JP3964350B2 - Manufacturing method of molded products - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention generally relates to a method for manufacturing a molded article, and more particularly, to a selective surface modification method for modifying an arbitrary position on the surface of a plastic molded article and an electroless plating method using the resultant product. The present invention is suitable for, for example, a method of manufacturing a plastic molded article having an electromagnetic wave shielding thin film by using injection molding and electroless plating.
[0002]
[Prior art]
Electromagnetic waves are emitted from OA equipment, medical equipment, and the like typified by mobile phones and personal computers, and it has become a big problem to have a great influence on the human body. In addition, in order to protect electronic circuit equipment such as a printed circuit board from electromagnetic noise generated by other electronic equipment, it is necessary to cover the circuit equipment with an electromagnetic wave shield molding or the like.
[0003]
As a method for imparting an electromagnetic wave shielding function to various devices made of these plastics, a method using a resin coated with conductive fine particles such as carbon black, a method of providing a metal layer by an electroless plating method, one side of each plastic film A method is known in which an electromagnetic wave shielding layer and an adhesive layer are formed on one side, the electromagnetic wave shielding film is placed in a mold, and then the molded body and the film are integrated by injection molding (for example, Patent Documents). 1).
[Patent Document 1]
JP-A-6-314895 [0004]
[Problems to be solved by the invention]
However, there is no manufacturing method that can form an electromagnetic wave shielding thin film that can provide good film thickness uniformity and sufficient shielding effect, and can be expected to have high throughput and low cost. In addition, a technique with a wide range of application that can simultaneously modify the surface during injection molding has not been proposed.
[0005]
For example, the electroless plating method has an advantage that a plating layer can be formed on a plastic surface even on a complicated curved surface, but has a problem that the process and equipment are very expensive. Furthermore, since the plastic surface must be roughened by etching with a chromic acid solution or the like, the surface properties are deteriorated and the characteristics are deteriorated. In addition, a chromic acid solution or an alkali metal hydroxide solution is used for etching. However, these etching solutions require post-treatment such as neutralization, which is a cause of high cost and a highly toxic etchant. There are also problems of handling and waste liquid treatment due to use.
[0006]
The present invention has been made to solve these problems, and a first exemplary object is to provide a surface without roughening the surface during the molding of a thermoplastic resin in compression molding, injection molding, or the like. The object is to provide a technique with a wide range of applications for modifying any point. A second exemplary object of the present invention is to provide a technique capable of easily dispersing plating nuclei in electroless plating in the vicinity of the plastic surface during the molding and an electromagnetic wave shielding thin film comprising a high-quality electroless plating layer. It is providing the manufacturing method of the plastic molded product which has this.
[0010]
A manufacturing method according to one aspect of the present invention is a method of manufacturing a molded product from a thermoplastic resin, the step of injecting a softened thermoplastic resin into a cavity formed by a mold, and at least a part of the cavity. Opening, injecting a functional organic material dissolved in a supercritical fluid onto the thermoplastic resin from the opened part of the cavity, the thermoplastic resin in the cavity and the function And pressurizing the organic material. In this manufacturing method, at least a part of the cavity is opened, and the functional organic material dissolved in the supercritical fluid is injected from the opened part, so that selective surface modification of the molded product is easily performed. be able to. Opening step is effective to inject functional organic material to a portion of the molded article, also functional organic materials in the cavity were dissolved in the supercritical fluid when pressure reduction during the opening step in a short time Is injected into the resin surface. Thereafter, by pressurizing and closing the opened cavity, the functional organic material dissolved in the supercritical fluid is injected from the resin surface into the interior at a high density to modify the surface of the molded body.
[0011]
In the opening step, it is preferable to further include a step of sealing a gate for injecting the thermoplastic resin into the cavity. Thereby, it is possible to prevent the thermoplastic resin from flowing into the cavity from the gate, and it is also possible to prevent the thermoplastic resin from flowing out to the gate when the cavity is pressurized.
