JP4008730B2 - 組み合わせ式高速光学粗面計及び偏光解析器 - Google Patents

組み合わせ式高速光学粗面計及び偏光解析器 Download PDF

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Publication number
JP4008730B2
JP4008730B2 JP2002085531A JP2002085531A JP4008730B2 JP 4008730 B2 JP4008730 B2 JP 4008730B2 JP 2002085531 A JP2002085531 A JP 2002085531A JP 2002085531 A JP2002085531 A JP 2002085531A JP 4008730 B2 JP4008730 B2 JP 4008730B2
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Prior art keywords
optical signal
polarized light
reflected
phase
incident
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Expired - Lifetime
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JP2002085531A
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English (en)
Japanese (ja)
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JP2002365232A5 (https=
JP2002365232A (ja
Inventor
ダブリュ．ミークス スティーブン
カディナー ラスミン
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ケーエルエー−テンコール テクノロジーズ コーポレイション
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Priority claimed from US09/818,199 external-priority patent/US20020015146A1/en
Priority claimed from US09/861,280 external-priority patent/US6757056B1/en
Application filed by ケーエルエー−テンコール テクノロジーズ コーポレイション filed Critical ケーエルエー−テンコール テクノロジーズ コーポレイション
Publication of JP2002365232A publication Critical patent/JP2002365232A/ja
Publication of JP2002365232A5 publication Critical patent/JP2002365232A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
JP2002085531A 2001-03-26 2002-03-26 組み合わせ式高速光学粗面計及び偏光解析器 Expired - Lifetime JP4008730B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/818,199 US20020015146A1 (en) 1997-09-22 2001-03-26 Combined high speed optical profilometer and ellipsometer
US09/861280 2001-05-18
US09/861,280 US6757056B1 (en) 2001-03-26 2001-05-18 Combined high speed optical profilometer and ellipsometer
US09/818199 2001-05-18

Publications (3)

Publication Number Publication Date
JP2002365232A JP2002365232A (ja) 2002-12-18
JP2002365232A5 JP2002365232A5 (https=) 2005-11-04
JP4008730B2 true JP4008730B2 (ja) 2007-11-14

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ID=27124244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002085531A Expired - Lifetime JP4008730B2 (ja) 2001-03-26 2002-03-26 組み合わせ式高速光学粗面計及び偏光解析器

Country Status (4)

Country Link
EP (1) EP1245922B1 (https=)
JP (1) JP4008730B2 (https=)
AT (1) ATE467810T1 (https=)
DE (1) DE60236337D1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6798512B2 (en) * 2001-08-09 2004-09-28 Therma-Wave, Inc. Multiple beam ellipsometer
US7224471B2 (en) * 2003-10-28 2007-05-29 Timbre Technologies, Inc. Azimuthal scanning of a structure formed on a semiconductor wafer
SE0303048L (sv) * 2003-11-17 2004-12-28 Optonova Ab Förfarande och anordning för beröringsfri avsyning och inmätning av ytegenskaper och ytdefekter på en materialyta
JP4748353B2 (ja) * 2005-08-04 2011-08-17 大日本印刷株式会社 異物検査装置
DE102007043937B4 (de) * 2006-09-13 2010-10-07 Innovent E.V. Verfahren zur Bestimmung der Dicke und des Brechungsindex von optisch transparenten Schichten auf optisch transparenten planparallelen Substraten
IL194839A0 (en) 2007-10-25 2009-08-03 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
CN102192882B (zh) * 2011-03-11 2013-01-09 山东大学 利用锁相放大器进行磁光椭偏测量的测量方法
US12416580B2 (en) 2018-05-07 2025-09-16 Unm Rainforest Innovations Method and system for in-line optical scatterometry
US11473901B2 (en) 2018-05-29 2022-10-18 Hitachi High-Tech Corporation Height measurement device in which optical paths projected on the sample at different incidence angles
US11043239B2 (en) * 2019-03-20 2021-06-22 Kla Corporation Magneto-optic Kerr effect metrology systems
WO2021087345A1 (en) * 2019-11-01 2021-05-06 Unm Rainforest Innovations In-line angular optical multi-point scatterometry for nanomanufacturing systems
CN115388765B (zh) * 2022-08-10 2023-10-24 睿励科学仪器（上海）有限公司 用于椭偏量测系统的自动聚焦装置
JP2025044916A (ja) * 2023-09-20 2025-04-02 株式会社Ｓｃｒｅｅｎホールディングス 観察装置、観察方法および基板処理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4585348A (en) * 1981-09-28 1986-04-29 International Business Machines Corporation Ultra-fast photometric instrument
US4674875A (en) 1983-12-09 1987-06-23 Hitachi, Ltd. Method and apparatus for inspecting surface defects on the magnetic disk file memories
US4906844A (en) * 1988-08-12 1990-03-06 Rockwell International Corporation Phase sensitive optical monitor for thin film deposition
JP3140664B2 (ja) 1995-06-30 2001-03-05 松下電器産業株式会社 異物検査方法及び装置
US5694214A (en) 1996-01-08 1997-12-02 Hitachi Electronics Engineering Co., Ltd. Surface inspection method and apparatus
NL1006016C2 (nl) * 1997-05-09 1998-11-10 Univ Delft Tech Ellipsometer met twee lasers.
JPH112512A (ja) 1997-06-11 1999-01-06 Super Silicon Kenkyusho:Kk ウェーハの光学式形状測定器
US6134011A (en) 1997-09-22 2000-10-17 Hdi Instrumentation Optical measurement system using polarized light
US6157444A (en) 1997-11-28 2000-12-05 Hitachi, Ltd. Defect inspection apparatus for silicon wafer

Also Published As

Publication number Publication date
EP1245922B1 (en) 2010-05-12
ATE467810T1 (de) 2010-05-15
EP1245922A1 (en) 2002-10-02
DE60236337D1 (de) 2010-06-24
JP2002365232A (ja) 2002-12-18

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