JP3950084B2 - High pressure processing equipment - Google Patents

High pressure processing equipment Download PDF

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Publication number
JP3950084B2
JP3950084B2 JP2003160050A JP2003160050A JP3950084B2 JP 3950084 B2 JP3950084 B2 JP 3950084B2 JP 2003160050 A JP2003160050 A JP 2003160050A JP 2003160050 A JP2003160050 A JP 2003160050A JP 3950084 B2 JP3950084 B2 JP 3950084B2
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JP
Japan
Prior art keywords
opening
pressure
processing
processed
processing fluid
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JP2003160050A
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Japanese (ja)
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JP2004079999A (en
Inventor
克充 渡邉
正悟 猿丸
由彦 坂下
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Kobe Steel Ltd
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Kobe Steel Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は、例えば、半導体製造工程など、特にウェーハや液晶ガラス基板の処理に用いられる高圧処理装置に関する。
【0002】
【従来の技術】
この種の高圧処理装置として、例えば、特開平8−206485号公報に、半導体装置及び液晶ディスプレイ等の微細加工部品を超臨界流体で洗浄するものが開示されている(以下、「従来技術1」という)。
この従来のものは、高圧容器に供給される処理流体の供給系統を、入口と出口を有した昇圧、排出用の第1系統と、循環させながら洗浄処理を行う第2系統の二つに分けたものであった。そして、第2系統による循環洗浄処理のとき、容器内の処理流体の流れを均一にすべく、容器内に層流ダクトやスノコからなる均一化手段を設けたものであった。
【0003】
この従来のものでは、被処理体が単数か複数か明示されておらず、また、均一化手段を通過した後の処理流体と被処理体との具体的な接触については開示されていない。
一方、複数の被処理体に対して処理流体を均一に接触させる具体的構成を開示したものとして、例えば、特開2001−77074号公報に記載のものが公知である(以下、「従来技術2」という)。
この従来のものは、洗浄流体が流入排出可能な洗浄容器内で半導体ウエハ等の被洗浄体を前記洗浄流体によって洗浄する装置であって、前記洗浄容器内部には、被洗浄体を複数収納する収納容器が設けられ、当該収納容器には、収納容器内部に洗浄流体を流入させるための流入口と、収納容器外部に洗浄流体を排出させるための排出口とが複数個設けられ、各被洗浄体の表面を流れる前記洗浄流体量がほぼ均一となるよう前記流入口及び排出口それぞれの開口面積及び/又は開口個数が被洗浄体の載置方向に異なるように形成されているものであった。
【0004】
【発明が解決しようとする課題】
前記従来技術2では、洗浄容器内部を昇圧するため、大流量の処理流体を供給すれば、収納容器の流入口からの処理流体の流速が早くなりすぎ、その内部に収納された被処理体を破損するおそれがあるため、昇圧速度を早くできないという問題があった。
この問題は、前記従来技術1においても同じであった。即ち、第1系統も第2系統も同じ均一化手段を処理流体が通過するため、昇圧時に大流量の処理流体を供給すれば、均一化手段を通過する処理流体の流速が早くなりすぎ、被処理体を破損する畏れがあった。
【0005】
そこで、本発明は、被処理体を破損することなく昇圧速度を速くして、処理時間の短縮を図った高圧処理装置を提供することを目的とする。
【0006】
【課題を解決するための手段】
