JP4080141B2 - Manufacturing method of wire tool - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention is a wire tool mainly made of resin for cutting hard and brittle materials such as silicon ingots, quartz, quartz, and metal materials.Manufacturing methodIn particular, wire that can improve the accuracy and efficiency of cuttingTool manufacturingRegarding the method.
[0002]
[Prior art]
Conventionally, wire tools have been used as cutting tools for hard and brittle materials such as silicon ingots, quartz and quartz, and metal materials, but as cutting means for silicon wafers from ingots in particular with the recent increase in diameter of silicon wafers. Attention has been paid.
[0003]
Conventionally, a cutting method using an inner peripheral blade has been applied to cutting a silicon ingot. In recent years, silicon wafers have been steadily increased in diameter to reduce and optimize the production cost of semiconductor devices. To increase the diameter of such wafers, the diameter of the inner peripheral blade has been increased. I have responded with. However, especially for silicon ingots of 8 inches or more, there is a limit to improving the throughput, cutting loss (Kerf-loss) is large, and it is difficult to set the inner peripheral blade to the cutting jig. The cutting method is changing from the inner peripheral cutting method to the multi-wire cutting method ("Electronic Materials" Vol. 35, No. 7, July 1996, page 29).
[0004]
By the way, as shown in FIG. 5, the conventional silicon ingot cutting process using a wire is performed in a predetermined path from a new wire reel 2 of a wire 1 such as a piano wire to a take-up roller 5. The main roller 4 and the like are provided to form a wire array having a predetermined pitch close to the ingot 6, and a highly viscous abrasive slurry is supplied from the slurry nozzle 7 and the ingot 6 is pressed against the wire array. Thus, the ingot 6 was cut to form a free abrasive grain. However, due to the free abrasive processing method, a large amount of industrial waste (waste liquid) is generated, running cost is high, wafer cleaning after cutting is difficult, improvement in processing efficiency cannot be expected, and cutting accuracy is poor. There were drawbacks.
[0005]
In order to solve these problems, there is a wire tool in which abrasive grains are fixed to a wire, that is, a fixed abrasive wire tool, which is already an electrodeposited wire tool (Japanese Patent Laid-Open No. 63-22275, Japanese Patent Publication No. 4-4105). Disclosed in Japanese Patent Laid-Open No. 7-227767, Japanese Patent Laid-Open No. 9-150314, etc.) or by a manufacturing method in which abrasive grains are mechanically embedded in the piano wire itself (trade name: Wiremond, Sumitomo Electric 3 / Showa 63) No. 132, described on pages 118-122). In these tools, a metal is used as a binder for fixing the abrasive grains.
[0006]
However, in wire tools using metal as a binder, the binder layer is hard, so the torsional strength and bending strength of the wire tool are low, and it is easy to break during processing. Due to the time required, the manufacturing cost is high, and it is difficult to lengthen the wire tool itself necessary for the multi-wire cutting method. In addition, in order to avoid the problem that the production cost of the wire is high and it is difficult to lengthen the wire, an endless type wire tool in which both ends of a short wire tool are joined has been prototyped. And the bending strength is extremely low.
[0007]
In order to solve these problems, wire tools using a resin as a binder have recently been developed. As a wire tool using a resin as a binder for fixing abrasive grains to such a wire and a manufacturing method thereof, a fixed abrasive diamond wire saw developed by Osaka Diamond Industrial Co., Ltd. 369-370), JP-A-8-126953, JP-A-9-155561, JP-A-10-138114, JP-A-10-151560, JP-A-10-315049, JP-A-10-. Those described in Japanese Patent No. 328932 and Japanese Patent Laid-Open No. 10-337612 are known. In these wire tools, the type of resin is not particularly limited, but as can be seen from the contents of the announcement, examples, etc., in fact, thermosetting resins such as phenolic resins conventionally used in grinding wheels are used. It is used. Japanese Patent Application Laid-Open No. 11-48035 discloses a wire tool using ceramic as a binder for increasing the abrasive grain holding strength.
