JP4017816B2 - Manufacturing method of plasma display - Google Patents

Description

誘電体ペーストは、塗布後に乾燥・焼成工程を経ると体積収縮が生じるため、これが膜欠陥発生の原因となっている。そのため、ペーストの固形分率を高くすることで、体積収縮を抑え、膜欠陥の発生を抑制している。その結果、誘電体ペーストは、粘度が高く、チキソ性の小さなペーストとなる傾向があり、ペースト内の気泡含有率が多くなり、脱泡処理も困難なものとなっていた。
【００３０】
しかし、このようなペーストでも、前述したように減圧雰囲気中で混練脱泡することにより、従来よりも高い脱泡効果を得られることを、本発明者は見いだした。
【００３１】
なお、図２に、従来のペースト及び減圧攪拌脱泡処理したペーストの粒度分布測定結果を示す。これらの結果より、減圧混練脱泡によって脱泡効果だけでなく高い分散効果も得られることが分かった。
【００３２】
つぎに、本実施の形態の誘電体について説明する。まず、表１に示した気泡含有率の異なるペーストを用いて、ダイコーターにより前面基板に形成された電極を被覆するように塗布した。その後、１００℃で１５分保持後、ピーク温度１３０℃で３０分保持する乾燥工程（図３参照）、及び３００℃で２０分保持後、ピーク温度６００℃で３０分保持する焼成工程（図４参照）を経て、ガラス成分を焼結させることで誘電体層を形成した。なお、図３は誘電体ペーストの乾燥温度プロファイルの説明図であり、図４は誘電体ペーストの焼成温度プロファイルの説明図である。これらの誘電体層の気泡含有率・焼成後の表面粗さＲａ・透過率・耐圧試験結果を、表２に示す。
【００３３】
【表２】

ここで、表２に示されている耐圧試験結果について、詳しく説明する。
【００３４】
耐圧試験については、前面基板１のみで行なった。具体的には、本実施の形態における耐圧試験方法の説明図である図５に示すように、仮りの背面基板電極１１を設け、封入ガス１０を封入して、走査電極４および維持電極５と仮り背面基板電極１１間に電圧を印加して行った。
【００３５】
なお、電圧印加に関しては、次のような手順で行った。まず、ＡＣ耐圧試験として、０Ｖから５００Ｖまで徐々に電圧を印加していき、絶縁破壊が生じれば０Ｖからもう一度やり直すという手法で行い、５００℃に達するまでの絶縁破壊個所数を集計する。次に、ＤＣ耐圧試験として、０Ｖから３０００Ｖまで徐々に電圧を印加していき、ＡＣ耐圧試験の場合と同様に、絶縁破壊が生じれば０Ｖからやり直すという手法で、３０００Ｖに達するまでの絶縁破壊個所数を集計する。
【００３６】
ここに、絶縁破壊がＡＣ耐圧試験で一個所でも生じた場合及びＤＣ耐圧試験の１５００Ｖ未満で一個所でも生じた場合を×とした。また、ＤＣ耐圧試験で１５００Ｖ以上２０００Ｖ未満の範囲で３個所以上生じた場合を△とした。また、ＡＣ耐圧試験で絶縁破壊が生じず、且つ２０００Ｖ未満のＤＣ耐圧試験で絶縁破壊個所が２個所以下であり、全絶縁破壊個所数が８個所以下の場合を合格品○（８個所を超えている場合は△）とした。
【００３７】
表２より、減圧混練脱泡処理したペーストでは、ペースト内の気泡含有量をより少なく出来るため、塗布形成後の誘電体層気泡含有率も小さく出来た。その効果として、誘電体層の表面粗さが小さく、緻密かつ均一な誘電体層を得ることができ、高い絶縁性と高い透過率特性（可視光域での透過率が７０％以上）を兼ね備えた誘電体層を実現できた。また、ペースト内の気泡含有量が最終的に０．３％以下となる場合に、このような傾向は顕著となり、優れた性質を有する誘電体ペーストが得られることがわかった。
【００３８】
（実施の形態２）
本実施の形態２では、ガラス粉末を６５重量部含有し、ペースト内気泡含有率が０．３ｖｏｌ％である、粘度特性の異なるペーストを作製した。ガラス粉末以外の成分に関しては、所望の粘度特性となるよう、バインダ成分・可塑剤成分・溶剤成分を配合した。減圧混練脱泡処理に関しては、前述の本実施の形態１と同様の方法により行った。それらのペーストを用いて、ダイコーターにより、前面基板に形成された電極を被覆するように塗布し、実施の形態１と同様の乾燥・焼成工程を経て、焼成後膜厚４０μｍの誘電体層を形成した。その際のペースト粘度特性に対する塗布性・焼成後表面粗さＲａ・透過率・耐圧試験結果を、表３、４に示す。なお、ダイコーターでの塗布では、通常、せん断速度４（１／ｓ）での粘度を基準としている。
【００３９】
【表３】

