JP3982126B2 - Refrigerant cooling type power control device - Google Patents

Refrigerant cooling type power control device Download PDF

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Publication number
JP3982126B2
JP3982126B2 JP33978199A JP33978199A JP3982126B2 JP 3982126 B2 JP3982126 B2 JP 3982126B2 JP 33978199 A JP33978199 A JP 33978199A JP 33978199 A JP33978199 A JP 33978199A JP 3982126 B2 JP3982126 B2 JP 3982126B2
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power control
refrigerant
cooling
plate portion
cooling body
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JP2001156482A (en
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孝史 鳥井
山本　　憲
訓孝 秋山
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Description

【０００１】
【発明の属する技術分野】
本発明は、冷媒が冷媒冷却型電力制御装置収容ケ−ス内を流れて内部の大発熱部品を冷却する冷媒冷却型電力制御装置に関する。
【０００２】
【従来の技術】
近年、電気自動車やハイブリッド車では、走行用モ−タやエアコン用コンプレッサ駆動モ−タなどの制御に大電力のスイッチング制御が要求され、これを行う電力制御装置の発熱が問題となっている。また、通常のエンジン駆動車でもエミッション低減や燃費向上の観点からアイドルストップが要望されており、アイドルストップ時の空調のためにエアコン用コンプレッサのモータ駆動が必要となり、上記と同様にその電力制御のための電力制御装置の発熱が問題となっている。
【０００３】
この種の半導体装置の冷却に冷媒を用いることはたとえば下記の公報などで公知となっている。すなわち、特開平７−３３６０７８号公報は、発熱体（半導体チップ）が密閉された発熱体パッケ−ジの一主面に密着して、冷媒が流れる冷却体を設け、更に、これら発熱体パッケ−ジ及び冷却体（コ−ルドプレ−ト）を断熱材で被覆した構造を開示している。
【０００４】
車載の電力制御装置では、車両がエアコン用の冷凍サイクル装置を搭載し、その冷媒を流用できるため、システムの複雑化を抑止しつつ電力制御装置の冷媒冷却が実現するため、実現可能性が高いと予想されている。
【０００５】
【発明が解決しようとする課題】
しかしながら、上記した公報の冷媒冷却ＩＣパッケ−ジのように、従来の冷媒冷却方式は発熱体パッケ−ジ（回路又はチップを収容するモジュ−ル）の頂面（上面）に冷媒が流通する冷却体を載置、密着して行われる。これは、電子回路部品である発熱体パッケ−ジが基板の配線と接続される端子を底面（下面）すなわち基板側にもつため、こちらから冷却できないためである。
【０００６】
このため、従来の冷媒冷却方式では、冷却体が発熱体パッケ−ジの上面に固定されるため、この冷却体への冷媒配管が基板上を中空配管されることになり、部品やブスバ−などを配置する場合の障害となって高密度実装を妨げていた。また、冷媒配管の支持構造が必要となり、配管引き回しも面倒であった。更に、冷却体を発熱体パッケ−ジに安定に固定するための工夫も必要であった。更にその上、冷却体の底面以外の部分は空気に露出するため冷熱が周囲の空気などに逸散したり、結露を生じたりする結果、それらを防止するために冷却体の底面以外を厚い断熱材で被覆する必要が生じ、発熱体パッケ−ジ上方空間がこれら冷却体や断熱材で占有され、発熱体パッケ−ジ直上やその周囲に他の回路部品を配置することが妨げられるという問題も生じた。たとえば、モ−タ制御用のインバ−タ用モジュ−ルについて説明すれば、このインバ−タ用モジュ−ル上には電力平滑コンデンサを配置してインバ−タ用モジュ−ルとその直上の電力平滑コンデンサとの配線距離の短縮を図り、配線抵抗損失の低減及び配線インダクタンスの低減によるスイッチングサ−ジノイズ電圧の低減を図ることが重要であるが、このような回路部品の二階建配置は実現が困難であった。
【０００７】
本発明は従来の冷媒冷却電力制御装置の上記問題点に鑑みなされたものであり、回路部品配置や配線引き回しの自由度の低下を回避しつつ大発熱部品の良好な冷却を実現可能な冷媒冷却型電力制御装置を提供することを、その目的としている。
【０００８】
【課題を解決するための手段】
請求項１記載の冷媒冷却型電力制御装置によれば、冷却体（コ−ルドプレ−ト）は、ケ−ス内の冷却べき大発熱部品、たとえばパワ−モジュ−ル、トランス、コンデンサなどの直下に位置して、ケ−スの底板部に設けられた凹部に配設され、この大発熱部品の底面に直接又は伝熱用金属板を通じて密接される。
【０００９】
このようにすれば、回路部品配置や配線引き回しの自由度の低下を回避しつつ大発熱部品の良好な冷却を実現可能な冷媒冷却型電力制御装置を実現することができる。
【００１０】
更に説明する。
【００１１】
本構成によれば、冷却体やそれに冷媒を流通させる冷媒配管が回路部品収容用のケ−ス自体に内蔵されるので、ケ−ス内の部品配置やブスバ−引き回しの障害となることがない。
【００１２】
また、冷媒配管がケ−ス内に露出したり、延設されたりすることがないので、冷媒配管構造中空支持構造やその断熱被覆構造が不必要となり、ケ−ス内の部品配置、配線引き回しが自由になる。なお、この冷媒配管は、ケ−ス内に露出したり、引き回す場合、必ず断熱材で被覆されねばならない。これは冷たい冷媒配管表面に空気が接触すると結露が生じ、この結露水分が滴下したりしてショ−トや腐食などの問題が発生するためである。これに対し、本構成では、冷却体は伝熱用金属板又は大発熱部品とケ−スとによってケ−ス内空間から遮断されるために、ケ−ス内の空気に結露が生じることが一切ない。また、ケ−スの底板部内に埋設された冷却体への冷媒配管は当然、底板部を通じて外部へ抜けることができ、冷媒配管の断熱も必要ではない。ただし、本構成は、冷媒配管の底板部への埋設に限定されるものではない。
