JP2002015664A - Manufacturing method of plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a plasma display panel solving a problem of a withstand voltage property of a dielectrics glass layer. SOLUTION: In a glass paste which forms a dielectric glass layer, a glass material having a grain size distribution in which two peaks exist is used, by mixing a glass materials having a large (course) grain size and a glass material having a small grain size.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plasma display panel used for a display device or the like, and more particularly to a method for manufacturing a plasma display panel capable of improving a dielectric glass layer.

[0002]

2. Description of the Related Art In recent years, expectations for high-definition and large-screen televisions including high-definition televisions have been increasing. Conventionally, CRTs, liquid crystals, and plasma display panels have been used as display devices for such televisions. Among them, the CRT is superior to the plasma display panel and the liquid crystal in terms of resolution and image quality, but is not suitable for a large screen of 40 inches or more in terms of depth and mass. Liquid crystals, on the other hand, have excellent performances such as low power consumption and low driving voltage, but have limitations in screen size and viewing angle. On the other hand, a plasma display panel is capable of realizing a large screen, and a 40-inch class product has already been developed (for example, “functional material” 19).
Vol. 16, No. 27 pages).

FIG. 8 is a perspective view of a main part of a conventional alternating current (AC) type plasma display panel. In FIG. 8, reference numeral 81 denotes a front glass substrate made of a sodium borosilicate glass by a float method.
A discharge electrode 82 is formed on the surface of the front glass substrate 81, and a dielectric glass layer 83 is formed so as to cover the discharge electrode 82.
Are formed, and the surface of the dielectric glass layer 83 is covered with a magnesium oxide (MgO) dielectric protective layer 84. The dielectric glass layer 83 functions as a capacitor,
Generally, it is formed using glass powder having an average particle diameter of 2 μm to 15 μm.

Reference numeral 85 denotes a rear glass substrate. On the surface of the rear glass substrate 85, address electrodes 86 are formed.
A dielectric glass layer 87 is provided so as to cover this, and a partition wall 88 and a phosphor layer 89 are further provided on the surface thereof. And between the partition walls 88 is a discharge space 90 for filling the discharge gas. The pixel level of full-spec high-definition televisions expected in recent years is 1 pixel.
920 × 1125, and the dot pitch is also 0.15 mm × 0.48 mm in the 42-inch class. Therefore, the area of one cell is as small as 0.072 mm ² .
The area of this one cell is the same as that of a conventional NTSC (640 × 480 pixels, dot pitch 0.43 mm × 1.
As compared with 29 mm, the area of one cell is 0.55 mm ² ), the fineness is 1/7 to 1/8.

[0005] Accordingly, in a full-spec high-definition television, the brightness of the panel is reduced (for example,
"Display and Imaging" 1997, Vo
l. 6, pp. 70). Further, not only the distance between the discharge electrodes becomes shorter, but also the discharge space becomes narrower. For this reason, in particular, the dielectric glass layers 83 and 87 need to have a smaller film thickness than before in order to ensure the same capacitance as a capacitor because the cell area is reduced.

Incidentally, there are mainly three methods described below for forming a dielectric glass layer by a conventional method. In the first method, a glass powder having an average particle size of 2 to 15 μm and a glass softening point of 550 ° C. to 600 ° C. and terpineol containing ethyl cellulose or butyl carbitol acetate as a solvent is used to form a three roll. It is applied on a front glass plate by a screen printing method (adjusted to a viscosity of 50,000 to 100,000 centipoise, which is a viscosity of the paste suitable for the screen printing method), dried and then softened point of the glass This is a method of forming a dielectric glass layer by sintering in the vicinity (550 ° C. to 600 ° C.).

In this method, the sintering is performed in the vicinity of the softening point where the glass does not flow so much that it is in an inactive state. Therefore, the molten glass is used as an electrode of Ag, ITO, Cr—Cu—C
It hardly reacts with r. Therefore, this method is characterized in that the resistance value of the electrode is not increased, the electrode component is not diffused in the glass to be colored, and the dielectric glass layer can be formed by one firing treatment. However, in this method, bubbles (pinholes) are generated in the dielectric, and the dielectric strength of the dielectric glass layer is reduced. Here, the withstand voltage means a limit of the insulating property when the insulating property is deteriorated due to physical breakdown of the dielectric glass layer when a voltage is applied.

