JP4011080B2 - Multilayer capacitor - Google Patents

Description

  The present invention relates to a multilayer capacitor that can be applied to various applications by increasing ESR (equivalent series resistance) and suppressing voltage oscillation of a power supply.

  Among the multilayer capacitors, the multilayer ceramic capacitors have the characteristics that the ESR (equivalent series resistance) is smaller than that of electrolytic capacitors and have excellent high frequency characteristics. In recent years, body thinning and multilayering have remarkably advanced. As a result, large-capacity monolithic ceramic capacitors having a large capacitance comparable to aluminum electrolytic capacitors and tantalum electrolytic capacitors have appeared.

  In recent years, the multilayering of multilayer ceramic capacitors has caused not only an increase in capacitance but also a tendency for ESR to further decrease. In other words, the ESR at the time of high-frequency fluctuation of the current is dominated by the electrical resistance of the inner conductor. Therefore, when the density of the inner conductor of the multilayer ceramic capacitor is increased by further multilayering, the ESR is further reduced. become.

  Here, the appearance of the multilayer capacitor 100, which is this conventional multilayer ceramic capacitor, is shown in FIG. 13, the internal structure is shown in FIG. 14, and the equivalent circuit is shown in FIG. A conventional multilayer capacitor 100 will be described below based on these drawings. That is, the multilayer capacitor 100 has a structure in which two types of internal conductors 114 and 116 shown in FIG. 14 overlap with each other via the ceramic layer 112A so that a large capacitance can be obtained.

  The inner conductor 114 protrudes from any one of the four side surfaces of the laminate 112 formed by laminating a large number of these ceramic layers 112A, and the side surface from which the inner conductor 114 protrudes. An inner conductor 116 is protruded on the side surface facing the. Furthermore, the terminal electrode 118 connected to the internal conductor 114 and the terminal electrode 120 connected to the internal conductor 116 are respectively installed on the mutually opposing side surfaces of the multilayer capacitor 100 shown in FIG. Although not shown, a large number of internal conductors 114 and internal conductors 116 are arranged in order along the stacking direction of the multilayer body 112.

From such a structure, an equivalent circuit in the conventional multilayer multilayer capacitor 100 is as shown in FIG. That is, the equivalent resistance of the inner conductor 114 itself is represented by R _{C1 to} R _Cn , and the equivalent resistance of the inner conductor 116 itself is represented by R _{D1 to} R _Dn, where n is the number of each inner conductor. Represents. As can be understood from the fact that R _{C1 to} R _Cn and R _{D1 to} R _Dn are arranged in parallel, ESR decreases in inverse proportion to the number of layers.

  On the other hand, a large-capacitance capacitor is mainly used for output smoothing of a switching power supply. However, using a capacitor with a small ESR is effective in reducing the output ripple voltage. However, if the ESR is too small, the output voltage becomes unstable or abnormal oscillation occurs for the control system of the switching power supply. There was a drawback of waking up. This is because when a capacitor having an excessive ESR is used, the phase of the feedback circuit of the control circuit is likely to be delayed, and the control circuit does not function normally.

For this reason, electrolytic capacitors having a larger ESR than multilayer capacitors are often used in applications such as smoothing the output of a switching power supply. On the other hand, from the viewpoints of cost reduction and miniaturization, it is desired to use multilayer capacitors for such applications, but the multilayer capacitors will be further multilayered by aiming for higher capacity in the future. As described above, there is a possibility that the ESR is further reduced and the ESR is excessively reduced.
In view of the above facts, an object of the present invention is to provide a multilayer capacitor applicable to various applications by increasing ESR.