[0012]
The functional organic material is a metal complex, and the method includes a step of removing a ligand of the metal complex to deposit metal particles, and a plating layer on a portion where the metal particles are deposited by electroless plating. And a step of forming. By using the metal complex, the electroless plating adhesion of the resin can be selectively improved. Thereby, the electromagnetic wave shielding thin film etc. as a plating layer can be formed easily.
[0013]
The method for removing the ligand of the metal complex is optional, such as a reduction reaction or a heating reaction, but it may be removed depending on the temperature or pressure of the resin during molding. Further, it may be removed in a separate step after molding, or may be removed by flowing a reducing solution or the like in the mold.
[0019]
Other objects and further features of the present invention will be made clear by embodiments described below with reference to the accompanying drawings.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, with reference to FIG.1 and FIG.2, the injection molding apparatus of embodiment of this invention is demonstrated. Here, Fig.1 (a) is principal part sectional drawing of the metal mold | die and shaping | molding apparatus as one Embodiment of this invention, FIG.1 (b) is an enlarged view of the A section of Fig.1 (a). . FIG. 2 is a partially enlarged sectional view for explaining the operation of the injection molding apparatus. 1 and 2 simply show each part for convenience of drawing, FIG. 3A is a partially enlarged sectional view showing a more detailed structure of FIG. 1, and FIG. It is the B section enlarged view of Drawing 3 (a). 4 (a) to 4 (d) are detailed views of FIG.
[0021]
The method for producing a molded product according to the present embodiment includes a step of molding a plastic molded product by injection molding and selectively modifying the surface, a (selective) thermal reduction treatment (reduction reaction) step, and an electroless process. And a plating step. Thermal reduction or a reduction reaction using a chemical solution is necessary only when the ligand of the metal complex is not removed during molding and metal fine particles are not formed on the plastic surface. In addition, as long as the molding method in this embodiment is made by softening a thermoplastic resin to Tg or more, injection molding, compression molding, etc. are arbitrary, but injection molding with excellent mass productivity is desirable.
[0022]
In injection molding, a softened thermoplastic resin is filled into a cavity, and after sealing the gate, a part of the cavity is opened and decompressed to inject a functional organic material dissolved in a supercritical fluid. The open cavity is then partially closed and the cavity is pressurized to allow the functional organic material to penetrate the surface and interior of the thermoplastic resin.
[0023]
The present invention does not particularly limit the type of thermoplastic resin. For example, thermoplastic resin is polycarbonate, polymethyl methacrylate, polyetherimide, polymethylpentene, amorphous polyolefin, polytetrafluoroethylene, liquid crystal polymer, styrene resin, polymethylpentene, polyacetal, etc. The polymer alloy which has these as a main component, and the thing which mix | blended various fillers with these can be used.
[0024]
The present invention does not specifically limit the type of supercritical fluid. For example, as the supercritical fluid, CO ₂ , butane, pentane, methanol, or the like can be used. However, supercritical CO ₂ having a solubility in organic materials comparable to hexane, non-polluting, and high affinity for plastics is desirable. Moreover, in order to improve the solubility of the organic material with respect to a supercritical fluid, you may mix a small amount of organic solvents, such as ethanol, as an entrainer.
[0025]
As long as the functional organic material adds functionality to the resin (plastic) by being dispersed on the surface of the resin, the present invention particularly limits the types of the functional organic material dissolved in the supercritical fluid. is not. For example, as the functional organic material, dyes, organometallic complexes, various polymers, low molecular polymers, and the like can be used.
[0026]
If an azo dye or an organic coloring material such as a fluorescent dye or phthalocyanine is used, the surface can be dyed or an organic recording film can be formed. If a hydrophobic ultraviolet stabilizer such as benzophenone or coumarin is used, the tensile strength after weathering can be improved. In addition, by using a fluorinated compound such as a fluorinated organic copper complex, it is possible to improve friction and provide a water repellent function. If a hydrophilic polymer such as polyethylene glycol is used, hydrophilicity can be imparted. If a metal complex is used, electroconductivity can be provided and a plating nucleus of electroless plating can be formed.
