JP4014040B2 - probe - Google Patents

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Publication number
JP4014040B2
JP4014040B2 JP2002314254A JP2002314254A JP4014040B2 JP 4014040 B2 JP4014040 B2 JP 4014040B2 JP 2002314254 A JP2002314254 A JP 2002314254A JP 2002314254 A JP2002314254 A JP 2002314254A JP 4014040 B2 JP4014040 B2 JP 4014040B2
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Japan
Prior art keywords
tip
layer
probe
support layer
contact portion
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JP2002314254A
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Japanese (ja)
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JP2004150874A (en
Inventor
親臣 森
哲司 上野
茂和 田中
勝彦 佐藤
雅成 中島
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Japan Electronic Materials Corp
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Japan Electronic Materials Corp
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  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Description

【0001】
【発明の属する技術分野】
本発明はLSIチップなどの半導体デバイスの電気的諸特性を測定するプローブカードのプローブに関する。
【0002】
【従来の技術】
LSIチップなどの半導体デバイスの電気的諸特性を測定するプローブカードのプローブは、半導体デバイスの電極パッドに押圧接触(オーバードライブ)させられる。
【0003】
従来、プローブは、導電性の一定長さの円形断面をした金属線の先端を機械研磨や電解研磨によって、四角錐や円錐状のシャープな形状に尖らせることで形成されている。
【0004】
図6は、従来のプローブの斜視構造を示す概念図である。プローブ51は、直径が0.1〜0.5mm程度のタングステン線を所定の長さに切断し、機械研磨や電解研磨によって、接触部52の先端部53をシャープに尖らせて形成している。
【0005】
図7は、従来のプローブの先端の正面と側面断面構造を示す概念図である。その接触部の先端部は、図7(a)の四角錐形状や、図7(b)の円錐形状のようなほぼシャープな形状をしている。このような形状をした接触部52は、電極パッドに何度も押圧され摩耗して行くと、その先端部53の形状はつぶれて形状変化する。
【0006】
【発明が解決しようとする課題】
しかしながら、上記の従来技術によるプローブは、半導体デバイスの電極パッドに接触する場合、シャープな四角錐や円錐状の形状をした先端部を持つ接触部が、電極パッド表面に対してオーバードライブして、一度前へ押して後、引くことによって接触するようにしている。このため、プローブの先端には、電極パッドが削りとられたアルミニウムAlなどの粉などの異物が付着する。この異物により、プローブと電極パッドとの間の導通不良が生じ、電気的接触が悪化するので、正確な特性の測定が不可能になる。
【0007】
また、従来、プローブには金属線そのままが使用されるので、検査における周波数帯域特性も狭いという問題があった。
【0008】
本発明は、半導体デバイスの電極パッドに接触するプローブにおいて、異物が付着しにくくなって導通不良を抑制し電気的接触を良化させた、検査周波数帯域を向上させた、高品質なプローブを提供することを目的とする。
【0009】
【課題を解決するための手段】
この課題を解決するため、本発明のプローブは、その解決手段として、測定対象物の電極パッドに接触するプローブで、プローブは、基板に接続される接続端子部と、電極パッドに先端で接触する接触部とを有し、少なくとも前記接触部が、先端層と支持層の少なくとも2層からなる積層体を含むように構成するものである。
【0010】
また、具体的には、接触部は、先端層が支持層の少なくとも一部に堆積されるように構成するものである。
【0011】
また、更に具体的には、接触部は、支持層の先端より先端層をはみ出させた形で形成した先端部を有するように構成するものである。
【0012】
また、更に具体的には、接触部は、一定の厚みを有しているように構成するものである。
【0013】
また、更に具体的には、接触部は、前記先端部の形状が、前記先端部の両辺が直線状である台形形状、あるいは少なくとも片辺が曲形形状であるように構成するものである。
【0014】
また、具体的には、先端層は、電気的特性に優れた導電性材料から形成され、支持層は、絶縁材料から形成され、支持層の表面には金属層を設けるように構成するものである。
【0015】
また、更に具体的には、先端層は、電気的特性に優れた導電性材料から形成され、支持層は、弾性を有する金属材料から形成されるように構成するものである。
【0016】
【発明の実施の形態】
以下、本発明の実施の形態について、図を用いて説明する。
【0017】
図1は、本発明の実施形態であるプローブを含むプローブカードの一部の断面構造を示す概念図である。プローブ1は、触針部2と、その一端に半導体デバイスチップなどの測定対象物3のアルミニウムAl電極パッド4に先端で接触する接触部5と、他端に基板6の接続用電極7に接続される接続端子部8とを有する。
