JP4022994B2 - Printed wiring board and manufacturing method thereof - Google Patents

Printed wiring board and manufacturing method thereof Download PDF

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JP4022994B2
JP4022994B2 JP19885198A JP19885198A JP4022994B2 JP 4022994 B2 JP4022994 B2 JP 4022994B2 JP 19885198 A JP19885198 A JP 19885198A JP 19885198 A JP19885198 A JP 19885198A JP 4022994 B2 JP4022994 B2 JP 4022994B2
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coating material
bottomed hole
printed wiring
wiring board
viscosity
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JP2000031626A (en
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輝代隆 塚田
昌留 高田
光広 近藤
健司 千原
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Ibiden Co Ltd
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Ibiden Co Ltd
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【０００１】
【技術分野】
本発明は，絶縁基板に設けた有底穴に確実に樹脂材料を充填できるプリント配線板及びその製造方法に関する。
【０００２】
【従来技術】
従来，プリント配線板としては，図４（ｃ）に示すごとく，底部が閉塞されているとともに壁面２０５が金属めっき膜４で被覆されている有底穴２０を有するものがある。上記有底穴２０の中にはソルダーレジスト９５０が充填されている。
上記プリント配線板の製造方法としては，まず，金属めっき膜４で壁面２０５を被覆した有底穴２０を有する絶縁基板２を準備する（図２参照）。次いで，上記絶縁基板２に，ソルダーレジストを溶媒に溶解させた塗布材料９５を塗布して，上記有底穴２０の中に上記塗布材料９５を供給する。
この塗布材料９５の粘度は２００ポアズである。
【０００３】
【解決しようとする課題】
しかしながら，上記従来のプリント配線板の製造方法においては，次の問題がある。
即ち，上記塗布材料９５は溶媒の含有量が少なく，粘度が比較的高いため，上記有底穴２０に供給されるときに，有底穴２０の中の空気を内部に閉じ込めてしまう場合がある。そのため，図４（ａ）に示すごとく，上記塗布材料９５の塗布後には，上記有底穴２０の中に空洞８が残されてしまう。また，図４（ｂ）に示すごとく，この状態で加熱すると，上記空洞８内の空気の膨張によって，上記ソルダーレジスト９５０が破れてしまうおそれがある。また，図４（ｃ）に示すごとく，上記有底穴２０の底部の隅は，上記ソルダーレジスト９５０が付着しにくく，空洞８ができやすい。
特に，プリント配線板の小型化に伴って，有底穴２０の孔径が小さくなるほど，上記の問題が起きやすい。
【０００４】
本発明は，かかる従来の問題点に鑑みてなされたもので，有底穴の中に空洞を残すことなく，内部全体に確実にソルダーレジスト等の樹脂材料を充填することができるプリント配線板及びその製造方法を提供しようとするものである。
【０００５】
【課題の解決手段】
請求項１に記載の発明は，底部が閉塞されているとともに壁面が金属めっき膜で被覆されている有底穴を有する絶縁基板を準備する工程と，
上記有底穴の中に，溶媒又は溶媒に絶縁性樹脂を溶解させてなる第１塗布材料を供給する工程と，
上記第１塗布材料を供給した上記有底穴の中に，絶縁性樹脂又は溶媒に絶縁性樹脂を溶解させてなる第２塗布材料を供給し，該第２塗布材料を上記有底穴の中の上記第１塗布材料に溶解させる工程とからなるプリント配線板の製造方法であって，
上記第１塗布材料の粘度は，上記第２塗布材料の粘度よりも小さいことを特徴とするプリント配線板の製造方法にある。
【０００６】