【００４０】
【表４】

表３は、チキソインデックス（すなわち、（０．１（１／ｓ）での粘度）／（）１００（１／ｓ）での粘度））３．２のペーストの比較結果であるが、気泡含有率が０．３ｖｏｌ％のペーストでは、４（１／ｓ）での粘度が３５０（Ｐ）以上６５０（Ｐ）以下のペーストを用いて塗布することで、透過率が高く、絶縁性も良好な誘電体層が実現できた。
【００４１】
４（１／ｓ）での粘度が、６５０（Ｐ）よりも高いペーストでは、粘度が高すぎるため塗布性が悪く、塗布後のレベリング性にも不利な状態となった。その結果、表面粗さＲａが悪化することで透過率も低下し、絶縁性も低下した。
【００４２】
４（１／ｓ）での粘度が、３５０未満のペーストでは、粘度が低すぎるためダイコーターで塗布可能な最大膜厚が小さくなり、狙いとする膜厚を得るためには複数回塗布する必要が生じた。なお、薄い膜厚で複数回塗布する手法は、重ね塗りすることで各回で生じる塗布ムラを相殺できるという利点があるが、タクトタイムが増加すると共に、塗布工程内でダスト等の異物が混入する確率も大幅に増加してしまうという問題が生じる。このようなことから、ダイコーターによる塗布では１回の塗布で所望の膜厚を塗布することが望ましく、粘度の低すぎるペーストは好ましくない。
【００４３】
表４は、チキソインデックスの異なるペーストの比較結果であるが、上記のように４（１／ｓ）での粘度が３５０（Ｐ）以上６５０（Ｐ）以下でも、チキソインデックスが異なれば、塗布性・焼成膜表面粗さＲａ・耐圧試験結果が異なる結果となった。
【００４４】
０．１（１／ｓ）での粘度が５００〜１０００（Ｐ）であり、チキソインデックスが５以下のペーストでは、塗布性が良好で、焼成膜表面粗さＲａも小さく、高い透過率及び高い絶縁性能が得られた。
【００４５】
０．１（１／ｓ）での粘度が１０００（Ｐ）よりも高いペーストでは、上記と同様に塗布性が悪く、レベリング性に乏しいペーストとなり、表面粗さＲａが大きく、透過率・絶縁性能が共に低い誘電体層となった。
【００４６】
０．１（１／ｓ）での粘度が１０００（Ｐ）以下であっても、チキソインデックスが５よりも大きなペーストでは、１００（１／ｓ）での粘度が低すぎるため、上記同様、塗布可能な最大膜厚が小さくなり、一度の塗布では所望の膜厚が得られなくなった。その結果、表面粗さ・透過率・耐圧試験結果共に、合格品に比べてやや劣る誘電体層となった。また、せん断速度が大きくなると共に粘度が増加する性質を持つペーストでは、塗布性が非常に悪く、誘電体層としての性能を満たすような膜を塗布することが出来なかった。
【００４７】
以上述べたことから明らかなように、気泡含有率が０．３ｖｏｌ％以下で、せん断速度４（１／ｓ）での粘度が３５０〜６５０（Ｐ）であり、せん断速度０．１（１／ｓ）での粘度が５００〜１０００（１／ｓ）であり、チキソインデックスが５以下であるペーストを塗布形成することで、透過率が高く、絶縁性能に優れた誘電体層を塗布形成することができた。
【００４８】
（実施の形態３）
本実施の形態３では、気泡含有率が０．３ｖｏｌ％であり、ガラス粉末の含有率が異なるペーストを作製した。ここで、それぞれのペーストのチキソインデックスは５以下とした。これらのペーストを用いてダイコーターにより前面基板に形成された電極を被覆するように塗布し、前述の本実施の形態１、２と同様の乾燥・焼成工程を経て、焼成後膜厚４０μｍの誘電体層を形成した。表５に、せん断速度０．１（１／ｓ）での粘度に対しての各ペーストの特性を示す。
【００４９】
【表５】

表５に示されているように、ガラス粉末含有量が５０〜９５ｗｔ％では、せん断速度０．１（１／ｓ）での粘度特性を５００〜１０００（Ｐ）とすることで、塗布形成後の高い透過率と高い絶縁性とを兼ね備えた誘電体層を得ることが出来た。
【００５０】
ガラス粉末の含有率が９５ｗｔ％以上の図中×印のみの場合では、ガラス粉末の含有量が多すぎるため、ペースト化することが不可能であった。
【００５１】
ガラス粉末含有量が９５ｗｔ％以下のペーストで粘度が１００（Ｐ）以下の場合では、粘度が低すぎて最大塗布可能膜厚が小さくなり、膜収縮も大きくなったため、高い透過率及び高い絶縁性を兼ね備えた誘電体層を得ることが出来なかった。また、ガラス粉末含有率が５０ｗｔ％未満となると、膜収縮が非常に大きくなるため焼成後の表面粗さＲａが大きくなり、高い透過率及び高い絶縁性を兼ね備えた誘電体層を得ることが出来ないことがあった。
【００５２】
なお、せん断速度０．１（１／ｓ）での粘度が１０００（Ｐ）を超える場合では、ガラス粉末含有量が５０〜９５ｗｔ％の場合でも、レベリング性が悪くなり、焼成後の表面粗さＲａが大きくなり、透過率及び絶縁性が低下した。
【００５３】
（実施の形態４）
本実施の形態４では、ＰｂＯ、Ｂ_２Ｏ_３、ＳｉＯ_２、ＣａＯの成分を含むガラス粉末を６０重量部と、バインダ成分であるエチルセルロースを６重量部と、可塑剤成分ＤＢＰ（フタル酸ジブチル）を４重量部と、溶剤成分を２５重量部とを３本ロール混練によりペースト化した。その後、更に、溶剤成分を５重量部上記ペーストに加えて、攪拌羽根及び混練用ミキサーを具備するハイビスディスパー（特殊機化（株）製）により、雰囲気圧力を変化させて減圧攪拌脱泡処理した。その際に、溶剤成分として沸点の異なる溶剤を用いた場合の、処理後の溶剤含有量・粘度上昇有無を、表６に示す。
【００５４】
【表６】

表６に示されているように、沸点が１００℃以上の溶剤を用いた場合は、減圧混練脱泡中での溶剤揮発は生じないが、沸点が１００℃未満の溶剤を用いた場合では、減圧混練脱泡中での溶剤揮発により、前述したような塗布性やレベリング性の悪化の原因となるペーストの粘度上昇が生じてしまった。
【００５５】
（実施の形態５）
本実施の形態では、減圧混練脱泡処理を行い、気泡含有率が０．３ｖｏｌ％以下で、せん断速度４（１／ｓ）での粘度が３５０〜６５０（Ｐ）であり、せん断速度０．１（１／ｓ）での粘度が５００〜１０００（１／ｓ）であり、チキソインデックスが５以下であるペーストを用いて誘電体層を塗布形成したプラズマディスプレイを作成した。そして、本実施の形態のプラズマディスプレイと、従来ペーストを用いて誘電体層の塗布形成を行ったプラズマディスプレイとを、透過率及び絶縁耐圧の性能の観点から、それぞれ１００台ずつ評価した。表７に、そのような評価の結果を示す。ここに、透過率は７０％未満を△、７０％以上を○とし、１００台に関する平均値で比較した。また、絶縁耐圧に関しては、上述の本実施の形態１に示した方法により評価し、比較した。
【００５６】
【表７】