[0008]
However, even in such an improved wire tool, since a thermosetting resin is used as a binder, a drying step for removing the solvent and a firing step for curing are required, and the time required for firing is also required. It takes several minutes at every wire tool point. In addition, when ceramic is used as the binder, not only the firing temperature is further increased, but the time required for firing is several tens of minutes or more. Therefore, it is difficult to manufacture a wire tool at a high speed, for example, at a speed of several hundred meters to several kilometers per minute, and it is extremely difficult to inexpensively manufacture a long wire tool having a length of 10 kilometers or more necessary for a multi-cutting method. It is. Furthermore, the wire tool using a thermosetting resin as a binder is lower in wear resistance, mechanical strength, heat resistance, and cutting efficiency than a wire tool using a metal as a binder. There's a problem.
[0009]
Therefore, from the viewpoint of improving the manufacturing speed, the photo-curing resin used for coating the optical fiber, etc., is replaced with a thermo-setting resin to make a binder, and further improve the wear resistance, mechanical strength, and heat resistance of the binder. Therefore, a technique for adding metal particles, metal fibers, or the like to a photocurable resin has been proposed (Japanese Patent Application No. 11-027857). Furthermore, in order to increase the adhesion strength between the wire and the bonding material to improve the wear resistance of the tool, a technique for multilayering the bonding material has been proposed (Japanese Patent Application No. 11-202225).
[0010]
[Problems to be solved by the invention]
However, when hard particles such as metal particles or hard fibers such as metal fibers or inorganic fibers are added to the bonding material, the hardness of the bonding material increases and the wear resistance of the tool improves. In addition, since the adhesiveness with the binder resin is poor, the additive itself drops off from the binder. As a result, the holding strength for holding the abrasive grains decreases, and the wear resistance of the tool decreases. Further, when the bonding material is multilayered, the adhesion strength between the wire and the bonding material is improved, but there is a problem that the manufacturing time of the tool is extended and the cost is increased.
[0011]
  The present invention has been made by paying attention to such a problem, and has a long life, high accuracy and high efficiency of cutting, and a long and inexpensive wire.Tool manufacturingIt aims to provide a method.
[0012]
[Means for solving problems]
  The invention according to claim 1 is a wire.The main component is a photo-curable resinWire tool with abrasive grains fixed with a single layer binderManufacturing methodBecauseA wire cleaning process for irradiating the wire with light, and a wire that has been subjected to the wire cleaning process running in the axial direction of the wire, with the photo-curing resin as a main component on the wire, one of abrasive grains and additives Or an adhesive application process for applying a mixed adhesive liquid containing both, and a photocuring process for photocuring the mixed adhesive liquid applied on the wire. In the adhesive application process, A mixed adhesive solution of a photocurable adhesive and abrasive grains containing 5 to 90 wt% of any or all of metal particles having an average particle diameter of 0.1 to 15 μm, inorganic powder, and organic resin powder is applied.It is characterized by that.
  Invention of Claim 2 is a manufacturing method of the wire tool which fixed the abrasive grain with the binder which consists of a photocurable resin on a wire as a main component, and consists of a single layer, Comprising: Light is irradiated to a wire and it wash | cleans A wire cleaning step, and a mixed adhesive liquid containing a light curable resin as a main component on the wire and containing one or both of abrasive grains and additives while running the wire subjected to the wire cleaning process in the axial direction. And a photocuring step for photocuring the mixed adhesive liquid applied on the wire, and in the adhesive application step, the minor axis is 0.1 on the wire. A mixed adhesive solution of a photocurable adhesive and abrasive grains containing 5 to 90 wt% of any or all of metal fibers, inorganic fibers, and organic resin fibers having a long diameter of 1 to 200 μm is applied.It is characterized by that.