本発明において最も注目すべきことは，塗布材料を２回に分けて上記有底穴の中に供給することであり，かつ１回目に供給する上記第１塗布材料の粘度は，２回目に供給する上記第２塗布材料の粘度よりも小さいことである。
【０００７】
次に，本発明の作用につき説明する。
本発明のプリント配線板の製造方法においては，まず，溶媒を多く含有させて粘度を比較的低くした上記第１塗布材料を，上記有底穴の中に供給する。このときに，上記第１塗布材料は粘度が低いため，上記有底穴の中の空気を確実に外部に逃がす。そのため，上記有底穴とその中に供給された上記第１塗布材料との間に，空洞が残ることはない。
【０００８】
次いで，上記第１塗布材料で満たされた上記有底穴に，上記第２塗布材料を供給する。これにより，上記第２塗布材料の中の絶縁性樹脂が，上記有底穴の中の第１塗布材料と混ざり合う。そして，溶媒が揮発した後には，上記有底穴の内部全体が上記絶縁性樹脂によって穴埋めされた状態となる。
上記のように，本発明によれば，上記有底穴の中に空洞を残すことなく，内部全体に上記絶縁性樹脂を充填することができる。
【０００９】
次に，請求項２に記載の発明のように，上記第１塗布材料の粘度は，上記第２塗布材料の粘度の１／１０以下であることが好ましい。
この場合には，上記第１塗布材料によって，迅速に上記有底穴の中の空気を外部に逃がすことができる。
一方，上記第１塗布材料の粘度が上記第２塗布材料の粘度の１／１０を越える場合には，上記有底穴の中に空洞が残るおそれがある。
【００１０】
次に，請求項３に記載の発明のように，上記第１塗布材料の粘度は，５０ポアズ以下であることが好ましい。
この場合には，上記第１塗布材料によって，迅速にほぼ完全に上記有底穴の中の空気を外部に逃がすことができる。
一方，上記第１塗布材料の粘度が５０ポアズを越える場合には，上記空気を外部に逃がす効果を得ることができない場合がある。
【００１１】
次に，請求項４に記載の発明のように，上記第２塗布材料の粘度は，１００〜５００ポアズであることが好ましい。
この場合には，上記第２塗布材料を，上記絶縁基板にスムーズに塗布することができると共に，予め上記有底穴の中に供給した上記第１塗布材料と均一に混合させることができる。
一方，上記第２塗布材料粘度が１００ポアズ未満の場合には，上記有底穴の充填が不完全になるおそれがある。また，上記第２塗布材料の粘度が５００ポアズを越える場合には，上記第２塗布材料が，上記有底穴の中の第１塗布材料と均一に混合しない場合がある。
【００１２】
次に，請求項５に記載の発明のように，上記第１塗布材料の溶媒は，上記第２塗布材料の溶媒と同じ種類であることが好ましい。
この場合には，上記第１塗布材料と第２塗布材料とのなじみがよくなり，上記有底穴の中で両者が均一に混合できる。
【００１３】
次に，請求項６に記載の発明のように，上記第１塗布材料の固形分濃度は，上記第２塗布材料の固形分濃度よりも低いことが好ましい。
この場合には，上記第１塗布材料の粘度を上記第２塗布材料の粘度よりも容易に小さくすることができる。
【００１４】
次に，請求項７に記載の発明のように，上記第１塗布材料の溶媒含有率は，上記第２塗布材料の溶媒含有率よりも大きいことが好ましい。
この場合には，上記第１塗布材料の粘度を上記第２塗布材料の粘度よりも容易に小さくすることができる。
一方，上記第２塗布材料の溶媒含有率が，上記第１塗布材料の溶媒含有率よりも大きい場合には，上記窪み部が大きくなり，上記有底穴の中にまで形成されてしまうおそれがある。
【００１５】
次に，請求項８に記載の発明のように，上記第１塗布材料の溶媒含有率は３０体積％以上であり，上記第２塗布材料の溶媒含有率は３０体積％未満であることが好ましい。
この場合には，溶媒が揮発した後，上記有底穴の開口側の上記絶縁性樹脂に形成される窪み部を小さくすることができる。
一方，上記第１塗布材料の溶媒含有率が３０体積％未満の場合には，第２塗布材料と均一に混合しないおそれがある。
また，上記第２塗布材料の溶媒含有率が３０体積％以上の場合には，同様に，第１塗布材料と均一に混合しないおそれがある。
【００１６】
上記溶媒としては，ジメチルホルムアミド（ＤＭＦ），エチレングリコール，ジエチレングリコール，プロピレングリコール，モノメチルエーテルアセテート等を用いることが好ましい。また，上記絶縁性樹脂としては，ソルダーレジスト，エポキシ系樹脂等を用いることが好ましい。
また，上記有底穴の底部は，導体パターンで被覆されていても，下に位置する絶縁基板で被覆されていてもよい（図３参照）。
【００１７】
上記の製造方法により得られるプリント配線板としては，例えば，底部が閉塞されているとともに壁面が金属めっき膜で被覆されている有底穴を有するプリント配線板において，
