JP4029049B2 - Current detection resistor - Google Patents

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JP4029049B2
JP4029049B2 JP2003004037A JP2003004037A JP4029049B2 JP 4029049 B2 JP4029049 B2 JP 4029049B2 JP 2003004037 A JP2003004037 A JP 2003004037A JP 2003004037 A JP2003004037 A JP 2003004037A JP 4029049 B2 JP4029049 B2 JP 4029049B2
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current
resistor
terminal
portions
pair
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JP2004221160A (en
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信三 山下
尚宏 十河
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts

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Description

【０００１】
【発明の属する技術分野】
本発明は、例えば半導体パワーモジュールの主回路電流を検出するなどの目的で、基板上に実装される電流検出用抵抗器に関する。
【０００２】
【従来の技術】
従来の半導体パワーモジュールとして、表面に銅などの回路パターンが形成された絶縁基板を備え、回路パターンに、ダイオードやＩＧＢＴ等のパワー半導体チップを半田付けしたものがある。回路パターンは複数設けてあり、その間を電流検出用抵抗器（シャント抵抗器）が跨ぐように設けてある。この抵抗器は、例えば銅とニッケルの合金の板をＵ字状に曲げ加工したもので、板の両端に形成した端子部を各回路パターンに半田を介して接合してある。
【０００３】
抵抗器に半導体パワーモジュールの主回路電流を流すことで、抵抗器の端子間には電圧降下Ｖが生じる。したがって、この電圧降下Ｖを測定することで、抵抗器の抵抗値Ｒにより主回路電流Ｉ（＝Ｖ／Ｒ）が求められる。
【０００４】
ところで、電流検出用抵抗器の端子部を半田を介して回路パターンに接合すると、抵抗器の垂直面に半田が這い上がる現象が生じることがある。この場合、抵抗器の実効抵抗値がわずかに低下するため、測定したＶから前記抵抗値Ｒを用いて得られる電流値が実際の主回路電流Ｉと異なり、主回路電流を高精度に検出できない。
【０００５】
そこで、従来では、半田の這い上がりが発生しても電圧―電流特性が変化しないための構成が種々提案されている（例えば、特許文献１〜４参照）。
【０００６】
【特許文献１】
特開平８−８３９６９号公報
【特許文献２】
特開平８−１１５８０２号公報
【特許文献３】
特開平１０−１１６７１０号公報
【特許文献４】
特開平７−１９１０５９号公報
【０００７】
【発明が解決しようとする課題】
本発明は、これらの従来の構成とは異なる新規な構成、あるいは改良された構成を有する電流検出用抵抗器を提供することを目的とする。
【０００８】
【課題を解決するための手段】
前記目的を達成するために、本発明に係る電流検出用抵抗器は、
基板の回路パターンに半田付け実装される電流検出用抵抗器において、
抵抗器は、回路パターンを流れる電流の通電部、および該電流を検出するための検出部を備え、
通電部は、前記基板とは反対側に凸になるように湾曲した板状本体部分、および該部分の両端に設けた半田付け用の一対の端子部分を有し、
検出部は、本体部分の半田這い上がりのない領域であって、本体部分の通電方向と直交する方向に関する側面から突出する突出部分を有することを特徴とする。
【０００９】
【発明の実施の形態】
