JP3947513B2 - Electrical inspection apparatus for film carrier tape for mounting electronic components and electrical inspection method for film carrier tape for mounting electronic components - Google Patents

Description

The present invention relates to TAB (Tape Automated Bonding) tape, T-BGA (Tape Ball Grid Array) tape, COF (Chip On Film) tape, CSP (Chip Size Package) tape, A
In electrical inspection of SIC (Application Specific Integrated Circuit) tape, 2 metal (double-sided wiring) tape, etc. (hereinafter simply referred to as “film carrier tape for mounting electronic components”), detect wiring patterns that may cause defects such as disconnection The present invention relates to an electrical inspection device for an electronic component mounting film carrier tape and an electrical inspection method for an electronic component mounting film carrier tape.

With the development of the electronics industry, the demand for printed wiring boards for mounting electronic components such as ICs (integrated circuits) and LSIs (large-scale integrated circuits) is increasing rapidly. There is a demand for higher functionality, and as a method for mounting these electronic components, recently, films for mounting electronic components such as TAB tape, COF (Chip On Film) film, T-BGA tape and ASIC tape, and two metal (double-sided wiring) tape are used. A mounting method using a carrier tape is employed.

  In particular, the importance is increasing in the electronic industry using a liquid crystal display element (LCD), such as a personal computer, for which high definition, thinning, and narrowing of the frame area of a liquid crystal screen are desired.

  Furthermore, with the recent shift to color liquid crystal displays on mobile phones, the demand for film carrier tapes for mounting electronic components has begun to increase significantly, and film carrier tapes in the field of print control in printers connected to personal computers. The increase in demand is starting to increase significantly.

  Such a film carrier tape for mounting electronic components is generally manufactured by the following manufacturing process, for example.

  That is, a plurality of sprocket holes for transportation are formed continuously in the longitudinal direction of the insulating film by punching an insulating film as a base material such as polyimide film, polyester film, polyamide film, liquid crystal polymer film, etc. A conductive layer is formed by adhering a copper foil, such as an electrolytic copper foil or a rolled copper foil, to the surface of the film by thermocompression bonding, for example, via an adhesive.

  Next, a photoresist is applied to the entire surface or a part of the conductive layer, the photoresist is exposed to ultraviolet rays through a photomask having a desired pattern shape, and the exposed photoresist portion is dissolved with a developer. Remove.

  Next, the conductive layer not covered with the photoresist is removed by chemical dissolution (etching treatment) with an acidic solution which is an etching solution, and further, the photoresist is dissolved and removed with an alkaline solution. Thereby, the desired wiring pattern which consists of a conductive layer which remained on the insulating film is formed.

Then, the wiring pattern is covered with a solder resist layer to prevent a short circuit due to dust, whiskers, or migration when mounting the electronic component, and to protect and insulate the wiring patterns.

  Specifically, a solder resist that is an insulating resin, for example, in an area excluding an inner lead portion connected to an electronic component such as an IC and an outer lead portion connected to an external terminal in the wiring pattern, for example, Then, a solder resist layer is formed by a screen printing method.

  After the solder resist layer is formed in this manner, the exposed lead portions are subjected to, for example, tin plating, gold plating, tin-lead eutectic alloy plating, etc., thereby obtaining a film carrier tape for mounting electronic components. This plating is applied to prevent oxidation and discoloration of each exposed lead portion and to secure bonding strength at each lead portion.

  Thereafter, a semiconductor is mounted on the inner lead portion of the electronic component mounting film carrier tape using a bonding apparatus, and is sealed with resin.

  By the way, in each process and final process of manufacturing such a film carrier tape for mounting electronic components, quality inspection, for example, quality inspection of a wiring pattern, etc. is performed. Conventional visual inspection (transmitted light inspection) In recent years, as a method for more efficient and accurate inspection, a pair of probe pins are brought into contact with a wiring pattern provided on one surface of a film carrier tape for mounting electronic components, thereby disconnecting the wiring. A method of electrically inspecting a short circuit or an insulation resistance between adjacent wirings has been performed.

  However, with such an inspection method, a disconnected wire can be reliably detected, but a wire that is about to be disconnected due to a defect such as chipping or thinning cannot be detected.

  For this reason, for example, when used for a liquid crystal display element (LCD), the wiring breaks when the film carrier tape for mounting electronic components is folded at the slit portion and used at the time of connection to the liquid crystal panel. There has been a problem that defects such as these occur.

  In addition, thin film carrier tapes for mounting electronic components in recent years and finer pitches for wiring patterns are rapidly progressing, which increases the number of defects such as wire breakage caused by bending of film carrier tapes for mounting electronic components. There is a problem that.

  For this reason, Patent Document 1 (Japanese Patent Laid-Open No. 2003-7774) proposes an inspection method and an inspection apparatus for an electronic component mounting film carrier tape that can prevent the occurrence of defects in the electronic component mounting film carrier tape.