上記有底穴の中には，絶縁性樹脂が充填されているとともに，該有底穴の開口側には，上記絶縁性樹脂の窪み部が形成されていることを特徴とするプリント配線板がある。
【００１８】
上記プリント配線板においては，上記有底穴の開口側には，上記絶縁性樹脂の窪み部が形成されている。この窪み部は，上記有底穴の中において上記絶縁性樹脂を溶解させていた溶媒の揮発跡である。この窪み部は，上記有底穴の開口部よりも上方にあることが多い。
【００１９】
【発明の実施の形態】
実施形態例１
本発明の実施形態例にかかるプリント配線板及びその製造方法につき，図１〜図３を用いて説明する。
本例のプリント配線板１は，図１（ｃ）に示すごとく，壁面２０５を金属めっき膜４で被覆した有底穴２０を有する。また，この有底穴２０の中には，ソルダーレジスト５３が充填されているとともに，この有底穴２０の開口側には，上記ソルダーレジスト５３の窪み部５３７が形成されている。
【００２０】
本例のプリント配線板の製造方法は，上記有底穴２０を有する絶縁基板２を準備する工程（図２）と，上記有底穴２０の中に第１塗布材料５１と，これよりも粘度の高い第２塗布材料５２を順に供給する工程（図１）とからなる。
【００２１】
以下，これを詳説する。
まず，図２（ａ）に示すごとく，ガラスエポキシ，ガラスビスマレイミドトリアジン，ガラスポリイミド等からなる厚み０．０８ｍｍの絶縁基板２の両面に銅箔３を貼着する。
次いで，図２（ｂ）に示すごとく，上記銅箔３に対して，エッチング等を施すことによって，上記絶縁基板２の上面，下面に導体パターン３１，３２を形成する。このとき，上記絶縁基板２の有底穴形成部分２０１の底部は，上記導体パターン３２により被覆し，上記有底穴形成部分２０１の開口部には，上記導体パターン３１を形成せず開口させておく。また，これと共に，パッド，ランド（図示略）等を形成する。
【００２２】
次いで，図２（ｃ）に示すごとく，上記絶縁基板２の有底穴形成部分２０１に対して，上記導体パターン３１の形成側からレーザを照射する。レーザは上記絶縁基板２の底部に位置する導体パターン３２に到達，反射するまで，上記絶縁基板２を気化除去していく。これにより，上記絶縁基板２に，底部が上記導体パターン３１に被覆された有底穴２０を形成する。この有底穴２０の孔径０．１００ｍｍである。
なお，上記有底穴２０の形成方法は，上記レーザを用いた穴あけ方法に限らず，例えばドリルを用いた穴あけ方法等でもよい。
【００２３】
次いで，図２（ｄ）に示すごとく，上記導体パターン３１，３２の表面，及び上記有底穴２０の壁面２０５に化学めっき処理，電気めっき処理を施し，Ｃｕ，Ｎｉ，Ａｕ等からなる金属めっき膜４を形成する。この金属めっき膜４は，上記有底穴２０の底部を被覆する導体パターン３２にも形成される。
【００２４】
次いで，図１（ａ）に示すごとく，溶媒にソルダーレジストを溶解させてなる第１塗布材料５１を上記絶縁基板２の表面に塗布して，上記有底穴２０の中に上記塗布材料５１を充填する。
上記第１塗布材料５１の粘度は１０〜３０ポアズである。また，上記第１塗布材料５１の溶媒はジメチルホルムアミド（ＤＭＦ）である。また，上記第１塗布材料５１の固形分濃度は６７重量％である。また，上記第１塗布材料５１の溶媒含有率は４１体積％である。
【００２５】
次いで，図１（ｂ）に示すごとく，溶媒にソルダーレジストを溶解させてなる第２塗布材料５２を，上記絶縁基板２の表面，及び上記第１塗布材料５１で満たされた有底穴２０に塗布する。これにより，上記第２塗布材料５２は，上記有底穴２０の中の第１塗布材料５１に溶解して，上記有底穴２０の内部全体に充填される。
上記第２塗布材料５２の粘度は１００〜５００ポアズである。また，上記第２塗布材料５２の溶媒はジメチルホルムアミド（ＤＭＦ）である。また，上記第２塗布材料５２の固形分濃度は８８重量％である。また，上記第２塗布材料５２の溶媒含有率は２５体積％である。
以上により，本例のプリント配線板１が得られる。
【００２６】
次に，本例の作用につき説明する。
本例のプリント配線板の製造方法においては，まず，図１（ａ）に示すごとく，溶媒を多く含有させて粘度を１０〜３０ポアズに低くした上記第１塗布材料５１を，上記有底穴２０の中に供給している。このときに，上記第１塗布材料５１は粘度が低いため，上記有底穴２０の中の空気を確実に外部に逃がす。そのため，第１塗布材料５１の塗布後において，上記有底穴２０の中に空洞が残ることはない。
【００２７】
次いで，図１（ｂ）に示すごとく，上記第１塗布材料５１で満たされた上記有底穴２０に，上記第２塗布材料５２を供給する。これにより，上記第２塗布材料５２の中のソルダーレジストが，上記有底穴２０の中の第１塗布材料５１と混ざり合う。そして，溶媒が揮発した後には，図１（ｃ）に示すごとく，上記有底穴２０の内部全体が上記ソルダーレジスト５３によって穴埋めされた状態となる。
