JP4041604B2 - Electronic component testing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component test apparatus, and more particularly, to an electronic component test apparatus that prevents the occurrence of dew condensation during a low temperature test of an electronic component at an interconnection portion between a test handler and a test head 70.
[0002]
[Prior art]
The outline of the flow of the measurement test by the electronic component test apparatus will be described with reference to the IC test apparatus shown in FIG. The IC test apparatus can be used for a measurement test of an electronic component by making some design changes.
The IC to be tested is transferred into the temperature-controlled room 20 in the test handler 10 and the IC test is performed in a high / low temperature atmosphere in the temperature-controlled room 20. At this time, the IC placed on the user tray 13 is placed again on the test tray 14 that can withstand high / low temperature inside the temperature-controlled room 20 in the loader unit 11 of the test handler 10. The test tray 14 on which the IC is placed is transferred to the soak chamber 22 of the temperature-controlled room 20, and is further transferred from here to the test chamber 21, where the high / low temperature test of the IC is performed. After the high / low temperature test, the test tray 14 on which the IC is placed is sent out from the test chamber 21 to the unloader unit 12 via the exit chamber 23. This time, the IC is transferred from the test tray 14 to the user tray in the unloader unit 12. 13 is remounted.
[0003]
Referring also to FIG. 6, when the IC is subjected to a measurement test, the IC is transported in a state of being placed on the test tray 14 as shown in FIG. 6B, and the measurement test is performed in this state. Then, the IC is placed on the test tray 14 with the tray insert 141 interposed. Here, FIG. 6A is a diagram showing the whole type exchange unit indicated by 63 belonging to the test head 70 side. Here, the product type exchange unit 63 includes an IC socket 60, a socket board 61, a motherboard 68, and a product type exchange unit base 631, and is a collective term for these four components. IC sockets 60 are arranged and arranged in a matrix on the top surface of the product type exchange unit 63. The terminal of the IC placed on the test tray 14 comes into contact with the IC socket 60. Then, the socket board 61, the mother board 68, the connector 17, and various measuring unit boards and cables in which multilayer wiring is formed are connected. Finally, the test is performed by connecting to the IC test apparatus main body. In actuality of the measurement test, the IC is transferred to the test chamber 21 in the temperature-controlled room 20 with the IC placed on the test tray 14 as described above, and the product changer 63 belonging to the test head 70 side is moved down to the test chamber 21. The operation is performed by airtightly coupling from the side and pressing and contacting the IC with the pusher against the uppermost IC socket 60 of the product changer 63.
[0004]
1 to 4, these will describe the interconnection between the temperature-controlled room 20 of the test handler 10 and the product changer 63 on the test head 70 side and the connection between the IC and the IC socket. FIG. In particular, FIG. 1 is a diagram for conceptually explaining that the type exchange unit 63 is airtightly coupled to the test chamber 21 from below. FIG. 2 is a view of the test handler 10, the test head 70, and the mutual coupling portion between the two viewed from behind, and FIG. 3 is a view of the test head 70 viewed from the side. FIG. 4 is an enlarged view of a part of FIG.
[0005]
In FIG. 1, a line SS ′ is a convenient boundary line indicating a boundary between the test handler 10 side and the test head 70 side. At the mutual coupling part between the test handler 10 and the test head 70, the IC as the measurement object is connected to the IC socket 60, and then the socket board 61, the cable 69 penetrating the product type exchange part 63, and the performance board 67 in this order. They are electrically connected, and finally are electromechanically connected to the main body of the IC test apparatus via a board 72 accommodated in the casing 71 of the test head 70. Alternatively, the IC is connected to the IC socket 60, and is electrically connected in the order of the socket board 61, the product exchange unit 63, the electrical connection member in the product exchange unit cover 66, and the performance board 67, and then the casing of the test head 70. It is finally electromechanically connected to the main body of the IC test apparatus via a board 72 accommodated in 71.