[0013]
  A photo-curable adhesive causes a photochemical reaction when irradiated with light such as ultraviolet rays and visible light, and the polymerization effect is obtained in a few seconds or less.IsTherefore, by using this as a binder, the manufacturing speed is improved, and an inexpensive and long wire tool can be provided. Here, a photo-curing adhesive (a photo-curing resin introduced with a functional group that enhances adhesion to a metal such as a carboxyl group) is compared to other photo-curing resins with the metal that is the material of the wire. It has excellent adhesion and can improve the wear resistance of the tool. However, a photocurable adhesive is usually more flexible than other photocurable resins and, in some cases, has adhesiveness, so that a sufficient abrasive layer hardness cannot be obtained as it is. As a result of extensive research by the inventors, by optimizing the type and amount of additives to the photocurable adhesive, or by optimizing the atmosphere at the time of photocuring, the photocurable adhesive It has been found that the adhesiveness can be lowered, and even when the abrasive grains are fixed with a binder composed of a photocurable adhesive layer (single layer), a sufficient abrasive layer hardness can be obtained.
  Moreover, since ultraviolet rays and electron beams used as an energy source for curing the binder have a cleaning action on the surface of metal or the like, the ultraviolet rays are applied to the wire before the mixed adhesive liquid used as the binder is applied onto the wire. Etc. Irradiate. By this light irradiation, the surface of the wire is degreased, and sufficiently high adhesion strength between the wire and the binder layer can be obtained. In addition, a cleaning processing speed of several hundred meters per minute or more can be realized by light irradiation, and the manufacturing speed of the wire tool is greatly improved. Furthermore, a lower manufacturing cost than the conventional cleaning method can be realized.
[0014]
  The present invention as a referenceIs a wire tool in which abrasive grains are fixed with a single-layer binder formed in the radial direction of the wire tool, and the binder is mainly composed of a photocurable adhesive on the wire surface,Abrasive grain, additive or bothA photocurable adhesive layer formed by applying a mixed adhesive solution containingHave a configuration.
[0015]
In wire tools, when the binder is composed of a single photocurable adhesive, sufficient abrasive layer hardness may not be obtained, and abrasive grains may fall off during cutting, or the abrasive layer may become heavily worn. However, the mechanical strength and wear resistance of the tool can be improved by adding additives such as metal particles to the binder. Here, additives such as hard particles such as metal particles and hard fibers are hard, so the bonding material hardness is high and the wear resistance of the tool is improved, but the flexibility and flexibility are inferior. Since the adhesion to the material resin is poor, a phenomenon occurs in which the additive itself falls off from the binder, resulting in a decrease in abrasive grain holding strength and a decrease in wear resistance of the tool. Thus, it has been found that by adding an appropriate amount of organic resin powder or organic resin fiber (resin fiber) having excellent flexibility and good adhesion to the binder resin, the abrasive grain holding strength can be increased. In addition, although only organic resin powder may be used as an additive, furthermore, an appropriate amount of organic resin powder and hard particles such as metal particles are blended and mixed into a photo-curable adhesive liquid, thereby serving as a cutting tool. Sufficient tool hardness, flexibility, etc. can be obtained.
[0016]
  As a reference, the present inventionThe binder is a metal having an average particle size of 0.1 to 15 μm in a photocurable adhesive.Particle, averageInorganic with a particle size of 0.1 to 15 μmPowder, averageOrganic resin powder having a particle size of 0.1 to 15 μmAny or allA layer formed by adding 5 to 90 wt%Have a configuration.
[0017]
  As a reference, the present inventionThe binder is a metal having a minor axis of 0.1 to 15 μm and a major axis of 1 to 200 μm in a photocurable adhesive.Fiber, inorganic fiber, organicResin fiberAny or allA layer formed by adding 5 to 90 wt%Have a configuration.
[0023]
  Claim 3The invention described in claim1 or 2In the above, after the wire cleaning process, a chemical primer process is performed on the wire prior to the adhesive application step.
[0024]
By applying chemical primer treatment to the wire surface, it is possible to increase the adhesion between the bonding material film (photo-curing adhesive layer) and the wire surface, and to suppress the decrease in tool life due to the peeling of the bonding material film. it can.
[0026]
  Claim 7The invention described inClaims 1-6In any one of the above, in the adhesive coating step, the coated wire has a predetermined diameter, or the film thickness on the wire is set to a predetermined value and then cured by irradiation with light. It is characterized by that.
[0027]
  As a reference, the present inventionThe photocuring process is performed in an atmosphere with a reduced oxygen concentration than in the atmosphere.Is going.
