JP3927158B2 - Substrate holder and device manufacturing method - Google Patents

Description

  The present invention provides a radiation system for supplying a projection beam of radiation, a support structure for supporting patterning means for patterning the projection beam according to a desired pattern, a substrate table for holding the substrate, and a patterned beam for the substrate. The present invention relates to a substrate holder used in a lithographic projection apparatus constituted by a projection system that projects onto a target portion, and a device manufacturing method.

As used herein, the term “patterning means” should be broadly interpreted as a means that can be used to provide an incident radiation beam with a patterned cross section that matches the pattern to be created on the target portion of the substrate. It is. The term “light valve” is also used in this context. In general, the above pattern corresponds to a special functional layer created in the target portion of the device, such as an integrated circuit or other device (see below). Such patterning means include the following. That is,
– Mask. The concept of mask is well known in lithography and includes not only various hybrid mask types, but also mask types such as binary mask, Levenson mask, attenuated phase shift mask. By disposing such a mask in the radiation beam, it is possible to selectively transmit (in the case of a transmissive mask) or selectively reflect (in the case of a reflective mask) the radiation applied to the mask according to the mask pattern. In the case of a mask, the support structure is generally capable of holding the mask in the desired position of the incident radiation beam and, if necessary, a mask that can be moved relative to the beam. It is a table.
A programmable mirror array. An example of such a device is a matrix addressable surface having a viscoelastic control layer and a reflective surface. The basic principle of such a device is that (for example) the addressed area of the reflective surface reflects incident light as diffracted light, whereas the unaddressed area reflects incident light as non-diffracted light. By using an appropriate filter, it is possible to filter the non-diffracted light from the reflected beam, leaving only the diffracted light. In this method, the beam is patterned according to the address pattern of the matrix addressable surface. Another embodiment of a programmable mirror array uses a matrix array of small multiple mirrors. Each of the mirrors is individually tilted about an axis by applying a suitable local electric field or by using piezoelectric actuation means. Once again, the mirrors are matrix addressable so that the addressed mirrors reflect the incoming radiation beam in a different direction than the unaddressed mirrors. In this way, the reflected beam is patterned according to the address pattern of the matrix addressable mirror. The required matrix addressing is performed using suitable electronic means. In both of the situations described above, the patterning means can consist of one or more programmable mirror arrays. For more information on the mirror array referred to here, for example, US Pat. Nos. 5,296,891 and 5,523,193, and PCT patent application No. WO 98/38597 and WO 98/33096. In the case of a programmable mirror array, the support structure is embodied as a frame or table, for example, which can be fixed or movable as required.
-Programmable LCD array. An example of such a configuration is disclosed in US Pat. No. 5,229,872 for reference. As described above, the support structure in this case is also embodied as a frame or a table, for example, which may be fixed or movable as required. For the sake of brevity, the remainder of the text will be directed to examples that require masks and mask tables at specific locations. However, the general principles discussed in these examples should be understood in the broader context of patterning means as already mentioned.

  Lithographic projection apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In this case, the patterning means generates circuit patterns corresponding to the individual layers of the IC. This pattern can then be imaged onto a target portion (e.g. consisting of one or more dies) on a substrate (silicon wafer) coated with a layer of radiation sensitive material (resist). In general, a single wafer will contain a whole network of adjacent target portions that are successively irradiated via the projection system, one at a time. Current devices that use patterning with a mask on a mask table are divided into two different types of machines. In one type of lithographic projection apparatus, each target portion is irradiated by exposing the entire mask pattern onto the target portion in one operation. Such an apparatus is commonly referred to as a wafer stepper. In another apparatus, called a step-and-scan apparatus, the mask pattern is gradually scanned under the projection beam in a predetermined reference direction (the “scanning” direction) and at the same time the substrate table is parallel to this direction or non- By scanning in parallel, each target portion is irradiated. In general, since the projection apparatus has a magnification factor M (generally <1), the speed V at which the substrate table is scanned is a factor M times that at which the mask table is scanned. Further information regarding the lithographic devices described herein can be obtained, for example, from US Pat. No. 6,046,792, by way of reference.

  In a manufacturing process using a lithographic projection apparatus, a pattern (eg in a mask) is imaged on a substrate that is at least partially covered by a layer of radiation-sensitive material (resist). Prior to this image forming step, the substrate undergoes various processes such as priming, resist coating, and soft baking. After exposure, the substrate goes through other processes such as post bake (PEB), development, hard bake, and imaging feature measurement / inspection. This sequence of steps is used as a reference for patterning individual layers of devices such as ICs. Such patterned layers are then subjected to various processes such as etching, ion implantation (doping), metallization, oxidation, chemical mechanical polishing, etc., all aimed at finishing the individual layers. If several layers are required, the entire process, or a modification thereof, must be repeated for each new layer. Finally, an array of elements is formed on the substrate (wafer). These elements are then separated from each other by techniques such as dicing and sawing. Individual elements can then be attached to a carrier or connected to pins. For further information on these processes, for example, a book titled “Microchip Fabrication: A Microchip Fabrication: A Practical Guide to Semiconductor Processing” published by McGraw Hill Publishing Company in 1997 by Peter van Zant. : A Practical Guide to Semiconductor Processing ”), 3rd edition, ISBN0-07-0667250-4.