  That is, in the inspection device for film carrier tape for mounting electronic components disclosed in Patent Document 1, as shown in FIG. 7, an inspection stage 102 and a pair of probe pins 104 and 106 are fixed to a pattern inspection unit 100. A member 108 is provided.

  A film carrier tape 110 is sandwiched and positioned between the inspection stage 102 and the fixing member 108 which can move up and down.

  A pair of probe pins 104 and 106 are brought into contact with the pad portions 114a and 116a of the outer leads 114 and 116 of the wiring pattern 112 of the film carrier tape 110, and a continuity test is performed.

In addition, the fixing member 108 has a conduction terminal 124 for connecting the wires of the inner lead 122 to each other in a region facing the portion of the inner lead 122 which is a portion to which the electronic component of the wiring pattern 112 is connected. Is fixed.

  Further, the inspection stage 102 is provided with a convex portion 126 protruding toward the fixing member 108 over the width direction of the film carrier tape 110. On the other hand, the fixing member 108 is provided with a recess 128 so as to sandwich the protrusion 126.

  Therefore, in the inspection apparatus of Patent Document 1, the outer leads 114 and 116 are held by sandwiching the film carrier tape 110 between the inspection stage 102 having the convex portion 126 and the fixing member 108 having the concave portion 128. A pair of probe pins 104 and 106 are brought into contact with the pad portions 114a and 116a, and a conductive terminal 124 is brought into contact (landing) with the inner lead 122 portion to conduct in a state where bending is applied at a predetermined position. A test is to be conducted.

By forcibly applying such bending, it is possible to forcibly disconnect a wiring pattern that is about to be disconnected due to a defect or the like, and to reliably detect a defect by a continuity test.
Japanese Patent Laid-Open No. 2003-7774

  In the conventional inspection apparatus disclosed in Patent Document 1, the above continuity test is continuously performed on the film carrier tape 110.

  However, when the film carrier tape 110 is bent, the state in which the film carrier tape 110 extends unevenly differs slightly for each measurement of the continuity test, and the repeated measurement accuracy decreases. Will do.

  That is, as shown in FIG. 8, in the inspection apparatus of Patent Document 1, by sandwiching the film carrier tape 110 between the inspection stage 102 having the convex portion 126 and the fixing member 108 having the concave portion 128, With the film carrier tape 110 extending unevenly in a state where the bending is applied to the predetermined position, the contact position (landing position) of the probe pins 104 and 106 is shifted, and the pad portions 114a and 116a of the outer leads 114 and 116 are displaced. In some cases, the probe pins 104 and 106 do not come into contact with each other.

  As a result, although the film carrier tape 110 is normally normal, continuity failure occurs in the continuity test, and it is determined as a defective product, and the accuracy of the inspection is lowered.

  In view of such a current situation, the present invention is a film for mounting electronic components capable of performing electrical inspection such as a continuity test continuously and with high accuracy even on a wiring pattern that is about to be disconnected due to a defect or the like. It is an object of the present invention to provide an electrical inspection apparatus for a carrier tape and an electrical inspection method for a film carrier tape for mounting electronic components.

The present invention has been invented in order to achieve the above-described problems and objects in the prior art, and the electrical inspection apparatus for a film carrier tape for mounting an electronic component according to the present invention is a film carrier tape for mounting an electronic component. A forced bending portion having a forced bending device for forcibly bending the wiring pattern of
An electrical inspection unit that is disposed on the downstream side of the forced bending portion and detects a conduction state of the wiring pattern by bringing a pair of probe pins into contact with the wiring pattern of the film carrier tape for mounting electronic components,
It is characterized by providing.

In addition, the electrical inspection method of the film carrier tape for mounting electronic components according to the present invention includes a forced bending step of forcibly bending the wiring pattern of the film carrier tape for mounting electronic components by a forced bending device,
After the forced bending step, an electrical inspection step of detecting a conduction state of the wiring pattern by bringing a pair of probe pins into contact with the wiring pattern of the film carrier tape for mounting electronic components,
It is characterized by providing.

  By configuring in this way, in the forced bending portion (bending process), the wiring pattern of the film carrier tape for mounting electronic components, in particular, the output side lead portion (drawing wiring) that has a thin wiring width and is easy to break, is forcibly bent. By forcibly bending the wiring pattern, it is possible to forcibly disconnect the wiring pattern that is about to be disconnected due to a defect or the like.

  Then, after such bending is applied and the wiring pattern that is about to be disconnected is forcibly disconnected, the film carrier tape is released from the bent state (in a state in which the film carrier tape is restored to the original state), and an electrical inspection is performed. In the part (electrical inspection process), a pair of probe pins are brought into contact with the wiring pattern of the film carrier tape to detect the conductive state of the wiring pattern.

  Therefore, in the electrical inspection, the film carrier tape that has been unevenly extended is given a bend, and the bend is released, that is, the film carrier tape returns to its original state. Therefore, the probe pin can be accurately brought into contact with the wiring pattern, in particular, the pad portion of the outer lead without shifting the contact position (landing position) of the probe pin.