【００１３】
また、本構成では、冷却体の有効冷却面以外の面がケ−スにより断熱囲覆されるので、冷却体の断熱被覆部材なしに冷却体を空気から遮断することができ、簡素な構成で結露及び冷熱損失を防止することができる。
【００１４】
更に、本構成では、大発熱部品の直上及びその周辺空間が空くので、部品を二階建構造（高さ方向二重配置）とすることができ、高密度実装及び配線短縮を実現することができる。
【００１５】
請求項２記載の冷媒冷却型電力制御装置において、冷却体（コ−ルドプレ−ト）は、ケ−ス内の冷却べき大発熱部品、たとえばパワ−モジュ−ル、トランス、コンデンサなどの直上に位置して、ケ−スの蓋部に設けられた凹部に配設され、この大発熱部品の頂面に直接又は伝熱用金属板を通じて密接される。
【００１６】
このようにすれば、回路部品配置や配線引き回しの自由度の低下を回避しつつ大発熱部品の良好な冷却を実現可能な冷媒冷却型電力制御装置を実現することができる。
【００１７】
更に説明する。
【００１８】
本構成によれば、冷却体やそれに冷媒を流通させる冷媒配管が回路部品収容用のケ−ス自体に内蔵されるので、ケ−ス内の部品配置やブスバ−引き回しの障害となることがない。
【００１９】
また、冷媒配管がケ−ス内に露出したり、延設されたりすることがないので、冷媒配管構造中空支持構造やその断熱被覆構造が不必要となり、ケ−ス内の部品配置、配線引き回しが自由になる。なお、この冷媒配管は、ケ−ス内に露出したり、引き回す場合、必ず断熱材で被覆されねばならない。これは冷たい冷媒配管表面に空気が接触すると結露が生じ、この結露水分が滴下したりしてショ−トや腐食などの問題が発生するためである。これに対し、本構成では、冷却体は伝熱用金属板又は大発熱部品とケ−スとによってケ−ス内空間から遮断されるために、ケ−ス内の空気に結露が生じることが一切ない。また、ケ−スの蓋部内に埋設された冷却体への冷媒配管は当然、蓋部を通じて外部へ抜けることができ、冷媒配管の断熱も必要ではない。ただし、本構成は、冷媒配管の蓋部への埋設に限定されるものではない。
【００２０】
また、冷却体の有効冷却面以外の面がケ−スにより断熱囲覆されるので、冷却体の断熱被覆部材なしに冷却体を空気から遮断することができ、簡素な構成で結露及び冷熱損失を防止することができる。
【００２１】
また、底板部に固定される大発熱部品と底板部との間の空間を空けることができ、部品を二階建構造（高さ方向二重配置）にすることができ、高密度実装及び配線短縮を実現することができる。
【００２２】
更に、回路部品群は底板部側に、冷却体及び冷媒配管を蓋部側に分けるので、回路部品点検や交換などにおいて、固定された蓋部から回路部品が収容された底板部を自由に分離することができ、作業が極めて簡単となる。また、冷却蓋部はそのままとして、回路部品を底板部とともに一挙に交換することもでき、修理作業を簡単化することができる。
【００２３】
なお、本明細書でいうケ−スの配置姿勢は自由であり、通常の底板部の上方に蓋部が位置する基本姿勢の他に、底板部及び蓋部は垂直又は斜めに配置されてもよく、あるいは蓋部が底板部の直下に配置されてもよい。したがって、本明細書でいう上又は下という用語は、ケ−スに上記基本姿勢を与えた場合の相対空間位置関係を意味するものである。
【００２４】
請求項３記載の構成によれば請求項１又は２記載の冷媒冷却型電力制御装置において更に、ケ−スの少なくとも凹部を含む部分は、樹脂成形部材からなる。
【００２５】
このようにすれば、冷却体や冷却体近傍の冷媒配管の断熱及び結露防止のための断熱構造が簡素となる。
【００２６】
請求項４記載の構成によれば請求項３記載の冷媒冷却型電力制御装置において更に、ケ−スの底板部又は蓋部は、側板部とともに樹脂成形された平板状の内板部と、内板部の外主面に密着された平板状の外板部とからなり、凹部は、内板部に貫設されて外側開口を外板部で閉鎖された開口部からなる。
【００２７】
すなわち、本構成では、孔あきの内板部の外主面に外板部を密着して、冷却体収容用の凹部を形成するので、ケ−スが大型であっても、インサ−ト成形なしに冷却体埋設ケ−スを実現でき、更に、冷却体はケ−スの外方から上記開口に挿入できるので、ケ−スに回路部品を実装した後で冷却体を埋設したり、外板部を取り外して点検したりすることができ、利便性を向上することができる。
【００２８】
請求項５記載の構成によれば請求項４記載の冷媒冷却型電力制御装置において更に、外板部は、開口部に面して冷却体に当接する突起部を有するので、冷却体と外板部との間の伝熱抵抗を増大することができ、冷却体の望ましくない冷熱損失を低減することができる。
【００２９】
請求項６記載の構成によれば請求項４又は５記載の冷媒冷却型電力制御装置において更に、伝熱用金属板は、内板部に埋設されて開口部の内側開口を閉鎖するので、冷却体とケ−ス内部の空気との接触が完全に遮断され、冷却体を収容する凹部に結露水が溜まったりすることがない。
【００３０】
請求項７記載の構成によれば請求項１乃至６のいずれか記載の冷媒冷却型電力制御装置において更に、冷却体は、冷凍サイクル装置の蒸発器の一部をなし、空調で吸熱して加温された冷媒を再利用して制御装置を冷却することができ、空調用の冷媒を有効活用することができる。
【００３１】
請求項８記載の構成によれば請求項１乃至７のいずれか記載の冷媒冷却型電力制御装置において更に、ケ−ス内の電力制御回路は、ケ−ス内の所定部位の温度、好ましくは大発熱部品の温度を検出し、この温度に基づいて冷却体への冷媒流量を制御するので、冷却装置用電力損失の無駄がない。
【００３２】
請求項９記載の構成によれば請求項１乃至８のいずれか記載の冷媒冷却型電力制御装置において更に、大発熱部品と垂直に重ねて他の前記回路部品を配置するので、一層の高密度実装が可能となる。
【００３３】
【発明の実施の形態】
本発明の好適な態様を以下の実施例を参照して説明する。
【００３４】
【実施例１】
実施例１の冷媒冷却型電力制御装置を図１を参照して説明する。
（車両用空調機の電気回路）
