JP2014048202A - Electronic component tester - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component tester that includes a cooling mechanism capable of efficiently cooling the inside of the tester while suppressing noise.SOLUTION: An electronic component tester 1 includes: a test module 100 on which an electronic component testing device is mounted; a control module 200 and power supply unit 300 that control the test module 100; a first cooling mechanism including a cooling fan 16 that cools the inside of the test module 100; and a second cooling mechanism including a cooling fan 311 that cools the inside of the control module 200 and power supply unit 300. The first cooling mechanism and second cooling mechanism are independent of each other.

Description

  The present invention relates to an electronic component testing apparatus, and more particularly to a small electronic component testing apparatus capable of testing an electronic component on a desk in a laboratory or office floor.

  In the process of manufacturing an electronic component such as an IC device, a test apparatus for testing the finally manufactured electronic component is required. In such an electronic component testing apparatus, an IC device to be tested is transported to a socket on a test head, and the IC device is mounted on the socket and electrically connected to perform a test. In this way, the IC device is tested and divided into at least a good product and a defective product in a semiconductor manufacturing factory or the like.

  On the other hand, development of a small desktop electronic component testing apparatus capable of testing an IC device on a desktop in a laboratory or office floor is underway for IC device research / development and design departments. Such a desktop electronic component testing apparatus can prepare a testing environment on demand by using cloud computing technology using a personal computer and an Internet connection environment. Compared with, IC devices to be measured have high expandability and are much easier to use in terms of price and space, and can be used effectively for research and development and prototype design.

  Since conventional electronic component testing devices have large external dimensions and generate corresponding noise, they are usually installed on an experimental floor in a semiconductor manufacturing factory or the like. On the other hand, even if it is a small desktop electronic component testing device used on a desktop in a laboratory or office floor, the device is equipped with a number of various testing devices that constitute a high-frequency circuit for testing and a power supply circuit. Since the module (pin electronics card) is housed, the terminal itself has heat during operation, and the IC device to be measured may be heated, which may affect the test result. There is a need.

  In addition to the test module, the small desktop electronic component testing apparatus includes a control module for controlling the operation of the test module and a power supply unit. Heat generation in the control module and power supply unit is generally smaller than that in the test module, but in order to cool the desktop electronic component testing device, the control system unit is also cooled together with the cooling of the test module. There is a need.

  In order to cool the test module, the control module, and the power supply unit, for example, a cooling fan may be rotated using a motor, and outside air may be introduced into the terminal for air cooling. However, the use of small desktop electronic component testing equipment is on the laboratory or office floor, and it is different from the case where it is installed in a factory where a certain amount of noise is allowed and appropriate temperature control is performed. If the size of the cooling fan is increased or the cooling mechanism is made large, the noise due to the cooling mechanism will increase.

  The present invention has been made in view of such a situation, and an object thereof is to provide an electronic component testing apparatus capable of efficiently cooling the inside of the apparatus while suppressing noise.

  In order to achieve the above object, first, the present invention is an electronic component test apparatus comprising a test module on which an electronic component test device is mounted, and a control unit that controls the test module, A first cooling mechanism that cools the inside of the test module; and a second cooling mechanism that cools the inside of the control unit; and the first cooling mechanism and the second cooling mechanism are independent cooling mechanisms. An electronic component testing apparatus is provided (Invention 1).

  According to the said invention (invention 1), since a test module and a control part can be cooled independently, respectively, the whole apparatus can be cooled efficiently according to the heat generation characteristic of each cooling object location. Further, since a cooling mechanism having a smaller size can be used as compared with the case where the entire apparatus is cooled by one cooling mechanism, noise can be reduced as a result. Further, since the cooling mechanisms for cooling the test module and the control unit are independent, it is possible to ensure the designed air flow rate in each cooling mechanism without the exhaust gas interfering inside the apparatus. In the present invention, the control unit mainly means a control module for controlling the test module. However, not only the control module but also a noise inflow from a power converter or a power supply system for converting from a commercial power source to a DC power source. It is a concept that may include power supply unit components such as a noise filter to prevent.