  Therefore, although the film carrier tape is normally a normal film, the continuity test results in poor continuity and is not judged as a defective product, so that the accuracy of inspection can be greatly improved.

Further, in the present invention, the forced bending device of the forced bending portion is,
A pair of first projecting members disposed on one side in the vertical direction of the electronic component mounting film carrier tape and spaced apart from each other in the longitudinal direction of the electronic component mounting film carrier tape;
A second projecting member disposed on the other side of the film carrier tape for mounting electronic components on the other side in the vertical direction between the pair of first projecting members;
The wiring pattern is configured to be forcibly bent by sandwiching the wiring pattern of the film carrier tape for mounting electronic components from above and below by the pair of first and second protruding members. It is characterized by.

  With this configuration, the wiring pattern is forcibly bent by sandwiching the wiring pattern of the electronic component mounting film carrier tape from above and below by the pair of first and second protruding members. In other words, the wiring pattern that is about to be disconnected due to a defect or the like can be forcibly disconnected, and a defect can be reliably detected by a continuity test.

  In the present invention, at least one of the pair of first projecting members and second projecting members is a roller.

  Thus, since at least one of the pair of first projecting members and second projecting members is a roller, the film carrier tape is not pulled excessively by frictional resistance, and the insulating film and the wiring pattern are configured. The conductive material (copper) is not plastically deformed and the merchantability is not lowered, and the original state can be restored and an accurate electrical inspection can be performed.

  The electronic component mounting film carrier tape electrical inspection apparatus according to the present invention includes a tensile force loading device that applies a tensile force to the electronic component mounting film carrier tape at the time of bending in the forced bending portion. It is characterized by providing.

  Further, the electrical inspection method for the film carrier tape for mounting electronic components according to the present invention is such that in the forced bending step, a tensile force is applied to the film carrier tape for mounting electronic components by the tensile force loading device during the bending. It is characterized by doing.

  With this configuration, the tensile force loading device can perform positioning accurately and can further apply tensile force to the film carrier tape for mounting electronic components during bending. The wiring pattern that is about to be disconnected due to, for example, can be forcibly disconnected, and a defect can be reliably detected by a continuity test.

  Further, in the electrical inspection apparatus for film carrier tape for mounting electronic components according to the present invention, the tensile force load device in the bent portion is a dancer roller that applies a tensile force to the film carrier tape for mounting electronic components. Features.

  Moreover, in the electrical inspection method for a film carrier tape for mounting electronic components according to the present invention, the tensile force load device in the bending step is a dancer roller that applies a tensile force to the film carrier tape for mounting electronic components. Features.

  Thus, since the tensile force load device in the bent portion (bending process) is a dancer roller, the weight of the dancer roller is adjusted to adjust the weight of the dancer roller to a predetermined film carrier tape for mounting electronic components. Therefore, it is possible to reliably forcibly disconnect the wiring pattern that is about to be disconnected due to a defect or the like, and it is possible to reliably detect a defect by a continuity test.

  In addition, by adjusting the weight of the dancer roller, a predetermined tensile force can be applied to the film carrier tape for mounting electronic components during bending, so that the film carrier tape is excessively pulled. There is no plastic deformation in the conductive material (copper) that constitutes the insulating film and wiring pattern, and the solder resist layer, and the merchantability is not reduced, and the original state is restored and accurate electrical inspection is performed. Can be implemented.

  Moreover, the electrical inspection apparatus for film carrier tape for mounting electronic components according to the present invention is a tensile force loading device for applying a tensile force to the film carrier tape for mounting electronic components in the electrical inspection section in the electrical inspection section. It is characterized by providing.

  Further, the electrical inspection method for the electronic component mounting film carrier tape according to the present invention provides a tensile force applied to the electronic component mounting film carrier tape by the tensile load device in the electrical inspection step. It is characterized by loading.

By configuring in this way, a predetermined tensile force can be applied to the electronic component mounting film carrier tape during the electrical inspection, so that during the electrical inspection, the bent portion (bending process) The film carrier tape that has been unevenly extended is returned to the original state by applying the bending at.

  Moreover, since a predetermined tensile force is applied to the electronic component mounting film carrier tape during the electrical inspection, the wires that are forcibly disconnected in the bent portion (bending process) are subjected to the electrical inspection. The state of being pulled so as not to be connected (contacted) again is maintained.

  Therefore, the probe pin can be accurately brought into contact with the wiring pattern, in particular, the pad portion of the outer lead without shifting the contact position (landing position) of the probe pin, and an accurate electrical inspection can be performed. .

  In addition, since the forcibly disconnected wiring is not re-contacted, there is no possibility that a defective product will pass the electrical inspection by mistake during the electrical inspection.

Moreover, the electrical inspection device for the film carrier tape for mounting electronic components of the present invention, the tensile load device in the electrical inspection unit,
A film carrier tape support device;
It is a dancer roller that applies a tensile force to a film carrier tape for mounting electronic components supported by the film carrier tape support device.