前記目的達成のため、本発明は、次の手段を講じた。即ち、本発明の特徴とするところは、複数の被処理体を収納する高圧容器と、該高圧容器へ処理流体を供給する供給装置とを備えた高圧処理装置において、前記供給装置は、高圧容器内圧を昇圧するために処理流体を供給する昇圧導入部と、前記複数の被処理体へ個別に処理流体を供給する処理導入部とをそれぞれ独立して備えている点にある。
前記構成の本発明によれば、昇圧導入部と処理導入部をそれぞれ独立して備えているので、昇圧導入部を処理導入部に影響を受けることなく設けることができ、すなわち、昇圧導入部からの処理流体が被処理体へ影響を与えないように昇圧導入部を設けることができる。
【0007】
このような昇圧導入部を設けることにより、昇圧導入部からの処理流体の流量を大きくして、昇圧時間の短縮を図っても、その処理流体により被処理体が破損されることが防止される。
前記昇圧導入部は、前記高圧容器内面に開口する開口部を備えた処理流体供給孔を有し、且つ前記開口部を開閉自在とする開閉装置を有するのが好ましい。
前記開閉装置は、前記高圧容器の内圧により前記開口部を密閉する開閉部材を有するのが好ましい。
【0008】
前記開口部は、前記供給孔よりも直径が大きな座ぐり凹部を有し、前記開閉装置は、前記凹部に嵌合して前記開口部を塞いだとき、高圧容器内面と面一になる開閉部材を有するのが好ましい。
前記駆動部は、磁気力により前記開閉部材の動作を行うものであるのが好ましい。
なお、最も好ましい技術的手段としては、複数の被処理体を収納する高圧容器と、該高圧容器へ処理流体を供給する供給装置とを備えた高圧処理装置において、前記供給装置は、高圧容器内圧を昇圧するために処理流体を供給する昇圧導入部と、前記複数の被処理体へ個別に処理流体を供給する処理導入部とをそれぞれ独立して備え、前記高圧容器内には前記複数の被処理体を個別に保持する保持手段を設け、前記保持手段は、前記高圧容器内の周方向に配置された複数の支柱と、該支柱に設けられ上下方向に積層状に前記被処理体を保持する保持部とを有し、前記昇圧導入部から供給された処理流体が、積層状に保持された被処理体の間へ、当該被処理体の全外周面から供給されるように構成するとよい。
【0009】
【発明の実施の形態】
以下、本発明の実施の形態を図面に基づき、説明する。
図1、2に示す高圧処理装置は、半導体ウェーハの超臨界洗浄装置である。この高圧処理装置は、高圧容器1を有し、該高圧容器1は、筒状本体2と、該本体2の上下開口部を塞ぐ上蓋3と下蓋4とから構成されている。この本体2内部が処理室5とされている。この容器1の上蓋3及び下蓋4は、図示省略のフレームなどにより支持されて、前記処理室5を密封状に維持する。
【0010】
前記処理室5内に被処理体6が収納される。
前記被処理体6は、この実施の形態では、円盤状の半導体ウェーハとされている。この被処理体6の複数枚が前記処理室5に収納される。この複数枚の被処理体6を保持する保持手段7が、前記下蓋4の上面に設けられている。前記処理室5は、その断面が円形とされ、前記保持手段7は、該処理室5と同心円上に周方向所定間隔を有して配置された支柱8を有する。この支柱8に、前記被処理体6を上下方向に等間隔を有して積層状に保持する保持部9が設けられている。
【0011】
前記下蓋4は、前記フレームの支持を解除されたとき、図示省略の昇降装置により上下動自在とされ、被処理体6を処理室5に収納又は取り出し自在とされている。
前記処理室5へ処理流体を供給する供給装置が設けられている。処理流体として、例えば、超臨界流体が用いられる。この供給装置は、高圧容器1内圧を昇圧するために処理流体を処理室5へ供給する昇圧導入部10と、前記複数の被処理体6へ個別に処理流体を供給する処理導入部11とをそれぞれ独立して備えている。
【0012】
前記昇圧導入部10は、前記高圧容器1内面に開口する開口部12を備えた処理流体供給孔13を有し、且つ前記開口部12を開閉自在とする開閉装置14を有する。この実施の形態では、前記上蓋3に処理流体供給孔13が上下方向に貫通して設けられ、前記開口部12は、上蓋3の下面に位置している。前記開口部12は、前記供給孔13よりも直径が大きな座ぐり凹部15を有する。この凹部15は、前記供給孔13と同心の円形に形成されている。
前記開閉装置14は、前記凹部15に嵌合して前記開口部12を塞いだとき、高圧容器1内面と面一になる開閉部材16を有する。この開閉部材16は、前記凹部15の深さと略同じ厚みを有する円板状に形成され、円板上面と凹部15下面間に面シール部材17が介在されている。即ち、前記開閉部材16は、前記処理室5内の内圧により前記開口部12を密閉する自己シール構造とされている。
【0013】