  In the above invention (Invention 1), the first cooling mechanism includes a first cooling fan that introduces air into the test module, and a first air that is introduced into the test module by the first cooling fan. A cooling air flow path is preferably provided (Invention 2).

  According to the above invention (invention 2), air (outside air) is taken into the test module by the first cooling fan, and the air flows through the first cooling air flow path and is steadily supplied to the cooling target location in the test module. In addition, since the heat generated at the location is air-cooled, the test module can be efficiently cooled.

  In the above invention (invention 2), the test module has a housing structure in which an air introduction portion is formed on a first surface and an air discharge portion is formed on a second surface facing the first surface. And the first cooling air flow path is formed so that the air introduced into the test module by the first cooling fan flows substantially linearly from the air introduction part to the air discharge part. Preferred (Invention 3).

  Since a large number of various test devices constituting a high-frequency circuit for test and a power supply circuit are mounted on the test module, the heat generation becomes very large. According to the above invention (Invention 3), the air introduced into the test module by the first cooling fan flows substantially linearly from the air introduction part to the air discharge part, thereby keeping the air flowing distance short. Since air can be prevented from staying in the test module for a long time, the cooling performance can be improved.

  In the said invention (invention 3), it further has the exhaust port for exhausting the air introduced in the said test module by the said 1st cooling fan out of an apparatus, Between the said exhaust port from the said air exhaust part. Is preferably provided with a bypass exhaust path (Invention 4).

  When a cooling fan is provided inside the electronic component testing apparatus, the operating noise of the cooling fan (and motor) leaks from the air exhaust port that has cooled the inside of the apparatus. According to the invention (Invention 4), When the first cooling fan is provided in the vicinity of the air exhaust part of the test module by providing a bypass exhaust path between the air exhaust part of the test module and the exhaust port, the noise generation source Since the distance to the exhaust port can be increased, noise can be reduced by the inverse distance law.

  In the said invention (invention 4), the said exhaust port is provided in the upper surface and / or lower surface of the said electronic component test device in order to provide a bypass exhaust path so that the distance from an air exhaust part to an exhaust port may become long. Alternatively, (Invention 5), the exhaust port may be provided on the back surface of the electronic component testing apparatus (Invention 6). Further, in the case where the exhaust port is provided on the back surface of the electronic component test apparatus as in the above invention (invention 6), it is preferable that the bypass exhaust path meanders between the air exhaust part and the exhaust port. (Invention 7). By causing the bypass exhaust path to meander in this way, even if the exhaust port is provided on the back surface, the bypass exhaust path can have a distance necessary to reduce noise.

  In the said invention (invention 4-7), it is preferable that the said bypass exhaust path equips the inside with the sound-absorbing material (invention 8).

  According to the said invention (invention 8), since the operating sound of a cooling fan (and a motor) is absorbed by the sound-absorbing material provided in the detour exhaust path, noise can be reduced.

  Moreover, in the said invention (invention 2-8), the said test module is provided with two or more, Each of the said test module may be provided with the said 1st cooling air flow path (invention 9).

  According to the above invention (Invention 9), it is possible to easily cope with an increase in the types of electronic components under test by increasing the number of test modules, and in this case, each test module has a cooling mechanism individually. The cooling performance of the entire electronic component testing apparatus can be maintained.

  In the said invention (invention 1-9), the said 2nd cooling mechanism is the 2nd cooling fan which introduces air in the said control part, and the 2nd which the air introduce | transduced in the said control part by the said 2nd cooling fan flows. A cooling air flow path is preferably provided (Invention 10).

  According to the above invention (Invention 10), air (outside air) is taken into the control unit by the second cooling fan, and the air flows through the second cooling air flow path and is steadily supplied to the cooling target location in the control unit. Since the heat generation at the location is air-cooled, the controller can be efficiently cooled.

