JP4056652B2 - Resin sealing device and mold mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin sealing device for resin sealing an electronic component such as a semiconductor chip attached to a printed circuit board, a lead frame or the like, and a mold mounting method for mounting a mold in the device. In particular, the present invention relates to a resin sealing device and a mold mounting method with improved workability when mounting a mold.
[0002]
[Prior art]
According to the conventional resin sealing device and mold mounting method, a mold having a space (cavity part) into which resin is to be injected is placed on the mold base, moved and positioned, and then a bolt is used. And fixed to the mold base.
Further, in the resin sealing device, a power supply voltage is supplied from the control unit to a heater for heating the mold, and a temperature detection signal based on the mold temperature is controlled by the control unit in order to control the mold temperature. Need to supply. For these purposes, a conventional resin sealing device is provided with a cable with a connector extending from the control unit and the mold, respectively. A part of the cable with connector extending from the control unit is connected to the heater power source and the temperature control circuit in the control unit, and a part of the cable with connector extending from the mold is connected to the heater and the temperature detecting means in the mold. It is connected to the. The connectors provided at the ends of the cables are connected manually to supply a power supply voltage to the heater, and a temperature detection signal detected by the temperature detection means is supplied to the temperature control circuit of the control unit.
Furthermore, in the resin sealing device, it is necessary to take out the product after resin sealing from the mold that has been opened. For this purpose, in a conventional resin sealing device, an opening is provided in a mold attached to a mold base, and an ejector pin is pushed up by an ejector from below the mold base to protrude from the opening of the mold. Is done. As a result, the product is ejected by the ejector pin and removed from the mold.
[0003]
[Problems to be solved by the invention]
However, according to the above-described conventional resin sealing device and mold mounting method, the mold is moved to the vicinity of a predetermined position on the mold base, and further fixed for fine positioning after positioning. There is a need. Therefore, when attaching a heavy metal mold to the mold base, the work required for movement and positioning cannot be easily performed, and workability when attaching the metal mold is low.
Further, when the mold is attached or removed, the connectors are connected to or detached from each other manually. Accordingly, since a certain amount of work time is required for connecting and disconnecting the connectors, workability when exchanging the mold is low.
Furthermore, when the specification of the electronic component to be resin-sealed is changed and the position pushed up by the ejector pin in the product after resin sealing is changed, there are the following problems. That is, in order to change the push-up position by the ejector pin, that is, the position of the ejector pin, it is necessary to change the position of the ejector. Therefore, it is necessary to replace the mold base itself. Therefore, workability is low because a large number of man-hours are required to replace the mold base. Moreover, it is necessary to manufacture and stock various mold bases corresponding to the positions of the ejector pins.
As described above, according to the conventional resin sealing device and the mold mounting method, it is difficult to reduce the manufacturing cost due to the problem of low workability and the problem of requiring the mold base inventory. It has become.
[0004]
In order to solve the above-described problems, the present invention provides a resin sealing device and a mold mounting method that improve workability when a mold is attached to or removed from a mold base, and positions of ejector pins. It is an object of the present invention to provide a resin sealing device capable of minimizing the stock of mold bases when they are different.
[0005]
[Means for Solving the Problems]
In order to solve the above-described technical problem, a resin sealing device according to the present invention is a resin sealing device that seals an electronic component placed on a substrate with resin, and the substrate should be placed thereon. A mold having a recess and a cavity to be filled with resin, a mold base on which the mold is moved to a predetermined position after the mold is placed, and the mold moves in the mold base When the mold moves to a predetermined position, a guide plate that substantially contacts one side surface of the mold and a guide plate that can be moved forward and backward are provided. Is a projection member that protrudes the tip from the surface of the guide plate that substantially contacts the mold, and the projection plate is provided in the mold, and the projection member advances when the mold reaches a predetermined position. Temporarily fix the mold by mating with the tip It is characterized in that a recess for.