【0018】
図2は、本発明の実施形態のプローブの先端の一部を拡大した上面と側面断面構造を示す概念図である。図2において、プローブの略全体、あるいは少なくとも接触部5は、先端層9と支持層10とからなる2層の積層体であるように形成し、あるいは、先端層9と支持層10の少なくとも2層からなる積層体を含むように形成している。先端層9は、電気的特性の優れた導電性材料、例えばニッケルNiやパラジウムPdなどから形成する。支持層10は、絶縁材料、例えばポリイミド樹脂などで形成しており弾性を有する。図2では、先端層9と支持層10と、更に、絶縁材料から形成した支持層10の先端層9とは反対側の表面に金メッキ層などの金属層11を形成して3層の積層体としていて、金属層11を接地電位と同電位とする。
【0019】
図2に示すように、接触部5の先端部分には、支持層10からオフセットの形で、支持層の先端12より先端層9をはみ出させた位置まで延長して形成した一定厚みtの小径の先端部13を設ける。そして、接触部5の一定厚みの先端部13の少なくとも片辺を、丸みを帯びた曲形形状の曲辺14のように形成する。好ましくは、電極パッドにプローブ1の先端をオーバードライブで押し付けて後、引いて来る方向にある接触部5の先端部13の片辺を曲形形状に形成する方が望ましい。電極パッドに対してプローブ1を最初前へ押したときに、電極パッドのアルミニウムAl表面を引っ掻くように、先端部13の他辺は直線形状であっても良い。
【0020】
図3は、本発明の実施形態の他の例であるプローブ先端の一部を拡大した上面と側面断面構造を示す概念図である。少なくとも接触部5を、先端層9と支持層10とからなる2層の積層体として形成している。また、接触部5の一定厚みの先端部13の両側の辺を直線形状の直辺20のように、先端部を台形形状に形成する。接触部の先端部分に、支持層の先端よりはみ出した形で形成した先端部の両側に直辺を持つ台形形状の先端部を有することにより、接触部が小径の形状の先端部を持つことになり、電極パッドの削りクズなどの異物が付着しにくくなり、導通不良を抑制できる。また、図3で、少なくとも接触部5を先端層9と支持層10からなる2層の積層体としているが、接触部5を、先端層9を少なくとも支持層10の一部に堆積あるいは積層し、先端層と支持層の一部が互いに重なり合い重畳されるように形成してもよい。
【0021】
図4は、本実施形態の他の実施例のプローブの先端の一部を拡大した側面断面構造を示す概念図である。図2と同じ構成のものは同じ参照番号を付与している。図4(a)において、接触部5は先端層9を二層とし支持層10を一層挟んだ3層の積層体である。図4(b)において、先端層9一層を支持層10二層で挟み込んだ3層の積層体であり、さらに支持層10の先端層9とは反対側の両表面には金属層11が形成され接地される。この他、支持層、先端層を組み合わせたさらに多層からなる積層体でも同様に実施可能である。図4においても、支持層の先端より先端層を延長させて形成した先端部により接触部5を構成するのは、図2、図3の実施例と同じである。
【0022】
図5は、本発明の実施形態のプローブ先端の正面と側面構造を示す概念図である。図2で、接触部5の先端部分は、支持層10の先端12より先端層9をはみ出させた位置まで延長して先端部13を一定厚みtで形成し、さらに少なくともその片辺を、丸みを帯びた曲形形状に形成している。従って、図2に示すプローブの接触部の上面と側面構造は図5に示すようになり、検査する度に、接触部5が電極パッドに接触し摩耗しても先端部13は常に一定の厚みtの一定幅を有した形状を保つので、プローブ先端をCCDカメラで繰り返し認識する際も誤認識する事が少なく、プローブ1の接触部5の先端部13の位置決めは容易になる。
【0023】
また、図1において、基板6の接続用電極7の上面部16に印刷法、ディスペンサー等で半田ペーストを塗布し、半田接合をおこない、プローブ1を電気的物理的に基板6に接続固定する。
【0024】
次に、プローブ1は以下のように製造する。犠牲基板の第1の表面にスピコーターなどでレジストを塗布し、第1のレジスト層を形成する。次に、第1のレジスト層の表面に、先端層9となるパターンをパターンニングされた第1のマスクを配置しステッパー等で露光する。次に、現像液に付け、第1のレジスト層の露光された部分のみレジストを除去し第1の空隙を形成する。次に、電解メッキにより、第1の空隙に、電気的特性の優れた材料を積層しプローブの先端層9を形成する。第1のレジスト層および先端層9の表面上にレジストを塗布し、第2のレジスト層を形成する。第2のレジスト層表面に、支持層10となるパターンをパターンニングされた第2のマスクを配置し露光する。次に、現像液に付け、第2のレジスト層の露光された部分のみレジストを除去し第2の空隙を形成する。次に、電解メッキにより、第2の空隙に、弾性のある材料を積層しプローブの支持層10を形成する。第1および第2のレジスト層を露光し、エッチングで完全に除去し、犠牲基板からプローブ1を取り出す。そしてプローブ全面に金メッキ処理を施し、プローブ1を製造する。
【0025】
上記で、プローブ略全体、あるいは少なくとも接触部を、先端層と支持層とからなる少なくとも2層の積層体で形成し、更に、接触部の先端部分に、支持層の先端よりはみ出した形で形成した先端層の先端部を有することにより、また、先端部の両側に直辺を有し、先端部の形状を台形形状とすることにより、接触部が小径の形状の先端部を持つことになり、電極パッドの削りクズなどの異物が付着しにくくなり、導通不良を抑制できる。
【0026】
また、接触部を、その先端部の少なくとも片辺を曲形形状にしたことにより、電極パッドにプローブ先端を押し付けて後、引いて来たときに、電極パッドの削りクズなどの異物が更に付着しにくくなり、導通不良を更に抑制でき電気的接触を更に良化し安定させることが可能になる。
【0027】
また、接触部の先端部分に、支持層の先端よりはみ出した形で形成した先端部の両側に直線状の直辺を持つ台形形状の先端部を有することにより、接触部が小径の形状の先端部を持つことになり、電極パッドの削りクズなどの異物が付着しにくくなり、導通不良を抑制できる。