上記のように，本例によれば，上記有底穴２０の中に空洞を残すことなく，内部全体に上記ソルダーレジスト５３を充填することができる。
【００２８】
また，上記第１塗布材料５１の粘度は，上記第２塗布材料５２の粘度の１／１０以下で，かつ５０ポアズ以下の１０〜３０ポアズである。これにより，上記第１塗布材料５１によって，迅速にほぼ完全に上記有底穴２０の中の空気を外部に逃がすことができる。
【００２９】
また，上記第２塗布材料５２の粘度は，１００〜５００ポアズである。これにより，上記第２塗布材料５２を，上記絶縁基板２にスムーズに塗布することができると共に，予め上記有底穴２０の中に供給した上記第１塗布材料５１に均一に混合させることができる。
【００３０】
また，上記第１塗布材料５１の溶媒は，上記第２塗布材料５２の溶媒と同じ種類である。これにより，上記第１塗布材料５１と第２塗布材料５２とのなじみがよくなり，上記有底穴２０の中で両者が均一に混合できる。
【００３１】
また，上記第１塗布材料５１の固形分濃度は，上記第２塗布材料５２の固形分濃度よりも低い。また，上記第１塗布材料５１の溶媒含有率は，上記第２塗布材料５２の溶媒含有率よりも大きい。これにより，上記第１塗布材料５１の粘度を上記第２塗布材料５２の粘度よりも容易に小さくすることができる。
【００３２】
また，上記第１塗布材料５１の溶媒含有率は３０体積％以上であり，上記第２塗布材料５２の溶媒含有率は３０体積％未満である。これにより，ジメチルホルムアミド（ＤＭＦ）が揮発した後，上記有底穴２０の開口側の上記ソルダーレジスト５３に形成される窪み部５３７を小さくすることができる。
【００３３】
実施形態例２
本例のプリント配線板１は，図３に示すごとく，２枚の絶縁基板２１，２２を，プリプレグ２５を介して積層した多層構造を有する。上記絶縁基板２１，２２の外部表面，内部表面には，それぞれ導体パターン３１，３２が設けられており，各導体パターンの間は有底穴２０により電気的に接続されている。
また，上記プリント配線板１の上面，下面は，ソルダーレジスト５３により被覆されている。ソルダーレジスト５３の一部は，上記有底穴２０を埋めている。
【００３４】
上記プリント配線板１の略中央には，電子部品７を搭載するための搭載用凹部７０が設けられている。そして，上記プリント配線板１の下面には，上記搭載用凹部７０の底面を構成する放熱板６２が接着剤５９により接着されている。
また，上記搭載用凹部７０の壁面には，上記導体パターン３１，３２の間を電気的に接続する壁面パターン３６が設けられている。この壁面パターン３６と上記搭載用凹部７０の近傍の導体パターン３１，３２は，Ｎｉ／Ａｕめっき膜３５により被覆されている。
【００３５】
また，上記導体パターン３１，３２と上記搭載用凹部７０に搭載した電子部品７との間は，ボンディングワイヤ７１により電気的に接続され，これらは上記搭載用凹部７０内に充填された封止樹脂５８により封止されている。
また，上記プリント配線板１の上面に設けた導体パターン３１には，外部基板に実装するための半田ボール６１が接合されている。
その他は，実施形態例１と同様である。
本例においても，実施形態例１と同様の効果を発揮することができる。
【００３６】
【発明の効果】
上述のごとく，本発明によれば，有底穴の中に空洞を残すことなく，内部全体に確実にソルダーレジスト等の樹脂材料を充填することができるプリント配線板及びその製造方法を提供することができる。
【図面の簡単な説明】
【図１】実施形態例１における，塗布材料の供給工程の説明図。
【図２】実施形態例１における，絶縁基板の準備工程の説明図。
【図３】実施形態例２における，プリント配線板の断面図。
【図４】従来例における，塗布材料の供給工程の説明図。
【符号の説明】
１．．．プリント配線板，
２．．．絶縁基板，
２０．．．有底穴，
３．．．銅箔，
３１，３２．．．導体パターン，
４．．．金属めっき膜，
５１．．．第１塗布材料，
５２．．．第２塗布材料，
５３．．．ソルダーレジスト，
５３７．．．窪み部，[0001]
【Technical field】
The present invention relates to a printed wiring board capable of reliably filling a bottomed hole provided in an insulating substrate with a resin material and a method for manufacturing the same.