As a second method, similarly, the glass powder has an average particle diameter of 2 μm to 15 μm and a softening point of 450 to 50 μm.
After preparing a glass paste using a low melting point lead glass powder of about 0 ° C. (PbO is about 85%) (paste viscosity: 35,000)
1000 to 50,000 centipoise) Apply paste by screen printing method and after drying, 550 which is about 100 ° C higher than softening point.
There is a method of sintering at ~ 600 ° C. The feature of this method is that since the firing temperature of the glass is sufficiently higher than the softening point and the flowability of the glass is good, a glass layer having a flat surface (surface roughness of about 2 μm) can be obtained. That is, a dielectric glass layer can be formed by the sintering process.

However, in this method, the molten glass is Ag,
It reacts with electrodes such as ITO and Cr-Cu-Cr to increase the resistance value, color the dielectric glass layer, and easily generate large bubbles due to the reaction with the electrodes. The third method is a method combining the first method and the second method (for example, JP-A-7-105855, JP-A-9-5).
0869). That is, the average particle size of the glass is 2 μm to 15 μm and the softening point of the glass is 550 ° C. on the electrode.
After using a glass powder of up to 600 ° C. and pasting it in the same manner, it is printed and dried by a screen printing method and sintered near the softening point. Then, on this dielectric glass layer, the average particle diameter is also 2 μm to 15 μm, and the softening point of the glass is similarly pasted using glass powder having a temperature of 450 ° C. to 500 ° C., followed by printing and drying by screen printing. And sintering at 550 ° C. to 600 ° C., which is 100 ° C. higher than the softening point, to form a dielectric glass layer.

The feature of this method is that by adopting such a two-layer structure, it is possible to suppress the reaction between the electrode and the glass and to improve the withstand voltage. However, such a two-layer structure complicates the manufacturing process of the dielectric glass layer. The present invention has been made in view of the above problems, and has as its object to provide a method of manufacturing a plasma display panel that is effective in overcoming the problem of withstand voltage of a dielectric glass layer. .

[0011]

In order to solve the above-mentioned problems, the present invention provides a method of forming a first substrate by forming a first dielectric glass layer on a surface of a first substrate body. Production of a plasma display panel comprising a substrate production step and a second substrate production step of producing a second substrate by forming a second dielectric glass layer and a phosphor layer on the surface of the second substrate body A method, wherein the first substrate manufacturing step and / or
Alternatively, the second substrate manufacturing step includes a sub-step of sintering a dielectric glass paste containing a dielectric glass material having a particle size distribution having at least two peaks.

Thus, in the layer (coating layer, printing layer) coated with the dielectric glass paste, the gap between the glass particles having a relatively large particle diameter corresponding to a large peak is formed.
By interposing glass particles having a relatively small particle size corresponding to a small peak, the amount of the gap is suppressed and the particles are arranged at a high filling rate. Then, when such a printed layer is fired, the glass particles having a relatively small specific heat and relatively small particles are melted before the glass particles having a relatively large particle diameter, and the glass having a relatively large particle diameter is melted. Settle the particles together. As a result, the film is densified. For this reason, the dielectric strength of the dielectric glass layer is improved.

[0013] Here, the dielectric glass paste used in the sub-step has a first dielectric glass material having a first particle size distribution and a first particle size distribution in a range where the particle size is smaller than the distribution particle size in the first particle size distribution. And a mixture of the first dielectric glass material having the second particle size distribution described above and a second dielectric glass material having the same glass composition.

Here, in the mixture in the dielectric glass paste used in the sub-step, the maximum particle size in the second particle size distribution of the second dielectric glass material is as follows:
It is desirable that the first dielectric glass material be smaller than the average particle size in the first particle size distribution. This is because the film becomes denser.

Here, the first dielectric glass material and the second dielectric glass material are such that the first dielectric glass material is more used than the second dielectric glass material in terms of mass ratio or volume ratio. It is desirable to be able to. This is because the film becomes denser.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of a plasma display panel (hereinafter referred to as "PDP") according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a main part of an AC surface discharge type PDP according to the present embodiment. FIG. 2 is a vertical sectional view including line XX in FIG.
FIG. 2 is a vertical sectional view including a line YY in FIG. 1. In these figures, only three cells are shown for the sake of convenience. However, a PDP is constituted by arranging a large number of cells emitting red (R), green (G), and blue (B) in actuality. ing.