Moreover, in the electrical inspection method of the film carrier tape for electronic component mounting according to the present invention, the tensile force load device in the electrical inspection section is
A film carrier tape support device;
It is a dancer roller that applies a tensile force to a film carrier tape for mounting electronic components supported by the film carrier tape support device.

  With this configuration, the film carrier tape is supported by the film carrier tape supporting device, the dancer roller, the weight of the dancer roller, and the electronic component mounting film carrier tape with a predetermined tensile force. Can be loaded.

  Thereby, in the case of an electrical inspection, the film carrier tape extended unevenly will be in the state returned to the original state in the exact position by giving a bend in a bending part (bending process). Therefore, the probe pin can be accurately brought into contact with the wiring pattern, in particular, the pad portion of the outer lead without shifting the contact position (landing position) of the probe pin, and an accurate electrical inspection can be performed. .

  Moreover, since a predetermined tensile force is applied to the electronic component mounting film carrier tape during the electrical inspection, the wires that are forcibly disconnected in the bent portion (bending process) are subjected to the electrical inspection. The state of being pulled so as not to be connected (contacted) again is maintained.

  Therefore, the wire that has been forcibly disconnected can be prevented from coming into contact again. Therefore, there is no possibility that a defective product will pass the electrical inspection by mistake during the electrical inspection.

Furthermore, in the present invention, the pair of first projecting members is disposed at a position corresponding to a position sandwiching the slit portion of the electronic component mounting film carrier tape,
The second projecting member is disposed at a position corresponding to a slit portion of a film carrier tape for mounting electronic components.

  By configuring in this way, the wiring pattern existing in the slit portion is used in, for example, a TAB tape, COF, etc., which is used in a state where the slit portion is bent, particularly in a liquid crystal display element (LCD). Can be bent forcibly.

  Therefore, among the wiring patterns of the slit portion that is bent during use, the wiring patterns that are about to be disconnected due to defects or the like can be forcibly disconnected, and defects can be reliably detected by a continuity test. It is possible to prevent the wiring pattern of the slit portion from being disconnected when bent during use.

  In the electrical inspection, in addition to the above continuity test, for example, a short check is performed in which a potential is applied between adjacent pads to check whether there is a short circuit between adjacent wirings. In addition, since the contact position (landing position) between the pad and the probe pin does not shift, an accurate short check inspection can be performed.

  According to the present invention, in the forced bending portion (bending step), the wiring pattern of the film carrier tape for mounting electronic components (between the inner lead and the outer lead) is forcibly bent by the forced bending device. It is possible to forcibly disconnect a wiring that is about to be disconnected due to a defect or the like.

  Then, after such bending is applied and the wire carrier that is about to be disconnected is forcibly disconnected, the bending of the film carrier tape is released (in a state of returning to the original state), and the electrical inspection unit In the (electrical inspection process), a certain tensile force is applied to the wiring pattern of the film carrier tape so that the disconnected wire is not reconnected, and a pair of probe pins are brought into contact with the wiring pattern, The connection state of the wiring is detected.

  Therefore, in the electrical inspection, the film carrier tape that has been unevenly extended is given a bend, and the bend is released, that is, the film carrier tape returns to its original state. Therefore, the probe pin can be accurately brought into contact with the wiring pattern, in particular, the pad portion of the outer lead without shifting the contact position (landing position) of the probe pin.

  Therefore, although the film carrier tape is normally a normal film, the continuity test results in poor continuity and is not judged as a defective product, so that the accuracy of inspection can be greatly improved.

  Hereinafter, embodiments (examples) of the present invention will be described in more detail with reference to the drawings.

  FIG. 1 is a schematic diagram of an electrical inspection apparatus according to an embodiment of a film carrier tape for mounting an electronic component of the present invention.

  In FIG. 1, reference numeral 10 denotes an electrical inspection apparatus (hereinafter simply referred to as “inspection apparatus”) for a film carrier tape for mounting electronic components as a whole.

  As shown in FIG. 1, the inspection apparatus 10 is such that the electronic component mounting film carrier tape 12 is continuously conveyed from a reel of a delivery mechanism (not shown) and passes through the forced bending portion 14 and the electrical inspection portion 16. Thus, it is configured to be wound around a reel of a winding mechanism (not shown).

  In this case, the electronic component mounting film carrier tape 12 is conveyed with the wiring pattern surface facing upward.

  The forced folding unit 14 includes a forced folding device 18. The forced folding device 18 moves up and down by a driving mechanism (not shown), and a pair of upper and lower upward bending members 20 that can approach and separate from each other. It comprises a downward bending member 22.

  At the lower end of the upward bending member 20, there are provided first projecting members 28, 30 composed of a pair of rollers 24, 26 arranged at a predetermined interval in the longitudinal direction of the electronic component mounting film carrier tape 12. It has been.

  On the other hand, on the upper end of the downward bending member 22, there is a second protruding member 34 composed of a roller 32 disposed so as to be positioned between the pair of rollers 24, 26 of the first protruding members 28, 30. Is provided.