前記開閉部材16の上面中心に軸18が固定され、該軸18が前記供給孔13に挿入されている。この軸18外周面と供給孔13内面との間には、処理流体が通過可能な通路が形成されている。
前記軸18は、上蓋3の上面よりも上方に突出し、該軸18の突出端部は、軸受19により上下方向摺動自在に支持されている。この軸受19は、前記処理流体供給孔13の上部開口を密閉するよう、上蓋3に固定されている。そして、この軸受19に昇圧導入部10の処理流体入口20が設けられ、該入口20から供給された処理流体が処理室5内へ供給可能に構成されている。
【0014】
前記開閉装置14は、前記開閉部材16の開閉動作を制御する駆動部21を有する。この実施の形態では、前記駆動部21は、磁気力により前記開閉部材16の動作を行うものとされている。
即ち、前記軸18の上端部に磁性体22が設けられ、前記軸受19に磁石23が上下動自在に設けられている。そして、前記磁石23を上下動させることにより、前記開閉部材16が上下動して、開口部12を開いたり閉じたり、または、その開度を制御する。この磁石23の上下動は、自動制御されている。
【0015】
前記処理流体供給装置の内、前記処理導入部11は、前記下蓋4に立設固定され、その内部に供給管24を有する。この処理導入部11は、前記処理室5の中心と同心円上に周方向に所定間隔を有して配置されている。そして、この処理導入部11は、前記保持手段7の支柱8と干渉しない位置に配置されている。
前記処理導入部11には、前記支柱8の保持部9と対応する位置に、ノズル25が設けられている。このノズル25から、噴出される処理流体が前記保持手段7に保持された被処理体6の上面又は下面、若しくは上下面間に供給される。なお、前記供給管24に処理流体を供給する流路26が、前記下蓋4に設けられている。
【0016】
なお、前記高圧容器1には、処理室5内の処理流体を排出するための排出孔27が設けられている。この実施の形態では、下蓋4に排出孔27が設けられているが、この位置は、特に限定されない。例えば、この排出孔27を、前記処理流体入口20と共用させてもよい。
前記実施の形態によれば、図1に示すように、昇圧導入部10の開口部12を開き、処理流体を処理室5内へ供給する。このとき、大流量の処理流体を供給しても、処理流体は、その液面を上昇させつつ積層された被処理体6の間へその全外周面から供給されるので、被処理体6を破損するようなことはない。
【0017】
処理室5内が所定圧力に達すると、開閉装置14の駆動部21の磁石23を上方へ移動させることにより、開閉部材16を上方へ移動させて供給孔13の開口部12を閉じる。
このとき、開閉部材16を移動させるための力は、初期シールが可能な最小の力で足り、処理室5内の圧力が昇圧導入部10の圧力よりも大きくなると、この開閉部材16は、自己シール機能により自分自身をシールするので、高圧処理室5内の処理流体が開口部12から漏れ出ることはない。
【0018】
図2は、昇圧が終わり、開閉部材16が開口部12を閉じ、処理導入部11から処理流体を導入している様子を示している。このとき、開閉部材16は、開口部12の凹部15内に収納され、高圧容器1内面は面一となっているので、処理室5内にデッドスペースが生じず、コンパクトな設計で多数の被処理体6を収納することができる。
図3に示すものは、本体2と下蓋4が一体成型されており、保持手段7が上蓋3より吊り下げられたものであり、また、処理導入部11も上蓋3に設けられており、その他の構成は、前記図1に示すものと同じである。
【0019】
尚、本発明は、前記各実施の形態に示すものに限定されるものではない。
【0020】
【発明の効果】
本発明によれば、被処理体を破損することなく昇圧速度を速くして、処理時間の短縮を図ることができる。
【図面の簡単な説明】
【図1】図1は、本発明の第1の実施の形態を示す断面図であり、開閉部材が開いている状態を示している。
【図2】図2は、本発明の第1の実施の形態を示す断面図であり、開閉部材が閉じている状態を示している。
【図3】図3は、本発明の第2の実施の形態を示す断面図である。
【符号の説明】
1 高圧容器
6 被処理体
7 保持手段
10 昇圧導入部
11 処理導入部
12 開口部
13 供給孔
14 開閉装置
15 凹部
16 開閉部材
17 面シール部材
21 駆動部
23 磁石
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a high-pressure processing apparatus used for processing a wafer or a liquid crystal glass substrate, such as a semiconductor manufacturing process.