[0028]
By reducing the oxygen concentration in the photocuring step as compared with that in the normal atmosphere, the polymerization curing reaction of the resin can be realized sufficiently stably and reliably. For example, even when the oxygen concentration in the photocuring process is reduced by 10% from that in normal air, a binder layer suitable for cutting can be obtained.
[0029]
  As a reference, the present inventionLight curing process in nitrogen atmosphereIs going.
[0030]
When the photocuring step is performed in a nitrogen atmosphere having no oxygen, the binder layer is completely cured, and a material that is sufficiently suitable for cutting is obtained.
[0031]
  Claim 4The invention described inClaims 1-3In any of the above, a heat aging step of heating and aging the photocured binder is characterized.
[0032]
When a metal powder effective for improving the wear resistance and heat resistance of a wire tool is added, light irradiation alone is caused by absorption and reflection of light in the added particle part and fiber part, and the action of metal ions in the additive. , Hardening failure tends to occur around the metal filler. Moreover, when the light irradiation time is shortened, the tool manufacturing speed is improved, but the uncured portion is likely to remain. Therefore, by providing the heating and aging step, it is possible to improve the decrease in the binder hardness due to the poor curing generated around the metal additive, and to further shorten the light irradiation time. In this way, it is possible to obtain a wire tool excellent in cutting characteristics and wear resistance while completely curing the binder layer and reducing the tool cost.
[0033]
  Claim 5The invention described inClaim 4In the heating and aging step, the wire tool wound after the photocuring of the binder is batch-processed.
[0034]
Since the heating and aging step is performed on a substantially hardened wire tool, the tool wound on the reel can be batch processed in a heating furnace or the like. According to the batch processing, since the manufacturing time per tool hardly changes, a wire tool having a binding material hardness sufficient to perform a cutting process is reliably and stably manufactured without reducing the tool manufacturing speed. be able to.
[0035]
  Claim 6The invention described inClaims 1-5In any of the above, based on the measuring step of measuring the outer diameter of the wire after application of the adhesive and photocuring, and based on the measured outer diameter, the outer diameter of the wire is set to a predetermined value. Application of the adhesiveProcess, lightCuring processOne or both ofAnd an adjusting step for adjusting.
[0036]
By providing the measurement process and the adjustment process, it is possible to minimize the variation in wire diameter, and it is possible to cut silicon wafers with stable cut surface quality with low cutting loss and warpage. Wire tools can be manufactured.
[0037]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, one embodiment of the present invention will be described with reference to the drawings. However, the present invention is not limited to this, and various metal particles, inorganic powders, organic resin powders, metal fibers, inorganic fibers are used as photocurable resins. This includes a wide range of applications of a wire tool for bonding abrasive grains to a wire using a fiber or a binder containing an organic resin fiber (resin fiber) and a manufacturing method thereof.
[0038]
[First Embodiment]
FIG. 1 shows a schematic configuration of a wire tool manufacturing apparatus according to a first embodiment of the present invention, and FIG. 2 shows a cross section of the manufactured wire tool.
[0039]
In FIG. 1, a wire 11 wound around a feed roll 10 is transported by a plurality of feed rollers 12, 13, 14 and a dancer roller 15, and is pulled by a take-up roll 20 to be wound up. The material of the wire 11 is not particularly limited, and a metal wire such as a piano wire, brass-coated piano wire, stainless steel wire, a wire made of an inorganic compound such as glass fiber, a wire made of an organic compound such as nylon, or a twisted wire thereof. can give.
[0040]
A dancer roller 15 is provided as a tension control mechanism in order to prevent disconnection due to fluctuations in tension when winding the wire 11, but other examples include tension control methods using a seesaw method or a capstan method. In the configuration shown in FIG. 1, the control system 16 controls the feeding speed of the feeding roll 10 and the winding speed of the winding roll 20, and the position of the dancer roller 15 is controlled so that the tension of the wire 11 becomes a predetermined value. Be controlled.
[0041]
Further, the wire 11 pulled out from the feed roll 10 and passed through the roller 12 is made of a photo-curing resin (adhesive) having excellent adhesion to metal after being degreased in a solvent vapor degreasing tank (not shown). The adhesive is applied to the funnel-shaped adhesive application tank 21 containing the mixed adhesive liquid 22 and passes through the adhesive application tank 21 to be applied. At this time, the mixed adhesive liquid 22 adheres in layers on the wire 11 to form an uncured mixed film.