This PDP generates a discharge inside the panel by applying a pulsed voltage to each electrode, and emits visible light of each color generated on the rear panel PA1 side by the discharge from the main surface of the front panel PA2. AC surface discharge type P to be transmitted
DP. The front panel PA1 has a dielectric glass layer 13 formed on a front glass substrate 11 on which the discharge electrodes 12 are arranged in a stripe shape so as to cover the discharge electrodes 12. Further, the dielectric glass layer 13 The protective layer 14 is formed so as to cover it. The discharge electrode 12 includes a transparent electrode 12a formed on the surface of the glass substrate 11, and a metal electrode 12b formed on the transparent electrode 12a.

On the other hand, the rear panel PA2 protects the address electrodes on the rear glass substrate 21 on which the address electrodes 22 are arranged in stripes so as to cover the address electrodes 22, and reflects visible light toward the front panel. A dielectric glass layer 23 having an effect is formed, and extends in the same direction as the address electrode 22 on the dielectric glass layer 23, and a partition wall 24 is erected so as to sandwich the address electrode 22. The phosphor layer 25 is provided between the partition walls 24.

Next, an outline of a method of manufacturing the PDP having the above configuration will be described. Fabrication of Front Panel PA1: The front panel PA1 forms discharge electrodes 12 in a stripe shape on the surface of a front glass substrate 11 by a known photolithography method, and then applies glass powder so as to cover the discharge electrodes 12. To form a dielectric glass layer 13 and further form a protective layer 14 made of magnesium oxide (MgO) on the surface of the dielectric glass layer 13 by an electron beam evaporation method.

Fabrication of Back Panel PA2: First, address electrodes 22 are formed on the surface of a back glass substrate 21 by the same photolithographic method as the formation of the discharge electrodes 12 described above. This address electrode is composed of only a metal electrode. Then, the dielectric glass layer 23 is formed in a manner similar to that of the front panel PA1 so as to cover the address electrodes 22.
To form

Next, glass partition walls 24 are provided on the dielectric glass layer 23 at a predetermined pitch. Then, a phosphor layer 25 is formed by disposing a red (R) phosphor, a green (G) phosphor, and a blue (B) phosphor in each space sandwiched by the partition walls 24. As the phosphors of the respective colors R, G, and B, phosphors generally used in PDPs can be used. Here, the following phosphors are used.

Red phosphor: (Y _x Gd _1-x ) BO ₃ : Eu ³⁺ Green phosphor: Zn ₂ SiO ₄ : Mn Completion of PDP by panel bonding: Next, front panel PA1 and rear panel PA2 are positioned such that discharge electrode 12 and address electrode 22 are orthogonal to each other, and both panels are bonded. Thereafter, discharge gas (for example, He-Xe-based, Ne-X
The PDP is completed by filling e-type inert gas) at a predetermined pressure.

The composition of the discharge gas to be filled is a conventionally used He-Xe type, Ne-Xe type or the like. In order to improve the light emission luminance of the cell, the content of Xe is reduced to 5% by volume. As described above, the sealing pressure is 0.67 × 10 ^{5 to} 1.01 ×
Set to 10 ⁵ Pa. The PDP having the above configuration is driven using the drive circuit shown in FIG. Address electrode drive unit 31
Is connected to the address electrode 22, and the scan electrode driving unit 3
2 is connected to an electrode on the scanning side of the discharge electrode 12, and the sustain electrode driving unit 33 is connected to an electrode on the sustain side of the discharge electrode 12. Then, wall charges are uniformly accumulated in all cells in the PDP so that discharge is easily generated in the setup period by such a driving circuit. Next, write discharge is performed on cells to be turned on in the address period. Further, the cells written in the address period are turned on during the sustain period to maintain the lighting, and the cell charges are stopped by erasing the wall charges during the erase period. These multiple operations are repeatedly performed to display an image of one TV field.