表７に示されているように、減圧混練脱泡品により誘電体層を塗布形成することにより、緻密で均一且つ均質な誘電体層を形成でき、高い透過率と高い絶縁性能を兼ね備えたプラズマディスプレイを得ることができた。
【００５７】
なお、上述された本実施の形態では、混練処理によるペースト化を行った後に、減圧下での混練を行いながら脱泡処理を行ったが、これに限らず、大気圧未満の雰囲気圧力の下でペースト化を行うことでも同様の効果が得られる。要するに、混練処理および／または混練処理後の脱泡処理を、大気圧未満の雰囲気圧力の下で行えばよい。
【００５８】
また、雰囲気圧力と、混練処理および／または脱泡処理を行う処理時間とは、誘電体ペーストの気泡含有率が０．３ｖｏｌ％以下となるような調整を行われればよい。なお、たとえば表１からも明らかなように、雰囲気圧力が低いほど処理時間を短くすることができるという利点があるが、低い雰囲気圧力を実現しようとするほど、大きな設備投資が必要になる。
【００５９】
ただし、表１からもわかるように、ペースト内の気泡含有量が０．３％以下となることが必ずしも要求されない場合にも、減圧混練脱泡処理を行うことにより、処理時間を短くすることができる。たとえば、雰囲気圧力を大気圧程度の１０１．３ｋＰａとして従来のような脱泡処理を行えば、気泡含有率を０．３８ｖｏｌ％とするのに２０分かかってしまうが、雰囲気圧力を９３．３ｋＰａとして脱泡処理を行えば、気泡含有率を０．３８ｖｏｌ％とするのに５分しかかからない。したがって、従来の気泡含有量を有するペーストを製造する場合にも、大気圧未満の雰囲気圧力の下で脱泡処理を行うことにより、望ましい効果が得られるといえる。もちろん、同じ理由により、従来の気泡含有量を有するペーストを製造する場合に、大気圧未満の雰囲気圧力の下で混練処理を行ってもよいことはいうまでもない。
【００６０】
また、上述された本実施の形態では、バインダ成分をエチルセルロース、可塑剤成分をＤＢＰ、溶剤成分をαテルピネオールとＢＣＡとしたが、これに限らず、異なるバインダ成分、可塑剤成分、溶剤成分を用いた場合でも同様の効果が得られる
また、上述された本実施の形態で述べた効果が得られるバインダ成分の一例としては、エチルセルロース、カルボキシメチルセルロース、ポリビニルブチラール、アクリル樹脂等が挙げられる。
【００６１】
また、減圧混練脱泡処理する設備に関しても、上述された本実施の形態では、ハイビスディスパー（特殊機化（株）製）を用いたが、これに限らず、減圧雰囲気中でペーストにせん断力を加えられる設備であれば同等の効果が得られる。
【００６２】
また、本発明に関連する発明の誘電体は、上述した本実施の形態においては、１００℃で１５分保持後、ピーク温度１３０℃で３０分保持する乾燥工程、および３００℃で２０分保持後、ピーク温度６００℃で３０分保持する焼成工程を経て、ガラス成分を焼結させられた。しかし、これに限らず、本発明に関連する発明の誘電体は、ピーク温度１５０℃以下の乾燥工程、およびピーク温度６５０℃以下の焼成工程を経て、ガラス成分を焼結させられればよい。なお、ピーク温度１５０℃を越える乾燥工程を経ると、ペースト内に含まれる可塑剤、溶剤、樹脂の成分が必要以上に揮発してしまい、膜としての可塑性が失われ、後工程におけるひび割れなどの膜欠陥が生じやすくなる。また、ピーク温度６５０℃を越える焼成工程を経ると、ペースト内に含まれる成分と電極材料との反応が生じ、変色などの問題が発生しやすくなる。このような理由により、ピーク温度１５０℃以下の乾燥工程、およびピーク温度６５０℃以下の焼成工程を経て、ガラス成分を焼結させることが望ましい。
【００６３】
また、本実施の形態では１種類の沸点が１００℃以上の溶剤のみを加える場合について述べたが、これに限らず、複数の、沸点が１００℃以上３００℃未満の溶剤を組み合わせて加えた場合でも、同様の効果が得られる。なお、沸点が１００℃未満の溶剤を組み合わせた場合には、前述したように、減圧混練脱泡中での溶剤揮発により、塗布性やレベリング性の悪化の原因となるペーストの粘度上昇が生じるという問題が発生する。また、沸点が３００℃以上の溶剤を組み合わせた場合には、乾燥工程での所要時間が長くなり、乾燥炉の炉長が長くなってしまうという問題が発生し、乾燥時間が長くなることで、異物などの混入確率も増大してしまう。このような理由により、溶剤の沸点は１００℃以上３００℃未満であることが望ましい。
【００６４】
また、本実施の形態で述べた効果が得られる溶剤成分の一例としては、ＢＣＡ、αテルピネオール、炭酸ジエチル、シュウ酸ジエチル、酢酸−ｎブチル、ジアセトンアルコール、シクロヘキサノン、メチルセルゾルブ、エチルセルゾルブ、ブチルセルゾルブ、ｎ−ブタノール、イソブタノール、ベンジルアルコール、カルビトール、ブチルカルビトール、カルビトールアセテート、セロソルブアセテート、ブチルセロソルブアセテート、ジエチルカルビトール、トルエン、キシレンが挙げられる。
【００６５】
以上述べたところから明らかなように、本発明に関連する発明は、たとえば、ガラス粉末を５０〜９５重量部と、バインダ、可塑剤、溶剤の内の少なくとも一つ以上からなる成分を１〜５０重量部含み、気泡含有率が０．３ｖｏｌ％以下で、せん断速度４（１／ｓ）の場合の粘度が３５０〜６５０（Ｐ）であることを特徴とする誘電体ペーストである。
【００６６】
また、本発明に関連する発明は、たとえば、せん断速度０．１（１／ｓ）の場合の粘度が５００〜１０００（１／ｓ）であり、チキソインデックス（０．１（１／ｓ）での粘度／１００（１／ｓ）での粘度）が５以下であることを特徴とする上記に記載の誘電体ペーストである。
【００６７】
また、本発明に関連する発明は、たとえば、沸点が１００℃以上３００℃未満の少なくとも１種類以上の溶剤成分を１〜５０重量部含めて混練することを特徴とする上記いずれかに記載の誘電体ペーストである。
【００６８】
また、本発明に関連する発明は、たとえば、ガラス粉末、バインダ、可塑剤、溶剤の内の少なくとも一つ以上の成分を圧力が０．１３３ｋＰａ以上１０１．３ｋＰａ未満の雰囲気中で分散・混練処理することを特徴とする上記いずれかに記載の誘電体ペーストの製造方法である。
【００６９】
また、本発明に関連する発明は、たとえば、ガラス粉末、バインダ、可塑剤、溶剤の内の少なくとも一つ以上の成分を分散・混練処理後に圧力が０．１３３ｋＰａ以上１０１．３ｋＰａ未満の雰囲気中で脱泡処理することを特徴とする上記のいずれかに記載の誘電体ペーストの製造方法である。
【００７０】
また、本発明に関連する発明は、たとえば、攪拌機又は分散機により、誘電体ペーストにせん断力を与えながら脱泡処理することを特徴とする上記に記載の誘電体ペーストの製造方法である。
【００７１】
また、本発明に関連する発明は、たとえば、気泡含有率が３０％以下で、ＰｂＯ、Ｂ_２Ｏ_３、ＳｉＯ_２、ＣａＯの少なくとも一つ以上の成分を含有し、可視光域での透過率が７０％以上で、膜として形成されていることを特徴とする誘電体である。
【００７２】
また、本発明に関連する発明は、たとえば、上記に記載の誘電体ペーストを塗布して形成することを特徴とする上記に記載の誘電体である。
【００７３】
また、本発明に関連する発明は、たとえば、ピーク温度１５０℃以下の乾燥工程後、ピーク温度６５０℃以下の焼成工程を経てガラス成分を焼結させることを特徴とする上記に記載の誘電体の製造方法である。
【００７４】
また、本発明に関連する発明は、たとえば、放電空間を介して対向配置された一対の基板を有し、前面基板に形成された電極を被覆するよう上記に記載の誘電体を形成した構造をもつことを特徴とするプラズマディスプレイである。
【００７５】
また、本発明は、たとえば、ピーク温度１５０℃以下の乾燥工程後、ピーク温度６５０℃以下の焼成工程を経てガラス成分を焼結させて誘電体を形成することを特徴とする上記に記載のプラズマディスプレイの製造方法である。
【００７６】
【発明の効果】
以上の説明から明らかなように、本発明は、気泡含有量の少ない誘電体ペーストを利用する、プラズマディスプレイの製造方法を提供することができるという長所を有する。
【図面の簡単な説明】
【図１】従来のＰＤＰの構造断面図
【図２】本発明の実施の形態１における誘電体ペーストの粒度分布測定結果の説明図
【図３】本発明の実施の形態１における誘電体ペーストの乾燥温度プロファイルの説明図
【図４】本発明の実施の形態１における誘電体ペーストの焼成温度プロファイルの説明図
【図５】本発明の実施の形態１における耐圧試験方法の説明図
【符号の説明】
１ 前面基板
２ 背面基板
３ 誘電体
４ 走査電極
５ 維持電極
６ 保護層
７ アドレス電極
８ リブ
９ 蛍光層
１０ 封入ガス
１１ 仮り背面版電極[0001]
BACKGROUND OF THE INVENTION
  The present invention is used for, for example, a plasma display panel (PDP).,The present invention relates to a method for manufacturing a plasma display.
[0002]
[Prior art]
Conventionally, as a method for producing a PDP, for example, a method described in JP-A-8-162027 is known.
[0003]
First, the configuration of the conventional PDP will be described with reference to FIG. 1 which is a configuration diagram of the conventional PDP.
[0004]
In FIG. 1, 1 is a front substrate, 2 is a back substrate, 3 is a dielectric, 4 is a scan electrode (with a transparent electrode), 5 is a sustain electrode (with a transparent electrode), 6 is a protective layer, 7 is an address electrode, 8 Is a rib, and 9 is a fluorescent layer.
[0005]
The front substrate 1 and the rear substrate 2 are bonded to each other by a seal layer, and a gas for generating ultraviolet rays during discharge is sealed in the two bonded substrates after being evacuated. In addition, by applying a voltage to the discharge space, ultraviolet rays are generated from the sealed gas, and the ultraviolet rays thus generated strike the fluorescent layer 9 to emit light, thereby obtaining an image.
[0006]
The above configuration is a three-phase electrode, surface discharge type, and is generally classified as a reflective color PDP.
[0007]
The required conditions for the dielectric layer covering the electrode are that the electrode is uniformly and densely coated, has high transmittance and insulation, has a smooth surface and uniform discharge characteristics. It can be obtained, the surface is formed of a protective material, the surface material is low in driving voltage, and the like.
[0008]
In order to satisfy the above conditions, an oxide glass (hereinafter referred to as glass) material is preferably used. Film formation is facilitated by using glass powder, and the denseness, uniformity and homogeneity of the dielectric layer can be improved by melting glass. As for the surface protective material, since there is no glass material that can obtain sufficient characteristics, a material such as MgO is formed by thin film technology such as vapor deposition or sputtering.
[0009]
Specifically, the dielectric layer is first formed by dispersing and kneading glass powder, a binder, a plasticizer, a solvent, and the like, and then applying and forming the paste by a printing method or a coating method using a nozzle. Then, a dielectric material layer is obtained by sintering glass through a drying process and a baking process.
[0010]
[Problems to be solved by the invention]
However, in the conventional dielectric paste, the bubble content is as high as 0.35 to 0.5 vol%, so that it is easy to cause foam biting at the time of application, and it is possible to realize a uniform and uniform dielectric layer and to achieve a high yield. There was a problem that it was difficult to realize. In the case of dielectric paste with a high bubble content, the film shrinkage rate in the film surface in the drying and firing processes becomes non-uniform, so that specific and minute defects are likely to occur after firing, and high insulation properties. It was difficult to get.
[0011]
  The present invention takes the above-described conventional problems into consideration, for example, a dielectric paste having a low bubble content.Use,TheA method for manufacturing a laser display is provided.
[0012]
[Means for Solving the Problems]
FirstoneThe present invention is(1) PbO, B ₂ O ₃ , SiO ₂ And glass powder containing at least one component of CaO, a binder, a plasticizer, and a solvent. (2) The weight part of the glass powder is 50 to 95 parts by weight, and (3) The part by weight of the solvent is 1 to 50 parts by weight. (4) The viscosity at a shear rate of 4 (1 / s) is 350 to 650 (P). (5) Shear rate of 0.1 (1 / S), the viscosity is 500 to 1000 (P), and (6) (viscosity at a shear rate of 0.1 (1 / s)) / (viscosity at a shear rate of 100 (1 / s)) The thixo index defined as is a method of manufacturing a plasma display using a dielectric paste, which is 5 or less,
The dielectric paste is manufactured by kneading the glass powder, the binder, the plasticizer, and the solvent, and after the kneading process, adding 5 parts by weight of the solvent and stirring. A dielectric paste manufacturing process;
Using the manufactured dielectric paste, forming a dielectric so as to cover an electrode formed on the front substrate disposed opposite to the rear substrate through a discharge space; and
With
The defoaming process is performed over a predetermined time corresponding to the predetermined atmospheric pressure under a predetermined atmospheric pressure,
The predetermined atmospheric pressure is 93.3 kPa,
  The predetermined time according to the predetermined atmospheric pressure is 40 minutes.TheThis is a method for manufacturing a laser display.
  FirsttwoThe present invention is(1) PbO, B ₂ O ₃ , SiO ₂ And glass powder containing at least one component of CaO, a binder, a plasticizer, and a solvent. (2) The weight part of the glass powder is 50 to 95 parts by weight, and (3) The part by weight of the solvent is 1 to 50 parts by weight. (4) The viscosity at a shear rate of 4 (1 / s) is 350 to 650 (P). (5) Shear rate of 0.1 (1 / S), the viscosity is 500 to 1000 (P), and (6) (viscosity at a shear rate of 0.1 (1 / s)) / (viscosity at a shear rate of 100 (1 / s)) The thixo index defined as is a method of manufacturing a plasma display using a dielectric paste, which is 5 or less,
The dielectric paste is manufactured by kneading the glass powder, the binder, the plasticizer, and the solvent, and after the kneading process, adding 5 parts by weight of the solvent and stirring. A dielectric paste manufacturing process;
Using the manufactured dielectric paste, forming a dielectric so as to cover an electrode formed on the front substrate disposed opposite to the rear substrate through a discharge space; and
With
The defoaming process is performed over a predetermined time corresponding to the predetermined atmospheric pressure under a predetermined atmospheric pressure,
The predetermined atmospheric pressure is 13.3 kPa,
  The predetermined time according to the predetermined atmospheric pressure is 30 minutes.TheThis is a method for manufacturing a laser display.
  FirstthreeThe present invention is(1) PbO, B ₂ O ₃ , SiO ₂ And glass powder containing at least one component of CaO, a binder, a plasticizer, and a solvent. (2) The weight part of the glass powder is 50 to 95 parts by weight, and (3) The part by weight of the solvent is 1 to 50 parts by weight. (4) The viscosity at a shear rate of 4 (1 / s) is 350 to 650 (P). (5) Shear rate of 0.1 (1 / S), the viscosity is 500 to 1000 (P), and (6) (viscosity at a shear rate of 0.1 (1 / s)) / (viscosity at a shear rate of 100 (1 / s)) The thixo index defined as is a method of manufacturing a plasma display using a dielectric paste, which is 5 or less,
The dielectric material is formed by subjecting the glass powder, the binder, the plasticizer, and the solvent to a kneading process, and after the kneading process, adding 5 parts by weight of the solvent and stirring. A dielectric paste manufacturing process for manufacturing a paste;
Using the manufactured dielectric paste, forming a dielectric so as to cover an electrode formed on the front substrate disposed opposite to the rear substrate through a discharge space; and
With
The defoaming process is performed over a predetermined time corresponding to the predetermined atmospheric pressure under a predetermined atmospheric pressure,
The predetermined atmospheric pressure is 0.1 kPa,
  The predetermined time according to the predetermined atmospheric pressure is 20 minutes.TheThis is a method for manufacturing a laser display.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments according to the present invention will be described with reference to the drawings.
[0026]
(Embodiment 1)
First, the dielectric paste of the first embodiment will be described. First, PbO, B₂O₃, SiO₂, 60 parts by weight of glass powder containing CaO component (ie, wt%), 6 parts by weight of ethyl cellulose as a binder component, 4 parts by weight of plasticizer component DBP (dibutyl phthalate), and α as a solvent component 15 parts by weight of terpineol and 10 parts by weight of BCA (EP diethylene glycol mono-n-butyl ether) were dispersed and kneaded by three-roll kneading to form a paste.
[0027]
Thereafter, 5 parts by weight of BCA (EP diethylene glycol mono-n-butyl ether) is added to the above paste, and the atmospheric pressure is increased by a hibis disperser (manufactured by Special Machine Co., Ltd.) equipped with a stirring blade and a mixer for kneading. The deaeration treatment was performed by changing the pressure to less than atmospheric pressure and stirring under reduced pressure.
[0028]
Table 1 shows the bubble content with respect to the reduced pressure stirring and defoaming treatment time of the atmospheric pressure in that case. Here, the viscosity of the paste was 800 (P) at a shear rate of 0.1 (1 / s), 500 (P) at 4 (1 / s), and 250 (P) at 100 (1 / s). In addition, NV (Non-Volatile) represents a non-volatile component and means the solid content rate.
[0029]
[Table 1]

