JP4025323B2 - Socket for semiconductor device - Google Patents

Description

  The present invention relates to a socket for a semiconductor device, and more particularly, to a socket for a semiconductor device that can easily open and close a lid.

  As a socket for a semiconductor device used for screening such as a burn-in test of an IC package, an open top type or a clamshell type is known.

  The clamshell type semiconductor device socket is configured so that the IC package is mounted manually. More specifically, when mounting the IC package on the semiconductor device socket, the lid is closed by hand, and at the same time, the IC package placed at a predetermined position is pushed down via the package presser provided on the lid, The external contact of the package and the corresponding contact are connected with a predetermined contact pressure.

  In recent years, as the function of an IC package is improved, the number of external contacts of the IC package is increased, and accordingly, the number of contacts connected to the IC package is also increased. As a result, even in the clamshell type semiconductor device socket, a considerable pressing force is required to push down the IC package against the elastic force of many contacts when closing the lid.

  Therefore, in a clamshell type semiconductor device socket, a semiconductor device socket using the lever principle has been proposed in order to reduce this pressing force and facilitate operability (for example, Patent Document 1). Etc.).

  A conventional socket for a semiconductor device will be briefly described with reference to FIGS.

  8 to 11 are side views of a conventional semiconductor device socket, and show a state in which IC packages mounted in the order of the numbers are removed from the semiconductor device socket.

  As shown in FIGS. 8 to 11, the semiconductor device socket 110 generally includes a socket body 120, a lid 130, a lever member 140, a contact 150, and a pedestal 160.

  The socket body 120 has a locking pin 122 so that an engaging portion 142 provided in front of a lever 141 of a lever member 140 to be described later is engaged in the front (referring to the left side in FIG. 8, the same applies hereinafter). It is formed so as to protrude from both sides (referred to as a direction perpendicular to the paper surface in FIG. 8; the same applies hereinafter), and supports the lid 130 via a shaft 125 so as to be rotatable at the rear (referred to the right side in FIG. 8). Is configured to do.

  The lid body 130 is formed in a substantially box shape that opens downward in FIG. 8, that is, a so-called lid shape that covers the upper surface of the socket body 120. As described above, the lid 130 is rotatably supported by the socket main body 120 via the shaft 125 as described above, and the lid 130 is opened by the spring member 126 (clockwise direction in FIG. 8). Is being energized. In addition, the lid 130 supports a lever 141 of a lever member 140 (described later) via a shaft 135 so as to be rotatable in front of the free end. In addition, a package presser 131 is provided in a substantially central portion of the lid body 130 downward in FIG.

  The lever member 140 extends downward from the left and right side portions of the top plate portion 144 and the top plate portion 144 covering the upper surface of the lid body 130, covers the left and right side portions of the lid body 130, and both the left and right free ends of the lid body 130. A pair of levers 141 rotatably supported by a shaft 135 via a shaft 135, a pair of engaging portions 142 extending in a substantially L shape from the front of the pair of levers 141, and a corresponding locking portion of the socket body 120 A latch 143 is included. The latch 143 is rotatably attached to the lever member 140 via the shaft 145 at the rear, which is the free end of the lever member 140, and is latched to the socket body 120 by the spring member 146 (in FIG. 8). (Clockwise direction).

  A plurality of contacts 150 are arranged corresponding to the external terminals of the IC package 170 to be mounted, and are fixedly supported on the socket body 120. Each of the contacts 150 includes a contact portion 151 that contacts an external terminal of the IC package 170, an elastic portion 152 that supports the contact portion 151 so as to move up and down, a fixing portion 153 that is fixedly supported by the socket body 120, a test board (not shown). ) Including an external contact.

  The pedestal 160 is supported to be movable up and down with respect to the socket body 120, and the IC package 170 is placed thereon. The pedestal 160 is formed with a plurality of through holes in which the contact portions of the plurality of contacts 150 respectively face the lower portions. When the IC package is mounted, when the pedestal 160 is pushed down, the contact portion 151 of the contact 150 passes through the through hole and comes into contact with the external contact of the IC package 170.

  In the semiconductor device socket 110 having the above-described configuration, removal of the mounted IC package is performed as follows.