[0002]
[Prior art]
Conventionally, as shown in FIG. 4C, some printed wiring boards have a bottomed hole 20 whose bottom is closed and whose wall surface 205 is covered with a metal plating film 4. The bottomed hole 20 is filled with a solder resist 950.
As a method for manufacturing the printed wiring board, first, an insulating substrate 2 having a bottomed hole 20 in which a wall surface 205 is covered with a metal plating film 4 is prepared (see FIG. 2). Next, a coating material 95 in which a solder resist is dissolved in a solvent is applied to the insulating substrate 2, and the coating material 95 is supplied into the bottomed hole 20.
The viscosity of the coating material 95 is 200 poise.
[0003]
[Problems to be solved]
However, the conventional printed wiring board manufacturing method has the following problems.
That is, since the coating material 95 has a low solvent content and a relatively high viscosity, the air in the bottomed hole 20 may be trapped inside when supplied to the bottomed hole 20. . Therefore, as shown in FIG. 4A, the cavity 8 remains in the bottomed hole 20 after the coating material 95 is applied. Further, as shown in FIG. 4B, when heated in this state, the solder resist 950 may be broken due to the expansion of air in the cavity 8. Further, as shown in FIG. 4C, the solder resist 950 is difficult to adhere to the bottom corner of the bottomed hole 20, and the cavity 8 is easily formed.
In particular, as the printed wiring board becomes smaller, the above-mentioned problem is more likely to occur as the hole diameter of the bottomed hole 20 becomes smaller.
[0004]
The present invention has been made in view of such conventional problems, and a printed wiring board capable of reliably filling a resin material such as a solder resist into the entire interior without leaving a cavity in the bottomed hole, and The manufacturing method is intended to be provided.
[0005]
[Means for solving problems]
The invention according to claim 1 is a step of preparing an insulating substrate having a bottomed hole whose bottom is closed and whose wall is covered with a metal plating film;
Supplying a first coating material formed by dissolving a solvent or an insulating resin in the solvent into the bottomed hole;
A second coating material obtained by dissolving an insulating resin or an insulating resin in a solvent is supplied into the bottomed hole supplied with the first coating material, and the second coating material is placed in the bottomed hole. A method of manufacturing a printed wiring board comprising the step of dissolving in the first coating material of
In the printed wiring board manufacturing method, the viscosity of the first coating material is smaller than the viscosity of the second coating material.
[0006]
The most notable point in the present invention is that the coating material is supplied into the bottomed hole in two portions, and the viscosity of the first coating material supplied in the first time is supplied in the second time. It is smaller than the viscosity of the second coating material.
[0007]
Next, the operation of the present invention will be described.
In the printed wiring board manufacturing method of the present invention, first, the first coating material containing a large amount of solvent and having a relatively low viscosity is supplied into the bottomed hole. At this time, since the viscosity of the first coating material is low, air in the bottomed hole is surely released to the outside. Therefore, a cavity does not remain between the bottomed hole and the first coating material supplied therein.
[0008]
Next, the second coating material is supplied to the bottomed hole filled with the first coating material. Thereby, the insulating resin in the second coating material is mixed with the first coating material in the bottomed hole. After the solvent is volatilized, the entire inside of the bottomed hole is filled with the insulating resin.
As described above, according to the present invention, it is possible to fill the entire interior with the insulating resin without leaving a cavity in the bottomed hole.
[0009]
Next, as in the invention described in claim 2, the viscosity of the first coating material is preferably 1/10 or less of the viscosity of the second coating material.
In this case, the air in the bottomed hole can be quickly released to the outside by the first coating material.
On the other hand, when the viscosity of the first coating material exceeds 1/10 of the viscosity of the second coating material, a cavity may remain in the bottomed hole.
[0010]
Next, as in the invention described in claim 3, the viscosity of the first coating material is preferably 50 poise or less.
In this case, the air in the bottomed hole can be released to the outside quickly and almost completely by the first coating material.
On the other hand, when the viscosity of the first coating material exceeds 50 poise, the effect of escaping the air to the outside may not be obtained.
[0011]
Next, as in the invention described in claim 4, the viscosity of the second coating material is preferably 100 to 500 poise.
In this case, the second coating material can be smoothly applied to the insulating substrate and can be uniformly mixed with the first coating material supplied in advance into the bottomed hole.
On the other hand, when the viscosity of the second coating material is less than 100 poise, the filling of the bottomed hole may be incomplete. Further, when the viscosity of the second coating material exceeds 500 poise, the second coating material may not be mixed uniformly with the first coating material in the bottomed hole.
[0012]
Next, as in the invention described in claim 5, the solvent of the first coating material is preferably the same type as the solvent of the second coating material.