[0002]
[Prior art]
As this type of high-pressure processing apparatus, for example, Japanese Patent Application Laid-Open No. 8-206485 discloses an apparatus that cleans microfabricated parts such as semiconductor devices and liquid crystal displays with a supercritical fluid (hereinafter referred to as “Prior Art 1”). Called).
In this conventional system, the supply system of the processing fluid supplied to the high-pressure vessel is divided into two systems: a first system for pressurization and discharge having an inlet and an outlet, and a second system for performing a cleaning process while circulating. It was. And in the circulation washing process by the second system, in order to make the flow of the processing fluid in the container uniform, a uniformizing means comprising a laminar flow duct and slats is provided in the container.
[0003]
In this prior art, it is not specified whether the object to be processed is singular or plural, and no specific contact between the processing fluid and the object to be processed after passing through the uniformizing means is disclosed.
On the other hand, as a disclosure of a specific configuration in which a processing fluid is uniformly brought into contact with a plurality of objects to be processed, for example, one disclosed in Japanese Patent Laid-Open No. 2001-77074 is known (hereinafter referred to as “Prior Art 2”). ").
This conventional apparatus is an apparatus for cleaning an object to be cleaned, such as a semiconductor wafer, with the cleaning fluid in a cleaning container into which cleaning fluid can flow in and out, and a plurality of objects to be cleaned are accommodated in the cleaning container. A storage container is provided, and the storage container is provided with a plurality of inlets for allowing the cleaning fluid to flow into the storage container and a plurality of outlets for discharging the cleaning fluid to the outside of the storage container. The opening area and / or the number of openings of the inflow port and the discharge port are different from each other in the mounting direction of the body to be cleaned so that the amount of the cleaning fluid flowing on the surface of the body is substantially uniform. .
[0004]
[Problems to be solved by the invention]
In the prior art 2, in order to pressurize the inside of the cleaning container, if a large flow rate of processing fluid is supplied, the flow rate of the processing fluid from the inlet of the storage container becomes too high, and the object to be processed stored in the inside of the cleaning container There was a problem that the pressure increase speed could not be increased because of the possibility of breakage.
This problem was the same in the prior art 1. That is, since the processing fluid passes through the same homogenizing means in both the first system and the second system, if a large amount of processing fluid is supplied at the time of pressurization, the flow speed of the processing fluid passing through the homogenizing means becomes too high, and the flow rate is increased. There was a fear of damaging the treated body.
[0005]
Therefore, an object of the present invention is to provide a high-pressure processing apparatus that can increase the pressure increase speed without damaging the object to be processed, thereby shortening the processing time.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has taken the following measures. That is, the present invention is characterized in that a high-pressure processing apparatus including a high-pressure container that houses a plurality of objects to be processed and a supply device that supplies a processing fluid to the high-pressure container, A pressure increase introduction unit that supplies a processing fluid to increase the internal pressure and a processing introduction unit that individually supplies the processing fluid to the plurality of objects to be processed are provided independently.
According to the present invention having the above configuration, since the boost introduction part and the process introduction part are provided independently, the boost introduction part can be provided without being affected by the process introduction part, that is, from the boost introduction part. The pressurizing introduction part can be provided so that the processing fluid does not affect the object to be processed.
[0007]
By providing such a pressure increase introduction part, even if the flow rate of the processing fluid from the pressure increase introduction part is increased and the pressure increase time is shortened, the object to be processed is prevented from being damaged by the process fluid. .