[0027]
The metal complex is arbitrary such as platinum dimethyl (cyclooctadiene), bis (cyclopentadienyl) nickel, bis (acetylacetonate) palladium, etc., for example, a molded article using 1,5-cyclooctadiene dimethylplatinum (II). After injection on the surface, depending on the case, the ligand can be removed by heating and reducing to form a plating nucleus.
[0028]
The molecular weight of the functional organic material of the present invention is preferably 100 to 20000, more preferably 500 to 10,000. When the molecular weight of the functional organic material is within this range, it is preferable in terms of solubility in a supercritical fluid and compatibility with a thermoplastic resin used for injection molding.
[0029]
The injection molding apparatus includes a mold, a resin supply unit that supplies a thermoplastic resin to the mold, and a fluid supply unit that supplies a functional organic material such as a metal complex dissolved in supercritical CO ₂ to the mold. .
[0030]
The mold defines the cavity 12 by the movable mold 13, the fixed mold 14, and the spool lock rod 36, and characteristically has a gate seal mechanism and a sealing mechanism.
[0031]
The gate seal mechanism allows the movable mold 13 to change the opening amount of the cavity 12 with the spool lock rod 36 sealing the gate. That is, the movable mold 13 can move with respect to the spool lock rod 36. With this mechanism, as will be described later, it becomes easy to inject the metal complex dissolved in the supercritical CO ₂ by partially opening the cavity 12 into the cavity 12, and at this time, the resin flows into the cavity 12 from the gate. Can be prevented.
[0032]
The sealing mechanism is a mechanism for sealing the supercritical fluid. As the sealing mechanism, an O-ring can be used. More preferably, the packing ring 40a, the thin plate spring 40b, and the tapered portion 40c shown in FIGS. 1B and 3 are used. First, regarding the sealing material, when CO ₂ is used as the supercritical fluid, the durability of the O-ring packing to be sealed is significantly lowered due to the influence of extremely high solubility. The mold temperature for cooling the molten resin often exceeds 100 ° C., and silicon-based or fluorine-based rubber is used as the sealing material because of its heat resistance. However, CO ₂ under high pressure does not have a sealing function because both materials are prematurely deteriorated by permeation and swelling.
[0033]
Therefore, in the present embodiment, a fluorine resin typified by polytetrafluoroethylene having high durability is used for CO ₂ under high pressure. By using a sliding part sealing structure that uses extremely low frictional resistance characteristics, pressure control can be stabilized by improving the durability of the sealing member, and running costs can be reduced by replacing the sealing member and reducing maintenance frequency. Is possible.
[0034]
Next, as a sealing mechanism , as shown in FIG. 3B, the packing ring 40a is provided in contact with or adjacent to the tapered portion 40c, and seals the space in which it is disposed. The thin leaf spring 40b pressurizes the packing ring 40a toward the tapered portion 40c. The tapered portion 40c is provided in the sealed space and is formed so that the cross-sectional area becomes smaller in the pressurizing direction with the supercritical fluid. Such a sealing mechanism is preferable because the sealing force by the packing ring 40a increases as the pressure by the supercritical fluid increases.
[0035]
These features are described in detail with the embodiments of the invention described below.
[0036]
【Example】
The molded body is a mobile phone casing having a maximum product thickness of 1 mm, and a resin is injected and filled into the cavity 12 formed by the fixed mold 14 and the movable mold 13 to obtain a product. In this example, CO ₂ was used as a supercritical fluid, and platinum dimethyl (cyclooctadiene), which is a metal complex, was used as a functional organic material dissolved in the supercritical fluid (molecular weight: 333.35).