* Formation of Dielectric Glass Layer The dielectric glass layer 13 is formed using a glass powder having a predetermined particle size distribution by a screen printing method, a die coating method, or the like.
It is formed by applying and printing the surface of the front glass substrate 11 on which the discharge electrodes 12 are formed by a spin coating method, a spray coating method, or a blade coating method, drying this, and then firing the printing layer (coating layer). ing.

The above-mentioned glass powder is used to finally form a dielectric glass layer by using a grinding device such as a ball mill or a jet mill (eg, HJP300-02 manufactured by Sugino Machine Co., Ltd.) of a glass coarse material having a predetermined composition. It has been ground to near the particle size of the glass powder used. When a glass composed of components G1, G2, G3,..., GN is used as the glass coarse material, components G1, G2, G3,.
.., GN was weighed at a ratio corresponding to the component ratio, and this was heated and melted in, for example, a furnace at 1300 ° C., and then poured into water to obtain GN. Specifically, the glass crude _{material, PbO-B 2 O 3 -SiO} 2 -CaO -based _{glass, PbO-B 2 O 3 -SiO} 2 -MgO based glass, P
_{bO-B 2 O 3 -SiO 2} -BaO -based glass, PbO-B _{2
O 3 -SiO 2 -MgO-Al 2} O 3 based glass, PbO-B
_{2 O 3 -SiO 2 -BaO-Al} 2 O 3 based glass, PbO
B ₂ O ₃ —SiO ₂ —CaO—Al ₂ O ₃ glass, Bi ₂ O
_{3 -ZnO-B 2 O 3 -SiO} 2 -CaO -based glass, ZnO
—B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ —CaO-based glass, P ₂ O ₅
—ZnO—Al ₂ O ₃ —CaO-based glass, Nb ₂ O ₅ —Zn
_{O-B 2 O 3 -SiO 2} -CaO -based glass can be used. In addition, glass generally used for a dielectric of a PDP can be similarly used.

Next, the glass powder used for forming the dielectric glass layer 13 is a glass powder having a particle size distribution having two peaks 41 and 42 as shown in FIG. Such a glass powder has a first glass material having the first particle size distribution 43 created as described above and a particle size smaller than the particle size range of the first particle size distribution, as indicated by the wavy line in the drawing. It is adjusted by mixing with a second glass material having a second particle size distribution 44 having the following.

Such a glass powder is well kneaded with a binder and a binder dissolving solvent by a ball mill, a disper mill or a jet mill to prepare a mixed glass paste. As the binder used here, an acrylic resin, ethyl cellulose, ethylene oxide alone or a mixture thereof can be used. As the binder dissolving solvent, terpineol, butyl carbitol acetate, pentanediol alone, or a mixture thereof can be used. By adjusting the amount of the binder-dissolving solvent to be contained in the mixed paste, the viscosity of the mixed paste is set to a value suitable for a film forming method employing the mixed paste.

It is desirable to add a plasticizer or a surfactant (dispersant) to the mixed glass paste as needed. This is because if a plasticizer is added, the glass film after applying and drying the glass paste becomes flexible, and it is possible to prevent the film from cracking during sintering.
Further, when a surfactant is added, the surfactant is adsorbed around the glass particles, the dispersibility of the glass is improved, and uniform glass application can be performed. The addition of a surfactant is particularly effective in the case of a die coating method, a spray coating method, a spin coating method, and a blade coating method in which a film is formed using a glass paste having a low viscosity.

The composition of this mixed paste is as follows.
5% by mass to 70% by mass, binder 5% by mass to 15% by mass
Is preferably 30% by mass to 65% by mass. The amount of the added plasticizer or surfactant (dispersant) is preferably 0.1% by mass to 3.0% by mass with respect to the binder component. As the surfactant (dispersant), an anionic surfactant can be used. Examples thereof include polycarboxylic acid, sodium salt of alkyl diphenyl ether sulfonate, alkyl phosphate, phosphate of higher alcohol, and polyoxyethylene. Ethylene diglycerin borate carboxylate, polyoxyethylene alkyl sulfate, naphthalenesulfonic acid formalin condensate, glycerol monooleate, sorbitan sesquiolate, or homogenol can be used. In addition, as a plasticizer, dibutyl phthalate,
Dioctyl phthalate or glycerin can be used. These may be used alone or in combination of two or more.