A multilayer capacitor according to claim 1 is a dielectric body formed by laminating dielectric layers;
At least a pair of terminal electrodes arranged outside the dielectric body and connected to an external circuit,
A first terminal protrusion that is disposed in the dielectric body and protrudes from the end of the dielectric layer and is connected to one terminal electrode, and an end of the dielectric layer different from the first terminal protrusion. A first inner conductor having a first connecting protrusion protruding therefrom;
A second terminal protrusion that is disposed in the dielectric body while being separated from the first inner conductor by the dielectric layer, protrudes from the end of the dielectric layer, and is connected to the other terminal electrode . A second inner conductor having a first connection protrusion protruding from an end of the dielectric layer different from the terminal protrusion ;
A pair of first connecting conductors each having a second connecting protrusion that is disposed in the dielectric body while being separated from the first inner conductor and the second inner conductor by the dielectric layer, and protrudes from the end of the dielectric layer. 3 inner conductors,
The outer side of the dielectric element body is disposed between the first connection protrusion of the first inner conductor and the second connection protrusion of the third inner conductor . A first connecting electrode to be connected;
Between the first connecting protrusion of the second inner conductor and the second connecting protrusion of the other third inner conductor on the outer side of the dielectric element body. A second connecting electrode to be connected;
It is characterized by providing.

In the multilayer capacitor according to claim 1, the first inner conductor, the second inner conductor, and the pair of third inner conductors are formed in a dielectric body formed by laminating dielectric layers. The structure is arranged while being separated by layers. Further, at least a pair of terminal electrodes that can be connected to the external circuits are arranged outside the dielectric body. The first inner conductor has a first terminal protrusion protruding from the end of the dielectric layer and connected to one terminal electrode of the pair of terminal electrodes. The second inner conductor has a second terminal protrusion protruding from the end and connected to the other terminal electrode.

On the other hand, the first inner conductor has a first connection protrusion protruding from the end of the dielectric layer different from the first terminal protrusion, and the end of the dielectric layer is different from the second terminal protrusion. the first connection protrusions protruded into the second also has inner conductor further comprises a third inner conductor of the second connection protruding portions of the pair of projecting an end portion of the dielectric layer, respectively Yes. And the 1st connection electrode arrange | positioned on the outer side of a dielectric body is between the 1st connection protrusion part of these 1st inner conductors, and the 2nd connection protrusion part of one 3rd inner conductor . A second connecting electrode connected to the outside of the dielectric element body and disposed outside the dielectric element body has a first connecting protrusion of the second inner conductor and a second connecting electrode of the other third inner conductor. The two connecting protrusions are connected outside the dielectric body .

Thus, the first inner conductor connected to one terminal electrode, the protruding portion for the first connection is connected to one of the third inner conductor through the first connection electrode and the second connection protruding portions, Since the third inner conductor functions as the same polarity as the first inner conductor, the equivalent series resistance of the multilayer capacitor increases as the flow path of the current in the multilayer capacitor becomes longer. Furthermore, the second inner conductor connected to the other terminal electrode is connected to the other third inner conductor via the first connection protrusion, the second connection electrode, and the second connection protrusion, Since the other third inner conductor functions as the same polarity as the second inner conductor, the equivalent series resistance of the multilayer capacitor increases as the flow path of the current in the multilayer capacitor becomes longer.

  For this reason, even in applications such as smoothing the output of a switching power supply with an increase in equivalent series resistance, a multilayer structure that achieves higher capacity by multilayering instead of electrolytic capacitors Capacitors can be used. That is, since the multilayer capacitor according to the present invention has an increased ESR, it can be applied to various uses including a switching power supply.

According to the multilayer capacitor of the second aspect, in addition to the configuration similar to that of the multilayer capacitor of the first aspect, the dielectric body has a configuration in which a plurality of first inner conductors and second inner conductors are stacked. ing. Therefore, according to this claim, not only the ESR is simply increased, but the ESR is adjusted to an arbitrary size as the number of laminated layers of the first inner conductor and the second inner conductor is appropriately set. Therefore, the ESR can be controlled to a desired value.

According to the multilayer capacitor of the third aspect, in addition to the same configuration as the multilayer capacitor of the first and second aspects, the first connecting protrusion of the first inner conductor and the one third inner conductor A plurality of second connection protrusions are provided, and a plurality of first connection electrodes that connect the second connection protrusions are arranged outside the dielectric body. Therefore, as a result of the connection between the first inner conductor and one of the third inner conductors by a plurality of connecting electrodes, as the number of contact points increases and the inner conductors are securely connected, It becomes difficult to produce poor contact.