In this case, the familiarity between the first coating material and the second coating material is improved, and both can be mixed uniformly in the bottomed hole.
[0013]
Next, as in the invention described in claim 6, the solid content concentration of the first coating material is preferably lower than the solid content concentration of the second coating material.
In this case, the viscosity of the first coating material can be easily made smaller than the viscosity of the second coating material.
[0014]
Next, as in the invention described in claim 7, the solvent content of the first coating material is preferably larger than the solvent content of the second coating material.
In this case, the viscosity of the first coating material can be easily made smaller than the viscosity of the second coating material.
On the other hand, when the solvent content rate of the second coating material is larger than the solvent content rate of the first coating material, there is a possibility that the hollow portion becomes large and is formed even in the bottomed hole. is there.
[0015]
Next, as in the invention described in claim 8, the solvent content of the first coating material is preferably 30% by volume or more, and the solvent content of the second coating material is preferably less than 30% by volume. .
In this case, after the solvent is volatilized, the recessed portion formed in the insulating resin on the opening side of the bottomed hole can be reduced.
On the other hand, when the solvent content of the first coating material is less than 30% by volume, the first coating material may not be mixed uniformly with the second coating material.
Similarly, when the solvent content of the second coating material is 30% by volume or more, there is a possibility that the second coating material is not uniformly mixed with the first coating material.
[0016]
As the solvent, dimethylformamide (DMF), ethylene glycol, diethylene glycol, propylene glycol, monomethyl ether acetate or the like is preferably used. Moreover, as the insulating resin, it is preferable to use a solder resist, an epoxy resin, or the like.
The bottom of the bottomed hole may be covered with a conductor pattern or may be covered with an insulating substrate located below (see FIG. 3).
[0017]
As a printed wiring board obtained by the above manufacturing method, for example , in a printed wiring board having a bottomed hole whose bottom is closed and whose wall is covered with a metal plating film,
In the printed circuit board, the bottomed hole is filled with an insulating resin, and a recessed portion of the insulating resin is formed on the opening side of the bottomed hole. is there.
[0018]
In the printed wiring board, a recessed portion of the insulating resin is formed on the opening side of the bottomed hole. This hollow portion is a volatile trace of the solvent in which the insulating resin is dissolved in the bottomed hole. This depression is often above the opening of the bottomed hole.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1
A printed wiring board and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to FIGS.
The printed wiring board 1 of this example has a bottomed hole 20 in which a wall surface 205 is covered with a metal plating film 4 as shown in FIG. In addition, the bottomed hole 20 is filled with a solder resist 53, and a recessed portion 537 of the solder resist 53 is formed on the opening side of the bottomed hole 20.
[0020]
The printed wiring board manufacturing method of this example includes the step of preparing the insulating substrate 2 having the bottomed hole 20 (FIG. 2), the first coating material 51 in the bottomed hole 20, and a viscosity higher than that. And a step (FIG. 1) of sequentially supplying the second coating material 52 having a high height.
[0021]
This will be described in detail below.
First, as shown in FIG. 2 (a), copper foils 3 are adhered to both surfaces of an insulating substrate 2 made of glass epoxy, glass bismaleimide triazine, glass polyimide, etc. and having a thickness of 0.08 mm.
Next, as shown in FIG. 2B, conductor patterns 31 and 32 are formed on the upper and lower surfaces of the insulating substrate 2 by etching the copper foil 3. At this time, the bottom of the bottomed hole forming portion 201 of the insulating substrate 2 is covered with the conductor pattern 32, and the opening of the bottomed hole forming portion 201 is opened without forming the conductor pattern 31. deep. Along with this, a pad, a land (not shown), and the like are formed.
[0022]
Next, as shown in FIG. 2C, the bottomed hole forming portion 201 of the insulating substrate 2 is irradiated with laser from the side on which the conductor pattern 31 is formed. The laser vaporizes and removes the insulating substrate 2 until it reaches and reflects the conductor pattern 32 located at the bottom of the insulating substrate 2. As a result, a bottomed hole 20 whose bottom is covered with the conductor pattern 31 is formed in the insulating substrate 2. The hole diameter of the bottomed hole 20 is 0.100 mm.
In addition, the formation method of the said bottomed hole 20 is not restricted to the drilling method using the said laser, For example, the drilling method etc. which used the drill may be used.
[0023]
Next, as shown in FIG. 2 (d), the surface of the conductor patterns 31, 32 and the wall surface 205 of the bottomed hole 20 are subjected to chemical plating and electroplating, and metal plating made of Cu, Ni, Au, or the like. A film 4 is formed. The metal plating film 4 is also formed on the conductor pattern 32 that covers the bottom of the bottomed hole 20.