この装置は、車両用空調機のコンプレッサ駆動モ−タ制御回路を示し、１は高圧バッテリ、２は低圧バッテリ、３は電力制御装置であり、電力制御装置３は、三相インバ−タ回路４、電力平滑コンデンサ５及びそれを制御するコントローラ６を有している。
【００３５】
三相インバータ回路４は、高圧バッテリ１から給電された直流電力を三相交流電力に変換して車両用空調機のコンプレッサ駆動モ−タ７に給電する。三相インバータ回路４は合計６つのＩＧＢＴとそれらと個別に逆並列接続されたフライホイルダイオ−ドとからなる。
【００３６】
電力平滑コンデンサ５は三相インバータ回路４の一対の直流入力端間に接続されて三相インバータ回路４の上記ＩＧＢＴのスイッチングに付随するスイッチングサ−ジ電圧の低減を行う。
【００３７】
コントローラ６は低圧バッテリ２から電源電圧を供給されて三相インバータ回路４の制御を行う。この種の電動機制御用の電力制御装置３自体は周知であるので、これ以上の説明は省略する。
（電力制御装置３の構造）
電力制御装置３は、図２に示すように、ケ−ス８に収容されている。
【００３８】
ケ−ス８は、上端開口の角箱形状を有する箱部８１、箱部８１の上端に固定されて箱部８１の上記開口を閉鎖する蓋部８２、箱部８１の外底面に密着、固定されてこの外底面を覆う外板部８３からなり、これら箱部８１、蓋部８２及び外板部８３はそれぞれ樹脂成形品で構成されている。
【００３９】
箱部８１は、平坦な底板部（内板部）８１１と、この底板部８１１の周縁から立設される所定高さの側板部８１２とからなる。
【００４０】
底板部８１１には開口部８１３が貫設され、開口部８１３には、開口部８１３の内側開口端８１３１の側に平板状の伝熱用金属板９が、開口部８１３の外側開口端８１３２の側に平板状の冷却体１０がそれぞれ埋設されている。
【００４１】
伝熱用金属板９は、アルミニウム板であって、箱部８１に一体成形されて、開口部８１３の内側開口端側８１３１側を閉鎖している。伝熱用金属板９の内側主面は底板部８１１の内側主面と同一平面を構成し、外板部８３は開口部８１３の外側開口端側８１３２側を閉鎖している。
【００４２】
その結果、冷却体１０は、外板部８３、開口部８１３の側面、伝熱用金属板９に囲まれた密閉空間に変位不能に収容され、冷却体１０の内側主面は伝熱用金属板の外側主面に熱伝導良好に密接し、冷却体１０の外側主面は外板部８３の内側主面に密着して支持されている。
【００４３】
ケ−ス８内に露出する伝熱用金属板の内側主面には三相インバータ回路モジュ−ル４’の底面が密着、固定されている。この三相インバータ回路モジュ−ル４’は、図１に示す三相インバータ回路４を樹脂又はセラミックパッケ−ジに収容してなり、三相インバータ回路モジュ−ル４’の底面は伝熱用金属板９の内側主面を完全に覆っている。これは伝熱用金属板９がケ−ス８内の空気に触れてその表面に結露が生じるのを防ぐためである。
【００４４】
三相インバータ回路モジュ−ル４’の上方には、ホルダ１１に支持されて電力平滑コンデンサ５が配置されている。電力平滑コンデンサ５の端子５１と三相インバータ回路モジュ−ル４’の上面に設けられた図示しない電極端子とはブスバ−１２により接続されている。
【００４５】
冷却体１０は、アルミダキャスト又は引き抜き加工により形成されて内部に互いに並列に延在する冷媒通路用の長孔１００を有し、これら長孔１００の両端は、図示しない冷媒入り口配管部及び冷媒出口配管部をもつ遮蔽板で閉鎖され、これら冷媒入り口配管部及び冷媒出口配管部はそれぞれ冷媒配管を通じて外板部８３を貫通して図２における下方へ延設され、図示しない車両用空調装置のエバポレ−タと並列接続されている。
【００４６】
外板部８３の内側主面８３０は、図３に示すように、突起８３１が設けられ、各突起８３１の頂面は冷却体１０の底面に密接してそれを支持している。８３２は隣接する突起８３１間の凹部である。このようにすれば、冷却体１０から下方へ逃げる冷熱を減らすことができる。
【００４７】
（動作）
この電力制御装置４を駆動して車両用空調機を運転し、冷却体１０に冷媒を通過させることにより、冷却体１０は伝熱用金属板９を通じて、三相インバータ回路モジュ−ル４’の熱を吸収し、その温度上昇を抑止する。
（変形態様）
三相インバータ回路４の温度を検出し、その温度に応じて冷却体１０の冷却流量を変更又はオン、オフすることは可能である。
（作用効果）
上記説明したこの実施例の電力制御装置によれば、上述した種々の効果を奏することができる。
【００４８】
【実施例２】
本発明の電力制御装置の他の実施例を説明する。
（電力制御装置３の構造）
電力制御装置３は、図４に示すように、ケ−ス８’に収容されている。
【００４９】
ケ−ス８’は、下端開口の角箱形状を有する箱部１３、箱部１３の下端に固定されて箱部１３の上記開口を閉鎖する底板部１４、箱部１３の外主面（頂面）に密着、固定されてこの外主面を覆う外板部１５からなり、これら箱部１３、底板部１４、及び外板部１５はそれぞれ樹脂成形品で構成されている。
【００５０】
箱部１３は、平坦な上板部（内板部）１３１と、この上板部１３１の周縁から垂下する所定高さの側板部１３２とからなる。
【００５１】
上板部１３１には開口部１３３が貫設され、開口部１３３には、開口部１３３の内側開口端の側にブロック状の伝熱用金属板９’が、開口部１３３の外側開口端の側に平板状の冷却体１０がそれぞれ埋設されている。
【００５２】
伝熱用金属板９’は、アルミニウム板であって、箱部１３に一体成形されて、開口部１３３の内側開口端側の側を閉鎖し、外板部１５は開口部１３３の外側開口端の側を閉鎖している。
【００５３】
その結果、冷却体１０は、外板部１５、開口部１３３の側面、伝熱用金属板９’に囲まれた密閉空間に変位不能に収容され、冷却体１０の内側主面は伝熱用金属板９’の外側主面に熱伝導良好に密接し、冷却体１０の外側主面は外板部１５の内側主面に密着して支持されている。
【００５４】
ケ−ス８’内に露出する伝熱用金属板９’の内側主面には三相インバータ回路モジュ−ル４’の頂面が密着している。三相インバータ回路モジュ−ル４’は、図１に示す三相インバータ回路４を樹脂又はセラミックパッケ−ジに収容してなり、三相インバータ回路モジュ−ル４’はバンプやボ−ルなどを通じて配線基板を兼ねる底板部１４の上面（部品載置面）に実装されている。
【００５５】
