JP4052822B2 - Substrate warpage measurement method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for measuring warpage of a plate-like object, and more particularly to a warpage measurement method for knowing the warpage state of a substrate such as a rectangular glass plate.
[0002]
[Prior art]
A glass plate as a substrate constituting various displays such as a plasma display panel forms a large number of components such as electrodes and ribs on the glass plate, and warps the substrate through the formation process of these components. It is important to manage the state. In particular, since the plasma display panel has a front plate and a back plate which are separately prepared and bonded together with a sealant at the outer periphery, it is ideal that each substrate does not warp.
[0003]
Regarding the warpage of the substrate, there are various standards for each company. As a method for measuring the warpage, the present inventor tried by the method shown in FIG.
[0004]
The method shown in FIG. 1 will be described as follows. That is, as shown in FIG. 1A, after the substrate G stands on several rubber plates 3 along the grooves of the grooved guide plates 2 respectively attached to the inner surfaces of the opposite side walls of the carriage 1, the grooves The straight gauge 4 is placed on the upper edge of the guide plate 2 and the straight gauge 4 is pressed against the opposite sides of the substrate G. Next, as shown in FIG. This is a method in which a gap gauge 5 is inserted between G and the straight gauge 4 and the maximum thickness that passes is used as the amount of warpage.
[0005]
[Problems to be solved by the invention]
The warpage measurement method described in the prior art takes into account the deformation of the substrate due to gravity compared to the conventional method of placing a substrate on a surface plate and measuring the gap generated between them with a gap gauge. Is excellent. However, two workers are required for the measurement work, and there are variations in how the straight gauge is pressed and how the gap gauge is inserted. Actually, when measuring the warp in the long side direction with the back plate (650 × 1050 mm) for the plasma display panel, the measured value varies from 0.4 to 0.5 mm depending on the operator even with the same substrate. . In addition, since the gap gauge needs to be inserted at least twice, the work takes time.
[0006]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for measuring the warpage of a substrate that can be measured easily, efficiently and accurately.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the substrate warpage measuring method of the present invention provides a straight gauge in which a dial gauge is attached at a predetermined position with a probe at the tip of the spindle protruding sideways. Check the zero point position of the dial gauge in advance by placing it on the surface plate, lower the board along the left and right ends of the groove of the grooved guide plate, and place the lower corner of the board in the resin jig The substrate to be measured is set in a standing state so that its lower side is not supported and freed, and then the dial gauge probe is pressed against the surface of the substrate. A straight gauge is brought into contact with both sides of the surface, and the difference between the value of the dial gauge at that time and the value of the zero point position is used as the amount of warpage.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings with specific examples.
[0009]
In the present invention, first, a straight gauge 10 with a dial gauge as shown in FIG. 2 is prepared. That is, the dial gauge 11 is attached to a predetermined position of the straight gauge 10 with the measuring element 11a at the spindle tip of the dial gauge 11 protruding sideways. In this case, it is attached to one surface of the square bar-shaped straight gauge 10, but the attachment position may correspond to a location where the warpage of the substrate is to be measured, and is generally near the center.
[0010]
Next, as shown in FIG. 3, the straight gauge 10 with a dial gauge is placed on the surface plate B. In this case, the direction in which the measuring element 11a of the dial gauge 11 is in contact with the surface plate B is set, and the scale where the measuring element 11a is retracted by a predetermined amount and the pointer stops is set as the zero point position.
[0011]
Then, using the straight gauge 10 with the dial gauge, the warpage of the substrate is measured as shown in FIG.
[0012]
That is, as shown in FIG. 4A, the substrate G is lowered along the grooves of the grooved guide plates 21 respectively attached to the inner surfaces of the opposite side walls of the carriage 20, and the lower corner of the substrate G is set at the lower corner of the carriage 20. After fitting and setting in the resin jig 22 at the bottom, the straight gauge 10 is placed on the resin plate 23 attached along the upper edge of the grooved guide plate 21, and then the straight gauge 10 is placed on the substrate G. The straight gauge 10 is pressed against the opposite sides of the substrate G in an upright state by sliding it toward the surface. At the time of this sliding, the probe 11a of the dial gauge 11 is pressed against the substrate G as shown in FIG. And the numerical value of the dial gauge 10 at that time is read, and the difference between the value and the numerical value at the zero point position is taken as the amount of warpage.
