JP4004754B2 - Embossed carrier tape for storing electronic components - Google Patents
Embossed carrier tape for storing electronic components Download PDFInfo
- Publication number
- JP4004754B2 JP4004754B2 JP2001211777A JP2001211777A JP4004754B2 JP 4004754 B2 JP4004754 B2 JP 4004754B2 JP 2001211777 A JP2001211777 A JP 2001211777A JP 2001211777 A JP2001211777 A JP 2001211777A JP 4004754 B2 JP4004754 B2 JP 4004754B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- embossed
- electronic components
- embossed carrier
- storing electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
【０００１】
【発明の属する技術分野】
本発明は電子部品の包装、特にQFP(Quad Flat Package)と呼ばれる電子部品の包装 及び 搬送に用いられる電子部品収納用エンボスキャリアテープに関するものである。
【０００２】
【従来の技術】
これまで本発明に関連するQFP(Quad Flat Package)の多くは、１枚の中に多くのリセスを有するトレーを使用し保管、または搬送が行われていた。最近の電子部品実装工程の高速化の要求からエンボスキャリアテープによるQFPデバイスの包装が求められている。
このような中、デバイス本体の左右動を抑制する２対のリブ（細長い突起部）と、リード部をエンボスポケット部底から浮かせる底上げ部が一体となっている形状のエンボスキャリアテープ、或いはデバイスの４箇所の角で位置決め、サポートする形状のエンボスキャリアテープが提案されている。
【０００３】
【発明が解決しようとする課題】
デバイスの左右動を抑制する２対のリブとリード部をエンボス部底から浮かせる底上げ部が一体となっている形状の場合、エンボス部の成形状態によっては、底上げ部からリブ部へつながるコーナー部分の丸みが大きくなり、デバイスが底上げ（底支持部）から一部浮き上がった状態となり十分な位置決め効果が得られずにリードの曲がり等が発生する、或いはエンボスポケット部からデバイスの頭が飛び出しテーピング時のガイド部分、或いは実装時のガイド部分に接触してしまうという問題の発生することが考えられる。
【０００４】
さらに、リブ部と底上げ部が一体となることにより、エンボス部を成形する際にリブ中央部付近で材料の流動特性により、リブ中央部の厚みが厚くなり、QFP(Quad Flat Package)でも厚みの薄いLQFP、TQFPと呼ばれるデバイスへの適用が難しかった。
【０００５】
また、デバイスの４箇所の角で位置決めする場合は、搬送時の衝撃等によりデバイスがエンボスポケット内で回転し、４箇所のコーナー部に一番近いリードが水平方向に曲がってしまうという問題の発生することが考えられる。
【０００６】
【課題を解決するための手段】
上記目的を達成する為、請求項１に記載の発明は、エンボス凹部が長手方向に一定の間隔で形成されているエンボスキャリアテープにおいて、エンボス底部からテープ長手方向、幅方向にそれぞれ対向する２対のリブ部を形成し、かつ本リブとは一定の間隔で隔てられた複数の底上げ部が形成された形状とした。
【０００７】
【発明の実施の形態】
以下、本発明の実施の形態を図面を参照して説明する。
図１から２は本発明を適用したエンボスキャリアテープを示し、図１は平面図、図２がＡ−Ａ断面図、図３から４は従来のリブ部と底上げ部が一体となっているエンボスキャリアテープを示し、図３が平面図、図４がＡ−Ａ断面図を示す。
【０００８】
【発明の効果】
以上説明したように、本発明によるエンボスキャリアテープにおいてデバイス本体が横方向に移動しないようを支持するリブ部とリードをポケット底部から一定の距離を設けるようにデバイス本体を上下方向に支持する底上げ部をそれぞれ独立して設ける事により、エンボスポケット部の成形状態が変化した場合であっても常に底上げ部より上方に位置するリブは正常な形状を保つことが可能となりリードの損傷を防止し またリードの汚染を防止する形状のエンボス部を安定して形成することが可能となる。
【０００９】
またリブの分割が可能となることからリブ自身の太さをそれぞれのデバイス寸法に合せたサイズに自由に設計することが可能となり、薄いQFP(Quad Flat Package)であるLQFP、TQFPに対しても同様の効果をもったエンボスキャリアテープを提供することが可能となる。
【図面の簡単な説明】
【図１】 本発明のエンボスキャリアテープの平面図
【図２】 本発明のエンボスキャリアテープのＡ−Ａ断面図
【図３】 従来のエンボスキャリアテープの平面図
【図４】 従来のエンボスキャリアテープのＡ−Ａ断面図[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an embossed carrier tape for storing electronic components used for packaging of electronic components, particularly packaging and transport of electronic components called QFP (Quad Flat Package).