[0006]
When performing the test measurement, the test chamber 21 must be shut off from the outside atmosphere in a state where the type exchange unit 63 on the test head 70 side is coupled to the test chamber 21 of the temperature-controlled room 20 on the test handler 10 side. This will be described in particular with reference to FIG. 1 which is a conceptual diagram. An annular handler-side product type changeover cover 25 is coupled and fixed to the outer peripheral portion of the lower surface of the handler base 24. And the cyclic | annular type | mold exchange part cover 66 is couple | bonded and fixed over the perimeter of the upper end part of the casing 71. FIG. In addition, a performance board 67 is attached to the coupling and fixing part between the casing 71 and the product type change part cover 66, and the IC socket 60 is connected to the cable 69 or the electrical connection member in the product type change part cover 66 as described above. The lever is connected to the performance board 67 and further connected to a board 72 accommodated in the casing 71. The above-described product type replacement unit cover is configured separately from the handler-side product type replacement unit cover 25 and the product type replacement unit cover 66. It may be the product type replacement unit cover 66.
[0007]
Here, referring also to FIG. 2 to FIG. 4, in order to shut off the inside of the test chamber 21 and the external atmosphere, the upper surface of the product type changer base 631 is interposed between the handler base flange 241 and an annular packing. Press contact. This pressure contact is made by pressing the product changer base 631 upward by the pressing member 26 inserted through the insertion hole 251 formed in the handler side product changer cover 25. Then, the entire casing 71 is pushed up by a lifting device (not shown), and the product type replacement unit cover 66 is brought into pressure contact with the lower end edge of the handler side product type replacement unit cover 25 with an annular packing interposed therebetween. As described above, the inside of the test chamber 21 and the external atmosphere can be temporarily blocked.
[0008]
An intake / exhaust fan 73 that cools the inside of the casing 71 is attached to the casing 71 at both front and rear ends. One of the intake / exhaust fans 73 exhausts heat generated by a large number of boards 72 accommodated in the casing 71 to the outside, and the other is used to suck outside air into the casing 71. The intake / exhaust amount of the intake / exhaust fan 73 cannot fall below a certain limit because of the relationship with the amount of heat generated by the board 72. The flow of air generated by the intake / exhaust fan 73 is as indicated by three arrows in FIG.
[0009]
Hereinafter, the reason why these air flows occur will be described. First, there is a gap between the performance board 67 and the test head 70. For example, a large number of unused through holes 671 remain in the performance board 67. When the intake / exhaust fan 73 starts the intake / exhaust operation, the inside of the casing 71 is depressurized thereby, so that the inside of the through hole 671 in the through holes 671 is unused from the inside of the product type replacement unit cover 66. Then, air is sucked into the casing 71 side. Since air flows out from the inside of the product type changing unit cover 66, air is supplied and refilled from somewhere inside the product type changing unit cover 66. Here, an insertion hole 251 is formed in contact with the handler base 24 at the upper end portion of the handler-side product replacement portion cover 25, and the white inside the product replacement portion cover 66 is thin through the insertion hole 251. Air replenishment from outside is performed as indicated by the arrow. Since the intake / exhaust amount of the intake / exhaust fan 73 cannot fall below a certain limit due to the relationship between the heat generation amount generated by the board 72, the inflow amount of air is not a small amount.
[0010]
[Problems to be solved by the invention]
In recent years, conditions for low-temperature tests in IC tests have become strict, and the low temperature side of the test temperature range has reached a very low temperature of −30 ° C. to −55 ° C. The product changer 63 is exposed to this extremely low temperature and cooled to a temperature close to this, and the product changer base lower surface 631 is also cooled, and its lower surface is also in a considerably low temperature state. Since the lower surface of the product type exchange unit base 631 is exposed on the inner side of the area formed by the handler side product type exchange unit cover 25 and the product type exchange unit cover 66 into which outside air flows, the product type exchange unit base cooled to an extremely low temperature is used. 631 is exposed to humid outside air, and condensation occurs on the lower surface. Since the connector 17 is present on the lower surface of the product exchange base 631 or the cable 69 is exposed through the cryogenic test chamber 21, if the condensation occurs here, an appropriate test result cannot be guaranteed. As the conditions for low-temperature tests become stricter, this dew condensation countermeasure becomes important, and it is becoming impossible to guarantee an appropriate test result without an appropriate dew condensation countermeasure.
[0011]
By the way, conventionally, dew condensation is eliminated by blowing dry air having a low dew point into the product exchange section cover 66 in an appropriate manner, and the inflow air is dehumidified. However, the effect of eliminating this dew condensation and dehumidification of the inflow air is still not achieved. It is hard to say that it is good enough.
The present invention provides an electronic component testing apparatus that solves the above problems.