  According to the fourth aspect of the multilayer capacitor, in addition to the same structure as the multilayer capacitor of the first to third aspects, the first internal conductor is provided with a cut portion. Therefore, by providing the cut portion in the first inner conductor, the current flow path is elongated in a bent shape, and the effect of increasing the equivalent series resistance of claim 1 is further increased.

  According to the multilayer capacitor of the fifth aspect, in addition to the same configuration as the multilayer capacitor of the first to fourth aspects, the width of the first inner conductor portion excluding the first terminal protruding portion is the first width. It has a configuration in which it is formed narrower than the width of the terminal protrusion. That is, while maintaining the width of the first terminal protrusion to a constant size and forming the first inner conductor narrow, the first terminal protrusion is reliably connected to one terminal electrode. As the current flows in the narrow first inner conductor, the electrical resistance of the first inner conductor increases, and the effect of increasing the equivalent series resistance is further increased.

  According to the present invention, it is possible to provide a multilayer capacitor applicable to various uses by increasing ESR.

Embodiments of a multilayer capacitor according to the present invention will be described below with reference to the drawings.
A multilayer capacitor 10 which is a multilayer ceramic capacitor according to a first embodiment of the present invention is shown in FIGS. As shown in these figures, a multilayer capacitor 10 is configured with a dielectric body 12 that is a rectangular parallelepiped sintered body obtained by firing a laminated body in which a plurality of ceramic green sheets are laminated as a main part. ing.

  That is, the dielectric body 12 is formed by laminating dielectric layers that are fired ceramic green sheets. An inner conductor 14 which is a planar first inner conductor is disposed at a predetermined height position in the dielectric element body 12, and a ceramic layer serving as a dielectric layer in the dielectric element body 12. An internal conductor 16 that is also a planar second internal conductor is disposed below the internal conductor 14 that is separated by 12A.

  Similarly, an inner conductor 18 that is a planar third inner conductor is disposed below the inner conductor 16 that separates the ceramic layer 12A in the dielectric element body 12, and the ceramic layer 12A is similarly disposed below. A plurality of internal conductors 14, internal conductors 16, and internal conductors 18 formed in the same manner are repeatedly arranged sequentially.

  For this reason, these three types of inner conductors from the inner conductor 14 to the inner conductor 18 are arranged to face each other while being separated by the ceramic layer 12 </ b> A in the dielectric element body 12. The centers from the inner conductor 14 to the inner conductor 18 are arranged at substantially the same position as the centers of the ceramic layers 12A, and the vertical and horizontal dimensions from the inner conductor 14 to the inner conductor 18 correspond to the corresponding ceramic layers. Each side is smaller than the length of 12A.

  Furthermore, as shown in FIG. 1, the conductor protrudes from the left portion of the inner conductor 14 toward the left end portion of the ceramic layer 12 </ b> A with the same width as the width of the inner conductor 14. A first terminal protrusion 14A is formed. Separately from this, the conductor protrudes from the front side portion and the back side portion of the internal conductor 14 one by one toward the front side end portion and the back side end portion of the ceramic layer 12A, respectively. Thus, two first connecting protrusions 15 are also formed on the inner conductor 14.

  Further, since the conductor protrudes from the right portion of the internal conductor 16 toward the right end of the ceramic layer 12A with the same width as the width of the internal conductor 16, the second terminal protrusion is provided on the internal conductor 16. 16A is formed. On the other hand, the conductors are protruded one by one from the front side portion and the back side portion of the inner conductor 18 toward the front end portion and the back end portion of the ceramic layer 12A, respectively. Two second connection protrusions 19 are formed.

  Further, as shown in FIGS. 2 and 3, the terminal electrode 21 connected to the first terminal protrusion 14 </ b> A of the inner conductor 14 is disposed on the left side surface 12 </ b> B that is the outside of the dielectric body 12. Further, the terminal electrode 22 connected to the second terminal protruding portion 16 </ b> A of the inner conductor 16 is disposed on the right side surface 12 </ b> B which is the outside of the dielectric body 12.