  In the forced bending portion 14 configured in this way, as shown in FIG. 1, there is a gap between a tension applying device 40 such as a dancer roller or a back tension gear disposed in the forced bending portion 14 and the drive roller 42. When passing, the drive of the drive roller 42 is temporarily stopped, and the feeding of the electronic component mounting film carrier tape 12 is temporarily stopped and positioned.

  Then, as shown in FIG. 2, the pair of rollers 24 and 26 of the first projecting members 28 and 30 are moved by moving the upper folding member 20 and the lower folding member 22 in a direction approaching each other. The wiring pattern 36 is forcibly bent (38) by sandwiching the wiring pattern 36 of the electronic component mounting film carrier tape 12 from above and below by the roller 32 of the second projecting member 34. .

  By configuring in this way, in the forced bending portion 14, the wiring pattern 36 of the film carrier tape 12 for mounting electronic components, particularly the wiring between the output-side inner lead and the outer lead that are originally narrow in width and easily disconnected. By forcibly bending the pattern by the forcible bending device 18, it is possible to forcibly disconnect the wiring pattern that is about to be disconnected due to a defect or the like.

  In this case, the dimensions of the rollers 24, 26, and 32 are not particularly limited. However, in consideration of the above-described forced disconnection effect, the diameter is preferably about 4 to 10 mm.

  Further, in the case of this embodiment, the first projecting members 28 and 30 are constituted by a pair of rollers 24 and 26, and the second projecting member 34 is constituted by a roller 32.

  This is because the film carrier tape 12 is not excessively pulled by frictional resistance by constituting the protruding member with a roller, and the insulating film 44 and the wiring pattern 36 constituting the electronic component mounting film carrier tape 12 are constituted. This is because the conductive material (copper) and the solder resist layer 80 are not plastically deformed, the merchantability is not deteriorated, the original state is restored, and an accurate electrical inspection can be performed. .

However, the film carrier tape 12 is not excessively pulled in this way, and plastic deformation does not occur in the insulating film 44 and the conductive material (copper) constituting the wiring pattern 36 constituting the film carrier tape 12 for mounting electronic components. As long as the first projecting members 28, 30 and the second projecting member 34 are limited to rollers, the projecting portions 46, 48, 50 may be used instead of the rollers, for example, as shown in FIG. It is. Further, these rollers and protrusions can be used in appropriate combination.

  In this embodiment, the first projecting members 28 and 30 are provided on the upper bending member 20 side, and the second projecting member 34 is provided on the lower bending member 22 side. As described above, the second projecting member 34 may be provided on the upper bending member 20 side, and the first projecting members 28 and 30 may be provided on the lower bending member 22 side.

  With the configuration shown in FIG. 6, the wiring pattern that is about to be disconnected due to a defect or the like can be more reliably disconnected. Therefore, in this case, the tension applying device 40 can be omitted.

  Further, as a position where the pair of rollers 24 and 26 of the first projecting members 28 and 30 and the roller 32 of the second projecting member 34 are provided, according to the type of the film carrier tape 12 for mounting electronic components, What is necessary is just to arrange | position so that it may be located in the predetermined place between the wiring pattern 36, especially an inner lead and an outer lead, and it does not specifically limit.

  It is also possible to provide a plurality of such combinations of the first projecting members 28 and 30 and the second projecting member 34.

  For example, FIG. 4 shows a TAB tape that is used in a liquid crystal display element (LCD) as a film carrier tape 12 for mounting an electronic component, and is used in a folded state at a slit portion 54. In FIG. 4, 52 is an outer lead, 54 is a slit, 56 is a device hole, 58 is an inner lead, 60 is a test pad formed on the outer lead 52, and 62 is a sprocket hole. Yes.

  In the case of such an electronic component mounting film carrier tape 12, as shown by a one-dot chain line in FIG. 4, the pair of first projecting members 28, 30 are formed as slit portions of the electronic component mounting film carrier tape 12. 54 is disposed at a position corresponding to a position sandwiching 54. And as shown with the dashed-two dotted line of FIG. 4, it is desirable for the 2nd protrusion member 34 to be arrange | positioned in the position corresponding to the slit part 54 of the film carrier tape 12 for electronic component mounting.

  With this configuration, it is used in a liquid crystal display element (LCD) and used in a bent state in the slit portion. For example, in a TAB tape, a COF tape, etc., in the slit portion 54 and its periphery. The existing wiring pattern 36 can be bent.

  Therefore, it is possible to reliably forcibly disconnect the wiring that is about to be disconnected due to a defect or the like among the slit portion 54 that is bent during use and the surrounding wiring pattern, and to detect defects reliably by a continuity test. Therefore, it is possible to prevent the slit portion 54 and its surrounding wiring pattern from being disconnected when it is bent during use.