  In the said invention (invention 10), the said control part has a several to-be-cooled area | region, and the air introduce | transduced in the said control part by the said 2nd cooling fan flows through the said to-be-cooled area in order. The second cooling air flow path is preferably formed (Invention 11).

  In the control unit, a plurality of heat generation points such as a control module including a control board, a power converter, and a noise filter are stored in separate spaces. According to the above invention (Invention 11), the air introduced into the control unit by the second cooling fan flows in a plurality of areas to be cooled (that is, a plurality of heat generation points) in order, whereby a single cooling is performed in the control unit. The mechanism can cool without leakage, and the cooling efficiency can be increased. At this time, unlike the test module, the heat generation in the control unit is smaller than that in the test module, so that the cooling performance does not deteriorate even if the air stays in the control module for a long time.

  The said invention (invention 1-11) is especially suitable when the said electronic component test apparatus is a desktop type | mold electronic component test apparatus (invention 12).

  Second, the present invention is an electronic component testing apparatus including a test module on which an electronic component test device is mounted and a control unit that controls the test module, and introduces air into the test module. A first cooling mechanism including a first cooling fan, a first cooling air passage through which air introduced into the test module by the first cooling fan flows, and second cooling for introducing air into the control unit. A second cooling mechanism including a fan and a second cooling air flow path through which air introduced into the control unit by the second cooling fan flows, and an exhaust path of the first cooling mechanism and the second cooling mechanism Provided is an electronic component test apparatus characterized in that the exhaust path of the mechanism is an independent exhaust path (Invention 13).

  According to the above invention (Invention 13), air (outside air) is taken into the test module by the first cooling fan, and the air flows through the first cooling air flow path and is steadily supplied to the cooling target location in the test module. As a result, the heat generated at the location is cooled by air, and air (outside air) is taken into the control unit by the second cooling fan, and the air flows through the second cooling air flow path and is steadily supplied to the location to be cooled in the control unit. Since the test module and the control unit can be independently cooled by air-cooling the heat generated at the location, the entire apparatus can be efficiently cooled according to the heat generation characteristics of each location to be cooled. . Further, since a cooling mechanism having a smaller size can be used as compared with the case where the entire apparatus is cooled by one cooling mechanism, noise can be reduced as a result. Furthermore, even if the cooling fan and cooling air flow path are provided separately for test module cooling and control unit cooling, if the exhaust path is not independent, it is caused by the position of the cooling fan, the difference in the cooling fan capacity, etc. As a result, the respective exhausts interfere with each other, and there is a possibility that the required air flow rate cannot be ensured in one of the cooling mechanisms, but the exhaust path of the first cooling mechanism and the exhaust path of the second cooling mechanism are connected to each other. By making the exhaust paths independent of each other, the air flow as designed can be secured in each cooling mechanism without the exhaust interfering inside the apparatus.

  According to the electronic component testing apparatus of the present invention, the inside of the apparatus can be efficiently cooled while suppressing noise.

FIG. 1 is a schematic diagram showing an electronic component test system according to an embodiment of the present invention. FIG. 2 is an exploded schematic view showing the structure of the electronic component testing apparatus according to the embodiment. FIG. 3 is a schematic view of the main body of the electronic component testing apparatus as viewed from the back side. FIG. 4 is a schematic diagram showing the structure of the apparatus main body and the air flow during cooling. FIG. 5 is a transparent schematic side view of the electronic component testing apparatus.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. As shown in FIG. 1, the electronic component test system 9 according to the present embodiment includes a desktop electronic component test apparatus 1, a socket board 2 having a socket 21, and a computer 4. The socket board 2 is connected to the electronic component testing apparatus 1 via the test cable 3, and the computer 4 is connected to the electronic component testing apparatus 1 via the USB cable 5.