【0028】
また、上記で、接触部を、先端層を支持層の先端より延長して一定の厚み幅を有して形成しているので、接触部が検査の度に接触を繰り返し摩耗しても、先端部は一定の幅形状を維持し、その形状を容易に認識することができスムーズに検査の操作を進めることができる。更にプローブ痕の形状は、接触部が接触を繰り返しても一定形状になる。
【0029】
また、先端層を、電気的特性の優れた導電性材料から形成し、支持層を、絶縁材料から形成して、支持層の先端層とは反対表面に接地電位と同電位にした金属層を形成したことにより、マイクロストリップライン構造になり、プローブの検査周波数帯域を拡大でき高周波数の信号を扱うことが可能になる。
【0030】
なお、以上の説明では、先端層を、電気的特性の優れた導電性材料から形成し、支持層を、絶縁材料から形成する構成で説明したが、先端層を、電気的特性の優れた導電性材料から形成し、支持層をバネ性のある弾性を有する金属材料で形成しても同様に実施可能である。
【0031】
また、上記で、支持層の表面に形成する金属層を金メッキ層とするとしたが、プローブ全面に金メッキ処理が施されていても同様に実施可能である。
【0032】
【発明の効果】
以上のように本発明によれば、プローブの少なくとも接触部を、先端層と支持層とからなる少なくとも2層の積層体とし、更に、接触部の先端部分に、支持層の先端よりはみ出した先端層の先端部を有することにより、また、先端部の両側に直線状の直辺を有し、先端部が台形形状となることにより、接触部は小径の形状の先端部となり、電極パッドの削りクズなどの異物が付着しにくくなり、導通不良を抑制できる。
【0033】
また、接触部を、その先端部の少なくとも片辺を曲形形状にしたことにより、電極パッドにプローブ先端をオーバードライブで押し付けて後、引いて来たときに、削りクズなどの異物が更に付着しにくくなり、導通不良を更に抑制でき電気的接触を更に良化し安定させることが可能になる。
【0034】
また、接触部を、先端層を支持層の先端より延長して一定の厚み幅を有して形成しているので、接触部が検査の度に接触を繰り返し摩耗しても、先端部は一定の幅形状を維持し、その形状を容易に認識することができスムーズに検査の操作を進めることができる。
【0035】
また、先端層を、電気的特性の優れた導電性材料から形成し、支持層を、絶縁材料から形成して、支持層の先端層とは反対表面に接地電位と同電位にした金属層を形成したことにより、マイクロストリップライン構造になり、プローブの検査周波数帯域を拡大でき高周波数の信号を扱う事が可能になる。
【図面の簡単な説明】
【図1】本発明の実施形態であるプローブを含むプローブカードの一部の断面構造を示す概念図
【図2】本発明の実施形態のプローブの先端の一部を拡大した上面と側面断面構造を示す概念図
【図3】本実施形態の他の実施例のプローブの先端の一部を拡大した上面と側面断面構造を示す概念図
【図4】本実施形態の他の実施例のプローブの先端の一部を拡大した側面断面構造を示す概念図
【図5】本発明の実施形態のプローブの先端の正面と側面構造を示す概念図
【図6】従来のプローブの斜視構造を示す概念図
【図7】従来のプローブの先端の正面と側面断面構造を示す概念図
【符号の説明】
1 プローブ
2 触針部
3 測定対象物
4 電極パッド
5 接触部
6 基板
7 接続用電極
8 接続端子部
9 先端層
10 支持層
11 金属層
12 支持層の先端
13 先端部
14 曲辺
15 底面部
16 上面部
20 直辺
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a probe of a probe card for measuring various electrical characteristics of a semiconductor device such as an LSI chip.
[0002]
[Prior art]
A probe of a probe card for measuring various electrical characteristics of a semiconductor device such as an LSI chip is brought into press contact (overdrive) with an electrode pad of the semiconductor device.
[0003]
Conventionally, a probe is formed by sharpening the tip of a metal wire having a circular cross section having a certain length of conductivity into a sharp shape such as a quadrangular pyramid or a cone by mechanical polishing or electrolytic polishing.
[0004]
FIG. 6 is a conceptual diagram showing a perspective structure of a conventional probe. The probe 51 is formed by cutting a tungsten wire having a diameter of about 0.1 to 0.5 mm into a predetermined length and sharply sharpening the tip 53 of the contact portion 52 by mechanical polishing or electrolytic polishing. .
[0005]