Next, using the mixed glass paste, the mixed paste is applied by screen printing, die coating, spin coating, spray coating, or blade coating to the front glass substrate 11 on which the discharge electrodes 12 are formed.
After being coated on top and dried, a predetermined temperature (550 ° C. to 59
(0 ° C.) to sinter the glass powder in the glass paste.
Note that this sintering process is preferably performed near the softening point of the dielectric glass as much as possible. This is because, when sintering is performed at a temperature much higher than the softening point, the flowability of the molten glass increases, which causes a reaction with the discharge electrode to generate bubbles.

As the thickness of the dielectric glass layer becomes thinner, the effect of improving the panel luminance and reducing the discharge voltage becomes more remarkable, so that it is desirable to set the thickness as thin as possible within a range where the dielectric strength is maintained. Hereinafter, a method of applying the mixed glass paste using the screen printing method in the printing method of the dielectric glass layer will be described.

In the screen printing method, the mixed glass paste (viscosity: about 50,000 centipoise) is placed on a stainless steel mesh having a predetermined mesh size (for example, 325 mesh), and printing is performed using a squeegee (printing step). . Next, through a step of drying and evaporating the organic solvent to dry the binder (drying step),
One film forming process is completed. When a predetermined film thickness is obtained by repeating this step a plurality of times, the glass powder is once fired at a temperature near the softening point (firing step). Next, after repeating the printing step and the drying step a plurality of times, a baking step is performed. By repeating such processing, the dielectric glass layer is finished. It is desirable that the number of firing steps be as small as possible because the panel is less likely to bend. On the other hand, when the thickness of the dielectric glass layer is relatively large, the number of firing steps is too small (for example, 1).
Times), the binder in the mixed paste remains without burning, or the gas generated by burning of the binder in the dielectric glass layer becomes a factor that remains as bubbles. The number of firing steps is determined in consideration of the final film thickness. Therefore, for example, when the final thickness of the dielectric glass layer is to be 40 μm, it is desirable to perform firing twice.

Next, the formation of the dielectric glass layer 23 will be described. The dielectric glass layer 23 on the address electrode is composed of a mixture of a first glass material and a second glass material having two different particle size distributions similar to those used for forming the dielectric glass layer 13. It is formed in the same manner as to form a dielectric glass layer 13 using the powder with the addition of TiO ₂ 5 to 30% by weight in the glass powder having two peaks in. By adding TiO ₂ in this manner, the dielectric glass layer on the rear glass substrate plays a role of reflecting light emitted from the phosphor toward the front panel. It should be noted that the greater the amount of TiO ₂ added, the higher the reflectivity. This is preferable in that respect. However, if the amount of TiO ₂ is too large, the withstand voltage is reduced.
0% by mass seems to be the limit.

If the dielectric glass layers 13 and 23 are formed using a glass powder comprising a mixture of the first glass material and the second glass material having different particle size distributions described above and having two peaks in the particle size distribution, The following operations and effects are obtained, and a PDP with excellent withstand voltage can be realized. FIG. 5 is a schematic diagram for explaining the operation and effect.

First, a description will be given of a case where a glass powder having a conventional general single-peak particle size distribution is used.
As shown in FIG. 5A, in the print layer (after drying),
Glass powder having a single peak particle size distribution is filled with a relatively large amount of gaps 51 between particles.
Therefore, there is a high possibility that the gap 52 between the glass particles is not filled and remains as it is during the firing shown in FIG.

On the other hand, as shown in FIG.
The glass powder having two peaks in the particle size distribution as in the present embodiment is a glass layer having a relatively large particle size corresponding to a large peak in the printed layer (after drying).
Since the glass particles 55 having a relatively small particle size corresponding to a small peak are interposed in the gaps 54 between the three (including the gaps formed between the particles and the glass substrate), the amount of the gaps is suppressed and high. Arrange by filling rate. Then, when such a printed layer is fired, the glass particles having a relatively small specific heat and relatively small particles are melted before the glass particles having a relatively large particle diameter, and the glass having a relatively large particle diameter is melted. Settle the particles together.

