JP4054830B2 - Embossed card - Google Patents

Description

The present invention relates to an embossed card, and more particularly to an embossed card intended to detect counterfeiting.

Conventionally, as the technology in such a field, for example, there are the following.
FIG. 7 is a cross-sectional view of the embossing process of such a conventional card. First, as shown in FIG. 7A, the card material 1 is set between a concave mold (lower mold) 2b and a convex mold (upper mold) 2a.
Next, as shown in FIG. 7B, the card material 1 is sandwiched between a concave mold (lower mold) 2b and a convex mold (upper mold) 2a.

Therefore, the emboss 4 can be formed on the emboss card 3 as shown in FIG.

However, the above-described conventional embossed card has the following problems.
FIG. 8 is a process diagram for explaining the problems of the conventional embossing.
First, as shown in FIG. 8A, the embossed card 3 between the flat molds 5c and 5d is heated and sandwiched between the flat molds 5c and 5d as shown in FIG. After returning to the flat card base 6 as shown in (c), as shown in FIG. 8 (d), the flat card base is placed between the counterfeit convex mold 5e and the counterfeit concave mold 5f. 8 is set, and as shown in FIG. 8 (e), the flat card base 6 is sandwiched between the counterfeit convex mold 5e and the counterfeit concave mold 5f, thereby embossing as shown in FIG. 8 (f). There is a problem that the counterfeit emboss 9 can be formed on the card 8.

An object of the present invention is to provide an embossed card that eliminates the above-described problems and can detect a counterfeit emboss on an embossed card.

In order to solve the above-mentioned problems, the means taken by the present invention includes a card base material in which a concave portion corresponding to the emboss formed on the front surface is formed on the back surface, and a film attached to the back surface so as to cover the concave portion. It is characterized by having.

  By configuring in this way, even if an attempt is made to form counterfeit embossing on the embossed card, forgery can be overlooked by the absence of the film, so that the above problem can be solved.

  In the present invention, the film may be a colored film, the film may be attached so as to cover a part of the back surface of the card base material including the region where the recess is formed, or the card base material may be made of gold. The above-described problem can be solved more reliably by using a mold and further making a device that can be flattened by using heating.

  As described above, by using the embossed card as in the present invention, forgery of the embossed card can be detected and counterfeiting can be prevented.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view of an essential part of an anti-counterfeit emboss card showing a first embodiment of the present invention, FIG. 2 is a front view of the emboss card, and FIG. 3 is a back view of the emboss card.

As shown in these drawings, the anti-counterfeit emboss card 11 has a recess 14 a on the back surface 12 and a protrusion 14 b on the front surface 13, thereby forming the emboss 14. The recess 14a is filled with resin 16. Various resins can be used as the resin 16. In particular, when a thermosetting resin is used, forgery can be reliably prevented.

As shown in FIG. 2, the anti-counterfeit embossing card 11 obtained in this way has an emboss 14 formed on the front surface 13 and a concave portion 14a filled with a resin 16 on the back surface 12 as shown in FIG. It is shown.
Such an anti-counterfeit emboss card is manufactured by the following method, for example.

(1) First, the first manufacturing method will be described with reference to FIG.
First, as shown in FIG. 4A, the card base 10 is set between the convex mold 15a and the concave mold 15b, and then, as shown in FIG. As shown in FIG. 4 (c), an emboss 14 having a concave portion 14a and a convex portion 14b is formed between the convex mold 15a and the concave mold 15b. Next, as shown in FIG. Then, the resin 16 is filled into the formed recess 14 a to produce the forgery prevention emboss card 11.

(2) Next, a second manufacturing method will be described with reference to FIGS.
First, as shown in FIG. 5 (a), the card substrate 10 is set between the convex mold 21 and the concave mold 15b that can be filled with the resin 22, and then, as shown in FIG. 5 (b). Then, the card substrate 10 is sandwiched between the convex mold 21 and the concave mold 15b, and as shown in FIG. 5 (c), an emboss 14 having a concave portion 14a and a convex portion 14b is produced. When removing 21, resin 22 is filled from the tip of convex mold 21 to produce anti-counterfeit emboss card 11.

(3) Next, a third manufacturing method will be described with reference to FIGS.
First, as shown in FIG. 6 (a), the card substrate 10 is set between a convex mold 31 and a concave mold 15b each having a tip formed of a resin 32, and then, as shown in FIG. 6 (b). When the card substrate 10 is sandwiched between the convex mold 31 and the concave mold 15b to form the concave portions 14a and the convex portions 14b and remove the convex mold 31 as shown in FIG. Then, the resin 32 is left in the recess 14a to obtain the forgery prevention emboss card 11.

Since it comprised as mentioned above, according to 1st Example, since the resin is filled in the embossed recessed part of the anti-counterfeit emboss card, the anti-counterfeit emboss card is heated and sandwiched between flat molds. However, it cannot be returned to a flat card substrate.

Next, a second embodiment of the present invention will be described.
FIG. 9 is a cross-sectional view of the main part of a forgery-preventing embossed card showing a second embodiment of the present invention, and FIG.

In this embodiment, as shown in FIG. 9, the anti-counterfeit emboss card 41 is filled with a resin 46 in the recess 44a so that the back surface 41a of the card is flat.