[0042]
Here, the mixed adhesive liquid 22 accommodated in the adhesive application tank 21 is obtained by adding a predetermined additive 22b to a photocurable adhesive 22a into which a functional group that enhances adhesion to a metal such as a carboxyl group is introduced. , And a fluid mixture obtained by further mixing predetermined abrasive grains 22c. Specifically, the mixed adhesive liquid 22 is a liquid resin, that is, a photocurable adhesive 22a, and optionally, metal particles having an average particle diameter of 0.1 to 15 μm and / or an average particle diameter of 0.1. Metal fiber and / or inorganic fiber having an inorganic powder of -15 μm and / or organic resin powder having an average particle diameter of 0.1-15 μm of 5-90 wt%, or a minor axis of 0.1-15 μm and a major axis of 1-200 μm And / or an organic resin fiber is added and mixed as an additive 22b in an amount of 5 to 90 wt%, and an additive-mixed liquid resin is produced, and the additive-mixed liquid resin and the abrasive grains 22c having a predetermined particle diameter are uniformly mixed. It is in solution. The abrasive grains 22c are not particularly limited, and may be hard abrasive grains such as diamond, CBN (cubic boron nitride), alumina, silicon carbide, and the like. However, among them, diamond abrasive grains having excellent processing ability are usually desirable.
[0043]
On the other hand, a wire diameter jig 23 is movably provided at the outlet of the adhesive application tank 21, and the excess mixed adhesive liquid 22 adhering to the wire 11 is scraped off by the wire diameter jig 23. The uncured mixed film is adjusted to a predetermined thickness, or the outer diameter of the wire on which the uncured mixed film is formed is adjusted to a predetermined diameter.
[0044]
The wire 11 that has passed through the wire diameter jig 23 is then irradiated with predetermined light (for example, ultraviolet rays) by the light irradiation device 24. The light irradiation unit 32c includes an ultraviolet light source (for example, a high-pressure mercury lamp having an output peak at a wavelength near 354 nm). Here, gas is injected and supplied from the gas injection mechanism 32a of the light irradiation device 24 to the light irradiation unit 32c. At this time, the gas 11 is jetted and supplied along the wire traveling direction (from the top to the bottom in the drawing) so that the wire 11 does not vibrate in the radial direction. The supply amount (flow rate) of the gas is desirably such that the oxygen concentration in the vicinity of the light irradiation unit 32c is reduced by at least about 10% from the oxygen concentration in the atmosphere. Further, it is desirable that the injection gas is nitrogen gas or argon gas that can be released into the atmospheric environment. Most of the injected gas is recovered by the exhaust mechanism 32b of the light irradiation device 24 and is circulated. In addition, you may comprise so that nitrogen gas etc. may be supplied not only to the light irradiation apparatus 24 but the whole inside of a manufacturing apparatus. By this photocuring step, a resin-based binder layer mainly composed of a photocurable adhesive, that is, a photocurable adhesive layer (single layer) in which the uncured mixed coating is cured to a hardness sufficient for cutting processing. It is formed.
[0045]
The wire diameter measuring instrument 17 measures the outer diameter of the wire tool 11T on the downstream side of the light irradiation device 24, and can feed back the measurement information to the control system 16. This wire diameter measuring instrument 17 has, for example, three non-contact displacement sensors that surround the wire tool 11T and are spaced at equal angular intervals at a predetermined position in the wire conveying direction, and only measure the wire diameter of the wire 11. In addition, misalignment of the mixed film with respect to the wire body (variation in the film thickness of the mixed film at three positions in the circumferential direction) can also be detected. The control system 16 detects the misalignment between the wire 11 and the wire diameter jig 23 based on the measurement information, the wire 11 always travels in the center of the wire diameter jig 23, and the mixed coating is in the length direction of the wire 11. In addition, the relative position of the wire 11 and the wire diameter jig 23 is controlled so as to have a constant thickness in the circumferential direction. The position can be controlled by displacing the wire diameter jig 23 or by displacing a wire position adjusting roller (not shown).