As a result, by forming a dielectric glass layer using a glass powder having two peaks in the particle size distribution, as shown in FIG.
A dense dielectric glass layer with a small amount of 6 is obtained. This contributes to the dielectric strength of the dielectric glass layer. The above effect of reducing the amount of the void 56 depends on the distance between the two peaks and the particle size distribution of the first glass material and the second glass material.

Specifically, the further apart the two peaks are, the denser the film becomes. Further, when the first glass material is in a particle size range larger than the particle size distribution of the second glass material, the maximum particle size in the particle size distribution of the second glass material is the first of the first dielectric glass material. It is desirable that the average particle size is smaller than the average particle size in the particle size distribution. Thereby, the film becomes denser.

Further, it is desirable that the first glass material and the second glass material be used in a mass ratio or a volume ratio in which the first glass material is larger than the second glass material. Thereby, the film becomes denser. Furthermore, by forming a dielectric glass layer using a glass powder having two peaks in the particle size distribution as described above, a dielectric glass layer having high surface flatness can be obtained, so that the protective layer and the partition wall come into contact with each other. The effect that the partition wall cracks and the like are unlikely to be generated by the pressing force at the time of the operation is also obtained.

<Example> Based on the above embodiment, the PD
Only the front panel, which is a part of P, was manufactured, and the characteristics of the dielectric glass layer were examined. Specifically, the glass powder contains PbO
-Al ₂ O ₃ -SiO ₂ having a particle size distribution as shown in FIG. 6 (as a result, the finally used glass powder has a particle size distribution of 2%).
With two peaks. 6), one having a particle size distribution in the range of 0.5 μm to 2 μm as shown in FIG. 6A (this material is referred to as A), and the other as shown in FIG. In this case, the material was distributed in the range of 4 μm to 10 μm (this material is referred to as B), and the mixing ratio thereof was set to a plurality. As shown in Table 1 below, in Example 1, A: B was 1: 2 by mass ratio, and in Example 2, A: B was 1: 1: by mass ratio.
1. In Example 3, A: B was set to 2: 1 by mass ratio.

[0041]

[Table 1]

The glass substrate has a size of 100 mm × 84.
A soda glass plate having a size of mm was used. The dielectric glass layer has an area of 80 mm × 50 mm and a thickness of 40 mm.
It was printed on a μm by a die coating method, dried at 120 ° C. for 25 minutes, and baked at 590 ° C. for 10 minutes. In printing, ethyl cellulose is used for the binder and α is used for the solvent.
-Terpineol was used.

An Ag electrode having a width of 2 mm and a length of 50 mm is printed and formed on the surface of the dielectric glass layer of each front panel manufactured as described above, and a DC voltage is applied between the discharge electrode and the Ag electrode. Then, the dielectric breakdown strength (withstand voltage) was measured. As a comparative example with respect to the above Examples 1 to 3, a dielectric glass layer was formed using a single peak particle size distribution (distributed in a particle size of 0.4 μm to 30 μm, indicated by wavy lines in FIG. 5). Was formed, and the dielectric breakdown strength (withstand voltage) was measured in the same manner.

The results are shown in Table 1 above. As shown in Table 1, in Examples 1 to 3, the withstand voltage varies depending on the mixing ratio of the materials A and B, but the withstand voltage is improved as compared with the comparative example. Also, among the examples, the larger the ratio of the material A, that is, the more glass particles having a small particle size,
It can be seen that the withstand voltage is improved.

In the above embodiments and examples, the dielectric glass layer is formed using a glass powder having only two peaks in the particle size distribution, but it is needless to say that the dielectric glass layer is not limited to this. The effect of densifying the film becomes more remarkable as the number of peaks increases to three, four,.... Further, the dielectric glass layer provided on both the front panel and the rear panel is not formed by using a material having a plurality of peaks in the particle size distribution as described above, but one of them may be formed as such. it can.

[0046]

As described above, the plasma display panel according to the present invention comprises a first substrate for forming a first substrate by forming a first dielectric glass layer on a surface of a first substrate body. A method for producing a plasma display panel, comprising: a production step; and a second substrate production step of producing a second substrate by forming a second dielectric glass layer and a phosphor layer on a surface of a second substrate body. Wherein the first substrate production step and / or the second substrate production step comprises sintering a dielectric glass paste containing a dielectric glass material having a particle size distribution having at least two peaks. It is characterized by including a step.