[0037]
The method for dissolving the functional organic material in the supercritical fluid is arbitrary, but in the present example, it was performed as follows. After the CO ₂ that is supplied from the CO ₂ cylinder 4 in a supercritical state at a supercritical fluid generator 3, the molding time most of the time 1D to open the solenoid valve 1B always the mixing tank 2 by closing the 1E The supercritical state was maintained.
[0038]
In this example, the pressure in the mixing tank 2 was maintained at 23 to 25 MPa and the temperature at 60 ° C. And the functional organic material 7 was replenished to the mixing tank 2 from the storage container 6 by opening the solenoid valves 1C and 1D simultaneously periodically. In this embodiment, only the supercritical CO ₂ and the functional organic material 7 are contained in the mixing tank 2, and the organic material 7 is dissolved in the supercritical CO ₂ in a state where the saturation solubility is reached, but the solubility is improved. Various organic solvents may be introduced, or a stirring mechanism may be provided.
[0039]
Next, a method for injecting the supercritical fluid and the organic material dissolved therein into the mold will be described with reference to FIG. First, by opening the electromagnetic valve 1E, the fluid passes through the introduction flow path 8a in the movable mold 13, and the staying space 11 provided in the gap between the ejector pin 10 and the movable mold 13 shown in FIG. Then, it is discharged into the cavity 12 from the periphery of the ejector pin 10 on the surface of the movable mold 13.
[0040]
In the mold according to the present embodiment, as shown in FIG. 1, two molded products are obtained, and each cavity 12 has two ejector pins 10 each. They are connected by a flow path. That is, the fluid introduced into the mold from the introduction flow path 8 a is discharged from the mold surface from the periphery of all the ejector pins 10.
[0041]
The gate seal mechanism will be described with reference to FIG. After injecting a predetermined amount of the molten resin into the cavity 12, the molding machine ejector rod 34 is advanced. At the same time as the ejector rod 34 contacts the ejector plate 37, the connected spool lock rod 36 advances. The gate seal stroke T1 at the time of injection is shielded to prevent the inflow of resin from the spool runner or the outflow of resin from the cavity.
[0042]
The gate seal stroke T1 is arbitrarily determined by the distance T2 between the end face of the stroke adjusting rod 38 and the fixed mold. Since the ejector plate 37 is independent of the operation of the movable mold 13, the stroke adjusting rod 38 is in contact with the fixed mold even at an arbitrary mold opening amount ΔT when the functional organic material is injected. By maintaining T2 = 0, it is possible to maintain the gate seal state even if any variation in the mold opening amount ΔT occurs. The stroke adjusting rod 38 is inserted into a compression spring 39 a, and the compression spring 39 a presses the movable mold 13 via the ejector plate 37.
[0043]
Since the ejector rod 34 moves the ejector pin 10 forward to take out the product, the distance T3 between the ejector plate 37 and the ejector pin 10 may affect each other's operation depending on the dimension setting of T3> T1 + (max.ΔT). Absent.
[0044]
In this embodiment, since the mold is opened after the resin is injected and filled, a sealing mechanism is provided so that the supercritical CO ₂ introduced at that time does not leak out of the mold. As shown in FIG. 1B, a seal ring 18 is provided outside the cavity in the fixed mold 14, and supercritical CO ₂ is introduced from the back surface of the seal ring 18 by opening the electromagnetic valve 1A. Thus, the ring is pressed against the movable mold 13 side. Note that the pressure of the seal ring can be released by opening the solenoid valve 1F.
[0045]
The sealing mechanism of the ejector pin 10 and the seal ring 18 which are sliding parts will be described with reference to FIGS. 3 (a) and 3 (b).
