JP3986047B2 - 事前のパターニングを有する、マイクロメカニカルおよびマイクロオプトメカニカルな構造物を製造するための方法 - Google Patents

事前のパターニングを有する、マイクロメカニカルおよびマイクロオプトメカニカルな構造物を製造するための方法 Download PDF

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Publication number
JP3986047B2
JP3986047B2 JP2001360360A JP2001360360A JP3986047B2 JP 3986047 B2 JP3986047 B2 JP 3986047B2 JP 2001360360 A JP2001360360 A JP 2001360360A JP 2001360360 A JP2001360360 A JP 2001360360A JP 3986047 B2 JP3986047 B2 JP 3986047B2
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layer
single crystal
crystal silicon
etching
patterning
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Expired - Fee Related
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JP2001360360A
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Japanese (ja)
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JP2002283296A (ja
JP2002283296A5 (enExample
Inventor
アール シャーフ ブルース
エム ガルヴィン ピーター
シェン ジンカン
エイ カビィ ジョエル
チア リン チュアン
ティー トゥラン アレックス
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Xerox Corp
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Xerox Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Element Separation (AREA)
JP2001360360A 2000-11-27 2001-11-27 事前のパターニングを有する、マイクロメカニカルおよびマイクロオプトメカニカルな構造物を製造するための方法 Expired - Fee Related JP3986047B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/724,506 US6479311B1 (en) 2000-11-27 2000-11-27 Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning
US09/724,506 2000-11-27

Publications (3)

Publication Number Publication Date
JP2002283296A JP2002283296A (ja) 2002-10-03
JP2002283296A5 JP2002283296A5 (enExample) 2004-11-11
JP3986047B2 true JP3986047B2 (ja) 2007-10-03

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JP2001360360A Expired - Fee Related JP3986047B2 (ja) 2000-11-27 2001-11-27 事前のパターニングを有する、マイクロメカニカルおよびマイクロオプトメカニカルな構造物を製造するための方法

Country Status (4)

Country Link
US (1) US6479311B1 (enExample)
EP (1) EP1213260B1 (enExample)
JP (1) JP3986047B2 (enExample)
DE (1) DE60128440T2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6506620B1 (en) * 2000-11-27 2003-01-14 Microscan Systems Incorporated Process for manufacturing micromechanical and microoptomechanical structures with backside metalization
US20040240034A1 (en) * 2001-11-30 2004-12-02 Scharf Bruce R. Diffraction compensation using a patterned reflector
US6755982B2 (en) * 2002-01-07 2004-06-29 Xerox Corporation Self-aligned micro hinges
US7067355B2 (en) * 2004-05-26 2006-06-27 Hewlett-Packard Development Company, L.P. Package having bond-sealed underbump
US20090088618A1 (en) 2007-10-01 2009-04-02 Arneson Michael R System and Method for Manufacturing a Swallowable Sensor Device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6149190A (en) 1993-05-26 2000-11-21 Kionix, Inc. Micromechanical accelerometer for automotive applications
DE4318466B4 (de) 1993-06-03 2004-12-09 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Sensors
US5476819A (en) 1993-07-26 1995-12-19 Litton Systems, Inc. Substrate anchor for undercut silicon on insulator microstructures
US5589083A (en) 1993-12-11 1996-12-31 Electronics And Telecommunications Research Institute Method of manufacturing microstructure by the anisotropic etching and bonding of substrates
US5660680A (en) 1994-03-07 1997-08-26 The Regents Of The University Of California Method for fabrication of high vertical aspect ratio thin film structures
US5645684A (en) 1994-03-07 1997-07-08 The Regents Of The University Of California Multilayer high vertical aspect ratio thin film structures
US5484073A (en) 1994-03-28 1996-01-16 I/O Sensors, Inc. Method for fabricating suspension members for micromachined sensors
US5569355A (en) 1995-01-11 1996-10-29 Center For Advanced Fiberoptic Applications Method for fabrication of microchannel electron multipliers
US6084257A (en) 1995-05-24 2000-07-04 Lucas Novasensor Single crystal silicon sensor with high aspect ratio and curvilinear structures
SE9502258D0 (sv) 1995-06-21 1995-06-21 Pharmacia Biotech Ab Method for the manufacture of a membrane-containing microstructure
DE19603829A1 (de) 1996-02-02 1997-08-07 Daimler Benz Ag Verfahren zur Herstellung von mikromechanischen Strukturen aus Silizium
US6074890A (en) * 1998-01-08 2000-06-13 Rockwell Science Center, Llc Method of fabricating suspended single crystal silicon micro electro mechanical system (MEMS) devices
US5853960A (en) 1998-03-18 1998-12-29 Trw Inc. Method for producing a micro optical semiconductor lens
US6117344A (en) 1998-03-20 2000-09-12 Borealis Technical Limited Method for manufacturing low work function surfaces
US6002507A (en) * 1998-12-01 1999-12-14 Xerox Corpoation Method and apparatus for an integrated laser beam scanner
US6014240A (en) 1998-12-01 2000-01-11 Xerox Corporation Method and apparatus for an integrated laser beam scanner using a carrier substrate
US6238581B1 (en) 1998-12-18 2001-05-29 Eastman Kodak Company Process for manufacturing an electro-mechanical grating device

Also Published As

Publication number Publication date
JP2002283296A (ja) 2002-10-03
EP1213260A3 (en) 2004-06-16
EP1213260A2 (en) 2002-06-12
DE60128440D1 (de) 2007-06-28
EP1213260B1 (en) 2007-05-16
US6479311B1 (en) 2002-11-12
DE60128440T2 (de) 2008-01-24

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