以下、添付図面を参照して本発明の実施の形態を説明する。なお、以下では、本発明に係る電流検出用抵抗器を半導体パワーモジュールに組み込んだ例を説明するが、本発明はこれに限定されるものではない。
【００１０】
実施の形態１．
図１は、本発明に係る電流検出用抵抗器（シャント抵抗器）の実施の形態１を示す斜視図である。この抵抗器２は、例えば銅とニッケルの合金の板を所定の形状に加工したもので、半導体パワーモジュールの絶縁基板４上に形成した銅などの通電用回路パターン６ａ，６ｂを跨ぐように設けた通電部８を有する。図示は省略するが、絶縁基板４は、Ａｌなどの放熱板に半田付け実装されている。通電部８は、矩形状の板の両端部を曲げてコ字状にし、さらに該両端部の先端側を折り返して両端部をＬ字状にした形状を有しており、半田層１０ａ，１０ｂを介して回路パターン６ａ，６ｂに接合するための端子部分１２ａ，１２ｂと、垂直部分（広義には脚部分）１４ａ，１４ｂと、絶縁基板４と略平行に延在した水平部分（広義には天板部分）１６とから構成されている。回路パターン６ａ，６ｂの間に配置された通電部８には、半導体パワーモジュールの主電流が流れるようになっている。説明の都合上、水平部分１６はＸＹ平面に延在するものとし、主電流の流れる方向をＸ方向、Ｘ方向に直交する方向をＹ方向とする。
【００１１】
抵抗器２はまた、通電部８と一体をなす、主電流を検出するための検出部１８を有する。検出部１８は、通電部８の水平部分１６のＸ方向両端近傍において、水平部分１６の（Ｙ方向に関する）側面からＹ方向に突出した一対の水平部分（広義には突出部分）２０ａ，２０ｂと、絶縁基板４上に形成した検出用回路パターン２２ａ，２２ｂと半田層２４ａ，２４ｂを介して接合する端子部分２６ａ，２６ｂと、水平部分２０ａ，２０ｂと端子部分２６ａ，２６ｂを接続する垂直部分２８ａ，２８ｂとから構成されている。回路パターン２２ａ，２２ｂは、高インピーダンスの電圧測定回路の検出端子（図示せず）に接続されている。
【００１２】
電流検出用抵抗器２の通電部８に関し、設計上の抵抗値の算定を容易にするために、図に示すように、端子部分１２ａ，１２ｂ、垂直部分１４ａ，１４ｂ、および水平部分１６のＹ方向側面は同一平面上に位置するのが好ましい。
【００１３】
かかる電流検出用抵抗器２では、通電部８の垂直部分１４ａ，１４ｂを半田層１０ａ，１０ｂの半田が這い上がっても、電流検出対象部分（図の斜線部分）の抵抗値は変化しないので、高精度に主電流を検出できる。なお、電圧測定回路のインピーダンスが高いため、検出部１８および半田層２４ａ，２４ｂには実質的に電流が流れることはなく、したがって、半田層２４ａ，２４ｂの半田の這い上がりは電圧測定に影響を与えない。
【００１４】
本実施形態では、検出部１８の水平部分２０ａ，２０ｂを通電部８の水平部分１６のＹ方向側面から突出させたが、這い上がりのない領域であれば、通電部８の垂直部分１４ａ，１４ｂの側面から突出させてもよい。但し、水平部分２０ａ，２０ｂから突出させる方が、半田の這い上がりにくさの点で好ましい。また、通電部８の水平部分１６のＹ方向に関して同一の側面から検出部１８の水平部分２０ａ，２０ｂを突出させる代わりに、水平部分１６のＹ方向に関して対向する一対の側面からそれぞれ、検出部の水平部分を突出させるようにしてもよい。
【００１５】
また、本実施形態では、通電部８の天板部分１６および脚部分１４ａ，１４ｂは、それぞれ水平部分および垂直部分からなり全体で断面コ字状に形成されているが、絶縁基板４とは反対側に凸になるように湾曲していれば、天板部分および脚部分の延在する面は互いに直交する必要はなく、また、天板部分および／または脚部分が曲面上に延在するよう加工してもよく、さらに天板部分と脚部分が同一曲面上に延在するよう加工してもよい。
【００１６】
実施の形態２．