[0012]
[Means for Solving the Problems]
A test handler 10 having a temperature-controlled room 20 for testing and measuring electronic components in a high / low temperature atmosphere, and a handler base 24 formed with an electronic component feed opening 28 and coupled and fixed to the lower end of the temperature-controlled room 20. A product type exchange unit 63 comprising an electronic component socket 60, a socket board 61, a mother board 68, and a product type exchange unit base 631, and a casing 71 in which a large number of electrical wiring boards 72 are accommodated and an intake / exhaust fan 73 is attached. And a performance board 67 that is attached and fixed between the inner area of the casing 71 and the inner area of the product changer cover 66, and the electronic component socket 60 is a cable 69 or socket board 61 that passes through the product changer 63, It is electrically connected to the performance board 67 via the motherboard 68, and the In an electronic component testing apparatus including an annular product type changer cover 66 that is coupled and fixed to the upper end of the sing 71, a dry air source is provided, and a dry air supply hole 27 is formed in the handler side product type changer cover 25. An electronic component test apparatus was configured in which a dry air source was connected and the unused through hole 671 of the performance board 67 was closed.
[0013]
And, in the electronic component testing apparatus according to claim 2, a dry air source is provided, a dry air supply hole 27 is formed in the handler side product type replacement part cover 25, and the dry air source is connected to the dry air source. An electronic component testing apparatus in which a screen was attached to the lower side of the unused through hole 671 of the board 67 was configured.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to FIGS.
Condensation on the bottom surface of the product replacement unit base 631 of the product replacement unit 631 is achieved by supplying dry air to an internal region constituted by the product replacement unit cover 66 including the handler-side product replacement unit cover 25 and making this region a low dew point. Occurrence can be reduced. That is, in the electronic component testing apparatus of the present invention, the intake / exhaust fan 73 that cools the inside of the casing 71 is attached to both the front and rear ends of the casing 71, and one of the intake / exhaust fans 73 is accommodated in the casing 71. The heat generated by the single board 72 is exhausted to the outside, and one of them adopts a configuration in which the outside air is sucked into the casing 71, and the intake / exhaust amount of the intake / exhaust fan 73 is not very small. However, a relatively small amount of economically sufficient dehumidifying effect can be exhibited as follows without the need to blow a particularly large amount of dry air.
[0015]
Referring to FIG. 1, a dry air supply hole 27 is formed in the handler side product exchange unit cover 25 of the product exchange unit cover 66, and an external dry air source is connected to the dry air supply hole 27 to supply dry air to the internal region of the product exchange unit cover 66. To do. By supplying and supplying dry air to the internal area of the product replacement cover 66, the atmosphere can be replaced with an atmosphere having a low dew point by the amount of dry air that has flowed in, and exposed to the cryogenic atmosphere in the cryogenic test chamber 21. Condensation in the vicinity of the connector 17 and the cable 69 passing through the lower surface of the cooled product type exchange unit base 631 of the product type exchange unit 63 is reduced. In this case, a configuration is adopted in which the atmosphere in the product replacement section cover 66 internal region is not affected by the air flow by the intake / exhaust fan 73. That is, a large number of heat generating boards 72 are accommodated, and an internal area of the casing 71 and an internal area of the product replacement section cover 66 are sucked and exhausted by attaching intake / exhaust fans 73 that cool the inside of the casing 71 to both front and rear ends. The airtightness between both regions is improved by blocking the gap. As a result, the atmosphere in the product replacement section cover 66 internal region, which has been supplied with dry air and has a low dew point, is sucked into the casing 71 by the intake / exhaust fan 73 and supplied to the internal product replacement unit covers 25 and 66 in the internal region. Can reduce waste.
[0016]
The performance board 67 can be used for this occlusion shielding. A performance board 67 is attached and fixed to a connecting and fixing part between the casing 71 and the product type changing part cover 66. However, since the unused through hole 671 generally remains on the performance board 67, the unused through hole 671 is closed. As a result, it is possible to reduce waste caused by the dry air in the region inside the product changer cover 66 caused by the intake / exhaust fan 73 being sucked into the casing 71 and reduced. That is, the influence of the air flow in the direction of the white thick arrow by the intake / exhaust fan 73 eliminates the room for the air flow in the direction of the thin white arrow and the solid line arrow, and the internal regions of the product type changeover covers 25 and 66 The amount of outside air that flows into the exhaust gas is reduced, and the amount of low dew point atmosphere that is constructed by supplying dry air into the product exchange section covers 25 and 66 in the area inside the casing 71 is also sucked into the casing 71 by the intake / exhaust fan 73. Decrease.