[0046]
Ejector pins 10 on the cylinder side, the sealing ring 18 to place the sealing mechanism on the piston side. Although there is a difference in the taper direction and deformation direction of the packing ring 40a, the basic structure is the same for both, and therefore the seal ring 18 will be described here. The packing ring 40a has a planar shape on the side where the supercritical fluid is introduced and a tapered shape on the other side, and the sliding fitting portion before the supercritical fluid is introduced has a gap of about 0.02. A thin plate spring 40b is mounted on the flat-side end surface of the packing ring 40a, and a preload is always generated on the contact surface between the taper portion (40c deleted) of the packing ring 40a and the taper portion 40c of the seal ring 18 for simple sealing. It becomes a state. Pressure generation can be selected depending on the size and structure of components such as coil springs and disc springs other than thin plate springs.
[0047]
The roughness of both the sliding fitting surface and the taper surface to be sealed needs to have an arithmetic average roughness Ra of 0.8 or more in order to improve airtightness and slidability. When the supercritical fluid is introduced from the thin plate spring 40b side in the molding process, the tapered surface is in a simple sealed state, so a large pressure that can ignore the gap of about 0.02 is applied to the plane of the packing ring 40a, The tapered surface is in close contact and completely sealed. Since pressure is continuously applied to the flat surface of the packing ring 40a, the outer periphery expands and deforms along the taper surface, and the gap of about 0.02 is reduced and closely adhered to be sealed.
[0048]
Excessive deformation may occur to absorb fluctuations in sealing performance due to variations in sealing member machining accuracy and supercritical pressure, but large sliding due to low friction coefficient and good smoothness of sliding surface No resistance is generated. Important structural design parameters are the pressure of the supercritical fluid, the tapering angle of the packing ring and parts, and the cross-sectional area of the deforming packing ring. For example, if the seal cannot be sufficiently obtained because the supercritical pressure is low and the deformation amount is small, a large deformation amount is generated by reducing the cross-sectional area of the packing ring by making the taper angle an acute angle. be able to.
[0049]
Polytetrachloroethylene was selected as the material for the packing ring 40a from the viewpoint of resistance to CO ₂ solubility under high pressure. The conditions for using this sliding part sealing mechanism are (1) the mold temperature is 100 ° C or higher. High heat resistance temperature, (2) The friction coefficient is small because the taper surface is slid and deformed by pressure, and (3) the material properties are that the Young's modulus is small and easy to deform. Polytetrachloroethylene has a heat-resistant temperature (50% decrease in physical properties) of 200 ° C or higher, a static friction coefficient (abrasion-resistant steel) of about 0.02, and a Young's modulus of about 460 MPa. Conditions for use in this sliding part sealing mechanism The material is very suitable for
[0050]
In this example, plasticization and injection of the resin were performed by a known method as follows. First, dried resin pellets (not shown) stay in the hopper 30 and are sent out while being plasticized in front of the screw 16 by rotating the screw 16 in the heating cylinder 17 during plasticization. Since molten resin accumulates in front of the screw 16 and the internal pressure increases, the screw 16 moves backward. Thereafter, the screw 16 advances to the mold side, passes through the nozzle 21, and fills each cavity 12 through the spool 15 in the mold. The mold is temperature-controlled at 120 ° C. by a temperature control medium flowing through a temperature control circuit (not shown).
[0051]
In this example, polycarbonate (GE Plastics Lexan 131) having a glass transition temperature of about 155 ° C. was used as the resin. And the temperature of the heating cylinder 17 was 340 degreeC.
[0052]
Next, with reference to FIGS. 2 (a) to 2 (c) and FIGS. 4 (a) to 4 (d), a molding method in this embodiment will be described. First, as shown in FIGS. 2 (a) and 4 (a), molten resin 9 was injected and filled in a state where mold clamping pressure P1 was applied to cavity 12 at 30 MPa.
[0053]
Next, as shown in FIG. 4B, the stroke adjusting rod 38 moves to T ₂ = 0. As a result, the spool lock rod 36 seals the gate at the lower end of the spool 15. The seal ring 18 is pressurized by supercritical CO ₂ and seals the cavity 12 in FIGS. 4 (a) and 4 (b).