[0006]
Moreover, the resin sealing device according to the present invention is the above-described resin sealing device, further comprising a friction reduction mechanism that is provided on the mold base and reduces friction between the mold base and the mold. It is a feature.
[0007]
Further, the resin sealing device according to the present invention is the above-described resin sealing device, wherein the plurality of through holes provided in the mold base and the ejector provided so as to be movable up and down in at least one of the plurality of through holes. And an ejector pin which is provided in the mold and protrudes into at least one of the recess and the cavity when pressed by the ejector.
[0008]
Further, the resin sealing device according to the present invention is the above-described resin sealing device, provided with the first connector provided on the mold side and the mold base side, and the mold has moved to a predetermined position. In some cases, the apparatus further includes a second connector that is electrically connected by fitting with the first connector.
[0009]
The mold mounting method according to the present invention includes a step of mounting a mold having a cavity portion to be filled with a resin for sealing an electronic component on the mold base, and the mold base. A step of moving the mold along the guide plate, and when the mold reaches a predetermined position, the protruding member is protruded from the guide plate and fitted into a recess provided in the mold. And a step of temporarily fixing.
[0010]
[Action]
According to the resin sealing device of the present invention, in a state where the mold moving along the guide plate on the mold base has reached a predetermined position, the tip of the protruding member protruding from the guide plate and the mold The recess is fitted. Thus, the mold is temporarily fixed after reaching the predetermined position by moving only in the direction along the guide plate. Further, since the friction between the mold base and the mold is reduced, the mold moves smoothly on the mold base. Therefore, the position of the mold can be finely adjusted in a short time for the purpose of positioning, and the mold can be easily moved.
Moreover, an ejector pin pressed by an ejector provided in at least one of the plurality of through holes in the mold base on which the mold is placed is at least one of a concave portion and a cavity portion provided in the die. Protruded inside. Thereby, at least one ejector can be selected so that the ejector pin can project the product after resin sealing at an optimum position. Therefore, even when the specification of an electronic component such as a semiconductor chip is changed and the position pushed up by the ejector pin is changed, the same mold base can be used.
Further, when the mold moves and reaches a predetermined position on the mold base, the first connector provided on the mold side and the second connector provided on the mold base side are electrically connected. Connected. Furthermore, when the mold starts to move from a predetermined position, the first connector and the second connector are electrically disconnected. Therefore, the electrical connection or disconnection between the connectors can be performed in parallel with the mounting or removing work of the mold, instead of being performed manually. In addition, by fitting the first and second connectors together, the mold is reliably positioned in the direction of movement on the mold base.
Further, according to the mold mounting method according to the present invention, in a state where the mold to be moved along the guide plate on the mold base has reached a predetermined position, the tip end portion of the protruding member protruded from the guide plate; Fit the concave part of the mold. Thereby, after moving a metal mold | die to a predetermined position in the direction along a guide plate, it can be temporarily fixed temporarily.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a resin sealing device and a mold mounting method according to the present invention will be described with reference to FIGS. FIG. 1 is a partial cross-sectional view and a right side view of the resin sealing device according to the present invention, as seen from the front, each showing a state where the lower mold is moving.
In FIG. 1, 1 is an upper mold | type and 2 is a lower mold | type, and comprises a metal mold | die together. Reference numeral 3 denotes a mold base to which the lower mold 2 is attached at a predetermined position. Reference numeral 4 denotes a concave portion for a substrate on which a printed circuit board, a lead frame, and the like (hereinafter referred to as a substrate) on which electronic components such as semiconductor chips are attached are placed. Reference numeral 5 denotes a cavity formed of a space to be filled with a molten resin in order to seal an electronic component attached to the substrate. 6 is a runner part through which the molten resin filled in the cavity part 5 flows. 7 is a cull part in which the molten resin supplied to the runner part 6 is stored.