Since the dielectric paste undergoes volume shrinkage after a drying / firing process after coating, this causes film defects. Therefore, by increasing the solid content rate of the paste, volume shrinkage is suppressed and the occurrence of film defects is suppressed. As a result, the dielectric paste tends to be a paste having a high viscosity and a small thixotropy, the bubble content in the paste is increased, and the defoaming treatment is difficult.
[0030]
However, the present inventors have found that even such a paste can obtain a higher defoaming effect than before by kneading and defoaming in a reduced pressure atmosphere as described above.
[0031]
In addition, in FIG. 2, the particle size distribution measurement result of the conventional paste and the paste which carried out pressure reduction stirring defoaming processing is shown. From these results, it was found that not only the defoaming effect but also a high dispersion effect can be obtained by the vacuum kneading defoaming.
[0032]
Next, the dielectric according to the present embodiment will be described. First, pastes having different bubble contents shown in Table 1 were applied so as to cover the electrodes formed on the front substrate with a die coater. Then, after holding at 100 ° C. for 15 minutes, a drying step (see FIG. 3) for holding at a peak temperature of 130 ° C. for 30 minutes, and a firing step for holding at 300 ° C. for 20 minutes and then holding at a peak temperature of 600 ° C. for 30 minutes (FIG. 4). The dielectric layer was formed by sintering the glass component. FIG. 3 is an explanatory diagram of the drying temperature profile of the dielectric paste, and FIG. 4 is an explanatory diagram of the firing temperature profile of the dielectric paste. Table 2 shows the bubble content, firing surface roughness Ra, transmittance, and pressure resistance test results of these dielectric layers.
[0033]
[Table 2]