[0046]
In this way, wire tools in which abrasive grains are fixed with a single-layer binder are sequentially produced.
[0047]
After the wires 11T pass through the rollers 14 and 15 and are wound on the winding roll 20, a plurality of wires 11T are further loaded and placed in the heating furnace 40 shown in FIG. 3, and subjected to heat treatment at a predetermined temperature for a predetermined time. Is done.
[0048]
This heating furnace 40 is a batch type furnace that carries in and accommodates a plurality of wire tools 11T after manufacture and winding described above from an inlet (not shown) and heat-treats them at a predetermined temperature for a predetermined time. A pair (or a plurality of pairs) of burners 42a and 42b provided on the upper surface of the furnace, exhaust ports 43a and 43b provided on the lower surface of the heating furnace 40, and a lower part of the furnace body 41, A mounting table 44 for mounting a plurality of (wire tools 11T), and the fuel and the combustion air supplied to the burners 42a and 42b are mixed and injected into the furnace for combustion. ing. In addition to the present embodiment, a heavy oil furnace, a gas furnace, an electric furnace, or the like can be appropriately selected and used depending on the configuration and the number of wire tools 11.
[0049]
In the heating and aging process using the heating furnace 40 described above, by heating and aging the wire tool after manufacturing for a predetermined time at a predetermined temperature, the uncured portion resulting from the addition of metal powder or the like is completely cured, and cutting processing is performed. It is possible to form a binder layer having a hardness suitable for the above. In addition, not only this embodiment but the storage which can store a some wire tool may be provided, and you may make it perform the natural hardening aging process after the photocuring of a tool binding material.
[0050]
In addition to the present embodiment, the surface of the wire after the degreasing treatment described above may be subjected to a chemical primer treatment before the application treatment of the photocurable adhesive liquid. Alternatively, the surface of the wire may be subjected to a chemical primer treatment before applying the photocurable adhesive liquid without performing the aforementioned degreasing treatment. By performing the chemical primer treatment, the curing of the mixed film on the surface of the wire can be promoted, and the adhesion between the wire 11 and the mixed film can be enhanced. Examples of the chemical primer treatment include surface coating of a photopolymerization accelerator and a coupling agent (for example, a silane coupling agent).
[0051]
Furthermore, the present invention is not limited to this embodiment, and a single-layer photocurable binder is formed by applying a mixed adhesive solution of a photocurable adhesive and abrasive grains on a wire and photocuring the mixed adhesive solution. May be formed.
[0052]
[Second Embodiment]
In FIG. 4, the structure of the manufacturing apparatus of the wire tool which concerns on the 2nd Embodiment of this invention is shown. In addition, the same code | symbol is provided to the structure similar to 1st Embodiment, and description is abbreviate | omitted.
[0053]
In the present embodiment, in order to improve the adhesion between the wire 11 and the mixed film (photocurable adhesive) formed thereon prior to the application treatment of the above-described photocurable adhesive liquid, the above-described degreasing is performed. Instead of processing, light irradiation processing (wire cleaning processing) is performed at a predetermined speed. In the wire cleaning process, while ozone-containing gas is supplied from the ozone generator 27 by the ozone supply unit 25, predetermined light (for example, ultraviolet rays) is applied to the surface of the wire 11 from the light irradiation unit 26 in the ozone supply unit 25. Irradiate for a predetermined time. The light irradiation unit 26 includes an ultraviolet light source (for example, a low-pressure mercury lamp having an output peak between 150 nm and 300 nm in wavelength).