[0017]
To describe another embodiment, a suitable screen is attached to the lower side of the performance board 67 instead of closing the through hole 671 of the performance board 67. Even according to this, the influence of suction by the intake / exhaust fan 73 is reduced, and the amount by which the low dew point atmosphere formed in the product replacement section covers 25 and 66 is reduced by being sucked into the casing 71 by the intake / exhaust fan 73. Is also limited.
[0018]
【The invention's effect】
As described above, according to the present invention, the atmosphere in the product replacement part cover inner region is not affected by the air flow by the intake and exhaust fans, that is, the casing inner region and the product replacement part cover inner region. Dry air is supplied to the inside of the product replacement part cover, which has a low dew point by being supplied with dry air. Can reduce waste.
[0019]
And this blockage shielding is performed by closing unused through holes on the performance board, thereby simplifying the configuration and reducing waste of reducing dry air from the internal area of the product replacement section cover caused by the intake and exhaust fans. Can do. In addition, even if an appropriate screen is attached to the lower side of the performance board, it is possible to reduce the influence of the intake / exhaust fan that reduces the suction of dry air from the internal area of the product replacement section cover.
[Brief description of the drawings]
FIG. 1 is a diagram conceptually illustrating a connection of a product type exchange unit with a test room.
FIG. 2 is a view of a mutual coupling portion viewed from behind.
FIG. 3 is a side view of the test head.
4 is an enlarged view showing a part of FIG.
FIG. 5 is a diagram for explaining an outline of a flow of a measurement test.
FIG. 6 is a diagram illustrating a product type exchange unit and a test tray.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Test handler 11 Loader part 12 Unloader part 13 User tray 14 Test tray 141 Tray insert 17 Connector 20 Temperature-controlled room 21 Test room 22 Soak room 23 Exit room 24 Handler base part 241 Handler base part flange 25 Handler side product exchange part cover 251 Insertion Hole 26 Press member 27 Dry air supply hole 28 Electronic component feed opening 60 IC socket 61 Socket board 63 Product exchange unit 631 Product exchange unit base 66 Product exchange unit cover 67 Performance board 671 Through hole 68 Motherboard 69 Cable 70 Test head 71 Casing 72 Board 73 Intake / exhaust fan

Claims (2)

A test handler having a temperature-controlled room for testing and measuring electronic components in a high / low temperature atmosphere, and a handler base portion in which an electronic component feed opening is formed and fixedly coupled to the lower end of the temperature-controlled room;
Electronic component socket, Ri socket board, a motherboard, and more varieties exchange unit base formed, the flange formed on the handler base portion via an annular packing provided with a variety exchanging unit where the variety exchanging unit base is pressed,
It has a casing that houses a large number of electrical wiring boards inside and is fixed with intake and exhaust fans.
Comprises a performance board to be mounted and fixed between the inner region and the cultivar exchange cover interior region of the casing,
The electronic component socket cable or the socket board penetrating the varieties exchange unit, electrically connected to the performance board through the motherboard,
The electronic device testing apparatus comprising an annular the varieties replacement cover which is coupled fixed to the upper end of the casing,
With a dry air source,
A dry air supply hole is formed in the handler-side product exchange section cover, and a dry air source is connected to this hole.
Electronic device test apparatus characterized by closing the unused through hole of said performance board. A test handler having a temperature-controlled room for testing and measuring electronic components in a high / low temperature atmosphere, and a handler base portion in which an electronic component feed opening is formed and fixedly coupled to the lower end of the temperature-controlled room;
An electronic component socket, a socket board, a mother board, and a product type exchange unit base, comprising a product type exchange unit in which the product type exchange unit base is pressed into contact with a flange formed on the handler base unit via an annular packing,
It has a casing that houses a large number of electrical wiring boards inside and is fixed with intake and exhaust fans.
Comprising a performance board that is mounted and fixed between the internal area of the casing and the internal area of the product replacement section cover;
The electronic component socket is electrically connected to the performance board via a cable or the socket board penetrating the product type changing unit, and the motherboard.
In the electronic component testing apparatus comprising the annular product type replacement unit cover coupled and fixed to the upper end of the casing,
With a dry air source,
A dry air supply hole is formed in the handler-side product exchange section cover, and a dry air source is connected to this hole.
Electronic device testing apparatus, characterized in that attached to the screen to the lower side of the unused through hole of said performance board.

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