Here, the breakdown voltage test results shown in Table 2 will be described in detail.
[0034]
The pressure resistance test was performed only on the front substrate 1. Specifically, as shown in FIG. 5, which is an explanatory diagram of the withstand voltage test method in the present embodiment, a provisional back substrate electrode 11 is provided, sealed gas 10 is sealed, and scan electrode 4 and sustain electrode 5 This was performed by applying a voltage between the temporary back substrate electrode 11.
[0035]
The voltage application was performed according to the following procedure. First, as an AC withstand voltage test, a voltage is gradually applied from 0 V to 500 V, and if dielectric breakdown occurs, it is performed again from 0 V, and the number of dielectric breakdown points until reaching 500 ° C. is counted. Next, as a DC withstand voltage test, a voltage is gradually applied from 0 V to 3000 V, and in the same manner as in the AC withstand voltage test, if a breakdown occurs, the method starts over from 0 V, and the breakdown until 3000 V is reached. Aggregate the number of locations.
[0036]
Here, the case where dielectric breakdown occurred even at one location in the AC breakdown voltage test and the case where breakdown occurred even at one location at less than 1500 V in the DC breakdown voltage test were evaluated as x. Moreover, it was set as (triangle | delta) when the three or more places generate | occur | produced in the range of 1500V or more and less than 2000V in a DC pressure | voltage resistant test. In addition, when AC breakdown test does not cause dielectric breakdown, and DC breakdown voltage test of less than 2000V, the number of breakdown points is 2 or less, and the total number of breakdown points is 8 or less. △).
[0037]
From Table 2, in the paste subjected to the vacuum kneading and defoaming treatment, the bubble content in the paste can be further reduced, and therefore the dielectric layer bubble content after the formation of the coating can be reduced. The effect is that the dielectric layer has a small surface roughness and a dense and uniform dielectric layer can be obtained, which has both high insulation and high transmittance characteristics (transmittance in the visible light range of 70% or more). Dielectric layer can be realized. Further, it was found that when the bubble content in the paste finally becomes 0.3% or less, such a tendency becomes remarkable and a dielectric paste having excellent properties can be obtained.
[0038]
(Embodiment 2)
In the second embodiment, pastes with different viscosity characteristics, containing 65 parts by weight of glass powder and a bubble content in the paste of 0.3 vol%, were produced. Regarding components other than glass powder, a binder component, a plasticizer component, and a solvent component were blended so as to obtain desired viscosity characteristics. The decompression kneading defoaming process was performed by the same method as in the first embodiment. Using these pastes, a die coater was applied so as to cover the electrodes formed on the front substrate, and after a drying and firing process similar to that of the first embodiment, a dielectric layer having a thickness of 40 μm after firing was formed. Formed. Tables 3 and 4 show the coating properties, post-baking surface roughness Ra, transmittance, and pressure resistance test results for the paste viscosity characteristics at that time. In the application with a die coater, the viscosity at a shear rate of 4 (1 / s) is usually used as a reference.
[0039]
[Table 3]

