JPH11347911A - Wire saw and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent degradation of the torsional breaking strength by using a wire to cause no degradation of the torsional breaking strength when heated to a specified temperature to suppress degradation of the wire due to the heat when a resin is thermo-set. SOLUTION: A binder 3 to fix abrasive grains 2 which are hard abrasive particles of diamond, CBN, alumina and silicon carbide on an outer circumferential surface of a wire 1 comprising stainless steel wires to cause no degradation of the torsional breaking strength when heated up to 250 deg.C, is formed by adding metallic particles 4, metallic or graphite fibers 5, an endothermic agent, oxidation suppressing agent, etc., to a resin to be thermo-set at a temperature below approximately 100 deg.C. The resin to be used for the binder 3 is a plastic resin which is excellent in adhesivity to the wire when the resin is liquefied with a solvent, etc., and free from any cracks or peeling of the binder 3 even when a wire saw is curved through the contact with a multi-groove block or a material to be ground. The wire 1 can be formed of a stainless steel wire, a hard steel wire to temper Al or Ti, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire saw for slicing hard and brittle materials such as silicon ingots, quartz, quartz and the like, and metal materials. The present invention relates to a wire saw that can be manufactured and a method for manufacturing the same.

[0002]

2. Description of the Related Art Wire saws have been used as a slicing tool for hard and brittle materials such as silicon ingots, quartz and quartz, and metal materials. It is drawing attention as a means.

Conventionally, slicing of a silicon ingot has been performed by using an inner peripheral blade. However, there is a limit in improving the throughput with respect to an increase in the diameter of the ingot. However, if the diameter becomes large, it is technically difficult to accurately set the blade on the jig, and it is not possible to take sufficient measures.
Is being replaced by slicing.

[0004] By the way, the conventional wire source
The slicing process of the silicon ingot according to the above was a process using free abrasive grains while supplying a high-viscosity abrasive slurry to a piano wire as a wire. However, in slicing using loose abrasives, the working environment is poor and high-precision machining is difficult. In addition, there are disadvantages such as the generation of industrial waste such as a waste liquid containing free abrasive grains and a workpiece cleaning liquid.

For this reason, Japanese Patent Application Laid-Open Nos. 9-150314, 7-227767, and 4-
As disclosed in Japanese Patent No. 4105, a wire saw having abrasive grains fixed to a wire has come to be used. However, conventional wire saws employ a method of fixing abrasive grains to a piano wire as a wire by electrodeposition or mechanically embedding the abrasive grains in a piano wire as a wire. Metal was used as the material.

However, in a wire saw using a metal as a binder, a shear force generated due to a difference in elongation between the piano wire and the plating layer increases at a boundary surface between the core wire and the plating layer, and peeling occurs. In addition, there are quality and economic problems such as a decrease in torsional rupture strength due to an increase in the wire diameter due to electrodeposition, and a higher manufacturing cost.

In order to solve such a problem, a wire saw using a resin as a binder has recently been developed (Literature: Proceedings of the 1997 Academic Society of Abrasive Processing, 36
9).

[0008]

However, in the manufacturing process of a wire saw for fixing abrasive grains by electrodeposition, 100
Temperatures above ℃ do not add to the wire saw, but piano wires cause hydrogen embrittlement due to the hydrogen generated during electrodeposition. On the other hand, in a method of manufacturing a wire saw using a thermosetting resin of a high-temperature curing type as a bonding material for fixing abrasive grains, usually, 15
The resin is cured by heating to 0 ° C to 200 ° C, and the wire becomes hotter than the heating temperature due to the heat generated during the polymerization reaction. However, when a temperature of around 200 ° C is applied to the piano wire,
It causes embrittlement and decreases elongation and strength (Reference: heat treatment of steel, Fig. 12.8, edited by the Iron and Steel Institute of Japan, Maruzen, 1969).

Therefore, a wire saw using a piano wire as a wire has a problem that the torsional rupture strength is reduced, the wire is likely to break during slicing, and the life as the wire saw is short.

The present invention has been made in view of the above circumstances, and has as its object to provide a thermosetting resin in a wire saw using a core wire having no thermal effect and using a resin as a main binder. It is an object of the present invention to provide a long-life wire saw which suppresses deterioration of the wire due to heat at the time and does not reduce torsional breaking strength, and a method for manufacturing the same.