FIG. 7 is a conceptual diagram showing the front and side cross-sectional structures of the tip of a conventional probe. The tip of the contact portion has a substantially sharp shape such as a quadrangular pyramid shape in FIG. 7A or a conical shape in FIG. When the contact portion 52 having such a shape is pressed and worn many times by the electrode pad, the shape of the tip end portion 53 is crushed and changes its shape.
[0006]
[Problems to be solved by the invention]
However, when the probe according to the above prior art is in contact with the electrode pad of the semiconductor device, the contact portion having a sharp quadrangular pyramid or conical tip is overdriven with respect to the electrode pad surface, Push once and then touch to pull. For this reason, foreign matters such as powder of aluminum Al or the like with the electrode pad shaved adhere to the tip of the probe. Due to the foreign matter, poor conduction between the probe and the electrode pad occurs, and the electrical contact deteriorates, so that accurate measurement of characteristics becomes impossible.
[0007]
Conventionally, since a metal wire is used as it is for the probe, there is a problem that the frequency band characteristic in inspection is narrow.
[0008]
The present invention provides a high-quality probe with improved inspection frequency band in which a foreign object is less likely to adhere to a probe that contacts an electrode pad of a semiconductor device, and electrical contact is improved by suppressing poor conduction. The purpose is to do.
[0009]
[Means for Solving the Problems]
In order to solve this problem, the probe of the present invention is a probe that comes into contact with the electrode pad of the object to be measured, and the probe contacts the connection terminal portion connected to the substrate and the electrode pad at the tip. A contact portion, and at least the contact portion includes a laminate including at least two layers of a tip layer and a support layer.
[0010]
Specifically, the contact portion is configured such that the tip layer is deposited on at least a part of the support layer.
[0011]
More specifically, the contact portion is configured to have a tip portion formed in a shape in which the tip layer protrudes from the tip of the support layer.
[0012]
More specifically, the contact portion is configured to have a certain thickness.
[0013]
More specifically, the contact portion is configured such that the shape of the tip portion is a trapezoidal shape in which both sides of the tip portion are linear, or at least one side is a curved shape.
[0014]
Specifically, the tip layer is formed of a conductive material having excellent electrical characteristics, the support layer is formed of an insulating material, and a metal layer is provided on the surface of the support layer. is there.