It is preferable that the pressurization introducing portion has a processing fluid supply hole having an opening that opens to the inner surface of the high-pressure vessel, and an opening / closing device that allows the opening to be opened and closed.
The opening / closing device preferably includes an opening / closing member that seals the opening by an internal pressure of the high-pressure vessel.
[0008]
The opening has a counterbore recess having a diameter larger than that of the supply hole, and the opening / closing device is flush with the inner surface of the high-pressure vessel when the opening is fitted to close the opening. It is preferable to have.
It is preferable that the driving unit performs the operation of the opening / closing member by a magnetic force.
The most preferable technical means is a high-pressure processing apparatus including a high-pressure container that houses a plurality of objects to be processed and a supply device that supplies a processing fluid to the high-pressure container. Each of the plurality of objects to be processed is provided independently from each other, and a pressure introducing part for supplying a processing fluid to the plurality of objects to be processed is provided independently. Holding means for individually holding the processing objects is provided, and the holding means holds the plurality of support columns arranged in the circumferential direction in the high-pressure vessel and the processing object provided in a stack in the vertical direction. It is preferable that the processing fluid supplied from the pressurizing introduction unit is supplied from the entire outer peripheral surface of the object to be processed between the objects to be processed held in a stacked shape. .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The high-pressure processing apparatus shown in FIGS. 1 and 2 is a supercritical cleaning apparatus for semiconductor wafers. The high-pressure processing apparatus has a high-pressure vessel 1, and the high-pressure vessel 1 is composed of a cylindrical main body 2, and an upper lid 3 and a lower lid 4 that close the upper and lower openings of the main body 2. The inside of the main body 2 is a processing chamber 5. The upper lid 3 and the lower lid 4 of the container 1 are supported by a frame or the like (not shown) to keep the processing chamber 5 sealed.
[0010]
A target object 6 is accommodated in the processing chamber 5.
In this embodiment, the object 6 is a disk-shaped semiconductor wafer. A plurality of the workpieces 6 are stored in the processing chamber 5. Holding means 7 for holding the plurality of workpieces 6 is provided on the upper surface of the lower lid 4. The processing chamber 5 has a circular cross section, and the holding means 7 has support columns 8 arranged concentrically with the processing chamber 5 and having a predetermined circumferential interval. The support 8 is provided with a holding portion 9 that holds the object 6 in a stacked manner with equal intervals in the vertical direction.
[0011]
When the support of the frame is released, the lower lid 4 can be moved up and down by an elevating device (not shown), and the object 6 can be stored in or removed from the processing chamber 5.
A supply device for supplying a processing fluid to the processing chamber 5 is provided. For example, a supercritical fluid is used as the processing fluid. This supply device includes a pressure introducing part 10 for supplying a processing fluid to the processing chamber 5 to increase the internal pressure of the high-pressure vessel 1 and a processing introducing part 11 for supplying the processing fluid individually to the plurality of objects to be processed 6. Each is provided independently.
[0012]
The pressurizing introduction unit 10 includes a processing fluid supply hole 13 having an opening 12 that opens to the inner surface of the high-pressure vessel 1, and an opening / closing device 14 that allows the opening 12 to be opened and closed. In this embodiment, a processing fluid supply hole 13 is provided in the upper lid 3 so as to penetrate in the vertical direction, and the opening 12 is located on the lower surface of the upper lid 3. The opening 12 has a counterbore 15 having a diameter larger than that of the supply hole 13. The recess 15 is formed in a circular shape concentric with the supply hole 13.
The opening / closing device 14 has an opening / closing member 16 that is flush with the inner surface of the high-pressure vessel 1 when the opening 12 is closed by fitting in the recess 15. The opening / closing member 16 is formed in a disk shape having substantially the same thickness as the depth of the recess 15, and a face seal member 17 is interposed between the upper surface of the disk and the lower surface of the recess 15. That is, the opening / closing member 16 has a self-sealing structure that seals the opening 12 by the internal pressure in the processing chamber 5.