冷却体１０は、アルミダキャスト又は引き抜き加工により形成されて内部に互いに並列に延在する冷媒通路用の長孔１００を有し、これら長孔１００の両端は、図示しない冷媒入り口配管部及び冷媒出口配管部をもつ遮蔽板で閉鎖され、これら冷媒入り口配管部及び冷媒出口配管部はそれぞれ冷媒配管を通じて外板部１５を貫通して図３における上方へ延設され、図示しない車両用空調装置のエバポレ−タと並列接続されている。
（作用効果）
上記説明したこの実施例の電力制御装置によれば、上述した種々の効果を奏することができる。
【図面の簡単な説明】
【図１】実施例１の電力制御装置を用いた車両用冷凍機用モ−タ制御回路を示す回路図である。
【図２】図１の電力制御装置の縦断面図である。
【図３】図２の電力制御装置の部分拡大断面図である。
【図４】実施例２の電力制御装置の縦断面図である。
【符号の説明】
４’：三相インバータ回路モジュ−ル（大発熱部品） ８：ケ−ス
９：伝熱用金属板
１０：冷却体
８１３：凹部
８１１：底板部（内板部）
１４：外板部
１５：蓋部
８１２：側板部
８３１：突起部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a refrigerant cooling type electric power control apparatus in which a refrigerant flows in a refrigerant cooling type electric power control apparatus housing case to cool an internal large heat generating component.
[0002]
[Prior art]
In recent years, in electric vehicles and hybrid vehicles, high-power switching control is required for control of a traveling motor, a compressor driving motor for an air conditioner, and the like, and heat generation of a power control device that performs this is a problem. In addition, idling stops are required from the viewpoint of reducing emissions and improving fuel efficiency even with ordinary engine-driven vehicles, and it is necessary to drive the motor of an air conditioner compressor for air conditioning during idling stop. Therefore, the heat generation of the power control device is a problem.
[0003]
The use of a refrigerant for cooling this type of semiconductor device is known, for example, in the following publications. That is, Japanese Patent Laid-Open No. 7-336078 discloses a cooling body through which a refrigerant flows in close contact with one main surface of a heating element package in which a heating element (semiconductor chip) is sealed, and these heating element packages. A structure in which a die and a cooling body (cold plate) are covered with a heat insulating material is disclosed.
[0004]
The in-vehicle power control device is equipped with a refrigeration cycle device for an air conditioner, and the refrigerant can be diverted. Therefore, the cooling of the power control device is realized while suppressing the complexity of the system, so the possibility is high. It is expected.
[0005]
[Problems to be solved by the invention]
However, like the refrigerant cooling IC package of the above-mentioned publication, the conventional refrigerant cooling system is a cooling in which the refrigerant flows through the top surface (upper surface) of the heating element package (module that accommodates the circuit or chip). The body is placed and closely attached. This is because the heating element package, which is an electronic circuit component, has a terminal connected to the wiring of the substrate on the bottom surface (lower surface), that is, the substrate side, and cannot be cooled from here.