[0013]
The carriage 20 used in the above measurement is fixed by fitting the lower corner of the substrate G into a groove of a resin jig 22 made of Teflon (registered trademark), nylon, or the like. Since the position forcing force applied to the substrate G that occurs when it is placed on the rubber plate 3 shown in A) is eliminated and the lower side of the substrate G is not supported, the substrate G is in a free state. can do.
[0014]
In addition, a resin plate 23 such as Teflon (registered trademark) or nylon is used for the portion where the straight gauge 10 is placed and slid. For this reason, the slide movement of the straight gauge 10 becomes smooth, and the straight gauge 10 is applied in the manner of application. The variation is eliminated, and the measurement of the warp becomes more accurate from this point.
[0015]
When the above-described carriage 20 was used to actually measure the warp in the long side direction with the back plate (650 × 1050 mm) for the plasma display panel, the variation in the measured value was suppressed to 0.1 mm or less in the range. I was able to.
[0016]
The carriage 20 used in the above measurement has a wheel 24 attached to the bottom, so that the carriage 20 can be moved to a place where the board G is present, so that the board G can be transported and set in the carriage 20. It was convenient.
[0017]
As described above, the embodiment of the present invention has been described in detail with reference to one specific example. However, the method for measuring the warpage of the substrate according to the present invention is not limited to the above-described embodiment. Of course, various changes can be made without departing from the spirit of the invention.
[0018]
【The invention's effect】
As described above, the substrate warpage measuring method of the present invention provides a straight gauge in which a dial gauge is mounted at a predetermined position with a probe at the tip of the spindle protruding sideways, and the straight gauge is mounted on a surface plate. Check the zero point position of the dial gauge in advance by placing it on the board, lower the board along the left and right ends of the groove of the grooved guide plate, and fit the lower corner of the board to the resin jig Set the substrate to be measured upright so that its lower side is not supported, and then press the dial gauge probe against the surface of the substrate. A straight gauge is brought into contact with the side, and the difference between the dial gauge value at that time and the zero point position value is used as the amount of warpage. Because it can measure the warping of the substrate in the dial gauge in operation just pressing the Togeji, it can be easily and efficiently and accurately measure the warping state of the substrate.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an explanatory view of a method for measuring a warpage of a substrate, which the present inventor tried, (A) is a side view of a carriage used for measurement, and (B) is a positional relationship between a straight gauge and a substrate during measurement. FIG.
FIG. 2 is a top view showing a straight gauge with a dial gauge.
3 is a side view showing a state in which a straight gauge with a dial gauge shown in FIG. 2 is placed on a surface plate. FIG.
4A and 4B are explanatory views showing a method for measuring warpage according to the present invention, in which FIG. 4A is a side view of a carriage used for measurement, and FIG. 4B is a positional relationship between a straight gauge with a dial gauge and a substrate. FIG.
[Explanation of symbols]
B Surface plate G Substrate 10 Straight gauge 11 Dial gauge 11a Probe 20 Carriage 21 Guide plate 22 with groove 22 Resin jig 23 Resin plate 24 Wheel

Claims (1)

Prepare a straight gauge by attaching the dial gauge to a predetermined position with the probe at the end of the spindle protruding sideways, and place the straight gauge on the surface plate to check the zero point position of the dial gauge in advance. Then, lower the board along both the left and right sides of the groove of the grooved guide plate and fit the lower corner of the board into the resin jig so that the lower side of the board to be measured is not supported After setting it so that it is free , press the dial gauge probe against the surface of the board and bring the straight gauge into contact with the opposite sides of the board. A method for measuring a warpage of a substrate, characterized in that a difference from a numerical value of a zero point position is set as a warpage amount.

Images