[0002]
[Prior art]
Many QFPs (Quad Flat Packages) related to the present invention have been stored or transported using trays having many recesses in one sheet. QFP device packaging with embossed carrier tape is required due to recent demands for speeding up electronic component mounting processes.
Under such circumstances, an embossed carrier tape having a shape in which two pairs of ribs (elongated protrusions) for suppressing the lateral movement of the device main body and a bottom raised portion for floating the lead portion from the bottom of the embossed pocket portion are integrated. An embossed carrier tape having a shape that is positioned and supported at four corners has been proposed.
[0003]
[Problems to be solved by the invention]
In the case of a shape in which two pairs of ribs that suppress left-right movement of the device and a bottom raised part that floats the lead part from the bottom of the embossed part are integrated, depending on the molding state of the embossed part, The roundness becomes larger and the device is partly lifted from the bottom (bottom support), resulting in insufficient positioning effect and bending of the lead, or the head of the device jumps out of the embossed pocket, It is conceivable that a problem of contact with the guide portion or the guide portion during mounting may occur.
[0004]
Furthermore, when the embossed part is molded, the rib part and the bottom raised part are integrated, so that the thickness of the rib central part increases due to the flow characteristics of the material near the central part of the rib, and the thickness of the QFP (Quad Flat Package) also increases. It was difficult to apply to thin LQFP and TQFP devices.
[0005]
In addition, when positioning at the four corners of the device, there is a problem that the device rotates in the emboss pocket due to impact during transportation and the lead closest to the four corners is bent in the horizontal direction. It is possible to do.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the invention described in claim 1 is an embossed carrier tape in which embossed recesses are formed at regular intervals in the longitudinal direction, and two pairs facing each other in the tape longitudinal direction and the width direction from the embossed bottom. The rib portion is formed, and a plurality of raised portions are formed that are separated from the main rib at a constant interval.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIGS. 1 and 2 show an embossed carrier tape to which the present invention is applied. FIG. 1 is a plan view, FIG. 2 is a cross-sectional view taken along the line AA, and FIGS. 3 shows a carrier tape, FIG. 3 is a plan view, and FIG. 4 is an AA cross-sectional view.
[0008]
【The invention's effect】
As described above, in the embossed carrier tape according to the present invention, the rib portion for supporting the device body not to move in the lateral direction and the bottom raising portion for supporting the device body in the vertical direction so as to provide a certain distance from the pocket bottom of the lead. By providing each independently, even if the molding state of the embossed pocket changes, the ribs located above the bottom raised part can always maintain a normal shape and prevent damage to the leads. It is possible to stably form an embossed portion having a shape that prevents contamination of the substrate.
[0009]
In addition, since ribs can be divided, the rib itself can be freely designed to match the size of each device, and even for thin QFP (Quad Flat Package) LQFP and TQFP It is possible to provide an embossed carrier tape having the same effect.
[Brief description of the drawings]
FIG. 1 is a plan view of an embossed carrier tape of the present invention. FIG. 2 is a cross-sectional view of the embossed carrier tape of the present invention taken along line AA. FIG. 3 is a plan view of a conventional embossed carrier tape. AA cross section of
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001211777A JP4004754B2 (en) | 2001-07-12 | 2001-07-12 | Embossed carrier tape for storing electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001211777A JP4004754B2 (en) | 2001-07-12 | 2001-07-12 | Embossed carrier tape for storing electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003026280A JP2003026280A (en) | 2003-01-29 |
| JP4004754B2 true JP4004754B2 (en) | 2007-11-07 |
Family
ID=19047035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001211777A Expired - Fee Related JP4004754B2 (en) | 2001-07-12 | 2001-07-12 | Embossed carrier tape for storing electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4004754B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6087518B2 (en) | 2012-05-14 | 2017-03-01 | 信越化学工業株式会社 | Thermally conductive sheet supplier and thermal conductive sheet supply method |
-
2001
- 2001-07-12 JP JP2001211777A patent/JP4004754B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003026280A (en) | 2003-01-29 |
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