  2 are respectively connected to the two first connection protrusions 15 of the inner conductor 14 and the two second connection protrusions 19 of the inner conductor 18. Are disposed on the front side surface 12C and the back side surface 12C, respectively. That is, the two connection electrodes 23 and 24 connect the first connection protrusion 15 and the second connection protrusion 19 on the outside of the dielectric body 12. However, these connection electrodes 23 and 24 are not connected to an external circuit because they are intended only to connect the internal conductors outside the dielectric body 12.

  As described above, in the present embodiment, the terminal electrodes 21 and 22 and the connection electrodes 23 and 24 are respectively disposed on the four side surfaces 12B and 12C of the dielectric body 12 that is a rectangular parallelepiped of the multilayer capacitor 10 and has a hexahedral shape. Will be. The terminal electrodes 21 of the terminal electrodes 21 and 22 disposed on the left and right side surfaces 12B are connected to, for example, the CPU electrode so that the internal conductors 14 to 18 become capacitor electrodes, and the terminal electrode 22 Is connected to the ground side, for example.

  Therefore, as shown in FIGS. 1 and 3, for example, when the inner conductor 14 becomes a positive pole and the inner conductor 16 adjacent to the inner conductor 14 becomes a negative pole, the first connecting protrusion is accompanied accordingly. The internal conductor 18 connected to the internal conductor 14 becomes a positive pole through the portion 15, the coupling electrodes 23 and 24, and the second connection protrusion 19.

Next, the operation of the multilayer capacitor 10 according to the present embodiment will be described.
In the multilayer capacitor 10 according to the present embodiment, three types of internal conductors including an internal conductor 14, an internal conductor 16, and an internal conductor 18 are mutually connected in a dielectric body 12 formed by laminating ceramic layers 12A. A plurality of layers are arranged while being separated by ceramic layers 12A.

  Further, a pair of terminal electrodes 21 and 22 that can be connected to an external circuit are disposed outside the dielectric element body 12. The inner terminal 14 has a first terminal protrusion 14 </ b> A connected to the terminal electrode 21 of the pair of terminal electrodes 21 and 22, and the second terminal protrusion connected to the terminal electrode 22. The internal conductor 16 has 16A.

  On the other hand, while the inner conductor 14 has two first connection protrusions 15 protruding from the front and back ends of the ceramic layer 12A different from the first terminal protrusion 14A, the ceramic layer 12A The internal conductor 18 has two second connection protrusions 19 protruding from the front and back end portions. The two connecting electrodes 23 and 24 arranged on the outer side of the dielectric body 12 are arranged between the first connection protrusion 15 and the second connection protrusion 19 on the outer side of the dielectric body 12. It is connected with.

  Therefore, the internal conductor 14 connected to the terminal electrode 21 is connected to the internal conductor 18 through the first connection protrusion 15, the coupling electrodes 23 and 24, and the second connection protrusion 19, and the internal conductor 18 is connected to the terminal electrode 21. Since it functions as the same polarity as the inner conductor 14, the equivalent series resistance of the multilayer capacitor 10 increases as the flow path of the current in the multilayer capacitor 10 becomes longer.

  For this reason, even in applications such as smoothing the output of a switching power supply with an increase in equivalent series resistance, a multilayer structure that achieves higher capacity by multilayering instead of electrolytic capacitors Capacitors can be used. That is, since the multilayer capacitor 10 according to the present embodiment increases the ESR, it can be applied to various applications including a switching power supply.

  On the other hand, according to the present embodiment, a plurality of first connection protrusions 15 and a plurality of second connection protrusions 19 are provided, and the connecting electrodes 23 and 24 that connect these are provided on the dielectric element body 12. Since a plurality of, for example, two are arranged outside, the inner conductor 14 and the inner conductor 18 are connected by these two connecting electrodes 23 and 24. As a result, the number of contact points increases and the internal conductors are securely connected to each other, so that poor contact or the like hardly occurs.

  Furthermore, according to the present embodiment, since the plurality of inner conductors 14 are laminated in the dielectric body 12, not only the ESR is increased, but the number of inner conductors 14 can be appropriately set. Since the ESR can be adjusted to an arbitrary size, the ESR can be controlled to a desired value.