  FIG. 8 shows a state where the IC package 170 is mounted. From this state, the latch 143 is first rotated counterclockwise against the spring member 146 to release the locking with the socket body 120 (see FIG. 9). Next, the lever member 140 is rotated counterclockwise around the shaft 135 to release the engagement portion 142 of the lever member 140 from the engagement with the locking pin 122 of the socket body 120 (see FIG. 10). When the engagement between the engaging portion 142 and the locking pin 122 is completely released, the lid 130 is rotated clockwise while pulling up the lever member 140. As a result, the pedestal 160 rises, and the contact portion 151 of the contact 150 is positioned below the through hole of the pedestal 160, so that the IC package 170 on the pedestal 160 can be easily removed (FIG. 11). reference).

  Note that the IC package 170 may be attached to the semiconductor device socket 110 by performing the reverse operation. That is, first, as shown in FIG. 11, the IC package 170 is placed on the base 160 of the semiconductor device socket 110 in a state where the lid 130 is opened. Subsequently, as shown in FIG. 10, the lid 130 is closed together with the lever member 140. At this time, the lid 130 is not completely closed with respect to the socket body 120. Next, the engaging portion 142 of the lever member 140 is hooked on the locking pin 122 of the socket body 120, and the lever 141 of the lever member 140 is rotated around the shaft 135 in the clockwise direction (see FIG. 9). At this time, the lever member 140 can be rotated in the clockwise direction without requiring a special force by the lever principle. As shown in FIG. 8, when the lever member 140 is fully rotated, the latch 143 is engaged with the corresponding locking portion of the socket body 120. As a result, the lid 130 is completely closed with respect to the socket body 120.

Japanese Utility Model Publication No.59-135699

  As described above, in the conventional semiconductor device socket, when the IC package 170 is mounted, the lid 130 is completely closed and the IC package 170 on the base 160 is brought into contact with the contact 150 with a predetermined contact pressure. The depression through the package holder 131 is performed by rotating the lever member 140. Then, the latch 143 urged clockwise by the spring 146 in the series of movements of the rotating lever member 140 engages with the engaging portion of the socket body 120, so that the operation is smoothly performed. .

  However, when removing the IC package 170, first, as described above, an operation of removing the latch 143 from the engaging portion of the socket body 120 is performed. For this reason, the operation process is increased as compared with the case of mounting, and a certain degree of dexterity is required to release the engagement of the latch 143 against the spring 146. Therefore, the work time is increased when the IC package 170 is replaced.

  In view of the above problems, an object of the present invention is to provide a socket for a semiconductor device that enables easy opening and closing of a lid with a small operating force and is excellent in workability.

  In order to achieve the above object, a socket for a semiconductor device according to the present invention is attached to a socket body, a lid that is pivotally attached to the rear of the socket body, and pivotally attached to the front of the socket body. A latch that engages the lid when the lid is closed; and a lever member that is pivotably attached to the front of the lid, the lever member being a latch pressing portion that can contact the latch; and And a pair of levers having a pair of engaging portions that engage with engaging portions provided on the left and right sides of the front of the socket body, and the lever engaging portion of the lever member is engaged with the socket body. When the lever member is rotated so as to be released from the engagement with the stop portion, the latch pressing portion comes into contact with the latch, and the latch is released from the engagement with the lid.

  Further, it is preferable that a spring member that urges the lever member in a direction to be always closed with respect to the lid member is disposed between the lid member and the lever member, and the latch is attached to the lid member by the spring member. It is preferable that the urging force is always applied in the direction of engagement.

  Moreover, the latching | locking part of a socket main body may be the both ends of the axis | shaft which is supporting the latch to the socket main body so that rotation is possible.

  The lid easily closes the lid with a small operating force even if the contact reaction force is large, by the pivoting action using the lever principle of the lever of the lever member that is pivotally attached to the front of the lid. be able to.

  Further, as the lever member rotates, the latch pressing portion provided in front of the lever member comes into contact with the latch, and further pressing the latch releases the engagement between the latch and the lid. The lid can be smoothly opened by the operation.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 and 2 are top views of a semiconductor device socket according to an embodiment of the present invention. FIG. 1 shows a state in which the lid is open, and FIG. 2 shows a state in which the lid is closed. 3 to 6 are diagrams for explaining the operation of mounting the IC package on the semiconductor device socket, and the IC packages are mounted in the order of the drawings. FIG. 7 is a diagram for explaining an operation when the IC package is removed from the socket for a semiconductor device.

  First, the structure of the socket for a semiconductor device will be described with reference to FIGS.

  The semiconductor device socket 10 generally includes a socket body 20, a lid body 30, an insulator member 40, contacts 50, and a pedestal 60.