図２は、本発明に係る電流検出用抵抗器の実施の形態２を示す斜視図である。以下の説明では、実施の形態１と同一または類似の構成要素は同一の符号または同一の符号に適当な添字を付して表す。この抵抗器２’は、通電部８’の垂直部分（広義には脚部分）１４ａと１４ｂの間には、垂直部分１４ａ，１４ｂおよび端子部分１２ａ，１２ｂより幅狭の水平部分１６’が設けてある。Ｙ方向一端側に関して、通電部８’の垂直部分１４ａ，１４ｂおよび端子部分１２ａ，１２ｂと水平部分１６’の側面は同一平面上に位置している。垂直部分１４ａ，１４ｂのＹ方向他端側の上端部から、検出部１８’の垂直部分（広義には突出部分）２８ａ’，２８ｂ’が、通電部８’の垂直部分１４ａ，１４ｂと対向するように延設されている。通電部８’の水平部分１６’と、検出部１８’の垂直部分２８ａ’，２８ｂ’とはＸ方向に沿ったスリット３０で分離されている。検出部１８’の垂直部分２８ａ’，２８ｂ’は、検出用回路パターン２２ａ’，２２ｂ’に半田付け（半田層を符号２４ａ’，２４ｂ’で示す。）された端子部分２６ａ’，２６ｂ’と接続されている。
【００１７】
かかる電流検出用抵抗器２’では、通電部８’の垂直部分１４ａ，１４ｂを半田層１０ａ，１０ｂの半田が這い上がっても、電流検出対象部分（図の斜線部分）の抵抗値は変化しないので、高精度に主電流を検出できる。また、例えば特開平１０−１１６７１０号公報に開示された従来の電流検出用抵抗器とは異なり、通電部８’の端子部分１２ａ，１２ｂにスリットが形成されておらず、該端子部分１２ａ，１２ｂの半田付け面積（すなわち絶縁基板４との接合面積）を十分に確保できるため、抵抗器２’の放熱性を高めることができる。
【００１８】
本実施形態では、検出部１８’の垂直部分２８ａ’，２８ｂ’はともに、垂直部分１４ａ，１４ｂの上端部のＹ方向他端近傍から延設されているが、例えば、一方を前記上端部のＹ方向一端部近傍から延設してもよいし、前記上端部中央付近から延設するようにしてもよい。後者の場合、検出部の垂直部分が突出する前記上端部の一部のＹ方向両側部分から、通電部の水平部分が延設される。
【００１９】
実施の形態３．
図３は、本発明に係る電流検出用抵抗器の実施の形態３を示す斜視図である。この抵抗器２”は、概略的に、矩形状の板の両端部を曲げてコ字状にし、さらに該両端部の先端側を折り返して両端部をＬ字状にした形状を有している。各両端部にはＸ方向に沿ったスリット３２（３２ａ，３２ｂ），３４（３４ａ，３４ｂ）が２つ形成されており、２つの幅広のＬ字部分３６（３６ａ，３６ｂ），３８（３８ａ，３８ｂ）と、該幅広Ｌ字部分に挟まれた幅狭のＬ字部分４０（４０ａ，４０ｂ）とに三分割されている。幅広Ｌ字部分３６ａ，３６ｂはそれぞれ、端子部分１２ａＲ，１２ｂＲと垂直部分１４ａＲ，１４ｂＲから構成されている。同様に、幅広Ｌ字部分３８ａ，３８ｂはそれぞれ、端子部分１２ａＬ，１２ｂＬと垂直部分１４ａＬ，１４ｂＬから構成されている。幅狭Ｌ字部分４０ａ，４０ｂはそれぞれ、端子部分２６ａ”，２６ｂ”と垂直部分（広義には突出部分）２８ａ”，２８ｂ”から構成されている。
【００２０】
幅広Ｌ字部分３６ａ，３８ａの端子部分１２ａＲ，１２ａＬは、半田層１０ａＲ，１０ａＬを介して凹状に形成された通電用回路パターン６ａ”に接合されている。同様に、幅広Ｌ字部分３６ｂ，３８ｂの端子部分１２ｂＲ，１２ｂＬは、半田層１０ｂＲ，１０ｂＬを介して凹状に形成された通電用回路パターン６ｂ”に接合されている。したがって、幅広Ｌ字部分３６，３８は通電部の通電端子を構成する。
【００２１】
絶縁基板４上には、通電用回路パターン６ａ”，６ｂ”の凹部に検出用回路パターン２２ａ”，２２ｂ”がそれぞれ突入して形成されている。幅狭Ｌ字部分４０ａ，４０ｂの端子部分２６ａ”，２６ｂ”はそれぞれ、半田層２４ａ”，２４ｂ”を介して検出用回路パターン２２ａ”，２２ｂ”に接合されている。したがって、幅狭Ｌ字部分４０ａ，４０ｂは検出部の検出端子を構成する。
【００２２】
かかる電流検出用抵抗器２”では、通電部の垂直部分１４ａＲ，１４ａＬ，１４ｂＲ，１４ｂＬを半田層１０ａＲ，１０ａＬ，１０ｂＲ，１０ｂＬの半田が這い上がっても、電流検出対象部分（図の斜線部分）の抵抗値は変化しないので、高精度に主電流を検出できる。また、幅狭の検出端子を幅広の通電端子の間に配置することにより、抵抗器２”を絶縁基板４上に実装する前の単体の状態において、検出端子が外力を受けるなどして変形するのを抑制・防止できる。
【００２３】