[0013]
A shaft 18 is fixed to the center of the upper surface of the opening / closing member 16, and the shaft 18 is inserted into the supply hole 13. A passage through which the processing fluid can pass is formed between the outer peripheral surface of the shaft 18 and the inner surface of the supply hole 13.
The shaft 18 projects upward from the upper surface of the upper lid 3, and the projecting end of the shaft 18 is supported by a bearing 19 so as to be slidable in the vertical direction. The bearing 19 is fixed to the upper lid 3 so as to seal the upper opening of the processing fluid supply hole 13. The bearing 19 is provided with a processing fluid inlet 20 of the pressure increasing introduction unit 10 so that the processing fluid supplied from the inlet 20 can be supplied into the processing chamber 5.
[0014]
The opening / closing device 14 includes a drive unit 21 that controls the opening / closing operation of the opening / closing member 16. In this embodiment, the drive unit 21 operates the opening / closing member 16 by a magnetic force.
That is, a magnetic body 22 is provided at the upper end of the shaft 18, and a magnet 23 is provided on the bearing 19 so as to be movable up and down. Then, by moving the magnet 23 up and down, the opening and closing member 16 moves up and down to open or close the opening 12 or to control its opening degree. The vertical movement of the magnet 23 is automatically controlled.
[0015]
Of the processing fluid supply device, the processing introducing portion 11 is erected and fixed to the lower lid 4 and has a supply pipe 24 therein. The processing introducing portion 11 is arranged on the concentric circle with the center of the processing chamber 5 at a predetermined interval in the circumferential direction. And this process introduction part 11 is arrange | positioned in the position which does not interfere with the support | pillar 8 of the said holding means 7. FIG.
The processing introduction part 11 is provided with a nozzle 25 at a position corresponding to the holding part 9 of the support column 8. From this nozzle 25, the ejected processing fluid is supplied between the upper or lower surface or the upper and lower surfaces of the workpiece 6 held by the holding means 7. A channel 26 for supplying a processing fluid to the supply pipe 24 is provided in the lower lid 4.
[0016]
The high-pressure vessel 1 is provided with a discharge hole 27 for discharging the processing fluid in the processing chamber 5. In this embodiment, the discharge hole 27 is provided in the lower lid 4, but this position is not particularly limited. For example, the discharge hole 27 may be shared with the processing fluid inlet 20.
According to the embodiment, as shown in FIG. 1, the opening 12 of the pressure increasing introduction unit 10 is opened, and the processing fluid is supplied into the processing chamber 5. At this time, even if a large amount of processing fluid is supplied, the processing fluid is supplied from the entire outer peripheral surface between the processing objects 6 stacked while raising the liquid level. There will be no damage.
[0017]
When the inside of the processing chamber 5 reaches a predetermined pressure, the opening / closing member 16 is moved upward by moving the magnet 23 of the driving unit 21 of the opening / closing device 14 upward to close the opening 12 of the supply hole 13.
At this time, the force for moving the opening / closing member 16 is sufficient as the minimum force capable of initial sealing. Since the sealing function seals itself, the processing fluid in the high-pressure processing chamber 5 does not leak from the opening 12.
[0018]
FIG. 2 shows a state in which the pressurization is finished, the opening / closing member 16 closes the opening 12, and the processing fluid is introduced from the processing introducing portion 11. At this time, since the opening / closing member 16 is housed in the recess 15 of the opening 12 and the inner surface of the high-pressure vessel 1 is flush, there is no dead space in the processing chamber 5, and a large number of covered objects with a compact design. The processing body 6 can be accommodated.
3, the main body 2 and the lower lid 4 are integrally molded, the holding means 7 is suspended from the upper lid 3, and the processing introduction part 11 is also provided on the upper lid 3. Other configurations are the same as those shown in FIG.
[0019]
In addition, this invention is not limited to what is shown to each said embodiment.
[0020]
【The invention's effect】
According to the present invention, it is possible to shorten the processing time by increasing the pressure increasing speed without damaging the object to be processed.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a first embodiment of the present invention, showing a state in which an opening / closing member is open.