[0006]
For this reason, in the conventional refrigerant cooling system, the cooling body is fixed to the upper surface of the heating element package, so that the refrigerant piping to this cooling body is a hollow piping on the substrate, and parts, bus bars, etc. This hinders high-density mounting as an obstacle to the placement. In addition, a support structure for the refrigerant piping is required, and the piping is troublesome. Furthermore, a device for stably fixing the cooling body to the heating element package is also required. In addition, since the parts other than the bottom surface of the cooling body are exposed to the air, the heat is dissipated into the surrounding air or the like, resulting in condensation. There is a problem that the space above the heating element package is occupied by the cooling body and the heat insulating material, and it is difficult to arrange other circuit components directly on or around the heating element package. occured. For example, if an inverter module for motor control is described, a power smoothing capacitor is arranged on the inverter module and the inverter module and the power just above it are arranged. It is important to shorten the wiring distance to the smoothing capacitor, to reduce the wiring resistance loss and to reduce the switching surge noise voltage by reducing the wiring inductance, but such a two-story arrangement of circuit components can be realized. It was difficult.
[0007]
The present invention has been made in view of the above-described problems of conventional refrigerant cooling power control devices, and is capable of realizing good cooling of large heat generating components while avoiding a decrease in the degree of freedom in circuit component arrangement and wiring routing. An object of the present invention is to provide a type power control apparatus.
[0008]
[Means for Solving the Problems]
According to the refrigerant cooling type power control apparatus of the first aspect, the cooling body (cold plate) is directly below a large heat generating component to be cooled in the case, for example, a power module, a transformer, a condenser and the like. And disposed in a recess provided in the bottom plate portion of the case, and is in close contact with the bottom surface of the large heat generating component directly or through a heat transfer metal plate.
[0009]
In this way, it is possible to realize a refrigerant cooling type power control apparatus that can realize good cooling of large heat generating components while avoiding a decrease in the degree of freedom of circuit component arrangement and wiring routing.
[0010]
Further explanation will be given.
[0011]
According to this configuration, since the cooling body and the refrigerant pipe for circulating the refrigerant are built in the case for housing the circuit components, there is no obstacle to the arrangement of the components in the case and the bus bar routing. .
[0012]
In addition, since the refrigerant pipe is not exposed or extended in the case, the refrigerant pipe structure hollow support structure and its heat insulation covering structure are unnecessary, and the arrangement of parts in the case and wiring routing are not required. Becomes free. Note that this refrigerant pipe must be covered with a heat insulating material when exposed or routed in the case. This is because condensation occurs when air comes into contact with the cold refrigerant pipe surface, and this condensed moisture drops, causing problems such as short circuit and corrosion. On the other hand, in this configuration, since the cooling body is blocked from the space in the case by the heat transfer metal plate or the large heat generating component and the case, condensation may occur in the air in the case. Nothing at all. In addition, the refrigerant piping to the cooling body embedded in the bottom plate portion of the case can naturally go out to the outside through the bottom plate portion, and it is not necessary to insulate the refrigerant piping. However, this configuration is not limited to the embedding in the bottom plate portion of the refrigerant pipe.
[0013]
Further, in this configuration, since the surfaces other than the effective cooling surface of the cooling body are thermally insulated by the case, the cooling body can be shielded from the air without the heat insulation covering member of the cooling body, and the configuration is simple. Condensation and heat loss can be prevented.
[0014]
Furthermore, in this configuration, the space immediately above the large heat generating component and its peripheral space are vacant, so that the component can have a two-story structure (double arrangement in the height direction), and high-density mounting and wiring shortening can be realized. .
[0015]
3. The refrigerant cooling type power control apparatus according to claim 2, wherein the cooling body (cold plate) is positioned directly above a large heat generating component to be cooled in the case, for example, a power module, a transformer, a condenser or the like. And it is arrange | positioned by the recessed part provided in the cover part of the case, and it closely_contact | adheres to the top face of this large heat-emitting component directly or through the metal plate for heat transfer.
[0016]
In this way, it is possible to realize a refrigerant cooling type power control apparatus that can realize good cooling of large heat generating components while avoiding a decrease in the degree of freedom of circuit component arrangement and wiring routing.
[0017]
Further explanation will be given.
[0018]
According to this configuration, since the cooling body and the refrigerant pipe for circulating the refrigerant are built in the case for housing the circuit components, there is no obstacle to the arrangement of the components in the case and the bus bar routing. .
[0019]
In addition, since the refrigerant pipe is not exposed or extended in the case, the refrigerant pipe structure hollow support structure and its heat insulation covering structure are unnecessary, and the arrangement of parts in the case and wiring routing are not required. Becomes free. Note that this refrigerant pipe must be covered with a heat insulating material when exposed or routed in the case. This is because condensation occurs when air comes into contact with the cold refrigerant pipe surface, and this condensed moisture drops, causing problems such as short circuit and corrosion. On the other hand, in this configuration, since the cooling body is blocked from the space in the case by the heat transfer metal plate or the large heat generating component and the case, condensation may occur in the air in the case. Nothing at all. In addition, the refrigerant piping to the cooling body embedded in the case lid portion can of course pass through the lid portion to the outside, and it is not necessary to insulate the refrigerant piping. However, this configuration is not limited to the embedding in the lid of the refrigerant pipe.
[0020]
Further, since the surfaces other than the effective cooling surface of the cooling body are thermally insulated by the case, the cooling body can be shielded from the air without the heat insulation covering member of the cooling body, and condensation and cooling loss can be achieved with a simple configuration. Can be prevented.
[0021]
In addition, a space between the large heat generating component fixed to the bottom plate and the bottom plate can be made free, and the component can be made into a two-story structure (double arrangement in the height direction). Can be realized.
[0022]
Furthermore, since the circuit component group is divided into the bottom plate side and the cooling body and the refrigerant pipe are divided into the lid side, the bottom plate portion containing the circuit components is freely separated from the fixed lid portion in the inspection and replacement of the circuit components. Can be very easy. Further, the circuit components can be exchanged together with the bottom plate portion while leaving the cooling lid portion as it is, and the repair work can be simplified.