[0040]
[Table 4]

Table 3 shows the results of comparison of the thixo index (ie, (viscosity at 0.1 (1 / s)) / () viscosity at 100 (1 / s))) 3.2, but containing bubbles When the paste with a rate of 0.3 vol% is applied using a paste having a viscosity at 4 (1 / s) of 350 (P) or more and 650 (P) or less, the transmittance is high and the insulation is also good. A dielectric layer was realized.
[0041]
In the paste having a viscosity at 4 (1 / s) higher than 650 (P), the viscosity was too high, the coating property was poor, and the leveling property after coating was in a disadvantageous state. As a result, the surface roughness Ra was deteriorated, so that the transmittance was also lowered and the insulating property was also lowered.
[0042]
For pastes with a viscosity at 4 (1 / s) of less than 350, the viscosity is too low, so the maximum film thickness that can be applied with a die coater is reduced, and multiple coatings are required to obtain the desired film thickness. Occurred. Note that the method of applying multiple times with a thin film thickness has the advantage that the coating unevenness that occurs each time can be offset by overcoating, but the tact time is increased and foreign substances such as dust are mixed in the application process. There arises a problem that the probability is greatly increased. For this reason, it is desirable to apply a desired film thickness by a single application in the application with a die coater, and a paste with too low a viscosity is not preferable.
[0043]
Table 4 shows a comparison result of pastes having different thixo indices. As described above, even when the viscosity at 4 (1 / s) is 350 (P) or more and 650 (P) or less, the coating properties are different if the thixo index is different. -The fired film surface roughness Ra and the pressure resistance test result were different.
[0044]
A paste having a viscosity at 0.1 (1 / s) of 500 to 1000 (P) and a thixo index of 5 or less has good coatability, a small surface roughness Ra of the fired film, high transmittance and high Insulation performance was obtained.
[0045]
A paste having a viscosity at 0.1 (1 / s) higher than 1000 (P) has poor coating properties and poor leveling properties, as described above, and has a high surface roughness Ra, high transmittance and insulation performance. Are both low dielectric layers.
[0046]
Even when the viscosity at 0.1 (1 / s) is 1000 (P) or less, the viscosity at 100 (1 / s) is too low for a paste having a thixo index greater than 5, so that the coating is applied as described above. The maximum possible film thickness became smaller, and the desired film thickness could not be obtained with a single coating. As a result, the surface roughness, transmittance, and pressure resistance test results were all slightly inferior to the acceptable products. Also, the paste having the property that the viscosity increases as the shear rate increases, the applicability is very poor, and a film satisfying the performance as a dielectric layer cannot be applied.
[0047]
As is clear from the above description, the bubble content is 0.3 vol% or less, the viscosity at a shear rate of 4 (1 / s) is 350 to 650 (P), and the shear rate of 0.1 (1 / By applying and forming a paste having a viscosity at s) of 500 to 1000 (1 / s) and a thixo index of 5 or less, a dielectric layer having high transmittance and excellent insulating performance is applied and formed. I was able to.
[0048]
(Embodiment 3)
In the third embodiment, pastes having a bubble content of 0.3 vol% and different glass powder contents were prepared. Here, the thixo index of each paste was 5 or less. Using these pastes, a die coater is applied so as to cover the electrodes formed on the front substrate, and after the same drying and baking processes as those of the first and second embodiments, a post-baking film thickness of 40 μm is obtained. A body layer was formed. Table 5 shows the characteristics of each paste with respect to the viscosity at a shear rate of 0.1 (1 / s).
[0049]
[Table 5]

As shown in Table 5, when the glass powder content is 50 to 95 wt%, the viscosity characteristic at a shear rate of 0.1 (1 / s) is set to 500 to 1000 (P). It was possible to obtain a dielectric layer having both high transmittance and high insulation.
[0050]
In the case where the glass powder content was 95 wt% or more and only the x mark in the figure, the glass powder content was too high, and it was impossible to make a paste.
[0051]
When the glass powder content is 95 wt% or less and the viscosity is 100 (P) or less, the viscosity is too low, the maximum coatable film thickness is reduced, and the film shrinkage is increased, resulting in high transmittance and high insulation. It was not possible to obtain a dielectric layer having both. Further, when the glass powder content is less than 50 wt%, the film shrinkage becomes very large, so that the surface roughness Ra after firing becomes large, and a dielectric layer having high transmittance and high insulation can be obtained. There was nothing.
[0052]
In addition, when the viscosity at a shear rate of 0.1 (1 / s) exceeds 1000 (P), even when the glass powder content is 50 to 95 wt%, the leveling property is deteriorated, and the surface roughness after firing. Ra became large and the transmittance | permeability and insulation fell.
[0053]
(Embodiment 4)
In the fourth embodiment, PbO, B₂O₃, SiO₂, 60 parts by weight of glass powder containing CaO component, 6 parts by weight of ethyl cellulose as a binder component, 4 parts by weight of plasticizer component DBP (dibutyl phthalate), and 25 parts by weight of solvent component A paste was formed by roll kneading. Thereafter, 5 parts by weight of the solvent component was further added to the above paste, and the mixture was stirred and defoamed under reduced pressure by changing the atmospheric pressure with a hibis disperser (manufactured by Special Machine Co., Ltd.) equipped with a stirring blade and a mixer for kneading. . Table 6 shows the solvent content and the presence / absence of viscosity increase after treatment when solvents having different boiling points are used as solvent components.
[0054]
[Table 6]