  The electronic component testing apparatus 1 does not include software such as a specific test function, an application such as an analysis tool for a test result, and a test program in advance, unlike the conventional electronic component testing apparatus. A small computer using cloud computing technology that connects a computer 4 connected to the Internet environment 1 to the computer 4 and connects the computer 4 to a predetermined server via the Internet, allowing the required testing environment to be used just in time. This is a desktop electronic component testing device.

  As shown in FIG. 1, the socket board 2 connected to the electronic component test apparatus 1 is provided with a socket 21, and a test is performed by mounting an electronic device under test (DUT) 8 on the socket 21. When the type of DUT 8 is changed, the socket 21 is appropriately changed to that appropriate for the type.

  As shown in FIGS. 2 and 3, the electronic component testing apparatus 1 has a housing structure configured to surround the apparatus main body 10 with a cover member 11, a bottom member 12, a front panel 13, and a back panel 14. ing. The apparatus main body 10 includes a test module 100 (pin electronics card) on which a large number of various test devices constituting a test high-frequency circuit and a power supply circuit are mounted, a control module 200 that controls the operation of the test module 100, a commercial power supply Is converted to a DC power source used in the electronic component testing apparatus 1, a noise filter 320 for preventing inflow of noise from the power supply system, and air after cooling the control module 200 is AC- A horizontal duct 330 and a vertical duct 340 for leading to a cooling fan 311 provided inside the DC converter 310, a cooling fan 16 for introducing outside air to the test module 100, a power source (not shown), and the like are provided. Yes. In the present embodiment, the AC-DC converter 310, the noise filter 320, the horizontal duct 330, and the vertical duct 340 are collectively referred to as a power supply unit 300. In the present invention, the control module 200 and the power supply unit 300 correspond to a control unit.

  A large number of ventilation holes 15 for introducing air into the electronic component testing apparatus 1 are formed in the front panel 13 over substantially the entire surface. A large number of exhaust slits 17 are formed in the upper corner portion of the cover member 11 and the lower corner portion of the bottom member 12 for discharging the air introduced into the test module 100 to the outside of the apparatus. In addition, a large number of exhaust holes 18 are formed in the side surface of the cover member 11 for discharging the air introduced into the control module 200 and the power supply unit 300 to the outside of the apparatus.

  The test module 100 has a thin housing structure that can be inserted into and removed from the apparatus body 10. The test module 100 has a main board (not shown) on which a large number of various test devices (not shown) constituting a test high-frequency circuit and a power supply circuit are mounted. For the purpose of radiating heat from the test device that has generated heat, the main board is provided with a radiating plate and a radiating fin.

  As shown in FIG. 2, the front panel 120 of the test module 100 is provided with two connectors 121 to which the socket board 2 is connected via the test cable 3. The front panel 120 is formed with honeycomb-shaped air introduction holes 122 for introducing air (outside air) into the test module 100.

  Further, as shown in FIG. 3, the rear panel 130 of the test module 100 has a connector 131 for electrically connecting the test module 100 to the apparatus main body 10 and an air introduction hole 122 into the test module 100. An air discharge port 132 for discharging the introduced air is provided. The air discharge port 132 is a position corresponding to the cooling fan 16 provided in the apparatus main body 10 so that the air introduced into the test module 100 from the air introduction hole 122 is discharged to the outside of the apparatus by the cooling fan 16. Is provided.

  The structure of the power supply unit 300 will be described with reference to FIGS. A vertical duct 340 is provided on the front side of the power supply unit 300, a horizontal duct 330 is provided on the upper side, and an AC-DC converter 310 is provided on the lower side. A noise filter 320 is provided on the back side of the AC-DC converter 310. In the vertical duct 340, when the DUT 8 is mounted on the socket board 2 and the ground terminal 341 for making the potential between the socket board 2 and the electronic component testing apparatus 1 the same, the DUT 8 is ESD (electrostatic discharge). And a ground terminal 342 for connecting a wristband for protection from the above.