本実施形態では、天板部分１６”および脚部分１４ａＲ，１４ａＬ，１４ｂＲ，１４ｂＬ，２８ａ”，２８ｂ”は、それぞれ水平部分および垂直部分から構成され全体として断面コ字状に形成されているが、絶縁基板４とは反対側に凸になるように湾曲していれば、天板部分および脚部分の延在する面は互いに直交する必要はなく、また、天板部分および／または脚部分が曲面上に延在するよう加工してもよく、さらに天板部分と脚部分が同一曲面上に延在するよう加工してもよい。
【００２４】
実施の形態４．
前記実施の形態１〜３に係る電流検出用抵抗器は、半田の這い上がりが発生しても電圧―電流特性が変化しない構成を備えることを特徴としている。したがって、半田の這い上がり量を制御するものではないため、半田が通電部の垂直部分を這い上がりさらに検出部に到達する恐れがある。これを防ぐために、前記実施形態に係る抵抗器は、例えば図４に示すように、通電部の垂直部分の裏側に半田這い上がり抑制用の段差を設けるのが好ましい。
【００２５】
図（ａ）は、通電部８Ｄの垂直部分１４ａＤ，１４ｂＤの裏側の一部に切り込み４２ａ，４２ｂを入れ、該切り込みに半田が溜まるようにして水平部分１６Ｄに半田が這い上がりにくくした例である。図（ｂ）は、通電部８Ｅの垂直部分１４ａＥ，１４ｂＥの裏側に段差を形成して、水平面４４ａ，４４ｂで半田の上昇を抑える例である。図（ｃ）は、通電部８Ｆの両端部の先端をさらにＬ字状に曲げることにより垂直部分１４ａＦ，１４ｂＦの裏側に段差を形成して、水平面４６ａ，４６ｂで半田の上昇を抑える例である。
【００２６】
【発明の効果】
本発明に係る電流検出用抵抗器によれば、半田の這い上がりが発生しても電圧―電流特性が変化せず、したがって高精度に電流を検出できる。
【図面の簡単な説明】
【図１】 本発明に係る電流検出用抵抗器の実施の形態１を示す斜視図。
【図２】 本発明に係る電流検出用抵抗器の実施の形態２を示す斜視図。
【図３】 本発明に係る電流検出用抵抗器の実施の形態３を示す斜視図。
【図４】 本発明に係る電流検出用抵抗器の実施の形態４において、通電部の断面形状の例を示す図。
【符号の説明】
２：電流検出用抵抗器、４：絶縁基板（基板）、６：通電用回路パターン、８：通電部、１０：半田層、１２：通電部の端子部分、１４：通電部の垂直部分（脚部分）、１６：通電部の水平部分（天板部分）、１８：検出部、２０：検出部の水平部分（突出部分）、２２：検出用回路パターン、２４：半田層、２６：検出部の端子部分、２８：検出部の垂直部分。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a current detecting resistor mounted on a substrate for the purpose of detecting a main circuit current of a semiconductor power module, for example.
[0002]
[Prior art]
As a conventional semiconductor power module, there is one in which an insulating substrate having a circuit pattern such as copper formed on the surface thereof is provided, and a power semiconductor chip such as a diode or IGBT is soldered to the circuit pattern. A plurality of circuit patterns are provided, and current detection resistors (shunt resistors) are provided between the circuit patterns. This resistor is formed, for example, by bending a copper and nickel alloy plate into a U shape, and terminal portions formed at both ends of the plate are joined to each circuit pattern via solder.