[0024]
Next, as shown in FIG. 1A, a first coating material 51 in which a solder resist is dissolved in a solvent is applied to the surface of the insulating substrate 2, and the coating material 51 is placed in the bottomed hole 20. Fill.
The viscosity of the first coating material 51 is 10 to 30 poise. The solvent of the first coating material 51 is dimethylformamide (DMF). The solid content concentration of the first coating material 51 is 67% by weight. The solvent content of the first coating material 51 is 41% by volume.
[0025]
Next, as shown in FIG. 1B, a second coating material 52 obtained by dissolving a solder resist in a solvent is applied to the surface of the insulating substrate 2 and the bottomed hole 20 filled with the first coating material 51. Apply. As a result, the second coating material 52 is dissolved in the first coating material 51 in the bottomed hole 20 to fill the entire inside of the bottomed hole 20.
The viscosity of the second coating material 52 is 100 to 500 poise. The solvent of the second coating material 52 is dimethylformamide (DMF). The solid content concentration of the second coating material 52 is 88% by weight. The solvent content of the second coating material 52 is 25% by volume.
Thus, the printed wiring board 1 of this example is obtained.
[0026]
Next, the operation of this example will be described.
In the method for manufacturing a printed wiring board of this example, first, as shown in FIG. 1A, the first coating material 51 containing a large amount of solvent and having a viscosity reduced to 10 to 30 poise is used as the bottomed hole. 20 is supplied. At this time, since the first coating material 51 has a low viscosity, the air in the bottomed hole 20 is surely released to the outside. Therefore, no cavity remains in the bottomed hole 20 after the first coating material 51 is applied.
[0027]
Next, as shown in FIG. 1B, the second coating material 52 is supplied to the bottomed hole 20 filled with the first coating material 51. As a result, the solder resist in the second coating material 52 is mixed with the first coating material 51 in the bottomed hole 20. After the solvent is volatilized, as shown in FIG. 1C, the entire inside of the bottomed hole 20 is filled with the solder resist 53.
As described above, according to this example, the solder resist 53 can be filled into the entire interior without leaving a cavity in the bottomed hole 20.
[0028]
The viscosity of the first coating material 51 is 1/10 or less of the viscosity of the second coating material 52 and 10 to 30 poises of 50 poises or less. As a result, the first coating material 51 allows the air in the bottomed hole 20 to escape to the outside quickly and completely.
[0029]
The viscosity of the second coating material 52 is 100 to 500 poise. Accordingly, the second coating material 52 can be smoothly applied to the insulating substrate 2 and can be uniformly mixed with the first coating material 51 previously supplied into the bottomed hole 20. .
[0030]
The solvent of the first coating material 51 is the same type as the solvent of the second coating material 52. Thereby, the familiarity of the first coating material 51 and the second coating material 52 is improved, and both can be uniformly mixed in the bottomed hole 20.
[0031]
The solid content concentration of the first coating material 51 is lower than the solid content concentration of the second coating material 52. The solvent content of the first coating material 51 is greater than the solvent content of the second coating material 52. Thereby, the viscosity of the first coating material 51 can be easily made smaller than the viscosity of the second coating material 52.
[0032]
The solvent content of the first coating material 51 is 30% by volume or more, and the solvent content of the second coating material 52 is less than 30% by volume. Thereby, after dimethylformamide (DMF) volatilizes, the recessed part 537 formed in the solder resist 53 on the opening side of the bottomed hole 20 can be reduced.
[0033]
Embodiment 2
As shown in FIG. 3, the printed wiring board 1 of this example has a multilayer structure in which two insulating substrates 21 and 22 are laminated via a prepreg 25. Conductor patterns 31 and 32 are provided on the outer surface and the inner surface of the insulating substrates 21 and 22, respectively, and the conductor patterns are electrically connected by a bottomed hole 20.
The upper and lower surfaces of the printed wiring board 1 are covered with a solder resist 53. A part of the solder resist 53 fills the bottomed hole 20.
[0034]
A mounting recess 70 for mounting the electronic component 7 is provided substantially at the center of the printed wiring board 1. A heat radiating plate 62 constituting the bottom surface of the mounting recess 70 is adhered to the lower surface of the printed wiring board 1 with an adhesive 59.
The wall surface of the mounting recess 70 is provided with a wall surface pattern 36 that electrically connects the conductor patterns 31 and 32. The conductor patterns 31 and 32 in the vicinity of the wall surface pattern 36 and the mounting recess 70 are covered with a Ni / Au plating film 35.
[0035]
The conductor patterns 31 and 32 and the electronic component 7 mounted in the mounting recess 70 are electrically connected by a bonding wire 71, and these are sealing resin filled in the mounting recess 70. 58 is sealed.