  An opening 331a is formed on the back side of the surface of the lateral duct 330 on the control module 200 side. Further, the substrate 201 mounted on the control module 200 has a notch 331b formed at a position corresponding to the opening 331a so that the air introduced into the control module 200 flows into the lateral duct 330. It has become. The horizontal duct 330 and the vertical duct 340 communicate with each other, and the air flowing into the horizontal duct 330 flows into the vertical duct 340 as it is.

  An opening 343 a is formed on the surface of the vertical duct 340 that contacts the AC-DC converter 310. Also in the AC-DC converter 310, an opening 343b is formed at a position corresponding to the opening 343a, so that the air flowing into the longitudinal duct 340 can be introduced into the AC-DC converter 310. ing.

  Next, the air flow for cooling the inside of the test module 100 will be described. First, the air is introduced from the air introduction hole 122 by turning the cooling fan 16, and the space in the test module 100 itself becomes the cooling air flow path. As a result, air flows into the test module 100 and cools the heat generated from a large number of test devices mounted on the main board in the test module 100. The air flowing through the test module 100 is discharged from the air discharge port 132 to the outside of the test module 100. At this time, the partition in the test module 100 is not particularly provided with a partition or a small room, and the air introduction hole 122 is formed on the front side of the test module 100 and the air discharge port 132 on the back side is formed. The air introduced into the test module 100 flows through the test module 100 substantially linearly. As described above, the air flows substantially linearly from the air introduction hole 122 to the air discharge port 132, so that the distance that the air flows can be kept short and the air is prevented from staying in the test module 100 for a long time. Therefore, the cooling performance can be improved.

  Here, in the electronic component testing apparatus 1 of the present embodiment, the apparatus main body 10 is surrounded by the cover member 11, the bottom member 12, the front panel 13, and the back panel 14 with the test module 100 inserted, and the housing structure 5, a space is generated between the apparatus main body 10 and the back panel 14 and between the apparatus main body 10, the cover member 11, and the bottom member 12. This space functions as the exhaust bypass 150. In other words, conventionally, the air introduced into the test module 100 is discharged directly from the exhaust hole or the like provided in the rear panel 14 through the cooling fan 16 to the outside of the apparatus. By being formed outside the unit 10 and inside the housing structure, the air introduced into the test module 100 flows into the exhaust bypass circuit 150 via the cooling fan 16, and there are no exhaust holes in the rear panel 14. Since the air is not provided, the air flows through the exhaust bypass circuit 150, bypasses the exhaust slit 17 formed in the cover member 11 and the bottom member 12, and then is discharged outside the apparatus. Since the bypass exhaust path 150 is provided between the air discharge port 132 and the exhaust slit 17 of the test module 100 in this way, the distance from the cooling fan 16 to the exhaust slit 17 can be increased. Noise that leaks out of the apparatus can be reduced by the inverse proportionality rule.

  Furthermore, in this embodiment, a sound absorbing material (not shown) is attached to the inner wall of the exhaust bypass circuit 150. In this way, by providing the sound absorbing material inside the exhaust bypass 150, the operating sound of the cooling fan 16 (and the motor) is absorbed by the sound absorbing material, so that the noise leaking outside the apparatus can be further reduced. . Since the sound absorbing performance is determined by the sound absorbing material and its application area, the sound absorbing effect can be improved by attaching the sound absorbing material to the entire inner wall of the exhaust bypass 150. Further, in the present embodiment, a sound absorbing material that has the maximum sound absorbing performance in the vicinity of 1 to 2 kHz is used.