[0003]
By causing the main circuit current of the semiconductor power module to flow through the resistor, a voltage drop V is generated between the terminals of the resistor. Therefore, by measuring this voltage drop V, the main circuit current I (= V / R) is obtained from the resistance value R of the resistor.
[0004]
By the way, when the terminal portion of the current detection resistor is joined to the circuit pattern via the solder, a phenomenon may occur in which the solder rises on the vertical surface of the resistor. In this case, since the effective resistance value of the resistor slightly decreases, the current value obtained from the measured V using the resistance value R is different from the actual main circuit current I, and the main circuit current cannot be detected with high accuracy. .
[0005]
In view of this, conventionally, various configurations have been proposed in which the voltage-current characteristics do not change even when the solder creeps up (see, for example, Patent Documents 1 to 4).
[0006]
[Patent Document 1]
JP-A-8-83969 [Patent Document 2]
JP-A-8-115802 [Patent Document 3]
JP-A-10-116710 [Patent Document 4]
Japanese Patent Application Laid-Open No. 7-191059
[Problems to be solved by the invention]
It is an object of the present invention to provide a current detection resistor having a new configuration or an improved configuration different from these conventional configurations.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a current detection resistor according to the present invention comprises:
In the current detection resistor soldered to the circuit pattern on the board,
The resistor includes a current-carrying part that flows through the circuit pattern, and a detection part for detecting the current,
The energization part has a plate-like main body part that is curved so as to protrude to the opposite side of the substrate, and a pair of terminal parts for soldering provided at both ends of the part,
The detection unit has a protruding portion that protrudes from a side surface in a direction perpendicular to the energization direction of the main body portion, which is a region where the main body portion does not creep up with solder.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings. Hereinafter, an example in which the current detection resistor according to the present invention is incorporated in a semiconductor power module will be described, but the present invention is not limited to this.
[0010]
Embodiment 1 FIG.
FIG. 1 is a perspective view showing a first embodiment of a current detection resistor (shunt resistor) according to the present invention. This resistor 2 is formed by processing a copper and nickel alloy plate into a predetermined shape, for example, and is provided so as to straddle the energizing circuit patterns 6a and 6b such as copper formed on the insulating substrate 4 of the semiconductor power module. The current-carrying part 8 is provided. Although illustration is omitted, the insulating substrate 4 is soldered and mounted on a heat sink such as Al. The energizing portion 8 has a shape in which both end portions of a rectangular plate are bent into a U-shape, and the both end portions are folded back so that both end portions are L-shaped. The solder layers 10a, 10b Terminal portions 12a and 12b for joining to the circuit patterns 6a and 6b through the vertical portions, vertical portions (leg portions in a broad sense) 14a and 14b, and horizontal portions (in a broad sense, broadly extending in parallel with the insulating substrate 4). (Top plate portion) 16. The main current of the semiconductor power module flows through the energizing portion 8 disposed between the circuit patterns 6a and 6b. For convenience of explanation, it is assumed that the horizontal portion 16 extends in the XY plane, the direction in which the main current flows is the X direction and the direction orthogonal to the X direction is the Y direction.
[0011]
The resistor 2 also has a detection unit 18 that is integrated with the energization unit 8 and detects a main current. The detection unit 18 includes a pair of horizontal portions (protruding portions in a broad sense) 20a and 20b protruding in the Y direction from the side surface (related to the Y direction) of the horizontal portion 16 in the vicinity of both ends in the X direction of the horizontal portion 16 of the energization unit 8. The detection circuit patterns 22a and 22b formed on the insulating substrate 4 are joined to the terminal portions 26a and 26b via the solder layers 24a and 24b, and the vertical portions 28a are connected to the horizontal portions 20a and 20b and the terminal portions 26a and 26b. , 28b. The circuit patterns 22a and 22b are connected to a detection terminal (not shown) of a high impedance voltage measurement circuit.
[0012]
In order to facilitate the calculation of the designed resistance value for the energizing portion 8 of the current detecting resistor 2, as shown in the figure, the Y of the terminal portions 12a and 12b, the vertical portions 14a and 14b, and the horizontal portion 16 are shown. The directional side surfaces are preferably located on the same plane.
[0013]
In such a current detection resistor 2, even if the solder of the solder layers 10 a and 10 b crawls up the vertical portions 14 a and 14 b of the energization portion 8, the resistance value of the current detection target portion (shaded portion in the figure) does not change. The main current can be detected with high accuracy. In addition, since the impedance of the voltage measurement circuit is high, no current substantially flows through the detection unit 18 and the solder layers 24a and 24b. Therefore, the rising of the solder in the solder layers 24a and 24b affects the voltage measurement. Don't give.
[0014]
In the present embodiment, the horizontal portions 20a and 20b of the detection unit 18 are projected from the side surface in the Y direction of the horizontal portion 16 of the energization unit 8. However, if the region does not creep up, the vertical portions 14a and 14b of the energization unit 8. You may make it protrude from the side surface. However, it is preferable to protrude from the horizontal portions 20a and 20b from the viewpoint of difficulty in scooping up the solder. Further, instead of projecting the horizontal portions 20a and 20b of the detection unit 18 from the same side surface with respect to the Y direction of the horizontal portion 16 of the energization unit 8, a pair of side surfaces opposed to the Y direction of the horizontal portion 16 respectively. The horizontal portion may be protruded.
[0015]
Further, in the present embodiment, the top plate portion 16 and the leg portions 14a and 14b of the energizing portion 8 are each formed of a horizontal portion and a vertical portion, and are formed in a U-shaped cross section as a whole, but opposite to the insulating substrate 4 If it is curved so as to be convex to the side, the extending surfaces of the top plate portion and the leg portion do not need to be orthogonal to each other, and the top plate portion and / or the leg portion extend on the curved surface. You may process, and you may process so that a top-plate part and a leg part may extend on the same curved surface.
[0016]
Embodiment 2. FIG.
FIG. 2 is a perspective view showing a second embodiment of the current detection resistor according to the present invention. In the following description, constituent elements that are the same as or similar to those in the first embodiment are represented by the same reference numerals or the same reference numerals with appropriate subscripts. This resistor 2 'is provided with a horizontal portion 16' narrower than the vertical portions 14a and 14b and the terminal portions 12a and 12b between the vertical portions (leg portions in a broad sense) 14a and 14b of the energizing portion 8 '. It is. With respect to one end side in the Y direction, the side surfaces of the vertical portions 14a and 14b and the terminal portions 12a and 12b and the horizontal portion 16 'of the energizing portion 8' are located on the same plane. From the upper end on the other end side in the Y direction of the vertical portions 14a and 14b, the vertical portions (protruding portions in a broad sense) 28a 'and 28b' of the detection portion 18 'face the vertical portions 14a and 14b of the energization portion 8'. It is so extended. The horizontal portion 16 ′ of the energizing portion 8 ′ and the vertical portions 28a ′ and 28b ′ of the detecting portion 18 ′ are separated by a slit 30 along the X direction. The vertical portions 28a ′ and 28b ′ of the detection unit 18 ′ are terminal portions 26a ′ and 26b ′ soldered to the detection circuit patterns 22a ′ and 22b ′ (solder layers are denoted by reference numerals 24a ′ and 24b ′). It is connected.
[0017]
In the current detection resistor 2 ′, even if the solder of the solder layers 10a and 10b rises up in the vertical portions 14a and 14b of the energization portion 8 ′, the resistance value of the current detection target portion (shaded portion in the figure) does not change. Therefore, the main current can be detected with high accuracy. Further, unlike the conventional current detection resistor disclosed in, for example, Japanese Patent Laid-Open No. 10-116710, no slits are formed in the terminal portions 12a and 12b of the energizing portion 8 ′, and the terminal portions 12a and 12b are not formed. Can sufficiently secure the soldering area (that is, the bonding area with the insulating substrate 4), so that the heat dissipation of the resistor 2 'can be improved.
[0018]
In the present embodiment, the vertical portions 28a 'and 28b' of the detection unit 18 'are both extended from the vicinity of the other end in the Y direction of the upper ends of the vertical portions 14a and 14b. You may extend from the Y direction one end part vicinity, and you may make it extend from the said upper end part center vicinity. In the latter case, the horizontal portion of the energization portion extends from both Y-direction both side portions of the upper end portion from which the vertical portion of the detection portion protrudes.
[0019]
Embodiment 3 FIG.
FIG. 3 is a perspective view showing a third embodiment of the current detection resistor according to the present invention. The resistor 2 ″ has a shape in which both ends of a rectangular plate are bent into a U shape, and the leading ends of the both ends are folded back so that both ends are L-shaped. Two slits 32 (32a, 32b), 34 (34a, 34b) along the X direction are formed at both ends, and two wide L-shaped portions 36 (36a, 36b), 38 (38a) are formed. 38b) and a narrow L-shaped portion 40 (40a, 40b) sandwiched between the wide L-shaped portions, the wide L-shaped portions 36a, 36b are respectively connected to the terminal portions 12aR, 12bR. Similarly, the wide L-shaped portions 38a and 38b are composed of the terminal portions 12aL and 12bL and the vertical portions 14aL and 14bL, respectively, and the narrow L-shaped portions 40a and 40b. Terminal Min 26a ", 26b" (in a broad sense protrusion) vertical portion and is composed of 28a ", 28b".
[0020]
The terminal portions 12aR and 12aL of the wide L-shaped portions 36a and 38a are joined to the energizing circuit pattern 6a ″ formed in a concave shape via the solder layers 10aR and 10aL. Similarly, the wide L-shaped portions 36b and 38b. The terminal portions 12bR and 12bL are joined to the energizing circuit pattern 6b ″ formed in a concave shape via the solder layers 10bR and 10bL. Therefore, the wide L-shaped portions 36 and 38 constitute energization terminals of the energization portion.
[0021]
On the insulating substrate 4, detection circuit patterns 22 a ″ and 22 b ″ are formed so as to protrude into the recesses of the energization circuit patterns 6 a ″ and 6 b ″, respectively. The terminal portions 26a "and 26b" of the narrow L-shaped portions 40a and 40b are joined to the detection circuit patterns 22a "and 22b" via the solder layers 24a "and 24b", respectively. Therefore, the narrow L-shaped portions 40a and 40b constitute detection terminals of the detection unit.
[0022]
In such a current detection resistor 2 ″, even if the solder of the solder layers 10aR, 10aL, 10bR, and 10bL rises up through the vertical portions 14aR, 14aL, 14bR, and 14bL of the energization portion, the current detection target portion (shaded portion in the figure) The main current can be detected with high accuracy since the resistance value of the resistor 2 ″ is not changed.Also, the resistor 2 ″ is mounted on the insulating substrate 4 by arranging the narrow detection terminal between the wide energization terminals. It is possible to suppress / prevent the detection terminal from being deformed by receiving an external force or the like in the single state.
[0023]
In the present embodiment, the top plate portion 16 ″ and the leg portions 14aR, 14aL, 14bR, 14bL, 28a ″, 28b ″ are respectively composed of a horizontal portion and a vertical portion, and are formed in a U-shaped cross section as a whole. If it is curved so as to be convex on the side opposite to the insulating substrate 4, the extending surfaces of the top plate portion and the leg portion need not be orthogonal to each other, and the top plate portion and / or the leg portion are curved surfaces. The top plate portion and the leg portion may be processed so as to extend on the same curved surface.
[0024]
Embodiment 4 FIG.
The current detection resistors according to the first to third embodiments are characterized in that the voltage-current characteristics do not change even when solder scooping occurs. Therefore, since the amount of solder creeping up is not controlled, there is a possibility that the solder creeps up the vertical portion of the current-carrying part and further reaches the detection part. In order to prevent this, it is preferable that the resistor according to the above-described embodiment is provided with a step for suppressing solder scooping up on the back side of the vertical portion of the energization portion as shown in FIG.
[0025]
FIG. 6A shows an example in which cuts 42a and 42b are made in a part of the back side of the vertical parts 14aD and 14bD of the energization part 8D so that the solder does not easily crawl up in the horizontal part 16D so that the solder accumulates in the cuts. . FIG. 7B shows an example in which a step is formed on the back side of the vertical portions 14aE and 14bE of the energization portion 8E, and the rise of the solder is suppressed by the horizontal surfaces 44a and 44b. FIG. 6C is an example in which a step is formed on the back side of the vertical portions 14aF and 14bF by further bending the tips of both end portions of the energizing portion 8F into an L shape, and the rise of solder is suppressed by the horizontal surfaces 46a and 46b. .
[0026]
【The invention's effect】
According to the current detection resistor of the present invention, the voltage-current characteristic does not change even when the solder crawls up, so that the current can be detected with high accuracy.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a first embodiment of a current detection resistor according to the present invention.
FIG. 2 is a perspective view showing a second embodiment of a current detection resistor according to the present invention.
FIG. 3 is a perspective view showing a third embodiment of a current detection resistor according to the present invention.
FIG. 4 is a diagram showing an example of a cross-sectional shape of a current-carrying part in a fourth embodiment of a current detection resistor according to the present invention.
[Explanation of symbols]
2: current detection resistor, 4: insulating substrate (substrate), 6: energization circuit pattern, 8: energization part, 10: solder layer, 12: terminal part of the energization part, 14: vertical part (leg) Part), 16: horizontal part of the current-carrying part (top plate part), 18: detection part, 20: horizontal part (protrusion part) of the detection part, 22: circuit pattern for detection, 24: solder layer, 26: detection part Terminal part, 28: vertical part of the detection part.

Claims (3)

基板の回路パターンに半田付け実装される電流検出用抵抗器において、
前記抵抗器は、回路パターンを流れる電流の通電部、および該電流を検出するための検出部を備え、
前記通電部は、天板部分、通電方向一端側の半田付け用の第１の端子部分対、通電方向他端側の第２の端子部分対、天板部分と第１の端子部分対を接続する第１の脚部分対、および天板部分と第２の端子部分対を接続する第２の脚部分対を有し、
前記検出部は、天板部分の通電方向一端側の一部から第１の脚部分対の間の領域に突出する第１の突出部分、および天板部分の通電方向他端側の一部から第２の脚部分対の間の領域に突出する第２の突出部分を有することを特徴とする電流検出用抵抗器。In the current detection resistor soldered to the circuit pattern on the board,
The resistor includes a current-carrying part that flows through the circuit pattern, and a detection part for detecting the current,
The energization part connects the top plate portion, the first terminal portion pair for soldering on one end side in the energizing direction, the second terminal portion pair on the other end side in the energizing direction, and the top plate portion and the first terminal portion pair. A first leg portion pair, and a second leg portion pair connecting the top plate portion and the second terminal portion pair,
The detection unit includes a first projecting portion projecting into a region between the first leg portion pair from a portion on one end side in the energization direction of the top plate portion, and a portion on the other end side in the energization direction of the top plate portion. A current detection resistor having a second projecting portion projecting into a region between the second leg portion pair. 基板の回路パターンに半田付け実装される電流検出用抵抗器において、
前記抵抗器は、前記基板とは反対側に凸になるように湾曲した板状本体部、および該本体部の両端に設けた半田付け用の一対の端子部を有し、
前記抵抗器両端はそれぞれ、前記端子部から本体部の一部まで通電方向に平行に伸びる一対のスリットにより三分割されており、
三分割された端子に関し、中央を回路パターンを流れる電流を検出するための検出端子、その両側を該電流の通電端子としたことを特徴とする電流検出用抵抗器。In the current detection resistor soldered to the circuit pattern on the board,
The resistor has a plate-like main body portion that is curved so as to protrude toward the opposite side of the substrate, and a pair of terminal portions for soldering provided at both ends of the main body portion,
Each end of the resistor is divided into three parts by a pair of slits extending in parallel with the energizing direction from the terminal part to a part of the main body part,
A current detection resistor having a detection terminal for detecting a current flowing through a circuit pattern in the center of the three divided terminals and a current-carrying terminal on both sides of the detection terminal. 前記脚部分の裏面に段差を設けたことを特徴とする請求項１または２のいずれかに記載の電流検出用抵抗器。The current detecting resistor according to claim 1, wherein a step is provided on a back surface of the leg portion.
JP2003004037A 2003-01-10 2003-01-10 Current detection resistor Expired - Fee Related JP4029049B2 (en)

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