  In this way, in the forced bending portion 14, the wiring pattern 36 of the electronic component mounting film carrier tape 12, that is, the so-called drawn wiring pattern is forcibly bent by the forced bending device 18, so that the wiring that is about to be disconnected due to a defect or the like is removed. The electronic component mounting film carrier tape 12 that has been forcibly disconnected passes through the guide roller 64, passes through the dancer roller 66 and the guide roller 68, and is conveyed to the electrical inspection unit 16.

  By the way, the dancer roller 66 can also function as a tensile force load device 70 that applies a tensile force to the electronic component mounting film carrier tape 12 when the forced bending portion 14 is bent.

  That is, the tensile force loading device 70 can further apply a tensile force to the electronic component mounting film carrier tape 12 during bending, so that the wiring pattern 36 that is about to be disconnected due to a deficiency or the like can be reliably secured. It can be forcibly disconnected, and a defect can be reliably detected by a continuity test.

  On the other hand, the film carrier tape 12 for mounting an electronic component conveyed to the electrical inspection unit 16 is in a state in which bending is applied and the bending of the film carrier tape in which the wiring pattern that is about to be disconnected is forcibly disconnected is released. In the electrical inspection section 16, a pair of probe pins are brought into contact with the input side and output side wiring patterns 36 of the electronic component mounting film carrier tape 12, so that the wiring pattern 36 The conduction state is detected.

  Further, during the electrical inspection in the electrical inspection unit 16, the electronic component mounting film carrier tape 12 is loaded with a predetermined tensile force by the tensile force load device 84 as will be described later. The state in which the wires that have been forcibly disconnected are pulled so as not to be connected (contacted) again during the electrical inspection is maintained.

  Therefore, the wire that has been forcibly disconnected can be prevented from coming into contact again, so that there is no risk that a defective product will erroneously pass the electrical inspection during the electrical inspection in the electrical inspection section 16. It has become.

  That is, as shown in FIGS. 1 and 5, the electrical inspection unit 16 includes a lower inspection stage 72 and an upper inspection stage 78 to which a pair of probe pins 74 and 76 are fixed. It has been.

  The lower inspection stage 72 and the upper inspection stage 78 can be moved up and down. For example, after the upper inspection stage 78 is lowered, the lower inspection stage 72 is slightly raised, so that the lower inspection stage 72 and the upper inspection stage 78 are moved upward. The film carrier tape 12 is sandwiched between the stage 78 and fixed.

  Then, a pair of probe pins 74, 76 are brought into contact with the test pad portion 60 of the outer lead 52 of the wiring pattern of the film carrier tape 12, and measuring instruments 71, 73 disposed between both the probe pins 74, 76. Therefore, a continuity test is performed to check for disconnection. Further, such a continuity test is performed by switching the wiring one after another.

  When the wiring width is large, for example, since the probe pin 74 or 76 can be directly landed on the input-side outer lead portion, the test pad portion 60 can be omitted.

  In addition, the upper inspection stage 78 has a conduction terminal 84 for connecting the wires of the inner lead 58 to each other in a region facing the portion of the inner lead 58 that is a portion to which the electronic component of the wiring pattern is connected. For example, a conductive rubber rod is fixed. The conductive terminal 84 is grounded by a ground 85.

Therefore, in the electrical inspection unit 16, the pair of probe pins 74 and 76 are placed on the test pad portion 60 of the outer lead 52 by sandwiching the film carrier tape 12 between the lower inspection stage 72 and the upper inspection stage 78. In addition, the continuity test is conducted by bringing the continuity terminal 84 into contact with the portion of the inner lead 58 (landing).

  Further, the electrical inspection unit 16 includes a tensile force load device 84 that applies a tensile force to the electronic component mounting film carrier tape 12 during the electrical inspection.

  The tensile force load device 84 includes a film carrier tape support device 86 and the dancer roller 66 that applies a tensile force to the film carrier tape 12 for mounting electronic components supported by the film carrier tape support device 86. It is configured.

  In the case of this embodiment, the film carrier tape support device 86 includes a locking member 88 that can be moved up and down by a drive mechanism (not shown) and engageable with the sprocket hole 62 of the film carrier tape 12 for mounting electronic components. Has been. In this case, as shown in FIG. 1, the locking member 88 is provided to be inclined in the transport direction of the electronic component mounting film carrier tape 12 in order to support the electronic component mounting film carrier tape 12. Is desirable.

  The film carrier tape support device 86 may be any device that can support the film carrier tape 12 for mounting electronic components, and may be composed of a pair of support rollers, a drive gear, and the like. It is not limited.

  With this configuration, the conveyance of the electronic component mounting film carrier tape 12 is temporarily stopped, and the electronic component mounting film carrier tape 12 is supported by the film carrier tape supporting device 86, and the dancer roller 66. The electronic component mounting film carrier tape 12 can be positioned by the weight of the dancer roller 66 and a predetermined tensile force can be applied to the electronic component mounting film carrier tape 12.