[0054]
Here, the ozone generator 27 is supplied to a power source 27c for supplying an alternating high voltage, an ozone generator 27a having electrodes in close contact with the inner and outer surfaces of a dielectric made of a hard glass tube, and the ozone generator 27a. A switching circuit 27b for switching the AC high voltage, and the AC high voltage is intermittently applied to the electrodes while a source gas containing oxygen is passed between the electrodes facing each other with the dielectric interposed therebetween. And then dissociating oxygen by silent discharge to generate high-concentration ozone (about 10 to 200 times the ozone generated only by ultraviolet rays). Note that, as the source gas, dehumidified air or high-concentration oxygen (oxygen concentration of 95% or more) is used, and in order to achieve the above-described ozone concentration, the number of times of switching is set in advance by the control system 16, and a predetermined load factor is set. Apply AC voltage. The source gas is supplied at a predetermined pressure by a compressor (not shown). Further, the configuration of the ozone generator 27 and the ozone generation method are not limited to those of the present embodiment, and it is sufficient that ozone with a predetermined concentration can be stably generated.
[0055]
After such a wire cleaning process, the wire 11 is guided to an adhesive application tank 21 containing a photo-curable adhesive liquid 22 having excellent adhesion to metal, and subjected to the application process as described above. The wire tool which fixed the abrasive grain 22c with the binder which consists of a single layer by performing a photocuring process and heat processing is obtained.
[0056]
In this embodiment, the binder is composed of a photocurable adhesive layer (single layer to which organic resin powder or organic resin fiber is added), and the surface of the wire 11 is coated before application of the photocurable adhesive liquid. By irradiating with ultraviolet light, the desired abrasive grain retention strength and wear resistance can be achieved while shortening the manufacturing time and reducing the manufacturing cost compared to the method of increasing the wear resistance of the tool by multilayering the binder. be able to.
[0057]
Note that the present invention is not limited to this embodiment, and a wire cleaning process using light irradiation and a cleaning process using another solvent (for example, a solvent vapor process) may be performed in combination.
[0058]
【Example】
In this embodiment, a piano wire having a diameter of 0.2 mm is used as the wire 11, and the binder layer is mainly composed of a photocurable adhesive.
[0059]
30 wt% of a polyamide fiber having a minor axis of 2 μm and a major axis of 5 μm is added to the acrylate-based photocurable adhesive, and the mixture is mixed with a homogenizer for about 10 minutes. Next, 30/40 μm diamond abrasive grains corresponding to a concentration level of 20 (5 vol%) are wetted with a small amount of ethyl alcohol, placed in the liquid resin, and mixed with a homogenizer for about 10 minutes. Subsequently, a mixed solution of a liquid resin added with polyamide fibers and diamond abrasive grains is placed in the adhesive application tank 21. Then, the wire 11 is guided into the adhesive coating tank 21 and further passed through a wire diameter jig having an opening diameter of about 0.27 mm for shaping, and then UV-cured using a high-pressure mercury lamp having a large peak near a wavelength of 354 mm. Then, a binder layer is formed. As a result, a wire tool having a diameter of 0.25 to 0.26 mm, in which the abrasive grains were fixed with a binder mainly composed of a photocurable adhesive, was obtained.
[0060]
Using this wire tool, a 3-inch silicon ingot was cut (wire speed was 300 m / min). As a result, almost no wear of the binder layer was observed, and the average cutting efficiency was 45 mm.²/ Min or better, and no local peeling of the binder layer was observed. In addition, since the binder resin coating process is performed only once, the tool manufacturing cost is reduced to about 3/4 compared to the conventional manufacturing method in which the binder resin coating process is repeated a plurality of times.
[0061]
In the present embodiment, the ultraviolet curing treatment is performed in the atmosphere. However, as described above, the binder layer can be cured more reliably by reducing the oxygen concentration in the ultraviolet irradiation section than in the atmosphere. Be expected.
[0062]
In addition to the present embodiment, the chemical primer treatment described above may be performed before the wire 11 is introduced into the adhesive application tank 21.
[0063]
Moreover, the component of the said photocurable adhesive and the additive to a photocurable adhesive are not restricted to a present Example, You may use another thing.
[0064]
【The invention's effect】
As described above, according to the present invention, when manufacturing a wire tool in which abrasive grains are fixed on a wire with a binder mainly composed of a photocurable adhesive, the binder is coated with a photocurable adhesive layer ( Organic resin powder or organic resin fiber that is composed of only a single layer) or only a photo-curable adhesive layer formed after primer treatment, and has excellent flexibility and adhesion to the photo-curable adhesive. Can be used as an additive, without increasing production time and cost due to the multi-layered binder, enabling high-precision cutting and high-efficiency cutting, and is long and inexpensive. A wire tool can be realized.