  In front of the socket body 20 (referring to the left side in FIG. 1; the same applies hereinafter), a locking shaft 22 is fixed to the socket body 20, and the locking shaft 22 penetrates the socket body 20 to the left and right (FIG. 1). The same applies to the following description, and protrudes from both sides to form a locking portion 22a. An engaging portion 42 provided in front of a lever 41 of a lever member 40 to be described later engages with the pair of engaging portions 22a protruding from the left and right side portions of the engaging shaft 22. A latch 21 disposed in a recess 27 formed in the socket body 20 is rotatably supported at the center of the locking shaft 22. The latch 21 has an engagement head 21a that engages with an engagement step 32a of the lid 30 described later, and is urged clockwise in FIG. 3 by a torsion coil spring 23 as a spring member. Furthermore, the engagement head 21a has an inclined surface 21b toward the rear.

  On the rear side of the socket body 20 (pointing to the right side in FIG. 1, the same applies hereinafter), the lid body 30 is rotatably supported via the shaft 25.

  As shown in FIG. 2, the lid 30 is formed as a box-shaped lid that opens downward and covers the entire top surface of the socket body 20 when closed.

  As described above, the lid 30 is supported by the socket body 20 via the shaft 25 so as to be rotatable, and the lid 30 is opened by a torsion coil spring 26 as a spring member (FIGS. 3 to 6). In the clockwise direction).

  The lid 30 has a concave portion 32 having a similar shape corresponding to the concave portion 27 of the socket body 20 at the center of the front end, which is a free end. The recess 32 is formed with an engagement step 32 a that engages with the engagement head 21 a of the latch 21 provided in the recess 27 of the socket body 20. With such a configuration, as shown in FIGS. 2 and 6, when the lid body 30 is closed, the front edge of the socket 10 for a semiconductor device formed by the socket body 20, the lid body 30 and the latch 21 is a surface. Become one.

  In front of the lid body 30, a lever 41 of a lever member 40 described later is rotatably supported via a shaft 35. Further, as clearly shown in FIG. 2, the cover 30 accommodates a coil spring 37 as a spring member in a pair of holes 36 formed slightly behind the shaft 35 and in the vicinity of both left and right side portions. . As shown in FIGS. 3 to 6, one end of the coil spring 37 is swingably attached to the lid body 30, and the other end is fixed to a lever member 40 described later. The coil spring 37 biases the lever member 40 around the shaft 35 in the clockwise direction.

  Further, as shown in FIG. 1 and the like, a package presser 31 is provided at a substantially central portion of the lid 30. The package holder 31 is preferably attached to the lid 30 so as to be swingable. By configuring the package presser 31 in this way, the IC package 70 can be pressed down uniformly against the contact 50 when the IC package 70 is mounted. However, the package holder 31 is not limited to this configuration, and may be fixed to the lid 30 or may be formed integrally with the lid 30.

  The lever member 40 extends downward from the left and right side portions of the top plate portion 44 covering the upper surface of the lid body 30 (perpendicular to the paper surface in FIG. 2) and covers both the left and right side portions of the lid body 30. , A pair of substantially L-shaped levers 41 rotatably supported on both left and right side portions of the free end of the lid 30 via shafts 35, and a pair of engaging portions 42 extending from the front of the pair of levers 41. Is included.

  In front of the top plate portion 44 of the lever member 40, it is positioned slightly above the top plate portion 44 corresponding to the engagement head 21 a of the latch 21, and protrudes forward from the front edge 44 a of the top plate portion 44. A latch pressing portion 47 is formed. Further, as shown in FIG. 6, the latch pressing portion 47 is formed so that the tip of the latch pressing portion 47 is located away from the engagement head 21 a of the latch 21 when the lid 30 is closed. .

  Further, as shown in FIGS. 3 to 6, the substantially L-shaped lever 41 is pivotally supported by the shaft 35 at a corner where the long piece 41a and the short piece 41b intersect at a substantially right angle. By configuring in this way, the length x of the long piece 41a and the short piece 41b are used to close the lever member 40 and thereby the lid 30 against the reaction force of the contact 50 as shown in FIG. If the ratio of the length y to the length y is (x / y), a force obtained by multiplying the force for directly closing the lid 30 by (y / x) is required. Therefore, the force which closes the cover body 30 can be made small enough by adjusting the length of the long piece 41a and the short piece 41b suitably.