[0015]
More specifically, the tip layer is formed of a conductive material having excellent electrical characteristics, and the support layer is formed of a metal material having elasticity.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0017]
FIG. 1 is a conceptual diagram showing a partial cross-sectional structure of a probe card including a probe according to an embodiment of the present invention. The probe 1 is connected to a stylus part 2, a contact part 5 that comes into contact with an aluminum Al electrode pad 4 of a measurement object 3 such as a semiconductor device chip at one end, and a connection electrode 7 of a substrate 6 at the other end. And a connection terminal portion 8.
[0018]
FIG. 2 is a conceptual diagram showing a top surface and a side sectional structure in which a part of the tip of the probe according to the embodiment of the present invention is enlarged. In FIG. 2, substantially the entire probe, or at least the contact portion 5, is formed so as to be a two-layer laminate including a tip layer 9 and a support layer 10, or at least two of the tip layer 9 and the support layer 10. It forms so that the laminated body which consists of layers may be included. The tip layer 9 is made of a conductive material having excellent electrical characteristics, such as nickel Ni or palladium Pd. The support layer 10 is made of an insulating material such as polyimide resin and has elasticity. In FIG. 2, the tip layer 9 and the support layer 10, and further, a metal layer 11 such as a gold plating layer is formed on the surface opposite to the tip layer 9 of the support layer 10 made of an insulating material, to form a three-layer laminate. The metal layer 11 is set to the same potential as the ground potential.
[0019]
As shown in FIG. 2, the contact portion 5 has a small diameter with a constant thickness t formed at the tip portion of the contact portion 5 so as to be offset from the support layer 10 and extended from the tip 12 of the support layer to the position where the tip layer 9 protrudes. The tip portion 13 is provided. Then, at least one side of the tip part 13 having a constant thickness of the contact part 5 is formed like a curved side 14 having a rounded shape. Preferably, after pressing the tip of the probe 1 to the electrode pad with overdrive, it is desirable to form one side of the tip portion 13 of the contact portion 5 in a pulling direction in a curved shape. When the probe 1 is first pushed forward against the electrode pad, the other side of the tip 13 may be linear so as to scratch the aluminum Al surface of the electrode pad.
[0020]
FIG. 3 is a conceptual diagram showing an enlarged top surface and side sectional structure of a part of a probe tip as another example of the embodiment of the present invention. At least the contact portion 5 is formed as a two-layer laminate composed of a tip layer 9 and a support layer 10. Further, the tip portion is formed in a trapezoidal shape such that the sides on both sides of the tip portion 13 having a constant thickness of the contact portion 5 are straight straight sides 20. By having a trapezoidal tip having straight sides on both sides of the tip formed in a shape protruding from the tip of the support layer at the tip of the contact portion, the contact portion has a tip having a small diameter. Thus, foreign matter such as electrode pad shavings is less likely to adhere, and poor conduction can be suppressed. In FIG. 3, at least the contact portion 5 is a two-layered laminate including the tip layer 9 and the support layer 10, but the contact portion 5 is deposited or laminated on at least a part of the support layer 10. The tip layer and the support layer may partially overlap each other and overlap each other.
[0021]
FIG. 4 is a conceptual diagram showing a side sectional structure in which a part of the tip of a probe of another example of the present embodiment is enlarged. The same components as those in FIG. 2 are given the same reference numerals. In FIG. 4A, the contact portion 5 is a three-layer laminate in which the tip layer 9 is two layers and the support layer 10 is sandwiched between them. In FIG. 4 (b), it is a three-layer laminate in which one end layer 9 is sandwiched between two support layers 10, and a metal layer 11 is formed on both surfaces of the support layer 10 opposite to the end layer 9. And grounded. In addition, the present invention can be similarly applied to a laminate composed of a further multilayered combination of the support layer and the tip layer. Also in FIG. 4, the contact portion 5 is configured by a tip portion formed by extending the tip layer from the tip of the support layer, as in the embodiment of FIGS. 2 and 3.
[0022]
FIG. 5 is a conceptual diagram showing the front and side structures of the probe tip according to the embodiment of the present invention. In FIG. 2, the tip of the contact portion 5 extends from the tip 12 of the support layer 10 to a position where the tip layer 9 protrudes to form a tip 13 with a constant thickness t, and at least one side thereof is rounded. It is formed in a curved shape. Accordingly, the upper surface and side structure of the contact portion of the probe shown in FIG. 2 are as shown in FIG. 5, and the tip 13 always has a constant thickness even if the contact portion 5 comes into contact with the electrode pad and wears every time it is inspected. Since the shape having a constant width of t is maintained, it is less likely to be erroneously recognized even when the tip of the probe is repeatedly recognized by the CCD camera, and positioning of the tip portion 13 of the contact portion 5 of the probe 1 is facilitated.