In this way, in the printed layer on which the dielectric glass paste is printed, the gap between the relatively large glass particles corresponding to the large peaks and the relatively small glass particles corresponding to the small peaks are present. Intervening reduces the amount of gaps and arranges them at a high filling rate. Then, when such a printed layer is fired, the glass particles having a relatively small specific heat and relatively small particles are melted before the glass particles having a relatively large particle diameter, and the glass having a relatively large particle diameter is melted. Settle the particles together. As a result, the film is densified. For this reason, the dielectric strength of the dielectric glass layer is improved.

[Brief description of the drawings]

FIG. 1 is an AC surface discharge type PD according to an embodiment of the present invention.
It is a principal part perspective view of P.

FIG. 2 is a vertical sectional view including the line XX of FIG. 1;

FIG. 3 is a vertical sectional view including a line YY of FIG. 1;

FIG. 4 is a characteristic diagram showing a particle size distribution of a glass material used in the embodiment.

FIG. 5 is a schematic diagram for explaining the operation and effect of the present invention. (A) is a schematic diagram showing the state of filling glass particles in a conventional printed layer of a dielectric glass layer. (B)
FIG. 3 is a schematic diagram illustrating a film state of a conventional dielectric glass layer (after firing). (C) is a schematic diagram showing the state of filling glass particles in the printed layer of the dielectric glass layer of the present invention.
(D) is a schematic diagram illustrating a film state of a dielectric glass layer (after firing) of the present invention.

FIG. 6 is a characteristic diagram showing a particle size distribution of a glass material used in Examples. (A) shows a particle size distribution in a range of 0.5 μm to 2 μm, and (b) shows a particle size distribution in a range of 4 μm to 10 μm.

FIG. 7 is a block diagram showing a driving circuit of the PDP.

FIG. 8 is a perspective view of a main part of an AC surface discharge type PDP according to a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Front glass substrate 12 Discharge electrode 12a Transparent electrode 12b Metal electrode 13 Dielectric glass layer 14 Protective layer 21 Back glass substrate 22 Address electrode 23 Dielectric glass layer 24 Partition wall 25 Phosphor layer 30 Discharge space 31 Address electrode drive part 32 Scan electrode Driving unit 33 Sustain electrode driving unit 41, 42 Peak 43 First particle size distribution 44 Second particle size distribution 51, 52 Gap 53 Glass particles (large particle size) 54 Gap 55 Glass particles (Small particle size) 56 Void PA1 Front panel PA2 Rear panel

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuya Hasegawa 1006 Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 5C027 AA05 5C040 FA01 FA04 GB03 GB14 GD07 GD09 JA02 KA07 KB09 KB19 KB28 MA23 MA26

Claims (4)

[Claims] A first substrate forming step of forming a first substrate by forming a first dielectric glass layer on a surface of the first substrate body; A second substrate forming step of forming a second substrate by forming a dielectric glass layer and a phosphor layer, wherein the first substrate forming step and / or the second The substrate manufacturing process
A method of manufacturing a plasma display panel, comprising a sub-step of sintering a dielectric glass paste containing a dielectric glass material having a particle size distribution having at least two peaks. 2. The dielectric glass paste used in the sub-step is distributed in a first dielectric glass material having a first particle size distribution and in a range in which the particle size is smaller than the distribution particle size in the first particle size distribution. 2. A method according to claim 1, wherein said first dielectric glass material has a second particle size distribution and a mixture of said first dielectric glass material and a second dielectric glass material having the same glass composition.
3. The method for manufacturing a plasma display panel according to item 1. 3. The mixture in the dielectric glass paste used in the sub-step, wherein the maximum particle size in the second particle size distribution of the second dielectric glass material is the same as that of the first dielectric glass material. 3. The method according to claim 2, wherein the average particle size is smaller than the average particle size in the first particle size distribution. 4. In the first dielectric glass material and the second dielectric glass material, the first dielectric glass material is used more in mass ratio or volume ratio than the second dielectric glass material. The method for manufacturing a plasma display panel according to claim 2, wherein: