JP4062529B2 - Probe card reinforcement plate - Google Patents

Probe card reinforcement plate Download PDF

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Publication number
JP4062529B2
JP4062529B2 JP2003208749A JP2003208749A JP4062529B2 JP 4062529 B2 JP4062529 B2 JP 4062529B2 JP 2003208749 A JP2003208749 A JP 2003208749A JP 2003208749 A JP2003208749 A JP 2003208749A JP 4062529 B2 JP4062529 B2 JP 4062529B2
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JP
Japan
Prior art keywords
probe card
reinforcing plate
main
contact
main board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003208749A
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Japanese (ja)
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JP2005069703A (en
Inventor
親臣 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Priority to JP2003208749A priority Critical patent/JP4062529B2/en
Publication of JP2005069703A publication Critical patent/JP2005069703A/en
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は主基板を補強するためのプローブカード用補強板に関するものである。
【0002】
【従来の技術】
LSIチップなどの半導体デバイスの電気的諸特性を測定するプローブカードは、一般に、測定器と接触する主基板と、被検査対象物と接触する接触子から構成され、主基板には、プローブカード全体を支えるための機械的強度と、測定時の電気的接触により発生する熱を吸収し起こる温度分布の変化に対応する熱伝導率の高さが要求される。
【0003】
従来から、上記の要求に対処するために、主基板の表裏面に補強板を設けることが一般的に行われている。このプローブカード用補強板としては、軽量化を重視したアルミニウムメタル系材料と、強度面を重視したステンレス系の材料が用いられている。
【0004】
【発明が解決しようとする課題】
しかしながらプローブカード用補強板にアルミニウム系の材料を用いる場合は、強度面で弱いという欠点があり、十分な太さを確保しないと半導体デバイスとのコンタクト圧力に耐えられないという問題点があった。又、材料が太くなって熱容量が増すと全体への熱伝導が緩慢となりアルミニウムの熱伝導率では、測定時の電気的接触により発生する熱による温度分布の変化への対応が不十分になるという問題点があった。
【0005】
又、プローブカード用補強板にステンレス系の材料を用いる場合は、熱伝導率が悪いために、測定時の電気的接触により発生する熱による温度分布の変化への追従性にさらに問題を生じた。
【0006】
又、主基板と補強板の材質の違いによる熱膨張差が発生し、それによるバイメタル的歪みによってプローブカード用補強板が主基板と同調して湾曲状に変形し、測定器と主基板の一方の主面との間、並びに被検査対象物と主基板の一方の主面との間に電気的な導通不良を起こし、電気的接触が不安定になり、信頼性を失わせるという問題点があった。
【0007】
本発明は、このような従来のプローブカード用補強板が有していた課題を解決したものであって、電気的諸特性の測定時に、熱伝導性の良好な材料にて測定時の電気的接触により発生する熱による温度分布の変化への対応をスムーズにし、長期に渡って安定した特性測定を可能にするプローブカード用補強板を提供することにある。
【0008】
【課題を解決するための手段】
上記目的を達成するために、本発明のプローブカード用補強板は、被検査対象物に接触する接触子を一方の表面に有する主基板の他方の表面に取り付けられ、且つ、銅層を含む材料からなるものとしている。
【0009】
本発明のプローブカード用補強板は、主材料にステンレス材あるいはアルミニウム材を用い、その表面に銅層を含む材料からなるメッキ層で被覆するという構成とすることにより、主材料で機械的強度面を確保でき、熱伝導性の面は、銅層の被覆により改善することができた。従って、本発明のプローブカード用補強板は材料的強度と熱伝導性の両面を兼ね備えたものと言える。
【0010】
【発明の実施の形態】
以下、本発明の実施例について図に基づき説明する。
図中、図1は本発明実施例を示す平面図、図2は図1のイ−イ線拡大断面図である。
【0011】
プローブカードAは、図1乃至図2に示すように、被検査対象物(図示省略)に接触する接触子2を第2主面1bに有する主基板1と、この主基板1の第1主面1aに設けられたプローブカード用補強板3とを備えている。
【0012】
主基板1は、図2に示すように、測定器(図示省略)の電極(図示省略)と接触する複数の第1接続用電極(図示省略)を有する第1主面1aと、第1接続用電極(図示省略)と配線(図示省略)にて電気的に導通する第2接続用電極(図示省略)を有し、この第2接続用電極(図示省略)を被検査対象物(図示省略)に接触する接触子2と電気的に導通してなる第2主面1bとからなっている。
【0013】
主基板1は、図1に示すように、円形状に形成されているが、特にこの形状に限定されるものではなく、楕円形であってもよく、又、一部欠けてなるほぼ円形、あるいはほぼ楕円形であってもよい。
【0014】
プローブカード用補強板3は、鉄、ステンレス、アルミニウム等の金属材料を母材3aとしており、この母材3aの表面に銅を含む材料にてメッキした、いわゆる銅層からなる材料のメッキ層3bで被覆し、このメッキ層3bは錆びやすいのでの表面に更に防錆特性を有する表層3cで被覆している。
【0015】
プローブカード用補強板3は、図1に示すように、円形状の主基板1に対して、ほぼ中央に方形状に形成しているが、特にこの形状に限定されるものではなく、例えばドーナツ状、クロス状、放射状等に形成してもよい。
【0016】
プローブカード用補強板3は、母材3aがステンレス鋼の金属材料の場合、特にそのステンレス鋼材の一つに限定するものではなく、例えばSUS304やSUS316等が使用できる。又、アルミニウムの金属材料の場合についても同様に、A5056やA6063等の一般のアルミニウム材が使用できる。
【0017】
プローブカード用補強板3の銅を含むメッキ層3bの材料としては、銅や銅合金等が用いられる。この場合の被覆方法としては、電気メッキや無電解メッキ等の方法があるが、いずれでも良い。
【0018】
プローブカード用補強板3の防錆特性を有する表層3cの材料としては、ニッケルやクロム等が用いられ、通常これらの材料によるメッキ処理が実施される。
【0019】
以上、本発明の代表例と思われる実施例について説明したが、本発明は必ずしもこれらの実施例構造のみに限定されるものではなく、本発明で述べた前記の構成要件を備え、かつ本発明に述べる目的を達成し、以下に述べる効果を有する範囲内において適宜改変して実施することができるものである。
【0020】
【発明の効果】
以上の説明から既に明らかなように、本発明で述べるところのプローブカード用補強板は、被検査対象物に接触する接触子を一方の表面に有する主基板に取りつけられ、該補強板が、該主基板の他方の表面に取り付けられ、且つ、銅層を含む材料からなることにより、熱伝導性の良好な材料にて、電気的諸特性の測定時、電気的接触により発生する温度分布の変化への対応をスムーズにし、長期に渡って安定した特性測定を可能にするという顕著な効果を期待することが出来るに至ったのである。
【図面の簡単な説明】
【図1】本発明実施例を示す平面図。
【図2】図1のイ−イ線拡大断面図。
【符号の説明】
A プローブカード
1 主基板
1a 主基板の第1主面
1b 主基板の第2主面
2 接触子
3 プローブカード用補強板
3a 母材
3b メッキ層
3c 表層
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a probe card reinforcing plate for reinforcing a main board.
[0002]
[Prior art]
A probe card for measuring electrical characteristics of a semiconductor device such as an LSI chip is generally composed of a main board that contacts a measuring instrument and a contact that contacts an object to be inspected. The main board includes the entire probe card. The mechanical strength required to support the temperature and the high thermal conductivity corresponding to the change in the temperature distribution caused by absorbing the heat generated by the electrical contact during measurement are required.
[0003]
Conventionally, in order to cope with the above requirements, it has been generally performed to provide reinforcing plates on the front and back surfaces of the main board. As the reinforcing plate for the probe card, an aluminum metal material that emphasizes weight reduction and a stainless material that emphasizes strength are used.
[0004]
[Problems to be solved by the invention]
However, when an aluminum-based material is used for the probe card reinforcing plate, there is a drawback that it is weak in strength, and there is a problem that it cannot withstand a contact pressure with a semiconductor device unless a sufficient thickness is secured. Also, when the material becomes thicker and the heat capacity increases, the heat conduction to the whole becomes slow, and the heat conductivity of aluminum is insufficient to cope with the change in temperature distribution due to the heat generated by electrical contact during measurement. There was a problem.
[0005]
In addition, when a stainless steel material is used for the probe card reinforcing plate, the thermal conductivity is poor, which causes further problems in the ability to follow changes in temperature distribution due to heat generated by electrical contact during measurement. .
[0006]