[0023]
In FIG. 1, a solder paste is applied to the upper surface portion 16 of the connection electrode 7 of the substrate 6 by a printing method, a dispenser or the like, soldering is performed, and the probe 1 is electrically and physically connected to the substrate 6.
[0024]
Next, the probe 1 is manufactured as follows. A resist is applied to the first surface of the sacrificial substrate with a spicator or the like to form a first resist layer. Next, a first mask on which a pattern to be the tip layer 9 is patterned is disposed on the surface of the first resist layer, and exposed with a stepper or the like. Next, it is applied to a developer and the resist is removed only from the exposed portion of the first resist layer to form a first gap. Next, a material having excellent electrical characteristics is laminated in the first gap by electrolytic plating to form the tip layer 9 of the probe. A resist is applied on the surfaces of the first resist layer and the tip layer 9 to form a second resist layer. On the surface of the second resist layer, a second mask patterned with a pattern to be the support layer 10 is arranged and exposed. Next, it is applied to a developer and the resist is removed only from the exposed portion of the second resist layer to form a second gap. Next, the support layer 10 of the probe is formed by laminating an elastic material in the second gap by electrolytic plating. The first and second resist layers are exposed, completely removed by etching, and the probe 1 is taken out from the sacrificial substrate. Then, the entire surface of the probe is gold-plated to manufacture the probe 1.
[0025]
In the above, the probe as a whole or at least the contact part is formed of a laminate of at least two layers consisting of a tip layer and a support layer, and further formed in a shape protruding from the tip of the support layer at the tip part of the contact part. By having the tip part of the tip layer, and having a straight side on both sides of the tip part and the tip part shape being trapezoidal, the contact part has a tip part with a small diameter. In addition, foreign matters such as electrode pad shavings are less likely to adhere, and poor conduction can be suppressed.
[0026]
In addition, because the contact portion has a curved shape at least one side of the tip, when the probe tip is pressed against the electrode pad and then pulled, foreign matter such as scraping scrapes on the electrode pad is further adhered. Therefore, it is possible to further suppress poor conduction and further improve and stabilize electrical contact.
[0027]
In addition, the tip of the contact portion has a trapezoidal tip having straight straight sides on both sides of the tip formed in a shape protruding from the tip of the support layer, so that the tip of the contact portion has a small diameter. Since it has a part, it becomes difficult for foreign matters, such as shavings of an electrode pad, to adhere, and a conduction defect can be controlled.
[0028]
In the above, the contact portion is formed with a certain thickness width by extending the tip layer from the tip of the support layer. The part maintains a constant width shape, the shape can be easily recognized, and the inspection operation can proceed smoothly. Furthermore, the shape of the probe mark is constant even if the contact portion repeats contact.
[0029]
In addition, the tip layer is formed of a conductive material having excellent electrical characteristics, the support layer is formed of an insulating material, and a metal layer having the same potential as the ground potential is formed on the surface opposite to the tip layer of the support layer. By forming it, it becomes a microstrip line structure, the inspection frequency band of the probe can be expanded, and a high frequency signal can be handled.
[0030]
In the above description, the tip layer is formed of a conductive material having excellent electrical characteristics and the support layer is formed of an insulating material. However, the tip layer is made of a conductive material having excellent electrical characteristics. The present invention can also be carried out in the same manner by forming the support layer from a metal material having elasticity with spring properties.
[0031]
In the above description, the metal layer formed on the surface of the support layer is a gold-plated layer. However, the present invention can be similarly applied even when the entire surface of the probe is gold-plated.
[0032]
【The invention's effect】
As described above, according to the present invention, at least the contact portion of the probe is a laminate of at least two layers including the tip layer and the support layer, and further, the tip protruding from the tip of the support layer to the tip portion of the contact portion By having the tip of the layer, and having straight straight sides on both sides of the tip, and the tip becomes trapezoidal, the contact part becomes a tip having a small diameter, and the electrode pad is shaved. Foreign matter such as debris is less likely to adhere, and poor conduction can be suppressed.