  A plurality of contacts 50 are arranged corresponding to the external terminals of the IC package 70 to be mounted and fixedly supported on the bottom of the socket body 20. As shown in FIG. 6, the structure of each contact 50 is fixed to a contact part 51 that contacts an external terminal of the IC package 70, an elastic part 52 that supports the contact part 51 so as to move up and down, and a bottom part of the socket body 20. It includes a fixed portion 53 to be supported and a terminal portion 54 that contacts an external contact of a test board (not shown). The structure of the contact 50 is not limited to the present embodiment, and any structure may be used as long as the contact portion 51 moves up and down elastically.

  The pedestal 60 is supported so as to be movable up and down with respect to the socket body 20 as in the conventional example, and the IC package 70 is placed thereon. The pedestal 60 is biased upward by a coil spring (not shown) or the like. The pedestal 60 is formed with a plurality of through holes 61 in which contact portions of the plurality of contacts 50 respectively face the lower portions. When the IC package 70 is mounted, when the pedestal 60 is pushed down, the contact portion 51 of the contact 50 passes through the through hole 61 and contacts the external contact of the IC package 70. Reference numerals 62 denote positioning members provided at the four corners of the base 60. The positioning member 62 guides the IC package 70 to be placed to a predetermined position, that is, a position where the external contact of the IC package 70 and the through hole 61 correspond.

  In the IC socket 10 according to the present invention having the above-described configuration, the mounting and removal of the IC package 70 is performed as follows.

  3 to 6 show an operation process for mounting the IC package 70 on the socket 10 for a semiconductor device.

  FIG. 3 shows a state where the lid 30 is opened with respect to the socket body 20. At this time, the lever member 40 is in a closed state with respect to the lid 30 as shown in FIG. 3 by the biasing force of the coil spring 37, and the latch 21 is pulled by the biasing force of the torsion coil spring 23 in the clockwise direction. , Upright. The pedestal 60 is in a raised state. In this state, the IC package 70 is placed on the pedestal 60. The IC package 70 is guided by the positioning member 62 and disposed at a predetermined position on the pedestal 60.

  When the IC package 70 is placed on the pedestal 60, the lever 41 of the lever member 40 is rotated counterclockwise around the shaft 35 against the coil spring 37 as shown in FIG. Is slightly opened from the lid 30. The lever member 40 is slightly opened, and the lid body 30 is rotated counterclockwise around the shaft 25 against the torsion coil spring 26 to close the lid body 30 with respect to the socket body 20.

  Furthermore, as shown in FIG. 5, the lid body 30 is closed until the engaging portion 42 of the lever member 40 comes into engagement with the locking portion 22 a of the socket body 20. During this operation, the engagement head 21 a of the latch 21 abuts on the recess 32 of the lid 30, whereby the latch 21 is rotated counterclockwise against the torsion coil spring 23.

  When the pair of engaging portions 42 of the lever member 40 are engaged with the corresponding pair of locking portions 22a of the socket body 20, the lever 41 of the lever member 40 is rotated around the shaft 35 in the clockwise direction.

  By the operation utilizing the principle of the lever, the lid 30 receives the reaction force of the contact 50 via the package holder 31 and the IC package 70 as shown in FIG. Can be completely closed. During this operation, the IC package 70 is pushed down together with the pedestal 60 via the package holder 31, and the external contact of the IC package 70 contacts the contact portion 51 of the contact 50 that relatively rises through the through hole 61. To do. When the lid 30 is completely closed, the IC package 70 and the base 60 are further pushed down, and the external contact of the IC package 70 and the contact portion of the contact 50 are in electrical contact with a desired contact pressure.

  When the lid 30 is completely closed with respect to the socket body 20, the lever member 40 is also completely closed with respect to the lid 30, and the engagement head 21 a of the latch 21 is caused by the biasing force of the torsion coil spring 23. The lid 30 is automatically engaged with the engaging step 32a formed in the recess 32, and the lid 30 is kept closed.

  With the above continuous operation, the mounting of the IC package 70 to the semiconductor device socket 10 is completed.

  Next, the operation of removing the IC package 70 from the semiconductor device socket 10 will be described with reference to FIG.

  Basically, in order to remove the IC package 70 from the semiconductor device socket 10, the operation shown in FIGS.

  FIG. 7 shows the operation showing the features of the present invention when the IC package 70 is removed from the IC socket 10. As shown in FIG. 7, in the present invention, the latch 21 and the lid 30 are engaged with each other by simply rotating the lever member 40 around the shaft 35 counterclockwise from the mounted state of FIG. 6. Canceled. That is, the lid body 30 is released with respect to the socket body 20, and the lid body 30 can be opened.