  Thereby, in the electrical inspection, the electronic component mounting film carrier tape 12 that has been unevenly extended by applying the bending at the forced bending portion 14 has returned to the original state at an accurate position. Become. In addition, since a predetermined tensile force is applied to the electronic component mounting film carrier tape 12 during the electrical inspection, the wires that are forcibly disconnected in the forced bending portion 14 are subjected to the electrical inspection. The pulled state is maintained so as not to connect (contact) again.

  Therefore, the probe pin can be accurately brought into contact with the wiring pattern, in particular, the pad portion of the outer lead without shifting the contact position (landing position) of the probe pin, and an accurate electrical inspection can be performed. .

  In this case, due to the weight of the dancer roller 66, the effect of returning the film carrier tape 12 that has been unevenly extended by such pulling to the original state and the wires that are forcibly disconnected are subjected to electrical inspection. In consideration of the effect of preventing reconnection so as not to be connected (contacted) again, the weight of the dancer roller 66 is preferably 100 to 500 g. If it is lighter than 100 g, the above-mentioned reconnection prevention effect cannot be expected. If it exceeds 500 g, the sprocket hole 62 is deformed or the film carrier tape 12 is excessively pulled, and the film carrier tape for mounting electronic components. This is because plastic deformation occurs in the conductive film (copper) that constitutes the insulating film 44 and the wiring pattern 36 that constitute the wiring pattern 36, and the merchantability decreases.

  In this embodiment, the dancer roller 66 is used to apply a tensile force to the electronic component mounting film carrier tape 12 during bending and electrical inspection. However, the present invention is not limited to this. The electronic component mounting film carrier tape 12 is gripped by two pairs of rollers and moved in a direction away from each other, thereby applying a tensile force to the electronic component mounting film carrier tape 12. May be.

  Thus, after conducting the continuity test in the electrical inspection section 16, the electronic component mounting film carrier tape 12 is wound around the reel of a winding mechanism (not shown) via the guide roller 90 and the dancer roller 92. It is configured.

  Using the inspection apparatus 10 of the present invention as shown in FIG. 1, as shown in FIG. 4, the surface of a polyimide insulating film having a width of 35 mm and a thickness of 75 μm used for LCD is 12 μm thick. An electrical inspection was performed on the so-called flex TAB tape 12 on which the copper wiring was formed with the wiring pattern surface facing upward.

  The forced bending portion 14 has a roller diameter of 6 mm, and the dancer rollers 66 and 92 each have a weight of 100 g.

  As shown in FIG. 6, the present invention has the forced bending portion 14 provided with the second protruding member 34 on the upper bending member 20 side and provided with the first protruding members 28 and 30 on the lower bending member 22 side. The film carrier tape 12 for mounting electronic components was subjected to electrical inspection using the inspection apparatus 10.

  In both Examples 1 and 2, the defect rate was reduced by 60% compared to the electrical inspection method using the conventional inspection apparatus. In other words, the number of products that were originally normal products but were judged to be defective due to a shift in the tape position was reduced by 60%, and an accurate and reliable electrical inspection became possible. In addition, it is possible to reliably prevent the reconnection of the forced disconnection product that has been forcibly disconnected, and the defect outflow rate to the semiconductor chip mounting process is reduced by about 20% compared to the defect outflow rate of the conventional product. .

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to this. For example, in the above embodiment, the film carrier tape 12 for mounting electronic components before mounting the electronic components is used. Although applied to the above, it can be used for electrical inspection of a semiconductor device using an FPC using a sheet-like film or a film carrier tape for mounting an electronic component after mounting a semiconductor chip. It can be changed.

FIG. 1 is a schematic diagram of an electrical inspection apparatus according to an embodiment of a film carrier tape for mounting an electronic component of the present invention. FIG. 2 is a schematic diagram for explaining a bent state in the forced bending portion 14 of the electrical inspection apparatus of FIG. FIG. 3 is a schematic view showing another embodiment of the forced bending portion 14 of the electrical inspection apparatus of FIG. FIG. 4 is a top view showing an example of a film carrier tape 12 for mounting electronic components used in the present invention. FIG. 5 is a schematic diagram for explaining a bent state in the electric inspection unit 16 of the electric inspection apparatus of FIG. FIG. 6 is a schematic diagram for explaining a bent state of another embodiment of the forced bending portion 14 of the electrical inspection apparatus of FIG. FIG. 7 is a schematic diagram for explaining a conventional electrical inspection apparatus. FIG. 8 is a schematic diagram illustrating a conventional electrical inspection apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Inspection apparatus 12 Film carrier tape 14 for electronic component mounting Forced bending part 16 Electrical inspection part 18 Apparatus 20 Upper bending member 22 Lower bending member 24, 26 Roller 28 First protrusion member 32 Roller 34 Second protrusion member 36 Wiring pattern 40 Dancer roller 42 Drive roller 44 Insulating film 46, 48, 50 Protrusion 52 Outer lead 54 Slit portion 58 Inner lead 60 Test pad portion 62 Sprocket hole 64 Guide roller 66 Dancer roller 68 Guide roller 70 Tensile force load device 72 Inspection stage 74 76 Probe pin 78 Fixing member 80 Solder resist layer 84 Conductive terminal 84 Tensile force load device 86 Film carrier tape support device 88 Locking member 90 Guide roller 92 Dancer roller