Specifically, an equivalent circuit of the multilayer capacitor 10 according to the present embodiment is as shown in FIG. In this circuit diagram, C is a capacitor, R _{11 to} R _1n are equivalent resistances of the plurality of inner conductors 14, and R _{21 to} R _2n are equivalent resistances of the plurality of inner conductors 16, respectively. R _{31 to} R _3n are equivalent resistances of the plurality of inner conductors 18, and n is the number of stacked inner conductors 14, 16, 18. In FIG. 3, two internal conductors are provided, but in reality, a large number of internal conductors are laminated.

  From the above, it can be understood from this circuit diagram that ESR can be adjusted without changing the total number of layers by adding an arbitrary number of internal conductors 14 and reducing the number of other internal conductors 16 and 18 by that amount. FIG. 5 shows the amount of change in ESR depending on the number of laminated inner conductors 14 at this time. In other words, it can be understood from this drawing that the ESR changes due to the change in the number of laminated inner conductors 14.

Next, a multilayer capacitor according to a second embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the member same as the member demonstrated in 1st Embodiment, and the duplicate description is abbreviate | omitted.
As shown in FIG. 6, in the present embodiment, a pair of cut portions 31 that extend inward from the back side of the inner conductor 14 and the pair of cut portions are formed from the front side of the inner conductor 14. An inwardly extending cut portion 32 is provided so as to cut into the internal conductor 14. Therefore, by providing a plurality of the cut portions 31 and 32 in the inner conductor 14 in this way, the current flow path is elongated in a zigzag manner, and the effect of increasing the equivalent series resistance is further increased. .

Next, a multilayer capacitor according to a third embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the member same as the member demonstrated in 1st Embodiment, and the duplicate description is abbreviate | omitted.
As shown in FIG. 7, the present embodiment has a structure in which the width dimension of the portion of the inner conductor 14 excluding the first terminal protrusion 14A is narrower than the width dimension of the first terminal protrusion 14A. .

  In other words, the first terminal protrusion 14A is securely connected to the terminal electrode 21 by maintaining the width dimension of the first terminal protrusion 14A at a constant size and forming the inner conductor 14 to be narrow. However, as the current flows through the narrow inner conductor 14, the electric resistance of the inner conductor 14 is increased and the effect of increasing the equivalent series resistance is further increased.

Next, a multilayer capacitor according to a fourth embodiment of the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the member same as the member demonstrated in 1st Embodiment, and the duplicate description is abbreviate | omitted.
As shown in FIGS. 8 and 9, the inner conductor 44, which is the first inner conductor of the multilayer capacitor 40 according to the present embodiment, protrudes from the front and back end portions of the ceramic layer 12A, respectively. A total of four terminal protrusions 44A are provided. The inner conductor 44 also has a pair of first connection protrusions 45 that protrude from left and right ends, which are the ends of the ceramic layer 12A, different from the first terminal protrusion 44A. .

  The internal conductor 46 that is the second internal conductor has a total of four second terminal protrusions 46A that protrude from the front and back ends of the ceramic layer 12A. However, the second terminal protrusions 46A are arranged so as to be shifted with respect to the first terminal protrusions 44A so as not to overlap the first terminal protrusions 44A. Further, the inner conductor 48 as the third inner conductor has second connection protrusions 49 protruding from the left and right ends of the ceramic layer 12A. As shown in FIG. 9, the pair of connecting electrodes 53, 54 arranged on the left and right ends that are outside the dielectric body 12 are provided between the first connection protrusion 45 and the second connection protrusion 49. Are connected outside the dielectric body 12.

  On the other hand, as shown in FIG. 9, a total of eight terminal electrodes 51, 52 are arranged on the outside of the dielectric body 12 and can be connected to external circuits, respectively. That is, the multilayer capacitor 40 of the present embodiment is a multi-terminal multilayer capacitor, and the adjacent terminal electrodes 51 and 52 are used with opposite polarities. Specifically, it is divided into a set of terminal electrodes 51 connected to the first terminal protrusion 44A and a set of terminal electrodes 52 connected to the second terminal protrusion 46A, and each is connected to an external circuit. Will be able to.