  More specifically, when the lever 41 of the lever member 40 is rotated counterclockwise around the shaft 35 against the coil spring 37, the lever member 40 protrudes from the front edge 44a of the top plate portion 44 of the lever member 40. The latch pressing portion 47 abuts on the inclined surface 21 b of the head 21 a of the latch 21. Thereby, the latch 21 is rotated counterclockwise around the locking shaft 22, and the engagement state between the engagement head 21 a of the latch 21 and the engagement step portion 32 a of the lid 30 is released.

  Further, as the lever member 40 rotates in the counterclockwise direction around the axis 35 of the lever 41, the engaging portion 42 formed at the tip of the lever 41 is disengaged from the locking portion 22 a of the socket body 20. At this time, if the lid 30 is rotated clockwise around the shaft 25, the biasing force of the torsion coil spring 26 is applied, and the lid 30 can be easily opened as shown in FIG. At the same time, the pedestal 60 is raised and the external contact of the IC package 70 and the contact portion 51 of the contact 50 are separated, so that the IC package 70 can be easily taken out.

In the socket for semiconductor devices concerning the example of the present invention, it is a top view of the socket for semiconductor devices in the state where the lid was opened. 2 is a top view of the semiconductor device socket shown in FIG. 1 and shows a state in which the lid is closed. It is a figure for demonstrating the operation | movement which mounts an IC package in the socket for semiconductor devices which concerns on this invention, and is a side view of the socket for semiconductor devices in which the cover body is open. FIG. 4 is a view for explaining the operation of mounting the IC package on the semiconductor device socket according to the present invention, and is a side view of the semiconductor device socket in which the lid is being closed from the state shown in FIG. 3; FIG. 5 is a view for explaining the operation of mounting the IC package on the socket for a semiconductor device according to the present invention, from the state shown in FIG. 4 while the engaging portion of the lever member is engaged with the engaging portion of the socket body. It is a side view of a certain socket for semiconductor devices. FIG. 6 is a view for explaining the operation of mounting the IC package on the semiconductor device socket according to the present invention, and is a side view of the semiconductor device socket with the lid completely closed from the state shown in FIG. 5. It is a figure for demonstrating the operation | movement at the time of removing an IC package from the socket for semiconductor devices which concerns on this invention, and is a side view of the socket for semiconductor devices from which the engagement of a cover body is being cancelled | released by the lever member. It is a figure for demonstrating the operation | movement at the time of removing an IC package from the conventional socket for semiconductor devices, and is a side view of the socket for semiconductor devices by which the cover body is closed completely. FIG. 9 is a diagram for explaining an operation when an IC package is removed from a conventional semiconductor device socket, and is a side view of the semiconductor device socket in which a latch is released from the socket body from the state of FIG. 8. It is a figure for demonstrating the operation | movement when removing an IC package from the conventional socket for semiconductor devices, and is a side view of the socket for semiconductor devices from which the lever member was released from the socket main body from the state of FIG. It is a figure for demonstrating operation | movement when removing an IC package from the conventional socket for semiconductor devices, and is a side view of the socket for semiconductor devices by which the cover body was opened from the state of FIG.

Explanation of symbols

10, 110 Semiconductor device sockets 20, 120 Socket body 21 Latch 22 Locking shaft 25 Shaft 30, 130 Lid 31 Package holder 35 Shaft 40, 140 Insulator member 41 L-shaped lever 42 Engaging portion 47 Latch pressing portion 50, 150 Contacts 60, 160 Pedestal 70, 170 IC package

Claims (4)

The socket body,
A lid that is pivotally attached to the rear of the socket body;
A latch that is pivotally attached to the front of the socket body and engages the lid when the lid is closed;
A lever member rotatably attached to the front of the lid;
With
The lever member includes a pair of levers having a latch pressing portion capable of contacting the latch and a pair of engaging portions that engage with engaging portions provided on both left and right front portions of the socket body. ,
When the lever member is rotated to release the engaging portion of the lever of the lever member from the engagement with the locking portion of the socket body, the latch pressing portion abuts the latch, and the latch is the lid A socket for a semiconductor device, wherein the socket is released from engagement with a body.   2. The semiconductor device according to claim 1, wherein a spring member that biases the lever member in a direction in which the lever member is always closed with respect to the lid is disposed between the lid and the lever member. socket.   3. The semiconductor device socket according to claim 1, wherein the latch is biased by a spring member in a direction in which the latch is always engaged with the lid. 4. The socket for a semiconductor device according to claim 1, wherein the engaging portion of the socket body is both ends of a shaft that rotatably supports the latch on the socket body. .

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