  Next, the airflow when cooling the control unit, that is, the control module 200 and the power supply unit 300 will be described. First, as shown in FIG. 4, the cooling fan 311 housed in the AC-DC converter 310 is installed. When turned, air is taken into the electronic component testing apparatus 1 from the vent hole 15. The air taken into the apparatus flows toward the back side along the control module 200 and passes through the openings 331a and 331b provided on the side surfaces of the control module 200 and the lateral duct 330 to the lateral duct 330. Flows in. The lateral duct 330 communicates with the longitudinal duct 340 at a location near the front side of the electronic component testing apparatus 1, and the longitudinal duct 340 and the AC-DC converter 310 communicate with each other through the openings 343a and b. Therefore, the air that has flowed into the lateral duct 330 flows in the lateral duct 330 so as to be folded back at a location close to the back side of the electronic component testing apparatus 1, and then passes through the longitudinal duct 340 to the AC-DC. Introduced into the converter 310. The air that has flowed into the AC-DC converter 310 passes through the cooling fan 311, further flows in the AC-DC converter 310 toward the back side of the electronic component testing apparatus 1, and reaches the periphery of the noise filter 320. Thereafter, the air is discharged from the exhaust holes 18 formed on the side surface of the cover member 11 to the outside of the apparatus.

  As described above, the air introduced into the control module 200 and the power supply unit 300 by the cooling fan 311 is converted into a plurality of areas to be cooled (a plurality of heat generation points, that is, the control module 200 and the longitudinal duct 340 in the present embodiment). By sequentially flowing through the AC-DC converter 310 and the noise filter 320), the inside of the control module 200 and the power supply unit 300 can be cooled without leakage by a single cooling mechanism, and the cooling efficiency can be improved. At this time, since the heat generation in the control module 200 and the power supply unit 300 is smaller than that in the test module 100, the cooling performance is deteriorated even if the air stays in the control module 200 and the power supply unit 300 for a long time. There is nothing.

  As described above, according to the electronic component testing apparatus 1 according to the present embodiment, the test module 100 and the control unit (the control module 200 and the power supply unit 300) can be cooled independently. Cooling can be efficiently performed according to the heat generation characteristics of the module. Further, since a cooling mechanism having a smaller size can be used as compared with the case where the entire apparatus is cooled by one cooling mechanism, noise can be reduced as a result. Further, the cooling mechanism for cooling the test module 100 and the control unit cooling is independent, and the exhaust path of the test module 100 cooling air and the exhaust path of the control unit cooling air are independent, so that the exhaust is The air flow rate as designed can be secured in each cooling mechanism without interference inside the apparatus.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, in the present embodiment, the electronic component test apparatus 1 includes only one test module 100, but the present invention is not limited to this. For example, a plurality of test modules 100 are provided in response to an increase in the number of DUT8 types. You may have. At this time, if each test module 100 has a cooling mechanism individually, the cooling performance of the electronic component test apparatus 1 as a whole can be maintained. In this case, it is not always necessary to prepare the number of cooling fans corresponding to each test module 100. For example, when the electronic component testing apparatus 1 includes four test modules 100, the electronic component testing apparatus 1 has two cooling units. The fan 16 may be provided, and one cooling fan 16 may be shared by the two test modules 100.

  Further, in the present embodiment, the exhaust slit 17 for discharging the air introduced into the test module 100 to the outside of the electronic component test apparatus 1 is provided on the cover member 11 having a housing structure surrounding the electronic component test apparatus 1. Although many are formed in the upper corner | angular part and the lower corner | angular part of the bottom member 12, it is not restricted to this, For example, you may provide in the back panel 14 of the electronic component test apparatus 1. FIG. When the rear panel 14 is provided with the exhaust slit 17, an air exhaust port of the test module 100 is formed in order to form the exhaust bypass circuit 150 outside the apparatus main body 10 and inside the housing structure surrounding the electronic component testing apparatus 1. A certain amount of space may be provided between the rear panel 14 and the rear panel 14 to increase the distance from the cooling fan 16 to the exhaust slit 17, or the exhaust bypass path in the space between the air outlet 132 and the rear panel 14. The bypass exhaust passage 150 may have a distance necessary for increasing the distance by meandering 150 and reducing noise.

  The present invention is useful for testing electronic components on a desk in a laboratory or office floor using an electronic component testing apparatus.

