return flat structure are joined in a laminated state. Heat carrier header for floor heating panel that is configured .

The heat medium receiving connection portion connecting the heat medium receiving connection portion in the header body communicates with the hollow space in the supply hollow structure and is partitioned from the hollow space in the return hollow structure In order to form a heat medium receiving relay path extending in the stacking direction of the supply hollow structure, the intermediate flat plate structure, and the return hollow structure, the heat medium receiving relay path forming portion includes the supply A hollow structural body, the intermediate plate structural body and the return hollow structural body,
In a state where the heating medium supply connecting portion for connecting the heating medium supply section in the header body communicates with the hollow space in the supply hollow structure and is partitioned from the hollow space in the return hollow structure, In order to form a heat medium supply relay path extending in the stacking direction of the supply hollow structure, the intermediate flat plate structure, and the return hollow structure, the heat medium supply relay path forming portion is provided with the supply hollow. Provided to the structure, the intermediate plate structure and the return hollow structure,
The heat medium return connection portion connecting the heat medium return connection portion in the header body communicates with the hollow space in the return hollow structure and is partitioned from the hollow space in the supply hollow structure In order to form a heat medium return relay path extending in the stacking direction of the supply hollow structure, the intermediate flat plate structure, and the return hollow structure, the heat medium return relay path forming portion includes the supply A hollow structural body, the intermediate plate structural body and the return hollow structural body,
In a state where the heating medium discharge connecting portion for connecting the heat medium discharging portion in the header body communicates with the hollow space in the return hollow structure and is partitioned from the hollow space in the supply hollow structure, In order to form a heat medium discharge relay path extending in the stacking direction of the supply hollow structure, the intermediate flat plate structure, and the return hollow structure, the heat medium discharge relay path forming portion is formed of the supply hollow. The heat-medium header for floor heating panels of Claim 1 with which the structure, the said intermediate | middle flat plate structure, and the said return hollow structure are equipped .

The heat for a floor heating panel according to claim 1, wherein the header body is configured to insulate between the communication path for supplying the heat medium and the communication path for returning the heat medium. Medium header.