[0012]
Reference numeral 8 denotes a plunger for filling the cavity part 5 with the molten resin via the cull part 7 and the runner part 6 by rising. Reference numeral 9 denotes an ejector pin for pushing up the product after the molten resin is cured and sealing the electronic component, that is, the package, and removing it from the lower mold 2. Reference numeral 10 denotes a space provided in the lower mold 2 for the ejector pin 9 to move up and down. Reference numeral 11 denotes through holes provided at a plurality of locations on the mold base 3 so that an ejector described later can be moved up and down. 12 is provided in at least one through-hole selected corresponding to the position where the ejector pin 9 is pushed out among the plurality of through-holes 11, and is lifted or lowered to push up the ejector pin 9 in the space 10. Ejector for lowering. Reference numeral 13 denotes an elevating mechanism that is provided below the plurality of through holes 11 and elevates and lowers an ejector provided in at least one of the plurality of through holes 11.
[0013]
Reference numeral 14 denotes a mold-side connector attached to the lower mold 2. At least a part of the terminals of the mold side connector 14 is electrically connected to a heater (not shown) provided on the lower mold 2 and temperature detecting means (not shown) composed of a thermocouple or the like, for example, by electric wires. ing. Reference numeral 15 denotes a control unit side connector having terminals electrically connected to a control unit (not shown). And the control part side connector 15 is connected to the mold side connector 14 attached to the lower mold 2 when the lower mold 2 moves to a predetermined position, so that a connector mounting plate described later Is attached. Reference numeral 16 denotes a connector mounting plate to which the control unit side connector 15 is mounted, and is fixed to the mold base 3.
[0014]
Reference numeral 17 denotes a temporary fixing recess provided on the side surface of the lower mold 2. 18 is provided so as to be able to advance and retreat toward the side surface of the lower mold 2, and when the lower mold 2 is in a predetermined position, the lower mold 2 moves forward by being pressed from the back surface, and the tip portion thereof is in contact with the temporarily fixing recess 17. This is a protruding member for fitting and temporarily fixing the lower mold 2. Then, when the pressing is released, the protruding member 18 is moved back to the original position by a spring (not shown), for example, so that the lower mold 2 can be moved on the mold base 3. Reference numeral 19 denotes a cylinder for advancing the protruding member 18. 20 has a protruding member 18 and a cylinder 19 attached thereto, and when the lower mold 2 moves on the mold base 3 to a predetermined position, the lower mold 2 substantially contacts the side surface of the lower mold 2. Is a guide plate for guiding to move along a predetermined route. Reference numeral 21 denotes a pin that can be moved up and down by a cylinder, for example, and fixes the projecting member 18 that is moving forward so as not to move backward.
[0015]
Reference numeral 22 denotes a free bear for smoothly moving the lower mold 2 on the mold base 3. 23, when the lower mold 2 moves, only the top of the free bear 22 protrudes from the upper surface of the mold base 3, and when the temporarily fixed lower mold 2 is fixed by a bolt, the free bear This is a spring for positioning the top of 22 on the same surface as the upper surface of the mold base 3.
[0016]
The operation when the lower mold is temporarily fixed in the resin sealing device according to the present invention will be described with reference to FIG. FIG. 2: is the fragmentary sectional view and right view which each looked at the state which was fixed after the lower mold | type was temporarily fixed about the resin sealing apparatus which concerns on this invention. In FIG. 2, when the lower mold 2 moves along a predetermined path along the guide plate 20 and reaches a predetermined position, the lower mold 2 stops by fitting the mold side connector 14 and the control unit side connector 15. In this state, the mold 2 is positioned on the mold base 3. Then, the head of the cylinder 19 presses the back surface of the protruding member 18, and the protruding member 18 advances. Thereby, the front-end | tip part of the protrusion member 18 which advanced is fitted with the recessed part 17 for temporary fixing of the lower mold | type 2, and the lower mold | type 2 is temporarily fixed. Then, after the pin 21 is lowered and the protruding member 18 is fixed, the head of the cylinder 19 is retracted. Therefore, since the protruding member 18 fitted in the temporarily fixing recess 17 of the lower mold 2 does not retreat, the temporarily fixed lower mold 2 does not move. Thereafter, the lower mold 2 is fixed to the mold base 3 using bolts (not shown).