  As described above, also in this embodiment, the internal conductor 44 connected to the terminal electrode 51 is connected to the internal conductor 48 via the first connection protrusion 45, the coupling electrodes 53 and 54, and the second connection protrusion 49. Since the inner conductor 48 functions as the same polarity as the inner conductor 44, the equivalent series resistance of the multilayer capacitor 40 increases as the flow path of the current in the multilayer capacitor 40 becomes longer. As a result, similar to the first embodiment, the multilayer capacitor 40 according to the present embodiment can be applied to various applications including a switching power supply.

Next, a multilayer capacitor according to a fifth embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the member same as the member demonstrated in 1st Embodiment, and the duplicate description is abbreviate | omitted.
As shown in FIG. 10, the present embodiment has an inner conductor 14, an inner conductor 16, and an inner conductor 18 as in the first embodiment. However, in the present embodiment, the first connecting protrusion 15 formed on the inner conductor 14 is only one protruding toward the inner end of the ceramic layer 12A, and the inner conductor 18 The number of the second connecting protrusions 19 formed in this is only one protruding toward the back end of the ceramic layer 12A.

  On the other hand, the inner conductor 16 is formed with one first connecting protrusion 17 that protrudes toward the front end of the ceramic layer 12A. In the dielectric body 12, an internal conductor 60, which is also a planar third internal conductor, is disposed below the internal conductor 18 separating the ceramic layer 12A. The internal conductor 60 includes: One second connection protrusion 61 is formed to protrude toward the front end of the ceramic layer 12A.

Further, similarly to the first embodiment shown in FIG. 2, in this embodiment (not shown), the terminal electrodes 21 and 22 are arranged on the left and right side surfaces 12B of the dielectric element body 12, and the connection electrodes 23 and 24 are disposed on the front side surface 12C and the back side surface 12C of the dielectric body 12, respectively . This connection electrode 24, which is the first connection electrode, connects the first connection protrusion 15 of the inner conductor 14 and the second connection protrusion 19 of the inner conductor 18 on the outside of the dielectric element body 12. The connecting electrode 23 , which is the second connecting electrode, is formed between the first connecting protrusion 17 of the inner conductor 16 and the second connecting protrusion 61 of the inner conductor 60 . Connected on the outside.

That is, in the present embodiment , the inner conductor 14 that is the first inner conductor is connected to the inner conductor 18 that is one third inner conductor via the connection electrode 24, and the inner conductor that is the second inner conductor. Since 16 is connected to the internal conductor 60, which is the other third internal conductor, via the connecting electrode 23 , the present embodiment also has the same effect as that of the first embodiment.

  On the other hand, the result of a test for comparing the impedance between the multilayer capacitor according to the embodiment and the conventional capacitor using an impedance analyzer is shown below. A multilayer capacitor 100 shown in FIG. 13 was used as a conventional capacitor to be compared here. On the other hand, the thing of 1st Embodiment was used, for example as a multilayer capacitor which concerns on embodiment.

  As shown in FIG. 11 showing the measurement result, the characteristic curve A representing the characteristics of the capacitor of the conventional example has a portion where the impedance is extremely lowered and resonance occurs in the vicinity where the frequency exceeds 1000 KHz. In the characteristic curve B representing the characteristics of the multilayer capacitor 10 according to the embodiment, there is no such portion and resonance does not occur.

  Moreover, as a result of measuring the equivalent series resistance value of these samples, the equivalent series resistance value of the capacitor of the conventional example was 3.0 mΩ. On the other hand, the equivalent series resistance value of the multilayer capacitor 10 according to the embodiment was 56.5 mΩ. That is, it was confirmed that the ESR of the multilayer capacitor 10 according to the embodiment is clearly increased as compared with the capacitor of the conventional example.

The ESR value is a value at the self-resonant frequency f ₀ shown in FIG. Here, in this figure, ESL is an equivalent series inductance, and C is a capacitance. Each capacitor used in the test is 3216 type, and both have a capacitance value of 10 μF. Here, the 3216 type means that the length is 3.2 mm and the width is 1.6 mm.

