JP3991959B2 - Solid sample surface analyzer - Google Patents

Description

  The present invention relates to various types of analyzers for analyzing the surface of a solid sample, such as an emission analyzer and a laser ICP (inductively coupled plasma) analyzer that detect and analyze light from a sample by emitting light by discharge.

An emission analysis apparatus as an example of a solid sample surface analysis apparatus performs discharge and analysis by switching discharge specifications such as spark discharge and arc discharge depending on the shape and material of the sample. When analyzing a solid sample, the sample is placed in the analysis gap and discharged by flowing a high current. However, if a discharge is performed on a defective part of the sample surface, the emission level is different from the normal part, and an accurate analysis is performed. I can't.
In order to detect the presence or absence of a defect on the sample surface, a predetermined position on the sample surface is analyzed, and whether or not the analysis position of the sample is a defective part is determined based on the result, A method is used in which a determined position is irradiated by a reflective sensor before analysis, and whether or not the corresponding position is a defective part is determined by the input signal.

When the sample surface is analyzed once and a defective portion is detected based on the result, both the defective portion and the normal portion must be analyzed. Therefore, useless analysis is required and the analysis time becomes long. In addition, since only a predetermined position can be determined, there are cases where the number of positions that can be analyzed decreases. Even if there is a defect only in a part of the sample surface, if the defective part happens to be at a predetermined analysis position, an analysis result cannot be obtained.
Detection of a defective portion by a reflective sensor has low accuracy.
As described above, the conventional method often results in a defective sample, and it is often necessary to collect the sample again and reanalyze it.

  Therefore, an object of the present invention is to improve the efficiency of analysis by detecting a defective portion on a sample surface.

  The analysis apparatus of the present invention includes an analysis unit that analyzes the surface of a solid sample, and image analysis means that detects an image of the analysis surface of the sample and detects a defective portion. When the analysis unit performs analysis, the image analysis is performed. The analysis is performed at the analysis position extracted based on the defect part information detected by the means.

  Further, the image analysis means can take a sample surface using a CCD camera as an imaging unit, for example, and detect a defective portion of the sample surface based on a difference in luminance from a normal portion.

  The installation position of the sample to be analyzed by the analysis unit is different from the installation position of the sample at the time of imaging in the image analysis means, and further includes a transport mechanism for transferring between the two sample installation positions. It is preferable that the transport mechanism is configured to position the sample in the analysis unit so that the analysis is performed at the analysis position extracted by the image analysis means.

  Since the sample surface is imaged and a defective part is detected by image analysis, and the analysis position is extracted and analyzed so as to avoid the defective part, the defect part is not analyzed and the analysis time can be shortened. it can. In addition, since the analysis position is controlled to be limited to the normal portion of the sample surface, it is possible to obtain a normal analysis result from the minimum necessary normal portion even for a sample having a defective portion. .

  As an example, as a detecting means for detecting a defect, an image of the sample surface is taken using a CCD camera, and the analysis process of the image is performed to detect the defective portion due to a difference in luminance between the normal portion and the defective portion. A description will be given by taking an emission analysis apparatus using a detection device and using a robot arm as a transport mechanism.

FIG. 1 is a block diagram schematically showing an embodiment.
The emission analyzer includes an analysis unit 2 having discharge electrodes, an imaging unit 10 having a CCD camera 4, a lamp 6 and a shielding cover 8 provided in the vicinity of the analysis unit 2, and a sample. The robot arm 12 serving as a transporting mechanism, the CCD camera 4, the robot arm 12, and the analysis unit 2 are connected to perform analysis processing of image data from the CCD camera 4, and the operation of the robot arm 12 based on the result. And a personal computer 14 (PC) as a control device for controlling the analysis unit 2.

In the imaging unit 10, a CCD camera 4 is installed upward in order to take an image of the sample surface, and a lamp 6 is installed on the side of the CCD camera 4 so as to irradiate the entire surface so that there is no shadow on the sample surface. Yes. Further, the imaging unit 10 is surrounded by a shielding cover 8 that prevents incidence of light that interferes with photographing.
Image data captured by the CCD camera 4 is transmitted to the personal computer 14. The personal computer 14 performs image analysis on the image data of the sample surface captured from the imaging unit 10 to detect a defective portion on the entire sample surface, extracts an analysis position based on the defect portion information, and coordinates of the extracted analysis position The robot arm 12 is controlled and moved based on the above to position the sample.

  The personal computer 14 controls the analysis unit 2 and the robot arm 12 so that the sample held by the robot arm 12 is analyzed at the analysis position extracted based on the defect portion information. At this time, the coordinates of the analysis position are associated with the position coordinates of the robot arm 12, so that the extracted analysis position can be analyzed accurately.