As shown in Table 6, when a solvent having a boiling point of 100 ° C. or higher is used, solvent volatilization does not occur during decompression kneading and defoaming, but when a solvent having a boiling point of less than 100 ° C. is used, Due to solvent volatilization during decompression kneading and defoaming, the increase in the viscosity of the paste causing the deterioration of the coating property and leveling property as described above has occurred.
[0055]
(Embodiment 5)
In this embodiment, vacuum kneading defoaming treatment is performed, the bubble content is 0.3 vol% or less, the viscosity at a shear rate of 4 (1 / s) is 350 to 650 (P), and the shear rate of 0. A plasma display in which a dielectric layer was applied and formed using a paste having a viscosity at 1 (1 / s) of 500 to 1000 (1 / s) and a thixo index of 5 or less was prepared. Then, 100 plasma displays according to the present embodiment and 100 plasma displays each having a dielectric layer coated and formed using a conventional paste were evaluated from the viewpoint of transmittance and withstand voltage performance. Table 7 shows the results of such evaluation. Here, the transmittance was Δ for less than 70%, and ○ for 70% or more, and the average values for 100 units were compared. In addition, the dielectric strength was evaluated and compared by the method described in the first embodiment.
[0056]
[Table 7]

As shown in Table 7, a dense, uniform and homogeneous dielectric layer can be formed by applying and forming a dielectric layer using a vacuum-kneaded defoamed product, and has a high transmittance and high insulation performance. I was able to get a display.
[0057]
In the above-described embodiment, the defoaming process is performed while performing the kneading process under reduced pressure after the pasting process by the kneading process. However, the present invention is not limited to this. The same effect can also be obtained by pasting with. In short, the kneading treatment and / or the defoaming treatment after the kneading treatment may be performed under an atmospheric pressure less than atmospheric pressure.
[0058]
Further, the atmospheric pressure and the processing time for performing the kneading process and / or the defoaming process may be adjusted so that the bubble content of the dielectric paste is 0.3 vol% or less. For example, as is clear from Table 1, there is an advantage that the processing time can be shortened as the atmospheric pressure is lower. However, as the atmospheric pressure is reduced, a larger capital investment is required.
[0059]
However, as can be seen from Table 1, even when the bubble content in the paste is not necessarily 0.3% or less, the processing time can be shortened by performing the reduced pressure kneading defoaming treatment. it can. For example, if the conventional defoaming process is performed at an atmospheric pressure of 101.3 kPa of about atmospheric pressure, it takes 20 minutes to set the bubble content to 0.38 vol%, but the atmospheric pressure is set to 93.3 kPa. If defoaming is performed, it takes only 5 minutes to bring the bubble content to 0.38 vol%. Therefore, even when producing a conventional paste having a bubble content, it can be said that a desired effect can be obtained by performing the defoaming treatment under an atmospheric pressure of less than atmospheric pressure. Of course, for the same reason, it goes without saying that the kneading treatment may be performed under an atmospheric pressure of less than atmospheric pressure when producing a conventional paste having a bubble content.
[0060]
In this embodiment described above, the binder component is ethyl cellulose, the plasticizer component is DBP, and the solvent component is α-terpineol and BCA. However, the present invention is not limited to this, and different binder components, plasticizer components, and solvent components are used. The same effect can be obtained even if
Examples of the binder component that can achieve the effects described in the above-described embodiment include ethyl cellulose, carboxymethyl cellulose, polyvinyl butyral, and an acrylic resin.
[0061]
In addition, regarding the equipment for defoaming and defoaming treatment, in the above-described embodiment, Hibis Disper (manufactured by Special Machine Co., Ltd.) is used. The same effect can be obtained with equipment that can be added.
[0062]
  In addition, the present inventionInventions related toIn the present embodiment described above, the dielectric is held at 100 ° C. for 15 minutes, then at a peak temperature of 130 ° C. for 30 minutes, and at 300 ° C. for 20 minutes, then at a peak temperature of 600 ° C. for 30 minutes. The glass component was sintered through the holding baking process. However, the present invention is not limited to this.Inventions related toThe dielectric material may be sintered through a drying step having a peak temperature of 150 ° C. or lower and a firing step having a peak temperature of 650 ° C. or lower. In addition, after passing through a drying step exceeding a peak temperature of 150 ° C., the plasticizer, solvent, and resin components contained in the paste volatilize more than necessary, and the plasticity as a film is lost. Film defects are likely to occur. In addition, when the baking process exceeds the peak temperature of 650 ° C., a reaction between the component contained in the paste and the electrode material occurs, and problems such as discoloration tend to occur. For these reasons, it is desirable to sinter the glass component through a drying step having a peak temperature of 150 ° C. or lower and a firing step having a peak temperature of 650 ° C. or lower.
[0063]
In this embodiment, the case where only one kind of solvent having a boiling point of 100 ° C. or higher is added. However, the present invention is not limited to this, and a plurality of solvents having a boiling point of 100 ° C. or higher and lower than 300 ° C. However, the same effect can be obtained. In addition, when a solvent having a boiling point of less than 100 ° C. is combined, as described above, the solvent volatilization during decompression kneading and defoaming causes an increase in the viscosity of the paste that causes deterioration in coating properties and leveling properties. A problem occurs. In addition, when a solvent having a boiling point of 300 ° C. or more is combined, the time required for the drying process becomes long, the problem that the furnace length of the drying furnace becomes long, and the drying time becomes long, The probability of contamination such as foreign matter also increases. For these reasons, the boiling point of the solvent is desirably 100 ° C. or higher and lower than 300 ° C.
[0064]
Examples of solvent components that can achieve the effects described in this embodiment include BCA, α-terpineol, diethyl carbonate, diethyl oxalate, n-butyl acetate, diacetone alcohol, cyclohexanone, methyl cellosolve, ethyl cellosolve, and butylcellosolve. N-butanol, isobutanol, benzyl alcohol, carbitol, butyl carbitol, carbitol acetate, cellosolve acetate, butyl cellosolve acetate, diethyl carbitol, toluene, xylene.
[0065]
  As is clear from the above description, the present inventionInventions related toContains, for example, 50 to 95 parts by weight of glass powder and 1 to 50 parts by weight of a component consisting of at least one of a binder, a plasticizer, and a solvent. The dielectric paste is characterized in that the viscosity at a speed of 4 (1 / s) is 350 to 650 (P).
[0066]
  In addition, the present inventionInventions related toFor example, the viscosity at a shear rate of 0.1 (1 / s) is 500 to 1000 (1 / s), and the thixo index (viscosity at 0.1 (1 / s) / 100 (1 / s) )) Is a dielectric paste as described above, wherein the viscosity is 5 or less.
[0067]
  In addition, the present inventionInventions related toIs a dielectric paste according to any one of the above, wherein 1 to 50 parts by weight of at least one solvent component having a boiling point of 100 ° C. or higher and lower than 300 ° C. is kneaded.
[0068]
  In addition, the present inventionInventions related toAny of the above, characterized in that, for example, at least one component of glass powder, binder, plasticizer, and solvent is dispersed and kneaded in an atmosphere having a pressure of 0.133 kPa or more and less than 101.3 kPa. A method for producing a dielectric paste as described in 1. above.
[0069]
  In addition, the present inventionInventions related toIs characterized in that, for example, at least one component of glass powder, binder, plasticizer, and solvent is subjected to defoaming treatment in an atmosphere having a pressure of 0.133 kPa or more and less than 101.3 kPa after dispersion / kneading treatment. A dielectric paste manufacturing method according to any one of the above.
[0070]
  In addition, the present inventionInventions related toIs a method for producing a dielectric paste as described above, wherein the defoaming treatment is performed while applying a shearing force to the dielectric paste by, for example, a stirrer or a disperser.
[0071]
  In addition, the present inventionInventions related toFor example, when the bubble content is 30% or less, PbO, B₂O₃, SiO₂, A dielectric containing at least one component of CaO, having a transmittance in the visible light region of 70% or more and being formed as a film.
[0072]
  In addition, the present inventionInventions related toIs the dielectric described above, which is formed by applying the dielectric paste described above, for example.
[0073]
  In addition, the present inventionInventions related toIs a method for producing a dielectric as described above, wherein the glass component is sintered after a drying step having a peak temperature of 150 ° C. or lower and then a firing step having a peak temperature of 650 ° C. or lower.
[0074]
  In addition, the present inventionInventions related toHas a structure in which the above-described dielectric is formed so as to cover the electrodes formed on the front substrate, for example, having a pair of substrates arranged opposite to each other via a discharge space It is.
[0075]
In addition, the present invention is characterized in that, for example, the dielectric material is formed by sintering a glass component through a baking step having a peak temperature of 650 ° C. or lower after a drying step having a peak temperature of 150 ° C. or lower. A display manufacturing method.
[0076]
【The invention's effect】
  As is apparent from the above description, the present invention provides a dielectric paste with a low bubble content.Use,TheIt has an advantage that a method for manufacturing a laser display can be provided.
[Brief description of the drawings]
FIG. 1 is a sectional view of a structure of a conventional PDP
FIG. 2 is an explanatory diagram of the particle size distribution measurement result of the dielectric paste in the first embodiment of the present invention.
FIG. 3 is an explanatory diagram of a drying temperature profile of the dielectric paste in the first embodiment of the present invention.
FIG. 4 is an explanatory diagram of a firing temperature profile of the dielectric paste in the first embodiment of the present invention.
FIG. 5 is an explanatory diagram of a pressure resistance test method according to the first embodiment of the present invention.
[Explanation of symbols]
1 Front substrate
2 Back substrate
3 Dielectric
4 Scanning electrodes
5 Maintenance electrode
6 Protective layer
7 Address electrodes
8 Ribs
9 Fluorescent layer
10 Filled gas
11 Temporary backside electrode