[0023]
In addition, the arrangement | positioning attitude | position of the case as used in this specification is free, and in addition to the basic attitude in which the lid portion is positioned above the normal bottom plate portion, the bottom plate portion and the lid portion may be arranged vertically or obliquely. Alternatively, the lid portion may be disposed immediately below the bottom plate portion. Accordingly, the terms “upper” and “lower” in the present specification mean a relative spatial positional relationship when the above basic posture is given to the case.
[0024]
According to the configuration of the third aspect, in the refrigerant cooling type power control device according to the first or second aspect, the portion of the case including at least the concave portion is formed of a resin molded member.
[0025]
This simplifies the heat insulating structure for heat insulation and prevention of condensation on the cooling body and the refrigerant piping in the vicinity of the cooling body.
[0026]
According to the fourth aspect of the present invention, in the refrigerant cooling type power control apparatus according to the third aspect, the bottom plate portion or the lid portion of the case further includes a flat inner plate portion formed by resin molding together with the side plate portion, and the inner plate portion. It consists of a flat outer plate part closely attached to the outer main surface of the plate part, and the recessed part consists of an opening part penetrating the inner plate part and closing the outer opening with the outer plate part.
[0027]
That is, in this configuration, the outer plate portion is brought into close contact with the outer main surface of the perforated inner plate portion to form a recess for accommodating the cooling body, so that there is no insert molding even if the case is large. In addition, the cooling body embedded case can be realized, and the cooling body can be inserted into the opening from the outside of the case. The part can be removed and inspected, and convenience can be improved.
[0028]
According to the configuration of the fifth aspect, in the refrigerant cooling type power control device according to the fourth aspect, the outer plate portion further includes a protrusion that faces the opening and contacts the cooling body. The heat transfer resistance between the parts can be increased, and undesirable cooling loss of the cooling body can be reduced.
[0029]
According to the configuration of the sixth aspect, in the refrigerant cooling type power control device according to the fourth or fifth aspect, the heat transfer metal plate is embedded in the inner plate portion and closes the inner opening of the opening portion. The contact between the body and the air inside the case is completely cut off, so that dew condensation does not accumulate in the recess housing the cooling body.
[0030]
According to the configuration of the seventh aspect, in the refrigerant cooling type power control device according to any one of the first to sixth aspects, the cooling body is a part of the evaporator of the refrigeration cycle device and absorbs heat by air conditioning. The control device can be cooled by reusing the warmed refrigerant, and the air conditioning refrigerant can be effectively utilized.
[0031]
According to the configuration of the eighth aspect, in the refrigerant cooling power control device according to any one of the first to seventh aspects, the power control circuit in the case further includes a temperature of a predetermined part in the case, preferably Since the temperature of the large heat generating component is detected and the refrigerant flow rate to the cooling body is controlled based on this temperature, there is no waste of power loss for the cooling device.
[0032]
According to the configuration of the ninth aspect, in the refrigerant cooling type power control device according to any one of the first to eighth aspects, since the other circuit components are arranged perpendicularly to the large heat generating components, a higher density is achieved. Implementation is possible.
[0033]
DETAILED DESCRIPTION OF THE INVENTION
Preferred aspects of the invention are described with reference to the following examples.
[0034]
[Example 1]
A refrigerant cooling power control apparatus according to Embodiment 1 will be described with reference to FIG.
(Electric circuit of vehicle air conditioner)
This apparatus shows a compressor drive motor control circuit for a vehicle air conditioner, wherein 1 is a high voltage battery, 2 is a low voltage battery, 3 is a power control device, and the power control device 3 is a three-phase inverter circuit 4. And a power smoothing capacitor 5 and a controller 6 for controlling the same.
[0035]
The three-phase inverter circuit 4 converts the DC power fed from the high-voltage battery 1 into three-phase AC power and feeds it to the compressor drive motor 7 of the vehicle air conditioner. The three-phase inverter circuit 4 is composed of a total of six IGBTs and flywheel diodes individually connected in reverse parallel.
[0036]
The power smoothing capacitor 5 is connected between a pair of DC input terminals of the three-phase inverter circuit 4 to reduce the switching surge voltage associated with the switching of the IGBT of the three-phase inverter circuit 4.
[0037]
The controller 6 is supplied with a power supply voltage from the low voltage battery 2 and controls the three-phase inverter circuit 4. Since this type of electric power control device 3 for controlling an electric motor is well known, further explanation is omitted.
(Structure of power control device 3)
The power control device 3 is accommodated in the case 8 as shown in FIG.
[0038]
The case 8 has a box part 81 having a rectangular box shape with an upper end opening, a lid part 82 that is fixed to the upper end of the box part 81 and closes the opening of the box part 81, and an outer bottom surface of the box part 81. The box portion 81, the lid portion 82, and the outer plate portion 83 are each formed of a resin molded product.
[0039]
The box portion 81 includes a flat bottom plate portion (inner plate portion) 811 and a side plate portion 812 having a predetermined height standing from the periphery of the bottom plate portion 811.
[0040]
An opening 813 is provided in the bottom plate portion 811, and the flat plate-shaped heat transfer metal plate 9 is provided on the inner opening end 8131 side of the opening 813, and the outer opening end 8132 of the opening 813 is provided in the opening 813. A flat plate-like cooling body 10 is embedded on the side.
[0041]
The heat transfer metal plate 9 is an aluminum plate, and is integrally formed with the box portion 81 to close the inner opening end side 8131 side of the opening portion 813. The inner main surface of the heat transfer metal plate 9 is flush with the inner main surface of the bottom plate portion 811, and the outer plate portion 83 closes the outer opening end side 8132 side of the opening 813.
[0042]
As a result, the cooling body 10 is undisplaceably accommodated in a sealed space surrounded by the outer plate portion 83, the side surface of the opening 813, and the heat transfer metal plate 9, and the inner main surface of the cooling body 10 is the heat transfer metal. The outer main surface of the cooling body 10 is in close contact with the outer main surface of the plate with good heat conduction, and the outer main surface of the cooling body 10 is supported in close contact with the inner main surface of the outer plate portion 83.