FIG. 2 is a cross-sectional view showing a first embodiment of the present invention, showing a state in which an opening / closing member is closed.
FIG. 3 is a cross-sectional view showing a second embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 High pressure vessel 6 To-be-processed object 7 Holding means 10 Pressure | voltage rise introduction part 11 Process introduction part 12 Opening part 13 Supply hole 14 Opening and closing device 15 Recessed part 16 Opening / closing member 17 Face seal member 21 Drive part 23 Magnet

Claims (6)

複数の被処理体を収納する高圧容器と、該高圧容器へ処理流体を供給する供給装置とを備えた高圧処理装置において、
前記供給装置は、高圧容器内圧を昇圧するために処理流体を供給する昇圧導入部と、前記複数の被処理体へ個別に処理流体を供給する処理導入部とをそれぞれ独立して備え
前記高圧容器内には前記複数の被処理体を個別に保持する保持手段が設けられ、
前記保持手段は、前記高圧容器内の周方向に配置された複数の支柱と、該支柱に設けられ上下方向に積層状に前記被処理体を保持する保持部とを有し、
前記昇圧導入部から供給された処理流体が、積層状に保持された被処理体の間へ、当該被処理体の全外周面から供給されるように構成されていることを特徴とする高圧処理装置。
In a high-pressure processing apparatus including a high-pressure container that stores a plurality of objects to be processed and a supply device that supplies a processing fluid to the high-pressure container,
The supply device is independently provided with a pressurization introduction unit that supplies a processing fluid to increase the internal pressure of the high-pressure vessel and a processing introduction unit that individually supplies the processing fluid to the plurality of objects to be processed ,
Holding means for individually holding the plurality of objects to be processed is provided in the high-pressure vessel,
The holding means includes a plurality of support columns arranged in the circumferential direction in the high-pressure vessel, and a holding unit that is provided on the support columns and holds the object to be processed in a vertical stack.
The high-pressure process is characterized in that the processing fluid supplied from the pressurizing introduction part is supplied from the entire outer peripheral surface of the object to be processed between the objects to be processed held in a laminated form. apparatus.
前記昇圧導入部は、前記高圧容器内面に開口する開口部を備えた処理流体供給孔を有し、且つ前記開口部を開閉自在とする開閉装置を有することを特徴とする請求項1記載の高圧処理装置。  2. The high pressure according to claim 1, wherein the pressure-introducing part has a processing fluid supply hole having an opening that opens to the inner surface of the high-pressure vessel, and an opening / closing device that allows the opening to be opened and closed. Processing equipment. 前記開閉装置は、前記高圧容器の内圧により前記開口部を密閉する開閉部材を有することを特徴とする請求項2記載の高圧処理装置。  The high-pressure processing apparatus according to claim 2, wherein the opening / closing device includes an opening / closing member that seals the opening by an internal pressure of the high-pressure vessel. 前記開口部は、前記供給孔よりも直径が大きな座ぐり凹部を有し、前記開閉装置は、前記凹部に嵌合して前記開口部を塞いだとき、高圧容器内面と面一になる開閉部材を有することを特徴とする請求項2記載の高圧処理装置。  The opening has a counterbore recess having a diameter larger than that of the supply hole, and the opening / closing device is flush with an inner surface of the high-pressure vessel when the opening is fitted to close the opening. The high-pressure processing apparatus according to claim 2, comprising: 前記開閉装置は、前記開閉部材の開閉動作を制御する駆動部を有することを特徴とする請求項3又は4記載の高圧処理装置。  5. The high-pressure processing apparatus according to claim 3, wherein the opening / closing device includes a drive unit that controls an opening / closing operation of the opening / closing member. 前記駆動部は、磁気力により前記開閉部材の動作を行うものであることを特徴とする請求項5記載の高圧処理装置。  The high-pressure processing apparatus according to claim 5, wherein the driving unit is configured to operate the opening / closing member by a magnetic force.
JP2003160050A 2003-06-04 2003-06-04 High pressure processing equipment Expired - Fee Related JP3950084B2 (en)

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