Also, a difference in thermal expansion occurs due to the difference in material between the main board and the reinforcing plate, and the bimetallic distortion causes the probe card reinforcing plate to be deformed into a curved shape in synchronism with the main board. The electrical contact failure occurs between the main surface of the substrate and between the object to be inspected and one of the main surfaces of the main substrate, resulting in unstable electrical contact and loss of reliability. there were.
[0007]
The present invention solves the problem of such a conventional probe card reinforcing plate, and is used to measure the electrical characteristics when measuring various electrical characteristics using a material having good thermal conductivity. An object of the present invention is to provide a reinforcing plate for a probe card that can smoothly cope with a change in temperature distribution due to heat generated by contact and can perform stable characteristic measurement over a long period of time.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a reinforcing plate for a probe card of the present invention is a material that is attached to the other surface of a main board having a contact that contacts an object to be inspected on one surface and includes a copper layer. It is supposed to consist of
[0009]
The reinforcing plate for probe card of the present invention uses a stainless steel or aluminum material as a main material and is coated with a plating layer made of a material containing a copper layer on the surface thereof, so that the mechanical strength surface of the main material The thermal conductivity surface could be improved by covering the copper layer. Therefore, it can be said that the probe card reinforcing plate of the present invention has both material strength and thermal conductivity.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
1 is a plan view showing an embodiment of the present invention, and FIG. 2 is an enlarged sectional view taken along the line II in FIG.
[0011]
As shown in FIGS. 1 and 2, the probe card A includes a main board 1 having a contact 2 on a second main surface 1 b that contacts an object to be inspected (not shown), and a first main board 1 of the main board 1. And a probe card reinforcing plate 3 provided on the surface 1a.
[0012]
As shown in FIG. 2, the main substrate 1 includes a first main surface 1a having a plurality of first connection electrodes (not shown) that are in contact with electrodes (not shown) of a measuring instrument (not shown), and a first connection. And a second connection electrode (not shown) that is electrically connected by a wiring electrode (not shown) and wiring (not shown), and this second connection electrode (not shown) is an object to be inspected (not shown). ) And a second main surface 1b formed in electrical continuity with the contact 2 in contact with the contact 2).
[0013]
As shown in FIG. 1, the main substrate 1 is formed in a circular shape. However, the main substrate 1 is not particularly limited to this shape, and may be an ellipse, or a substantially circular shape partially missing. Alternatively, it may be almost elliptical.
[0014]
The probe card reinforcing plate 3 uses a metal material such as iron, stainless steel, aluminum or the like as a base material 3a, and a plating layer 3b made of a so-called copper layer plated on the surface of the base material 3a with a material containing copper. Since this plating layer 3b is easily rusted, the surface is further covered with a surface layer 3c having anti-rust properties.
[0015]
As shown in FIG. 1, the probe card reinforcing plate 3 is formed in a square shape substantially at the center of the circular main substrate 1, but is not particularly limited to this shape. You may form in a shape, cloth shape, radial shape, etc.
[0016]
When the base material 3a is a stainless steel metal material, the probe card reinforcing plate 3 is not particularly limited to one of the stainless steel materials. For example, SUS304, SUS316 or the like can be used. Similarly, in the case of an aluminum metal material, a general aluminum material such as A5056 or A6063 can be used.
[0017]
As the material of the plating layer 3b containing copper of the probe card reinforcing plate 3, copper, a copper alloy, or the like is used. As a coating method in this case, there are methods such as electroplating and electroless plating, and any method may be used.
[0018]
As a material for the surface layer 3c having the antirust property of the probe card reinforcing plate 3, nickel, chromium, or the like is used, and plating treatment with these materials is usually performed.
[0019]
As mentioned above, although the Example considered to be a typical example of this invention was demonstrated, this invention is not necessarily limited only to these Example structures, It is equipped with the said component requirements described by this invention, and this invention. Can be implemented with appropriate modifications within the range having the effects described below.
[0020]
【The invention's effect】
As is apparent from the above description, the probe card reinforcing plate described in the present invention is attached to a main substrate having a contact on one surface that contacts an object to be inspected. Changes in temperature distribution caused by electrical contact when measuring various electrical characteristics of materials with good thermal conductivity by being attached to the other surface of the main board and comprising a copper layer As a result, it has become possible to expect a remarkable effect of smoothing the response to the problem and enabling stable characteristic measurement over a long period of time.
[Brief description of the drawings]
FIG. 1 is a plan view showing an embodiment of the present invention.
FIG. 2 is an enlarged cross-sectional view taken along line II in FIG.
[Explanation of symbols]
A Probe card 1 Main substrate 1a First main surface 1b of main substrate Second main surface 2 of main substrate Contact 3 Reinforcing plate for probe card 3a Base material 3b Plating layer 3c Surface layer