[0043]
The bottom surface of the three-phase inverter circuit module 4 ′ is adhered and fixed to the inner main surface of the heat transfer metal plate exposed in the case 8. This three-phase inverter circuit module 4 ′ is obtained by housing the three-phase inverter circuit 4 shown in FIG. 1 in a resin or ceramic package, and the bottom surface of the three-phase inverter circuit module 4 ′ is a metal for heat transfer. The inner main surface of the plate 9 is completely covered. This is to prevent the heat transfer metal plate 9 from coming into contact with the air in the case 8 and causing condensation on the surface thereof.
[0044]
Above the three-phase inverter circuit module 4 ′, a power smoothing capacitor 5 is arranged supported by the holder 11. A terminal 51 of the power smoothing capacitor 5 and an electrode terminal (not shown) provided on the upper surface of the three-phase inverter circuit module 4 ′ are connected by a bus bar 12.
[0045]
The cooling body 10 has long holes 100 for refrigerant passages formed by aluminum casting or drawing and extending in parallel with each other, and both ends of the long holes 100 are connected to a refrigerant inlet pipe section and a refrigerant (not shown). The refrigerant inlet pipe part and the refrigerant outlet pipe part are respectively extended through the outer plate part 83 through the refrigerant pipe and extending downward in FIG. It is connected in parallel with the evaporator.
[0046]
As shown in FIG. 3, the inner main surface 830 of the outer plate portion 83 is provided with a protrusion 831, and the top surface of each protrusion 831 is in close contact with and supports the bottom surface of the cooling body 10. Reference numeral 832 denotes a recess between adjacent protrusions 831. If it does in this way, the cold heat which escapes from the cooling body 10 below can be reduced.
[0047]
(Operation)
By driving the power control device 4 to operate the vehicle air conditioner and passing the refrigerant through the cooling body 10, the cooling body 10 passes through the heat transfer metal plate 9 and the three-phase inverter circuit module 4 ′. Absorbs heat and suppresses temperature rise.
(Modification)
It is possible to detect the temperature of the three-phase inverter circuit 4 and change or turn on / off the cooling flow rate of the cooling body 10 according to the temperature.
(Function and effect)
According to the power control apparatus of this embodiment described above, the various effects described above can be achieved.
[0048]
[Example 2]
Another embodiment of the power control apparatus of the present invention will be described.
(Structure of power control device 3)
As shown in FIG. 4, the power control device 3 is accommodated in a case 8 ′.
[0049]
The case 8 ′ has a box part 13 having a rectangular box shape with a lower end opening, a bottom plate part 14 that is fixed to the lower end of the box part 13 and closes the opening of the box part 13, and an outer main surface (top) of the box part 13. The outer plate 15 includes an outer plate 15 that is in close contact with and fixed to the outer surface. The box portion 13, the bottom plate 14, and the outer plate 15 are each formed of a resin molded product.
[0050]
The box portion 13 includes a flat upper plate portion (inner plate portion) 131 and a side plate portion 132 having a predetermined height that hangs down from the periphery of the upper plate portion 131.
[0051]
An opening 133 is provided in the upper plate 131, and the opening 133 has a block-shaped heat transfer metal plate 9 ′ on the inner opening end side of the opening 133, and an outer opening end of the opening 133. A flat plate-like cooling body 10 is embedded on the side.
[0052]
The heat transfer metal plate 9 ′ is an aluminum plate, and is integrally formed with the box portion 13 to close the inner opening end side of the opening 133, and the outer plate portion 15 is an outer opening end of the opening 133. The side is closed.
[0053]
As a result, the cooling body 10 is undisplaceably accommodated in a sealed space surrounded by the outer plate 15, the side surface of the opening 133, and the heat transfer metal plate 9 ′, and the inner main surface of the cooling body 10 is for heat transfer. The outer main surface of the metal plate 9 ′ is in close contact with the outer main surface with good heat conduction, and the outer main surface of the cooling body 10 is supported in close contact with the inner main surface of the outer plate portion 15.
[0054]
The top surface of the three-phase inverter circuit module 4 ′ is in close contact with the inner main surface of the heat transfer metal plate 9 ′ exposed in the case 8 ′. The three-phase inverter circuit module 4 'is formed by housing the three-phase inverter circuit 4 shown in FIG. 1 in a resin or ceramic package, and the three-phase inverter circuit module 4' is through bumps or balls. It is mounted on the upper surface (component mounting surface) of the bottom plate portion 14 that also serves as a wiring board.
[0055]
The cooling body 10 has long holes 100 for refrigerant passages formed by aluminum casting or drawing and extending in parallel with each other, and both ends of the long holes 100 are connected to a refrigerant inlet pipe section and a refrigerant (not shown). The refrigerant inlet pipe part and the refrigerant outlet pipe part are respectively extended through the outer plate part 15 through the refrigerant pipe and extending upward in FIG. It is connected in parallel with the evaporator.
(Function and effect)
According to the power control apparatus of this embodiment described above, the various effects described above can be achieved.
[Brief description of the drawings]
FIG. 1 is a circuit diagram showing a motor control circuit for a refrigerator for a vehicle using the power control apparatus according to the first embodiment.
2 is a longitudinal sectional view of the power control device of FIG. 1. FIG.
3 is a partial enlarged cross-sectional view of the power control device of FIG. 2;
4 is a longitudinal sectional view of a power control apparatus according to a second embodiment. FIG.