[0011]

In order to achieve the above object, the present invention provides a wire saw in which abrasive grains are fixed to a wire with a binder containing resin as a main component. It is intended to provide a wire saw characterized by using a wire which does not cause a decrease in torsional rupture strength when heated up to ℃.

According to a second aspect of the present invention, in a wire saw in which abrasive grains are fixed to a wire with a binder containing resin as a main component, a resin which is thermoset at 100 ° C. or lower is used as the resin for the binder. Is provided.

According to a third aspect of the present invention, there is provided a wire saw characterized in that abrasive grains are fixed to a wire with a binder mainly composed of a resin which does not precipitate carbon during thermosetting.

According to a fourth aspect of the present invention, the resin used as the binder according to the first to third aspects further comprises a heat absorbing agent having an average particle diameter of 15 μm or less.
It is characterized by adding 90 wt%.

A fifth aspect of the present invention provides a method of mixing at least a liquid resin and abrasive grains into a wire while running the wire which does not cause a decrease in torsional rupture strength when heated to 250 ° C. in the axial direction. A method for producing a wire saw, comprising the steps of: adhering a solution to form a mixed film on a wire; removing excess mixed solution adhering to the wire; drying the mixed film; and curing the mixed film. To provide.

In the present invention, a wire that does not cause a decrease in torsional rupture strength when heated to 250 ° C. is used as a wire, that is, a core wire. Examples of such a wire include a stainless steel wire and a hard steel wire tempered with Al or Ti, but a core wire made of a high heat-resistant resin material other than the metal material can also be used.

The resin used as the binder in the present invention, when made into a liquid state with a solvent such as alcohol, has good adhesion to the wire, and comes into contact with a multi-groove pulley or a work material to form a wire source. A plastic resin that does not cause cracking or peeling of the binder even when the substrate is curved, particularly a resin that is thermoset at 100 ° C. or lower is used.

Examples of such a resin include synthetic resin emulsion-type vinyl acetate homopolymer, vinyl acetate copolymer, acrylic copolymer, thermoplastic acrylic resin, two-pack polyurethane resin, and catalyst-curable polyurethane resin. In the present invention, any of these can be used. Further, for example, a resin which does not precipitate carbon during thermosetting, such as a silicone resin, can also be suitably used.

In the resin used for the binder, a heat-absorbing agent having an average particle size of 15 μm or less, for example, iron sulfate, ammonium nitrate, wax or the like is used in an amount of 5 to 90 wt% based on the total amount of the binder.
It is preferable to add in the range. When such a heat absorbing agent is added to the binder, it is possible to suppress an excessive rise in the temperature of the wire and a deterioration in the torsional rupture strength due to the temperature rise during the heating and curing.

Further, in the present invention, silver, copper, aluminum, iron, tungsten, and the like may be added to the resin used for the binder, if necessary, to improve the heat diffusion, conductivity, and abrasion resistance of the binder. Metal particles such as nickel or brass or metal fiber, and the binder is reinforced to prevent peeling or cracking due to the bending of the wire saw during processing, and metal or graphite fiber is made of resin to improve its heat diffusion and conductivity. Is preferably added. For metal particles, the average particle diameter is 15 μm or less, for the fiber, the short diameter is 15 μm or less, and the long diameter is 200 μm or less. The addition amount is 5 to 90 wt% based on the total amount of the binder. I do.

It is also possible to add a surfactant or formaldehyde as an oxidation inhibitor and a surfactant or lubricating particles such as molybdenum disulfide, Teflon or graphite as a lubricant to the resin. These additives have an average particle size of 15 μm.
The following materials are used and are added in the range of 5 to 90 wt% based on the total amount of the binder.

According to the wire saw of the present invention, by using a wire which does not cause a decrease in the torsional rupture strength against a temperature rise up to 250 ° C., heat or heat generated when the resin as the binder is cured can be obtained. A decrease in strength of the wire can be suppressed. Also, by using a resin which does not affect the torsional rupture strength of the wire, that is, a resin which is thermoset at a temperature of 100 ° C. or lower, as the resin used for the binder, a decrease in the strength of the wire can be similarly prevented.
Further, by adding a heat absorbing agent to the binder, it is possible to suppress an excessive rise in the temperature of the wire and a deterioration in the strength of the wire due to the temperature increase during the heat curing.