Claims (14)

A forced bending section having a forced folding device for forcibly folding a wiring pattern of a film carrier tape for mounting electronic components;
An electrical inspection unit that is disposed on the downstream side of the forced bending portion and detects a conduction state of the wiring pattern by bringing a pair of probe pins into contact with the wiring pattern of the film carrier tape for mounting electronic components,
Equipped with a,
The forced bending device of the forced bending portion is,
A pair of first projecting members disposed on one side in the vertical direction of the electronic component mounting film carrier tape and spaced apart in the longitudinal direction of the electronic component mounting film carrier tape, and for mounting the electronic component A second projecting member disposed on the other side in the vertical direction of the film carrier tape so as to be positioned between the pair of first projecting members;
The wiring pattern is configured to be forcibly bent by sandwiching the wiring pattern of the film carrier tape for mounting electrical components from above and below by the pair of first and second protruding members. An electrical inspection apparatus for film carrier tape for mounting electronic components. 2. The electrical inspection apparatus for a film carrier tape for mounting electronic components according to claim 1 , wherein at least one of the pair of first projecting members and second projecting members is a roller. 3. The electron according to claim 1, further comprising a tensile force load device that applies a tensile force to the film carrier tape for mounting an electronic component when the forced bending portion is bent. Electrical inspection equipment for film carrier tape for component mounting. The electrical force of the film carrier tape for electronic component mounting according to claim 3 , wherein the tensile force loading device in the bent portion is a dancer roller that applies a tensile force to the film carrier tape for electronic component mounting. Inspection device. 5. The electrical inspection unit according to claim 1, further comprising a tensile force load device that applies a tensile force to the electronic component mounting film carrier tape in the electrical inspection. Electrical inspection equipment for film carrier tape for mounting electronic components. The tensile load device in the electrical inspection unit is
A film carrier tape support device;
6. The electric power of the film carrier tape for mounting electronic components according to claim 5 , which is a dancer roller that applies a tensile force to the film carrier tape for mounting electronic components supported by the film carrier tape support device. Inspection device. The pair of first projecting members are disposed at positions corresponding to positions sandwiching the slit portion of the film carrier tape for mounting electronic components,
The film carrier tape for mounting electronic components according to any one of claims 1 to 6 , wherein the second projecting member is disposed at a position corresponding to a slit portion of the film carrier tape for mounting electronic components. Electrical inspection device. A forced folding step of forcibly folding the wiring pattern of the film carrier tape for mounting electronic components by a forced folding device;
After the forced bending step, an electrical inspection step of detecting a conductive state of the wiring pattern by bringing a pair of probe pins into contact with the wiring pattern of the electronic component mounting film carrier tape ;
Equipped with a,
A forced bending apparatus for the forced folding step is as follows:
A pair of first projecting members disposed on one side in the vertical direction of the electronic component mounting film carrier tape, spaced apart from each other in the longitudinal direction of the electronic component mounting film carrier tape, and for mounting the electronic component A second projecting member disposed on the other side in the vertical direction of the film carrier tape so as to be positioned between the pair of first projecting members;
The wiring pattern is configured to be forcibly bent by sandwiching the wiring pattern of the film carrier tape for mounting electronic components from above and below by the pair of first and second protruding members. An electronic inspection method for film carrier tape for mounting electronic components. 9. The electrical inspection method for an electronic component mounting film carrier tape according to claim 8 , wherein at least one of the pair of first projecting members and second projecting members is a roller. 10. The electron according to claim 8 , wherein in the forcible bending step, a tensile force is applied to the film carrier tape for mounting an electronic component by the tensile force loading device during the bending. Electrical inspection method for film carrier tape for component mounting. 11. The electric power of the film carrier tape for mounting electronic components according to claim 10 , wherein the tensile force loading device in the bending step is a dancer roller that applies a tensile force to the film carrier tape for mounting electronic components. Inspection method. In the electrical inspection process, pulling by the force load device when the electrical inspection for the film carrier tape, tension claim 8, characterized in that the load of any one of 11 Electrical inspection method for film carrier tape for electronic component mounting. The tensile load device in the electrical inspection unit is
A film carrier tape support device;
The electric power of the film carrier tape for mounting electronic components according to claim 12 , wherein the dancer roller applies a tensile force to the film carrier tape for mounting electronic components supported by the film carrier tape support device. Inspection method. The pair of first projecting members are disposed at positions corresponding to positions sandwiching the slit portion of the film carrier tape for mounting electronic components,
The film carrier tape for mounting an electronic component according to any one of claims 8 to 13 , wherein the second projecting member is disposed at a position corresponding to a slit portion of the film carrier tape for mounting an electronic component. Electrical inspection method.

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