[0054]
Next, as shown in FIGS. 2 (b) and 4 (c), the both molds were opened so that the opening amount T was 0.01 mm after filling. FIG. 4C shows a state in which the movable mold 13 has moved leftward relative to the fixed mold 14 and the spool lock rod 36 from the state shown in FIG. At that time, the seal ring 18 was driven to maintain the confidentiality of the cavity 12. As soon as the cavity 12 was opened, a supercritical fluid and an organic material were injected from the surface of the movable mold 13 into the molten resin surface through the mold introduction flow path 8a. Since the cavity 12 is decompressed, the fluid flows into the cavity 12 in a short time. Due to the pressure of the fluid, the resin molded product sticks to the fixed mold 14 side, and the fluid penetrates into the gap between the movable mold 13 and the molten resin 9. In this embodiment, the timing for opening the cavity and reducing the pressure is the same as the timing for injecting the supercritical fluid, but they are arbitrary.
[0055]
In the present invention, the position of the opening portion of the cavity 12 and the opening method are not limited. For example, the fixed mold 14 and the movable mold 13 that form the cavity 12 are opened immediately after resin filling, and only one side of the resin is modified by injecting a supercritical fluid and an organic material from one of the mold surfaces. The entire surface can be modified by injecting a supercritical fluid and an organic material from both sides of the mold. When the movable mold 13 is opened after filling with the molten resin, the resin of the runner spool 15 having high fluidity usually enters the cavity 12 at a high temperature. Similarly, when the movable mold 13 is closed, the molten resin in the cavity 12 flows out to the runner / spool 15 side. However, the filling amount and pressure in the cavity are controlled by a gate seal mechanism independent of the mold opening amount of the mold. Can be stabilized. In addition, since the gate seal member can be prevented from contacting and colliding by holding the gate seal position stably, the maintenance frequency is also reduced. A drive part such as an ejector pin is formed on a part of the cavity surface, and the drive part is formed by injecting the substance after depressurizing the resin surface by retracting the drive part after filling the resin. Only a portion can be selectively surface-modified.
[0056]
By vacuum-adsorbing the molded body on the cavity surface opposite to the side on which the supercritical fluid is injected, it is possible to suppress the wraparound of the supercritical fluid and organic material to the opposite surface. In addition, the pressure can be controlled with a mold part such as an ejector pin to selectively modify the surface.
[0057]
Next, as shown in FIGS. 2 (c) and 4 (d), a high mold clamping pressure P <b> 3 was applied to close the cavity 12. As a result, an organic material, that is, a metal complex was injected near the entire surface of the movable side.
[0058]
Next, after the cooling of the molded body in the mold was completed, the solenoid valve 1G was opened, the CO ₂ was gasified under reduced pressure, escaped to the atmosphere, and the mold was opened to the product removal position. Furthermore, the ejector plate 35 and the ejector pin 10 attached thereto were driven by the ejecting force of the ejector rod 34 built in the movable platen 32 to eject the molded product, and the product was taken out. The ejector pin 10 is inserted into a compression spring 39 b, and the compression spring 39 b presses the movable mold 13 via the ejector plate 35.
[0059]
It was confirmed that the surface of the molded article produced in this example was oriented with Pt complexes that were dissolved in the supercritical fluid and Pt fine particles with organic substances removed from the complexes. It was also confirmed that the melt was hardly contained in the center of the molded product.
[0060]
In the present invention, after the supercritical fluid solution such as a metal complex is oriented on the surface of the molded article by the above-mentioned method, a post-treatment such as heating or a reduction reaction may be performed. For 1 hour to remove the ligand almost completely.