Therefore, according to the present invention, the wire source
Deterioration of the strength of the wire due to heating or the like for curing the resin during manufacturing can be suppressed, and the life of the wire saw can be prolonged.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to these embodiments, and various types of thermoplastic or thermosetting liquid resins can be used. The present invention also includes a wide range of applications of a wire saw for fixing abrasive grains to a wire using a binder containing metal fine particles, metal fibers, ceramic fibers, antioxidants, coolants, lubricants, and the like.

FIG. 1A is a sectional view in the axial direction of the wire saw, and FIG. 1B is a sectional view in a direction perpendicular to the axial direction.
Is a wire made of, for example, a stainless steel wire, and abrasive grains 2 as hard abrasive particles such as diamond, CBN, alumina, and silicon carbide are fixed to the outer peripheral surface thereof by a binder 3. The binder 3 is formed by adding a metal particle 4 having an average particle diameter of 15 μm or less and a minor
m or less, a metal or graphite fiber 5 having a major diameter of 200 μm or less, and a heat absorbing agent, an oxidation inhibitor, a lubricant, etc., having an average particle diameter of 15 μm or less in total of 5 to 90 wt%.

Next, a method for manufacturing a wire saw will be described with reference to FIG. The wire 7 wound around the bobbin 6 is pulled and wound by the wire winding bobbin 21. The wire 7 pulled out of the bobbin 6
After entering the solvent vapor degreasing tank 9 via the guide pulleys 8 and 10 to degrease the oils and fats applied to the wire 7,
It is dried in the solvent vapor degreasing tank 9 while being pulled up through the guide pulleys 11 and 12.

Next, the wire 7 is connected to the guide pulley 13,
15, immersed in a mixed solution 14a of an additive-mixed liquid resin and abrasive grains, which will be described later, housed in the resin coating tank 14 via
A mixed film is formed by the mixed solution adhered to the surface of the wire 7. The wire 7 on which the mixed film is formed is further guided to a wire diameter jig 17 via a guide reel 16 and
The excess mixed solution adhering to the surface is scraped off by the wire diameter jig 17 to adjust the mixed film to a certain thickness. Next, the solvent in the liquid resin forming the mixed film is evaporated by the dryer 18 and dried. After drying, the coating is hardened by the heating device 19 and then cooled, and then wound around the wire winding bobbin 21 via the guide pulley 20.

In order to improve the adhesion of the wire 7, if necessary, the wire 7 is degreased in a solvent vapor degreasing tank 9, and then the wire 7 is converted into a chemical treatment tank 2 via guide pulleys 23 and 25.
2 and a phosphatization coating may be applied.

When wound around the wire winding bobbin 21 in this manner, as shown in FIG. 1, a wire saw in which a large number of abrasive grains 2 are fixed to the outer peripheral surface of the wire 1 by a bonding material 3 is manufactured. Is done. The wire saw is used for slicing hard and brittle materials such as silicon ingots, quartz, quartz, and metallic materials.

The additive-mixed liquid resin is added to a liquid resin, that is, a resin that has become liquid by adding a solvent, to the resin having an average particle diameter of 15 μm.
m or less, a metal particle having an average particle size of 15 μm or less, a metal or graphite fiber having a minor diameter of 15 μm or less, a major diameter of 200 μm or less, an oxidation inhibitor, and a lubricant in total of 5 to 5 μm.
90 wt% is added and mixed, and the resin coating tank 14 contains a mixed solution in which the additive-mixed liquid resin and the abrasive grains are uniformly mixed.

Example 1 Copper fine particles having an average particle size of 10 μm were wetted with a small amount of ethyl alcohol, and then added to the liquid resin for 60 watts.
Add t% and mix with an ultrasonic homogenizer for 10 minutes. Next, a particle size of 20/30 μm corresponding to a concentration of 10
Is wetted with a small amount of ethyl alcohol, put into a liquid resin, and mixed with an ultrasonic homogenizer for 10 minutes. The liquid mixture of the liquid resin and the additive is diluted with a solvent in accordance with the diamond abrasive particle diameter to be used, and is adjusted so that the diamond abrasive grains are exposed to 20 to 30% of the particle diameter after evaporation of the solvent. Then, in order to prevent separation or sedimentation due to the specific gravity difference between the resin, the copper fine particles, and the abrasive grains, the resin coating tank 14 is used.
Continue to mix using a stirring blade in the inside. As a wire, a 0.2 mm diameter stainless steel wire was used, and 10 mm /
The wire 7 is moved at a speed of 2 seconds, and a mixed solution of the liquid resin to which the copper fine particles are added and the diamond abrasive grains is added to the resin coating tank 14, and the wire 7 is mixed with the mixed solution in the resin coating tank 14 by the manufacturing method described above. , And passed through a wire jig having a hole diameter of 0.27 mm, heated at a temperature of 150 ° C. in the heating device 19 for 7 minutes to cure, thereby obtaining a wire saw having a diameter of 0.25 to 0.26 mm. .