  Image analysis is performed as shown in FIG. (A) is the image data of the sample surface taken in from the imaging unit 10. 20 is the entire sample surface, and 22 is a defect. A plurality of analysis candidate ranges 24 are set on the sample surface 20 as shown in (B), and whether or not each analysis candidate range 24 is suitable for analysis is determined by image analysis. This determination is made by comparing the luminance in each analysis candidate range 24 with the luminance of the normal part, and comparing the ratio (%) of the defective portion in the analysis candidate range with the set value, thereby determining whether the analysis candidate range 24 is appropriate. Determine. A range 24 that does not overlap each other is extracted from the analysis candidate ranges 24 in which the proportion of the defective portion is equal to or less than the set value, and is recognized as the analysis position 24a as shown in (C), and based on the result. The robot arm 12 is controlled.

The setting of the analysis candidate range 24 is determined by determining the optimum position (radius r) for analysis from the radius of the entire sample surface or the like based on the result of image analysis.
Parameters such as the number of analysis positions 24a, the radius r for setting the analysis position, the degree of overlap with other analysis positions, and the set value (%) as a criterion for determining whether or not the analysis position is appropriate are arbitrarily set by the operator. can do.

FIG. 3 is a block diagram schematically showing the configuration of the embodiment.
The operator holds the sample on the robot arm 12, sets various parameters, and inputs analysis start to the personal computer 14. The personal computer 14 controls the robot arm 12 based on an instruction from the operator and transports the sample to the imaging unit 10. In the imaging unit 10, the entire sample surface is irradiated with light from the lamp 6, and the image is taken by the CCD camera 4. The photographed image of the sample surface is taken into the personal computer 14 as data and subjected to image analysis, and a defective portion is detected based on a difference in luminance from the normal portion. The personal computer 14 extracts the analysis position based on the defect part information obtained by the image analysis, moves the robot arm 12 to the analysis part 2 to analyze the analysis position, and performs analysis at the analysis position. Control and capture analysis data.

The coordinates of each analysis position 24a are associated with the analysis position of the robot in advance, and the extracted analysis position can be analyzed accurately.
When the analysis of one analysis position is completed, the robot arm 12 is controlled to position the sample in order to analyze the next analysis position, and the analysis position is analyzed. Thereafter, the analysis is repeated until the analysis of all the extracted analysis positions is completed.

FIG. 4 is a flowchart schematically showing the operation of the embodiment again.
The robot arm 12 holding the sample moves the sample to the imaging unit 10, and the imaging unit 10 images the sample surface (step S1). The captured image data is taken into the personal computer 14, and a defective portion is detected based on a difference in luminance from the normal portion (step S2). Several analysis positions are extracted by detecting the defective part (step S3). The personal computer 14 controls the robot arm 12 based on the coordinates of the analysis position and positions the sample so as to analyze the analysis position (step S4). When the positioning of the sample is completed, the analysis electrode of the analysis unit 2 is discharged and analysis is performed (step S5). When the analysis is completed at one analysis position, the robot arm 12 is moved so as to analyze the next analysis position, and the sample is positioned and analyzed. In this way, the positioning and analysis operations are repeated until all analysis positions are analyzed, and when the analysis of all analysis positions is completed, the analysis of the sample is completed (step S6).

The image acquisition of the sample surface may be performed manually. At that time, it is also possible to manually adjust the entire sample surface to be reflected on the monitor while checking the image from the CCD camera 4 on the monitor of the personal computer 14.
In the embodiment, the operator inputs all parameters, but some of them may be automatically determined and set. For example, the diameter of the sample surface is obtained by image analysis, and the radius r determining the analysis candidate range 24 is determined based on the image analysis result obtained for the defective portion so that the most analysis positions 24a can be obtained. Thus, the analysis can be automatically started.

It is a schematic block diagram which shows one Example. It is a figure for demonstrating extraction of the analysis position in the sample surface of the Example. It is a block diagram which shows the same Example. It is a flowchart figure which shows the operation | movement of the Example.

Explanation of symbols

2 Analyzing unit 4 CCD camera 6 Lamp 8 Shielding cover 10 Imaging unit 12 Robot arm 14 Personal computer 20 Sample surface 22 Defect unit 24 Analysis candidate range 24a Analysis position

Claims (3)

An analysis unit that analyzes the surface of the solid sample, and an image analysis unit that detects the defective portion by imaging the analysis surface of the sample,
When analyzing by the analysis unit, a radius for setting an analysis position is calculated based on the radius of the entire sample surface detected by the image analysis means, and a plurality of analysis candidate ranges are formed on a circumference having the calculated radius. set, optical emission spectrometer being characterized in that to carry out the analysis in a plurality of analysis location extracted from among the analysis candidate range based on the detected defect information by the image analysis means. The extraction of the analysis position is performed so that the analysis position is based on the defect part information detected by the image analysis unit so that the ratio of the defect part in the analysis candidate range is equal to or less than a set value. The luminescence analyzer as described. The installation position of the sample to be analyzed by the analysis unit is different from the installation position of the sample at the time of imaging in the image analysis means, and further includes a transport mechanism for transferring between the two sample installation positions,
The image analysis means performs until the analysis position is extracted,
The emission analysis apparatus according to claim 1, wherein the transport mechanism also positions a sample in the analysis unit so as to perform analysis at an analysis position extracted by the image analysis unit.

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