[0017]
When the resin sealing device of the present invention performs resin sealing, it operates as follows. First, the substrate is placed in the substrate recess 4, and then, for example, the lower mold 2 is raised and the mold surface P.P. L. Then, the upper mold 1 is clamped. Next, as the plunger 8 moves up, the molten resin is sequentially injected into the cavity portion 5 through the cull portion 7 and the runner portion 6 and then cured.
[0018]
FIG. 3 is a perspective view showing the mold base with the lower mold removed in the resin sealing apparatus according to the present invention. In FIG. 3, the lower mold moves smoothly on the mold base 3 by the free bear 22 in the direction of the arrow, that is, from the lower left to the upper right. And the control part side connector 15 attached to the connector attaching plate 16 is engaged with a mold side connector (not shown), so that the connectors are electrically connected to each other reliably, and the lower mold 2 has a predetermined shape. It is positioned and stopped at the position, and then temporarily fixed. Further, an ejector 12 provided in at least one of the plurality of through holes 11 provided in the mold base 3 pushes up an ejector pin (not shown).
[0019]
As described above, according to the present invention, the lower mold 2 can move to the predetermined position on the mold base 3 along the guide plate 20 reliably and smoothly by the free bear 22. Thereby, for the purpose of positioning, the position of the lower mold 2 that is a heavy object can be finely adjusted in a short time, and the lower mold 2 can be easily moved on the mold base 3. Therefore, workability is improved when the lower mold 2 is attached to the mold base 3.
In addition, the lower mold 2 that has moved to a predetermined position is temporarily fixed by fitting the tip of the advanced protruding member 18 into the temporary fixing recess 17 of the lower mold 2, and the protruding member 18 is fixed by the pin 21. It is fixed so as not to move backward. Thereby, the lower mold | type 2 is temporarily stopped | fastened reliably and does not move. Therefore, since the operation | work which fixes the lower mold | type 2 to the metal mold | die base 3 can be performed easily, workability | operativity is improved when fixing the lower mold | type 2. FIG.
Moreover, the ejector pin 9 can protrude the product after resin sealing in the optimal position by the ejector 12 provided in at least 1 selected from the several through-hole 11. FIG. Thereby, even when the position pushed up by the ejector pin 9 changes, the same mold base 3 can be used by selecting the through hole 11 at the optimum position and arranging the ejector 12. Therefore, the stock quantity of the mold base 3 corresponding to the lower mold | type 2 from which the position pushed up by the ejector pin 9 differs can be reduced.
Further, when the lower mold 2 is attached to the mold base 3, the mold side connector 14 and the control unit side connector 15 are fitted together as the lower mold 2 reaches a predetermined position. Connected to. Furthermore, when the lower mold 2 is removed from the mold base 3, the mold side connector 14 and the control unit side connector 15 are detached as the lower mold 2 starts to move. Thereby, in the operation | work which attaches or removes the lower mold | type 2 with respect to the metal mold | die base 3, connectors are automatically electrically connected or interrupted | blocked. In addition, the lower mold 2 is reliably positioned in the movement direction on the mold base 3. Therefore, workability is improved when the lower mold 2 is attached to the mold base 3 and when the lower mold 2 is removed from the mold base 3.
[0020]
Although the lower mold 2 has been described in the above description, the present invention is not limited to this, and the present invention can also be applied to the upper mold 1.
Further, the mechanism in which the protruding member 18 moves forward and backward, the mechanism to be fixed, and the friction reducing mechanism are not limited to the above description.
Furthermore, the present invention is not limited to the above-described embodiment, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention.