Claims (1)

被検査対象物に接触する接触子を一方の表面に有する主基板に取り付けられるプローブカード用補強板であって、該補強板が、該主基板の他方の表面に取り付けられ、且つ、金属材料を母材とし、該母材の表面を銅からなる材料のメッキ層で被覆し、該メッキ層の表面を防錆特性を有する表層で被覆することを特徴とするプローブカード用補強板。A reinforcing plate for a probe card that is attached to a main board having a contact that contacts an object to be inspected on one surface, the reinforcing board being attached to the other surface of the main board, and a metal material A reinforcing plate for a probe card, characterized in that the base material is coated with a plated layer of a material made of copper, and the surface of the plated layer is coated with a surface layer having antirust properties .
JP2003208749A 2003-08-26 2003-08-26 Probe card reinforcement plate Expired - Fee Related JP4062529B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003208749A JP4062529B2 (en) 2003-08-26 2003-08-26 Probe card reinforcement plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003208749A JP4062529B2 (en) 2003-08-26 2003-08-26 Probe card reinforcement plate

Publications (2)

Publication Number Publication Date
JP2005069703A JP2005069703A (en) 2005-03-17
JP4062529B2 true JP4062529B2 (en) 2008-03-19

Family

ID=34401907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003208749A Expired - Fee Related JP4062529B2 (en) 2003-08-26 2003-08-26 Probe card reinforcement plate

Country Status (1)

Country Link
JP (1) JP4062529B2 (en)

Also Published As

Publication number Publication date
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