  On the other hand, the number of inner conductors is not limited to the number of multilayer capacitors 10 according to the above-described embodiment, and may be a larger number, or the order of the inner conductors in the stacking direction may be arbitrarily changed. Furthermore, the structure of the inner conductor is not limited to that described in the above embodiment, and for example, the number of terminal electrodes may be further increased, or the number of cut portions may be four or more.

1 is an exploded perspective view showing a multilayer capacitor according to a first embodiment of the present invention. 1 is a perspective view showing a multilayer capacitor according to a first embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating the multilayer capacitor in accordance with the first embodiment of the present invention, and corresponds to a cross section taken along line 3-3 in FIG. 2. 1 is a circuit diagram showing an equivalent circuit of a multilayer capacitor according to a first embodiment of the present invention. It is a figure which shows the graph showing the variation | change_quantity of ESR by the lamination | stacking quantity of a 1st internal conductor. It is a disassembled perspective view which shows the multilayer capacitor which concerns on the 2nd Embodiment of this invention. It is a disassembled perspective view which shows the multilayer capacitor which concerns on the 3rd Embodiment of this invention. It is a disassembled perspective view which shows the multilayer capacitor which concerns on the 4th Embodiment of this invention. It is a perspective view which shows the multilayer capacitor which concerns on the 4th Embodiment of this invention. It is a disassembled perspective view which shows the multilayer capacitor which concerns on the 5th Embodiment of this invention. It is a figure which shows the graph which compares the impedance characteristic of a prior art example and embodiment. It is a figure which shows the graph showing the impedance characteristic of a capacitor | condenser. It is a perspective view which shows the conventional multilayer capacitor. It is a disassembled perspective view which shows the conventional multilayer capacitor. It is a circuit diagram which shows the equivalent circuit of the conventional multilayer capacitor.

Explanation of symbols

10 multilayer capacitor 12 dielectric body 12A ceramic layer 14 inner conductor (first inner conductor)
15 first connecting protrusion 16 inner conductor (second inner conductor)
17 First connection protrusion 18 Inner conductor (third inner conductor)
19 Second connection protrusions 21, 22 Terminal electrodes
23 Second connecting electrode
24 first connecting electrode
60 inner conductor (third inner conductor)
61 Second connection projection

Claims (5)

A dielectric body formed by stacking dielectric layers;
At least a pair of terminal electrodes arranged outside the dielectric body and connected to an external circuit,
A first terminal protrusion that is disposed in the dielectric body and protrudes from the end of the dielectric layer and is connected to one terminal electrode, and an end of the dielectric layer different from the first terminal protrusion. A first inner conductor having a first connecting protrusion protruding therefrom;
A second terminal protrusion that is disposed in the dielectric body while being separated from the first inner conductor by the dielectric layer, protrudes from the end of the dielectric layer, and is connected to the other terminal electrode . A second inner conductor having a first connection protrusion protruding from an end of the dielectric layer different from the terminal protrusion ;
A pair of first connecting conductors each having a second connecting protrusion that is disposed in the dielectric body while being separated from the first inner conductor and the second inner conductor by the dielectric layer, and protrudes from the end of the dielectric layer. 3 inner conductors,
The outer side of the dielectric element body is disposed between the first connection protrusion of the first inner conductor and the second connection protrusion of the third inner conductor . A first connecting electrode to be connected;
Between the first connecting protrusion of the second inner conductor and the second connecting protrusion of the other third inner conductor on the outer side of the dielectric element body. A second connecting electrode to be connected;
A multilayer capacitor comprising: 2. The multilayer capacitor according to claim 1, wherein a plurality of first inner conductors and second inner conductors are laminated in the dielectric body. A plurality of first connection protrusions of the first inner conductor and a plurality of second connection protrusions of one third inner conductor are provided, and a first connection electrode connecting the first connection conductors is formed on the dielectric element body. The multilayer capacitor according to claim 1, wherein a plurality of capacitors are arranged outside.   The multilayer capacitor according to claim 1, wherein a cut portion is provided in the first inner conductor.   The width of the part of the 1st inner conductor except the protrusion part for 1st terminals was formed narrower than the width | variety of the protrusion part for 1st terminals, The Claim 1 characterized by the above-mentioned. Multilayer capacitor.

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