Example 2 30 wt% of a steel fiber having a short diameter of 10 μm and a long diameter of 100 μm wetted with a small amount of ethyl alcohol was put into a liquid resin, and an ultrasonic homogenizer was used.
Then, the same amount of diamond abrasive grains as in Example 1 was added to prepare a mixed solution under the same conditions, and a 0.2 mm diameter stainless steel wire was used as the mixed solution and wire. After forming a mixed film on the wire in the same manner as described above, the wire was heated and cured at 90 ° C. for 20 minutes to obtain a diamond wire saw.

Example 3 Iron nitrate 1 having an average particle size of 50 μm
5 wt% is put in a liquid resin, and 1 is added by an ultrasonic homogenizer.
After mixing for 0 minutes, the same amount of diamond abrasive grains as in Example 1 is added to make a mixed solution under the same conditions. This mixed solution was put into the resin coating tank 14, and a diamond wire saw was obtained in the same manner as in Example 1 using a stainless steel wire having a diameter of 0.2 mm as a wire.

[0034]

As described above, according to the present invention,
Since a wire whose torsional rupture strength does not decrease with heating up to 250 ° C. is used, compared to existing wire saws,
A high-precision, long-life wire saw can be obtained in slicing of a silicon wafer without a decrease in strength due to heat. In addition, a resin that is cured at a temperature of 100 ° C. or less is used as a binder material component that fixes abrasive grains,
By adding the heat absorbing agent, it is possible to suppress a decrease in the torsional rupture strength of the wire due to heat at the time of manufacturing the wire saw, and to obtain a wire saw having high accuracy and long life. Further, according to the manufacturing method of the present invention, the wire is immersed in a mixed solution of the liquid resin and the abrasive grains while the wire is running, and the mixed solution is attached to the wire to form a coating film. Since the liquid is removed, there is an effect that a wire saw having a stable quality can be continuously manufactured efficiently.

[Brief description of the drawings]

FIG. 1 shows a wire saw according to an embodiment of the present invention;
2 is a sectional view of the wire saw in an axial direction, and FIG. 2B is a sectional view in a direction perpendicular to the axial direction.

FIG. 2 is a schematic process chart showing a method for manufacturing the wire saw shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Wire 2 ... Abrasive grain 3 ... Binder

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hideo Yoshizawa 2-3-5 Nakane, Meguro-ku, Tokyo Inside the Tokyo Diamond Tool Works, Ltd. (72) Masao Mayuzumi 2-3-5 Nakane, Meguro-ku, Tokyo No. In Tokyo Diamond Tool Manufacturing Co., Ltd.

Claims (5)

[Claims] 1. A wire saw in which abrasive grains are fixed to a wire with a binder containing resin as a main component.
A wire saw which uses a wire which does not cause a decrease in torsional breaking strength when heated to 250 ° C. 2. A wire saw in which abrasive grains are fixed to a wire with a binder containing a resin as a main component, wherein a resin which is thermoset at 100 ° C. or lower is used as a resin for the binder. -. 3. A wire saw in which abrasive grains are fixed to a wire with a binder mainly composed of a resin, wherein a resin that does not precipitate carbon during thermosetting is used as a resin used for the binder. -. 4. A resin used as a binder for fixing abrasive grains,
The wire saw according to any one of claims 1 to 3, wherein a heat absorbing agent having an average particle size of 15 m or less is added in an amount of 5 to 90 wt%. 5. A mixed solution obtained by mixing at least a liquid resin and abrasive grains is attached to the wire while running in the axial direction a wire that does not cause a decrease in torsional rupture strength when heated to 250 ° C. Forming a mixed film on the wire by removing the excess mixed solution attached to the wire, drying the mixed film, and curing the mixed film. Production method.