[0061]
In this example, electroless copper plating was performed on the molded product produced by the injection molding method by the following method. First, it was placed in a container containing an aqueous solution for electroless copper plating ("OPC700A" manufactured by Okuno Pharmaceutical Co., Ltd., 100 ml / liter + "OPC700B" manufactured by Okuno Pharmaceutical Co., Ltd., 100 ml / liter) and stirred for 60 minutes at room temperature to perform copper plating. Further, after washing, an aqueous solution for electroless copper plating ("OPC Copper T1" manufactured by Okuno Pharmaceutical Co., Ltd. 60ml / liter + "OPC Copper T2" manufactured by Okuno Pharmaceutical Co., Ltd. 12ml / liter + "OPC Copper T3" manufactured by Okuno Pharmaceutical Co., Ltd. 100ml) / Liter) was placed in a container containing 60 lC and stirred for 120 minutes and air for copper plating. After ultrasonic cleaning with pure water and methanol, a copper plating film having a thickness of 10 μm was formed on the entire surface of the molded product. Further, it was confirmed that the plating film had a uniform film thickness, no blistering, and an adhesion strength having no practical problem was obtained in the peel test. Further, it was confirmed that the electroless plating film had an electric resistance of 1Ω or less and excellent electromagnetic shielding properties.
[0062]
As explained above, the plastic molded body of the present embodiment has a good electromagnetic shielding thin film excellent in adhesion and film thickness uniformity because metal fine particles serving as plating nuclei for electroless plating are dispersed in the vicinity of the plastic surface. Have. In addition, according to the plastic molding method of the present invention, since the surface of an arbitrary portion of the molded body can be modified, the molded body can be enhanced in function.
[0063]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the method, metal mold | die, and molded product which manufacture the molded article by which the surface was selectively modified without roughening the surface at the time of shaping | molding are provided.
[Brief description of the drawings]
FIG. 1 is a sectional view of an injection molding apparatus according to the present invention and a partially enlarged view thereof.
FIG. 2 is a partially enlarged cross-sectional view for explaining a molding operation of the injection molding apparatus shown in FIG.
3 is a partially enlarged cross-sectional view of the injection molding apparatus shown in FIG.
FIG. 4 is a detailed partial sectional view of FIG. 2;
[Explanation of symbols]
7 Functional Organic Material 8a Introduction Channel 9 Molten Resin 10 Ejector Pin 11 Retention Space 12 Cavity 13 Movable Mold 14 Fixed Mold 15 Spool 18 Seal Ring

Claims (5)

A method for producing a molded product from a thermoplastic resin,
Injecting a softened thermoplastic resin into the cavity formed by the mold;
Opening at least a portion of the cavity;
Injecting a functional organic material dissolved in a supercritical fluid onto the thermoplastic resin from the open part of the cavity;
A method for producing a molded product comprising the step of pressurizing the thermoplastic resin and the functional organic material in the cavity.   The method of claim 1, further comprising sealing a gate for injecting the thermoplastic resin into the cavity during the opening step. The functional organic material is a metal complex,
The method
Removing the ligand of the metal complex to precipitate metal particles;
The method according to claim 1, further comprising: forming a plating layer at a site where the metal particles are deposited by electroless plating. A method for producing a molded product from a thermoplastic resin,
Injecting a softened thermoplastic resin into a cavity formed by a fixed mold and a movable mold;
Moving the movable mold relative to the fixed mold so as to form a predetermined opening amount;
Injecting a functional organic material dissolved in a supercritical fluid onto the thermoplastic resin in the cavity;
A method for producing a molded product comprising the step of pressurizing the thermoplastic resin and the functional organic material in the cavity. A method for producing a molded product from a thermoplastic resin,
Injecting a softened thermoplastic resin into a cavity formed by a fixed mold and a movable mold;
Moving the movable mold relative to the fixed mold so as to form a predetermined opening amount;
Injecting a functional organic material dissolved in a supercritical fluid onto the thermoplastic resin in the cavity;
And a step of infiltrating the functional organic material into the surface of the thermoplastic resin in the cavity.

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