[Explanation of symbols]
4 ': Three-phase inverter circuit module (large heat generating component) 8: Case 9: Metal plate for heat transfer 10: Cooling body 813: Recessed portion 811: Bottom plate portion (inner plate portion)
14: Outer plate portion 15: Lid portion 812: Side plate portion 831: Projection portion

Claims (8)

大発熱部品を含んで電力制御回路を構成する多数の回路部品を載置する平板状の底板部を有して前記回路部品および配線体を収納するケ−スと、
良熱伝導性の金属を素材としてプレ−ト状に形成されて冷媒が外部から供給される冷却体と、
前記大発熱部品の直下に位置して部品載置面側から前記底板部に凹設されて前記冷却体を収容する凹部と、
を備え、
前記冷却体は、前記ケ−スの前記底板部に断熱支持されて前記凹部に収容されるとともに前記大発熱部品の底面に直接または良熱伝導性の伝熱用金属板を通じて密着することを特徴とする冷媒冷却型電力制御装置。A case which has a flat bottom plate portion on which a large number of circuit components constituting a power control circuit including a large heat generating component are placed, and which accommodates the circuit component and the wiring body;
A cooling body that is formed in a plate shape from a metal having good heat conductivity and to which a refrigerant is supplied from the outside;
A concave portion that is located directly below the large heat generating component and is recessed in the bottom plate portion from the component placement surface side to accommodate the cooling body;
With
The cooling body is insulated and supported by the bottom plate portion of the case and is accommodated in the concave portion, and is in close contact with the bottom surface of the large heat generating component directly or through a heat conductive metal plate. Refrigerant cooling type power control device. 大発熱部品を含んで電力制御回路を構成する多数の回路部品を載置する平板状の底板部、並びに、前記底板部に対面する平板状の蓋部を有して前記回路部品および配線体を収納するケ−スと、
良熱伝導性の金属を素材としてプレ−ト状に形成されて冷媒が外部から供給される冷却体と、
前記大発熱部品の直上に位置して内主面側から前記蓋部に凹設されて前記冷却体を収容する凹部と、
を備え、
前記冷却体は、前記ケ−スの前記蓋部に断熱支持されて前記凹部に収容されるとともに前記大発熱部品の頂面に直接または良熱伝導性の伝熱用金属板を通じて密着することを特徴とする冷媒冷却型電力制御装置。A plate-like bottom plate portion on which a large number of circuit components constituting a power control circuit including a large heat generating component are placed, and a plate-like lid portion facing the bottom plate portion, and the circuit component and the wiring body are arranged. The case to be stored;
A cooling body that is formed in a plate shape from a metal having good heat conductivity and to which a refrigerant is supplied from the outside;
A recess that is located directly above the large heat generating component and that is recessed in the lid from the inner main surface side and accommodates the cooling body;
With
The cooling body is insulated and supported by the lid portion of the case and is accommodated in the concave portion, and is in close contact with the top surface of the large heat generating component directly or through a metal plate for heat conduction. A refrigerant-cooled power control device. 請求項１又は２記載の冷媒冷却型電力制御装置において、
前記ケ−スの少なくとも前記凹部を含む部分は、樹脂成形部材からなることを特徴とする冷媒冷却型電力制御装置。In the refrigerant cooling type power control device according to claim 1 or 2,
The part including at least the concave portion of the case is made of a resin molded member. 請求項１乃至３のいずれか記載の冷媒冷却型電力制御装置において、
前記ケ−スの底板部又は蓋部は、側板部とともに樹脂成形された平板状の内板部と、前記内板部の外主面に密着された平板状の外板部とからなり、
前記凹部は、前記内板部に貫設されて外側開口端を前記外板部で閉鎖された開口部からなることを特徴とする冷媒冷却型電力制御装置。In the refrigerant cooling type power control device according to any one of claims 1 to 3,
The bottom plate portion or the lid portion of the case includes a flat plate-like inner plate portion that is resin-molded together with the side plate portion, and a flat plate-like outer plate portion that is in close contact with the outer main surface of the inner plate portion,
The coolant-cooled power control apparatus according to claim 1, wherein the recess includes an opening that extends through the inner plate and has an outer opening end closed by the outer plate. 請求項４記載の冷媒冷却型電力制御装置において、
前記外板部は、前記開口部に面して前記冷却体に当接する突起部を有することを特徴とする冷媒冷却型電力制御装置。The refrigerant-cooled power control apparatus according to claim 4,
The refrigerant cooling power control apparatus, wherein the outer plate part has a protrusion part facing the opening and contacting the cooling body. 請求項４又は５記載の冷媒冷却型電力制御装置において、
前記伝熱用金属板は、前記内板部に埋設されて前記開口部の内側開口部を閉鎖することを特徴とする冷媒冷却型電力制御装置。The refrigerant-cooled power control apparatus according to claim 4 or 5,
The refrigerant-cooled power control apparatus, wherein the heat transfer metal plate is embedded in the inner plate portion and closes an inner opening portion of the opening portion. 請求項１乃至６のいずれか記載の冷媒冷却型電力制御装置において、
前記冷却体は、冷凍サイクル装置の蒸発器の一部をなすことを特徴とする冷媒冷却型電力制御装置。The refrigerant cooling power control apparatus according to any one of claims 1 to 6,
The refrigerant cooling power control apparatus, wherein the cooling body forms part of an evaporator of a refrigeration cycle apparatus. 請求項１乃至７のいずれか記載の冷媒冷却型電力制御装置において、
前記大発熱部品と垂直に重ねて他の前記回路部品を配置することを特徴とする冷媒冷却型電力制御装置。The refrigerant cooling power control apparatus according to any one of claims 1 to 7,
A refrigerant cooling type power control device, wherein the other circuit components are arranged vertically overlapping the large heat generating component.
JP33978199A 1999-11-30 1999-11-30 Refrigerant cooling type power control device Expired - Lifetime JP3982126B2 (en)

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