[0021]
【The invention's effect】
According to the resin sealing device of the present invention, the mold smoothly moves in the direction along the guide plate by the guide plate and the friction reduction mechanism and reaches a predetermined position, and then the protruding member and the recess Therefore, the position of the mold can be finely adjusted in a short time for the purpose of positioning. Moreover, the mold once positioned does not move. Therefore, it is possible to provide an excellent practical effect that it is possible to provide a resin sealing device with improved workability when attaching and fixing the mold to the mold base.
Further, even when the position pushed up by the ejector pin changes, at least one ejector can be selected so that the ejector pin can project the product at the optimum position. Therefore, since the same mold base can be used, the mold base inventory can be reduced.
Further, the electrical connection or disconnection between the connectors can be performed in parallel with the attaching or removing operation of the mold, instead of performing it manually. In addition, the mold can be reliably positioned simultaneously with the connection between the connectors. Therefore, workability is improved when the mold is replaced.
Furthermore, according to the mold attachment method of the present invention, the mold can be easily positioned after being moved along the guide plate and reaching a predetermined position. Therefore, the workability when attaching and fixing the mold to the mold base can be greatly improved.
[Brief description of the drawings]
FIG. 1 is a partial cross-sectional view and a right side view of a resin sealing device according to the present invention, as seen from the front, each showing a state where a lower mold is moving.
FIGS. 2A and 2B are a partial cross-sectional view and a right side view, as seen from the front, illustrating a state in which the lower mold is fixed after being positioned in the resin sealing device according to the present invention.
FIG. 3 is a perspective view showing the mold base with the lower mold removed in the resin sealing device according to the present invention.
[Explanation of symbols]
1 Upper mold (mold)
2 Lower mold (mold)
3 Mold base 4 Substrate recess 5 Cavity part 6 Runner part 7 Cull part 8 Plunger 9 Ejector pin 10 Space 11 Through hole 12 Ejector 13 Lifting mechanism 14 Mold side connector (first connector)
15 Control side connector (second connector)
16 Connector mounting plate 17 Temporary fixing recess 18 Protruding member 19 Cylinder 20 Guide plate 21 Pin 22 Free bear (friction reduction mechanism)
23 Spring

Claims (5)

A resin sealing device for sealing an electronic component placed on a substrate with a resin,
A mold having a recess to be placed with the substrate and a cavity to be filled with the resin;
A mold base on which the mold is moved to a predetermined position after the mold is placed; and
A guide plate that is provided along a direction in which the mold moves in the mold base, and that substantially contacts one side surface of the mold when the mold moves to the predetermined position;
A projecting member that is provided on the guide plate so as to freely advance and retreat, and projects a tip portion from a surface that substantially contacts the mold among the surfaces of the guide plate when the guide plate is advanced;
A recessed portion for temporarily fixing the mold by fitting with the tip when the protruding member is advanced in the state where the mold has reached the predetermined position, provided in the mold; A resin sealing device comprising: The resin sealing device according to claim 1,
A resin sealing device, further comprising a friction reducing mechanism provided on the mold base for reducing friction between the mold base and the mold. In the resin sealing device according to claim 1 or 2,
A plurality of through holes provided in the mold base;
An ejector provided to be movable up and down in at least one of the plurality of through holes;
A resin sealing device further comprising: an ejector pin that is provided on the mold and protrudes into at least one of the recess and the cavity when pressed by the ejector. In the resin sealing device described in any one of Claims 1-3,
A first connector provided on the mold side;
A second connector which is provided on the mold base side and is electrically connected by fitting with the first connector when the mold is moved to the predetermined position; A resin sealing device. Mounting a mold having a cavity portion to be filled with a resin for sealing an electronic component on a mold base;
Moving the mold along a guide plate provided on the mold base;
A step of temporarily fixing the mold by protruding a protruding member from the guide plate and fitting it into a recess provided in the mold when the mold reaches a predetermined position. A mold mounting method characterized by.

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