Claims (3)

(1) glass powder containing at least one component of PbO, B ₂ O ₃ , SiO ₂ and CaO, a binder, a plasticizer, and a solvent, (2) parts by weight of the glass powder are: 50 to 95 parts by weight, (3) the solvent is 1 to 50 parts by weight, and (4) the viscosity at a shear rate of 4 (1 / s) is 350 to 650 (P). Yes, (5) The viscosity at a shear rate of 0.1 (1 / s) is 500 to 1000 (P), and (6) (viscosity at a shear rate of 0.1 (1 / s)) / ( The thixo index defined as the viscosity at a shear rate of 100 (1 / s) is a manufacturing method of a plasma display using a dielectric paste, which is 5 or less,
The dielectric paste is manufactured by kneading the glass powder, the binder, the plasticizer, and the solvent, and after the kneading process, adding 5 parts by weight of the solvent and stirring. A dielectric paste manufacturing process;
Using the manufactured dielectric paste, forming a dielectric so as to cover an electrode formed on the front substrate disposed opposite to the rear substrate through a discharge space; and
With
The defoaming process is performed over a predetermined time corresponding to the predetermined atmospheric pressure under a predetermined atmospheric pressure,
The predetermined atmospheric pressure is 93.3 kPa,
Wherein the predetermined time according to a predetermined ambient pressure, 40 minutes, up plasma production method of the display. (1) glass powder containing at least one component of PbO, B ₂ O ₃ , SiO ₂ and CaO, a binder, a plasticizer, and a solvent, (2) parts by weight of the glass powder are: 50 to 95 parts by weight, (3) the solvent is 1 to 50 parts by weight, and (4) the viscosity at a shear rate of 4 (1 / s) is 350 to 650 (P). Yes, (5) The viscosity at a shear rate of 0.1 (1 / s) is 500 to 1000 (P), and (6) (viscosity at a shear rate of 0.1 (1 / s)) / ( The thixo index defined as the viscosity at a shear rate of 100 (1 / s) is a manufacturing method of a plasma display using a dielectric paste, which is 5 or less,
The dielectric paste is manufactured by kneading the glass powder, the binder, the plasticizer, and the solvent, and after the kneading process, adding 5 parts by weight of the solvent and stirring. A dielectric paste manufacturing process;
Using the manufactured dielectric paste, forming a dielectric so as to cover an electrode formed on the front substrate disposed opposite to the rear substrate through a discharge space; and
With
The defoaming process is performed over a predetermined time corresponding to the predetermined atmospheric pressure under a predetermined atmospheric pressure,
The predetermined atmospheric pressure is 13.3 kPa,
Wherein the predetermined time according to a predetermined ambient pressure, 30 minutes, up plasma production method of the display. (1) glass powder containing at least one component of PbO, B ₂ O ₃ , SiO ₂ and CaO, a binder, a plasticizer, and a solvent, (2) parts by weight of the glass powder are: 50 to 95 parts by weight, (3) the solvent is 1 to 50 parts by weight, and (4) the viscosity at a shear rate of 4 (1 / s) is 350 to 650 (P). Yes, (5) The viscosity at a shear rate of 0.1 (1 / s) is 500 to 1000 (P), and (6) (viscosity at a shear rate of 0.1 (1 / s)) / ( The thixo index defined as the viscosity at a shear rate of 100 (1 / s) is a manufacturing method of a plasma display using a dielectric paste, which is 5 or less,
The dielectric paste is manufactured by kneading the glass powder, the binder, the plasticizer, and the solvent, and after the kneading process, adding 5 parts by weight of the solvent and stirring. A dielectric paste manufacturing process;
Using the manufactured dielectric paste, forming a dielectric so as to cover an electrode formed on the front substrate disposed opposite to the rear substrate through a discharge space; and
With
The defoaming process is performed over a predetermined time corresponding to the predetermined atmospheric pressure under a predetermined atmospheric pressure,
The predetermined atmospheric pressure is 0.1 kPa,
Wherein the predetermined time according to a predetermined ambient pressure, is 20 minutes, flop plasma production method of the display.

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