Next, a method for producing an anti-counterfeit emboss card showing the second embodiment of the present invention will be described.
(1) First, as shown in FIG. 10 (a), the card substrate 40 is set between the convex mold 42a and the concave mold 42b, and then, as shown in FIG. 10 (b), the card base 40 is set. The material 40 is sandwiched between the convex mold 42a and the concave mold 42b, and as shown in FIG. 10 (c), an emboss card 41 having a concave portion 44a and a convex portion 44b is produced. As shown in FIG. 10 (e), the embossed card 41 thus produced is sandwiched between an upper mold 48 and a lower mold 49, and a concave portion 44a serving as a cavity is filled with a resin 46. The forgery prevention emboss card 41 filled with the resin 46 so as to be flat can be produced. Reference numeral 44 denotes an emboss.

In addition, as a method of flattening the resin, a method in which the surface from which the resin is removed matches the surface on the back of the card, a method in which the filled resin is squeezed, or the like can be considered.

As described above, according to the second embodiment, since the resin is formed so as to be flat on the same plane as the back side of the card, printing or the like can be reliably performed on the back side. Can be pasted.

Next, a third embodiment of the present invention will be described.
FIG. 11 is a cross-sectional view of a main part of an anti-counterfeit emboss card showing a third embodiment of the present invention, FIG. 12 is a front view of the anti-counterfeit emboss card, and FIG. 13 is a back view of the anti-counterfeit emboss card.
In FIG. 11, the anti-counterfeit emboss card 51 is formed with an emboss 54 in which a concave portion 54a is formed on the back surface 53 and a convex portion 54b is formed on the front surface 52. A thin film 55 is affixed to the upper part of the concave portion 54 a of the back surface 53. The thin film 55 is not colorless and transparent, and is preferably a colored film.

That is, as shown in FIG. 12, a convex portion 54 b is formed on the surface 52 of the anti-counterfeit emboss card 51. As shown in FIG. 13, a recess 54a is formed on the back surface 53 of the anti-counterfeit emboss card 51, and a thin film 55 is attached to the surface on the recess 54a.

As described above, according to the third embodiment, the anti-counterfeit embossing card is heated by a thin mold attached to the surface of the embossed recess of the anti-counterfeit embossing card. When sandwiched and flattened, the film is integrated with the card substrate, so that even if the emboss is forged, the film disappears and the forgery can be detected.

Furthermore, it goes without saying that the first embodiment or the second embodiment can be combined with the third embodiment.
In addition, this invention is not limited to the said Example, A various deformation | transformation is possible based on the meaning of this invention, and these are not excluded from the scope of the present invention.

As described above in detail, according to the present invention, the following effects can be obtained.
(1) Since the resin is filled in the embossed recesses of the anti-counterfeit embossing card, the anti-counterfeit embossing card cannot be returned to the flat card substrate even if it is heated and sandwiched between flat molds.
Therefore, forgery of the embossed card can be reliably prevented.

(2) Since the resin is formed so as to be flat on the same plane as the back surface of the card, printing or the like can be reliably performed on the back surface, and a sign panel or the like can be attached.

(3) Since a pre-Symbol resin to use a thermosetting resin, heating the anti-counterfeiting embossing cards, the resin becomes hard through insertion at the flat die, a flat card group sandwiched by flat die Returning to the material can be reliably prevented.

(4) A forgery-preventing embossed card can be produced by a simple process of simply filling the embossed recess with resin.

(5) When a thin film is affixed to the surface of the embossed recess of the anti-counterfeit embossing card, the anti-counterfeit embossing card is heated and sandwiched between flat molds to make it flat. Therefore, even if the emboss is forged, the film is gone and the forgery can be detected.
Therefore, forgery of the embossed card can be reliably prevented.

(6) A forgery-preventing embossed card can be produced by a simple process of simply sticking a thin film on the surface of the embossed recess.

It is principal part sectional drawing of the forgery prevention emboss card | curd which shows 1st Example of this invention. It is a surface view of the forgery prevention emboss card | curd which shows 1st Example of this invention. It is a reverse view of the forgery prevention emboss card | curd which shows 1st Example of this invention. It is sectional drawing of the 1st production process of the forgery prevention emboss card showing the 1st example of the present invention. It is 2nd manufacturing process sectional drawing of the forgery prevention emboss card | curd which shows 1st Example of this invention. It is sectional drawing of the 3rd manufacturing process of the forgery prevention emboss card | curd which shows 1st Example of this invention. It is manufacturing process sectional drawing of the embossing of the conventional card | curd. It is process drawing explaining the problem of the conventional embossing. It is principal part sectional drawing of the forgery prevention emboss card | curd which shows 2nd Example of this invention. It is production process sectional drawing of the forgery prevention emboss card | curd which shows 2nd Example of this invention. It is principal part sectional drawing of the forgery prevention emboss card | curd which shows 3rd Example of this invention. It is a surface view of the forgery prevention emboss card | curd which shows 3rd Example of this invention. It is a reverse view of the forgery prevention emboss card | curd which shows 3rd Example of this invention.

Explanation of symbols

10, 40 Card base material 11, 41, 51 Anti-counterfeit emboss card 12, 41a, 53 Back surface 13, 52 Front surface 14, 44, 54 Emboss 14a, 44a, 54a Concave portion 14b, 44b, 54b Convex portion 15a, 21, 31, 42a Convex mold 15b, 42b Concave mold 16, 22, 32, 46 Resin 48 Upper mold 49 Lower mold 55 Thin film

Claims (3)

A card base material that can be flattened by using a mold and that can be flattened by heating, and has a recess corresponding to the emboss formed on the front surface.
A film attached to the back surface to cover the recess,
An embossed card characterized by comprising:   The embossed card according to claim 1, wherein the film is a colored film.   The embossed card according to claim 1, wherein the film is attached so as to cover a part of the back surface including a region where a recess is formed.

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