[0033]
In addition, by making the contact part curved at least one side of the tip, when the probe tip is pressed against the electrode pad with overdrive and then pulled, foreign matter such as shavings is further adhered. Therefore, it is possible to further suppress poor conduction and further improve and stabilize electrical contact.
[0034]
In addition, since the contact portion is formed with a certain thickness width by extending the tip layer from the tip of the support layer, the tip portion is constant even if the contact portion wears repeatedly during each inspection. Thus, the shape can be easily recognized, and the inspection operation can proceed smoothly.
[0035]
In addition, the tip layer is formed of a conductive material having excellent electrical characteristics, the support layer is formed of an insulating material, and a metal layer having the same potential as the ground potential is formed on the surface opposite to the tip layer of the support layer. By forming it, it becomes a microstrip line structure, the inspection frequency band of the probe can be expanded, and a high frequency signal can be handled.
[Brief description of the drawings]
FIG. 1 is a conceptual diagram showing a partial cross-sectional structure of a probe card including a probe according to an embodiment of the present invention. FIG. 2 is an enlarged top and side cross-sectional structure of a part of a probe tip according to an embodiment of the present invention. FIG. 3 is a conceptual diagram showing an enlarged top surface and side cross-sectional structure of a part of a tip of a probe of another example of this embodiment. FIG. 4 is a diagram of a probe of another example of this embodiment. FIG. 5 is a conceptual diagram showing a side sectional structure in which a part of the tip is enlarged. FIG. 5 is a conceptual diagram showing the front and side structure of the tip of the probe according to the embodiment of the present invention. FIG. 7 is a conceptual diagram showing the front and side cross-sectional structures of the tip of a conventional probe.
DESCRIPTION OF SYMBOLS 1 Probe 2 Contact point part 3 Measuring object 4 Electrode pad 5 Contact part 6 Substrate 7 Connection electrode 8 Connection terminal part 9 Tip layer 10 Support layer 11 Metal layer 12 Tip of support layer 13 Tip part 14 Curved side 15 Bottom part 16 Right side of upper surface 20

Claims (5)

測定対象物の電極パッドに接触するプローブで、前記プローブは、基板に接続される接続端子部と、前記電極パッドに先端で接触する接触部を有し、前記接触部が、先端層と支持層との積層体からなり、前記先端層が前記支持層の先端からはみ出し、はみ出た前記先端層の厚みの面が前記電極パッドに押し当てられ、押し当てられる前記先端層の平面形状が一辺を直線状で他片を曲形形状の略台形に構成されたことを特徴とするプローブ。A probe that contacts an electrode pad of a measurement object, wherein the probe has a connection terminal portion connected to a substrate and a contact portion that contacts the electrode pad at the tip, and the contact portion includes a tip layer and a support layer. And the tip layer protrudes from the tip of the support layer, the surface of the tip layer that protrudes is pressed against the electrode pad, and the planar shape of the tip layer that is pressed is straight on one side A probe characterized in that the other piece is formed in a substantially trapezoidal shape with a curved shape . 前記接触部は、前記先端層が前記支持層の少なくとも一部に堆積されるように構成した請求項1に記載のプローブ。The probe according to claim 1, wherein the contact portion is configured such that the tip layer is deposited on at least a part of the support layer. 前記接触部は、前記先端層が一定の厚みを有しているように構成した請求項1からのいずれか一項に記載のプローブ。The contact portion, the probe according to any one of claims 1 2 wherein the distal layer is configured to have a constant thickness. 前記先端層は、電気的特性に優れた導電性材料から形成され、前記支持層は、絶縁材料から形成され、前記支持層の表面には金属層を設けるように構成した請求項1からのいずれか一項に記載のプローブ。The tip layer is formed from a high conductivity material on the electrical characteristics, the support layer is formed of an insulating material, wherein the surface of the support layer from claim 1 configured to provide a metal layer of 3 The probe according to any one of the above. 前記先端層は、電気的特性に優れた導電性材料から形成され、前記支持層は、弾性を有する金属材料から形成されるように構成した請求項1からのいずれか一項に記載のプローブ。The probe according to any one of claims 1 to 3 , wherein the tip layer is formed from a conductive material having excellent electrical characteristics, and the support layer is formed from a metal material having elasticity. .
JP2002314254A 2002-10-29 2002-10-29 probe Expired - Fee Related JP4014040B2 (en)

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US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using

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