Solder balls 61 for mounting on an external substrate are joined to the conductor pattern 31 provided on the upper surface of the printed wiring board 1.
Others are the same as in the first embodiment.
Also in this example, the same effects as those of the first embodiment can be exhibited.
[0036]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a printed wiring board capable of reliably filling a resin material such as a solder resist into the entire interior without leaving a cavity in a bottomed hole, and a method for manufacturing the same. Can do.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of a coating material supply step in Embodiment 1;
2 is an explanatory diagram of an insulating substrate preparation step in Embodiment 1. FIG.
3 is a cross-sectional view of a printed wiring board in Embodiment 2. FIG.
FIG. 4 is an explanatory view of a coating material supply process in a conventional example.
[Explanation of symbols]
1. . . Printed wiring board,
2. . . Insulating substrate,
20. . . Bottomed hole,
3. . . Copper foil,
31, 32. . . Conductor pattern,
4). . . Metal plating film,
51. . . First coating material,
52. . . Second coating material,
53. . . Solder resist,
537. . . Hollow,

Claims (8)

底部が閉塞されているとともに壁面が金属めっき膜で被覆されている有底穴を有する絶縁基板を準備する工程と，
上記有底穴の中に，溶媒又は溶媒に絶縁性樹脂を溶解させてなる第１塗布材料を供給する工程と，
上記第１塗布材料を供給した上記有底穴の中に，絶縁性樹脂又は溶媒に絶縁性樹脂を溶解させてなる第２塗布材料を供給し，該第２塗布材料を上記有底穴の中の上記第１塗布材料に溶解させる工程とからなるプリント配線板の製造方法であって，
上記第１塗布材料の粘度は，上記第２塗布材料の粘度よりも小さいことを特徴とするプリント配線板の製造方法。Preparing an insulating substrate having a bottomed hole whose bottom is closed and whose wall is covered with a metal plating film;
Supplying a first coating material formed by dissolving a solvent or an insulating resin in the solvent into the bottomed hole;
A second coating material obtained by dissolving an insulating resin or an insulating resin in a solvent is supplied into the bottomed hole supplied with the first coating material, and the second coating material is placed in the bottomed hole. A method of manufacturing a printed wiring board comprising the step of dissolving in the first coating material of
A method for producing a printed wiring board, wherein the viscosity of the first coating material is smaller than the viscosity of the second coating material. 請求項１において，上記第１塗布材料の粘度は，上記第２塗布材料の粘度の１／１０以下であることを特徴とするプリント配線板の製造方法。  2. The method of manufacturing a printed wiring board according to claim 1, wherein the viscosity of the first coating material is 1/10 or less of the viscosity of the second coating material. 請求項１又は２において，上記第１塗布材料の粘度は，５０ポアズ以下であることを特徴とするプリント配線板の製造方法。  3. The method for manufacturing a printed wiring board according to claim 1, wherein the viscosity of the first coating material is 50 poise or less. 請求項１〜３のいずれか一項において，上記第２塗布材料の粘度は，１００〜５００ポアズであることを特徴とするプリント配線板の製造方法。  The method for manufacturing a printed wiring board according to any one of claims 1 to 3, wherein the viscosity of the second coating material is 100 to 500 poise. 請求項１〜４のいずれか一項において，上記第１塗布材料の溶媒は，上記第２塗布材料の溶媒と同じ種類であることを特徴とするプリント配線板の製造方法。  5. The method for manufacturing a printed wiring board according to claim 1, wherein the solvent of the first coating material is the same type as the solvent of the second coating material. 6. 請求項１〜５のいずれか一項において，上記第１塗布材料の固形分濃度は，上記第２塗布材料の固形分濃度よりも低いことを特徴とするプリント配線板の製造方法。  6. The method for manufacturing a printed wiring board according to claim 1, wherein the solid content concentration of the first coating material is lower than the solid content concentration of the second coating material. 請求項１〜６のいずれか一項において，上記第１塗布材料の溶媒含有率は，上記第２塗布材料の溶媒含有率よりも大きいことを特徴とするプリント配線板の製造方法。  The method for manufacturing a printed wiring board according to claim 1, wherein the solvent content of the first coating material is larger than the solvent content of the second coating material. 請求項７において，上記第１塗布材料の溶媒含有率は３０体積％以上であり，上記第２塗布材料の溶媒含有率は３０体積％未満であることを特徴とするプリント配線板の製造方法。  8. The method of manufacturing a printed wiring board according to claim 7, wherein the solvent content of the first coating material is 30% by volume or more, and the solvent content of the second coating material is less than 30% by volume.
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