[Brief description of the drawings]
FIG. 1 is a diagram showing a schematic configuration of a wire tool manufacturing apparatus according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of the wire tool according to the first embodiment of the present invention.
FIG. 3 is a diagram showing a schematic configuration of a batch heating furnace according to the first embodiment of the present invention.
FIG. 4 is a diagram showing a schematic configuration of a wire tool manufacturing apparatus according to a second embodiment of the present invention.
FIG. 5 is a perspective view showing a schematic configuration of a multi-wire cutting apparatus using loose abrasive grains used for cutting a conventional silicon ingot.
[Explanation of symbols]
10 Feeding roller
11 wire
11T wire tool
12-14 Feed roller
15 Dancer Laura
16 Control system
17 Wire diameter measuring instrument
20 Winding roll
21 Adhesive application tank
22 Mixed adhesive liquid (mixed solution)
22a Photocurable resin (adhesive)
22b Additive
22c abrasive
23 Wire diameter jig
24 Light irradiation device
25 Ozone supply unit
26, 32c Light irradiation part
27 Ozone generator
32a Gas injection mechanism
40 Heating furnace
44 mounting table

Claims (7)

A method of manufacturing a wire tool in which a light curable resin is a main component on a wire and abrasive grains are fixed with a single layer binder.
A wire cleaning process for irradiating and cleaning the wire with light;
Adhesive application that applies a mixed adhesive solution containing photo-curing resin as the main component and containing either abrasive grains or additives while running the wire that has undergone wire cleaning treatment in the axial direction Process,
A photocuring step of photocuring the mixed adhesive liquid applied on the wire;
Have
In the adhesive application step, a photocurable adhesive and abrasive grains containing 5 to 90 wt% of any or all of metal particles having an average particle diameter of 0.1 to 15 μm, inorganic powder, and organic resin powder on the wire. A method of manufacturing a wire tool , wherein a mixed adhesive liquid is applied . A method of manufacturing a wire tool in which a light curable resin is a main component on a wire and abrasive grains are fixed with a single layer binder.
A wire cleaning process for irradiating and cleaning the wire with light;
Adhesive application that applies a mixed adhesive solution containing photo-curing resin as the main component and containing either abrasive grains or additives while running the wire that has undergone wire cleaning treatment in the axial direction Process,
A photocuring step of photocuring the mixed adhesive liquid applied on the wire;
Have
In the adhesive application step, photocurability containing 5 to 90 wt% of any or all of a metal fiber, an inorganic fiber, and an organic resin fiber having a minor axis of 0.1 to 15 μm and a major axis of 1 to 200 μm on the wire. The manufacturing method of the wire tool characterized by apply | coating the mixed adhesive liquid of an adhesive agent and an abrasive grain . In the manufacturing method of the wire tool of Claim 1 or Claim 2,
A method of manufacturing a wire tool , comprising: performing a chemical primer treatment on a wire prior to the adhesive application step after the wire cleaning treatment . In the manufacturing method of the wire tool as described in any one of Claims 1-3 ,
The manufacturing method of the wire tool characterized by having the heating aging process which heats and age | cure | ripens the binder after the said photocuring . In the manufacturing method of the wire tool of Claim 4 ,
In the heating and aging step, the wire tool wound after the photocuring of the binding material is batch-processed, and the wire tool manufacturing method is characterized in that: In the manufacturing method of the wire tool as described in any one of Claims 1-5,
A measurement process for measuring the outer diameter of the wire after adhesive application and photocuring;
Based on the measured outer diameter dimension, an adjustment process for adjusting one or both of the adhesive application process and the photocuring process so that the outer diameter dimension of the wire becomes a predetermined value;
The manufacturing method of the wire tool characterized by having . In the manufacturing method of the wire tool as described in any one of Claims 1-6 ,
The adhesive coating step includes a photocuring step of setting the wire after coating to a predetermined diameter, or setting the film thickness on the wire to a predetermined value, and then curing by irradiation with light. A method of manufacturing a wire tool.

Images