DESCRIPTION OF SYMBOLS 1 ... Electronic component test apparatus 10 ... Apparatus main-body part 11 ... Cover member 12 ... Bottom member 13 ... Front panel 14 ... Back panel 15 ... Ventilation hole 16 ... Cooling fan 17 ... Exhaust slit 18 ... Exhaust hole 2 ... Socket board 21 ... Socket 3 ... Test cable 4 ... Computer 5 ... USB cable 8 ... Electronic device under test (DUT)
DESCRIPTION OF SYMBOLS 9 ... Electronic component test system 100 ... Test module 120 ... Front side panel 121 ... Connector 122 ... Air introduction hole 130 ... Back side panel 131 ... Connector 132 ... Air exhaust port 150 ... Exhaust bypass circuit 200 ... Control module 300 ... Power supply unit 310 ... AC-DC converter 311 ... cooling fan 320 ... noise filter 330 ... lateral duct 331a ... opening 331b ... notch 340 ... vertical duct 341,342 ... grounding terminals 343a, 343b ... opening

Claims (13)

An electronic component test apparatus comprising a test module on which an electronic component test device is mounted, and a control unit that controls the test module,
A first cooling mechanism that cools the inside of the test module; and a second cooling mechanism that cools the inside of the control unit;
The electronic component testing apparatus, wherein the first cooling mechanism and the second cooling mechanism are independent cooling mechanisms.   The first cooling mechanism includes a first cooling fan that introduces air into the test module, and a first cooling air flow path through which the air introduced into the test module by the first cooling fan flows. The electronic component testing apparatus according to claim 1. The test module has a housing structure in which an air introduction portion is formed on a first surface and an air discharge portion is formed on a second surface facing the first surface;
The first cooling air flow path is formed so that the air introduced into the test module by the first cooling fan flows substantially linearly from the air introduction part to the air discharge part. The electronic component testing apparatus according to claim 2. An exhaust port for exhausting the air introduced into the test module by the first cooling fan to the outside of the apparatus;
The electronic component testing apparatus according to claim 3, wherein a bypass exhaust path is provided between the air exhaust unit and the exhaust port.   The electronic component testing apparatus according to claim 4, wherein the exhaust port is provided on an upper surface and / or a lower surface of the electronic component testing apparatus.   The electronic component testing apparatus according to claim 4, wherein the exhaust port is provided on a back surface of the electronic component testing apparatus.   The electronic component testing apparatus according to claim 6, wherein the bypass exhaust path meanders between the air discharge portion and the exhaust port.   The electronic component testing apparatus according to claim 4, wherein the bypass exhaust path includes a sound absorbing material therein.   The electronic component testing apparatus according to claim 2, wherein a plurality of the test modules are provided, and each of the test modules includes the first cooling air flow path.   The second cooling mechanism includes a second cooling fan that introduces air into the control unit, and a second cooling air flow path through which air introduced into the control unit by the second cooling fan flows. The electronic component testing apparatus according to claim 1, wherein the electronic component testing apparatus is characterized in that: The controller has a plurality of areas to be cooled;
11. The electron according to claim 10, wherein the second cooling air flow path is formed so that air introduced into the control unit by the second cooling fan flows through the plurality of cooled regions in order. Component testing equipment.   The electronic component testing apparatus according to claim 1, wherein the electronic component testing apparatus is a desktop electronic component testing apparatus. An electronic component test apparatus comprising a test module on which an electronic component test device is mounted, and a control unit that controls the test module,
A first cooling mechanism comprising: a first cooling fan for introducing air into the test module; and a first cooling air passage through which air introduced into the test module by the first cooling fan flows;
A second cooling mechanism including a second cooling fan for introducing air into the control unit, and a second cooling air flow path through which air introduced into the control unit by the second cooling fan flows,
The electronic component testing apparatus according to claim 1, wherein the exhaust path of the first cooling mechanism and the exhaust path of the second cooling mechanism are independent exhaust paths.