  For the sake of brevity, the projection system will hereinafter be referred to as the “lens”. However, this term should be construed broadly to encompass various types of projection systems including, for example, refractive optical systems, reflective optical systems, and catadioptric optical systems. The radiation system can also include components that operate according to any of these design types to direct, shape, or control the projection beam of radiation. Such components are also referred to hereinafter collectively or singly as “lenses”. Furthermore, the lithographic apparatus is of a type having two or more substrate tables (and / or two or more mask tables). In such “multi-stage” devices, additional tables are used in parallel. Alternatively, the preliminary process is performed on one or more tables while one or more other tables are used for exposure. For example, for reference, a dual stage lithographic apparatus is described in US Pat. No. 5,969,441 and International Patent Application No. WO 98/40791.

  Silicon wafers used to manufacture semiconductor devices include standard sizes of 150 mm, 200 mm, and 300 mm (often approximately 6 inches, 8 inches, and 12 inches depending on the approximate size), and the step of replacing the wafer Larger wafer sizes are becoming more and more common as the number can be reduced to increase throughput and more devices can be fabricated on a single wafer. Lithographic apparatus, and other apparatus used in semiconductor manufacturing, are designed to operate on these standard wafer sizes. In general, the lithographic apparatus is adapted to accept only one type of standard size wafer. Despite the general tendency to favor large wafer sizes, it is desirable in some specialized fields to be able to manufacture on thin wafers that are smaller than the standard sizes as described above. However, it is uneconomical to manufacture a lithographic apparatus to accommodate such small and thin wafers and to adapt the lithographic apparatus to it.

  Silicon wafers of the type as discussed above are usually very thin (between 100 μm and 350 μm, for example 140 μm), and therefore tend to curve considerably depending on the weight of the wafer itself. When performing exposure with a stepper tool, the wafer needs to have a flatness within 1 micrometer. Furthermore, it is beneficial that the wafer is flat during handling so that the wafer can be moved through a narrow space without contact. Still further, other problems arise when handled by a robot, for example because the wafer is fragile. In addition, if the wafer is curved, the connection with the vacuum holder may not be made well. It is therefore desirable to keep the wafer flat whenever the wafer is in the lithographic apparatus.

  The present invention provides an adapter that allows the holding of relatively small substrates, allows a small wafer to be imaged in a lithographic apparatus with a substrate table adapted to receive a large substrate, and / or It is an object to enable processing in another substrate processing apparatus for a large substrate.

  It is a further object of the present invention to provide a means for keeping the wafer flat.

  The holder of the present invention can be used not only with a substrate such as a silicon wafer but also with a substrate made of other nonmagnetic materials.

  This and other objects are achieved by a substrate holder comprising a plate member having a first nominal size acceptable in a lithographic apparatus and a clamp for holding a second nominal size substrate smaller than the first nominal size. This is achieved according to the present invention.

  Preferably, the clamp is adapted to hold the substrate at substantially its entire periphery. This keeps the wafer substantially flat and provides a good connection to the vacuum system when holes are provided in the plate member to transmit vacuum to the wafer.

  By clamping a small substrate to a large plate member having a nominal size so that it can be processed by a standard lithographic apparatus, the lithographic apparatus, or other substrate processing apparatus, does not need to modify such an apparatus, Processing is possible.

  The plate member is preferably substantially circular on a plane and has one or more flats or notches. The plate member consists of a standard size silicon wafer to which the clamp is attached. Alternatively, the plate member can be made of Zerodur ™ or other non-magnetic material with low thermal expansion.

  The first nominal size is preferably 150 mm, 200 mm, 300 mm or larger. The second nominal size is 100 mm or smaller. The nominal size in each case is the nominal diameter of the plate member or substrate that does not take into account flats or notches. The substrate and the holder need not be circular, and may be other shapes such as a square. The nominal size in that case is the maximum dimension.

  The plate member is preferably provided with one or more positioning pins, and when the substrate is in contact with the positioning pins, the positioning pin is arranged so that the substrate is arranged in a predetermined position and / or direction of the plate member. Has been. Here, if the plate member is provided with one or more flat portions or notches, and the holder is used with a substrate having one or more flat portions or notches, the positioning pin is preferably The flat portion or notch portion of the substrate is disposed in a predetermined direction that preferably matches the flat portion or notch portion of the plate member.

  The clamp preferably consists of a ring of magnetic material having an inner contour similar to but smaller than the outer contour of the substrate, and a plurality of magnets secured to the plate member. With this configuration, a uniform force is applied to the substrate, which has the effect of maintaining the substrate flat while keeping the overall thickness of the substrate holder small.

  In a preferred embodiment, the plate member is provided with a fine burl pattern in a portion where the substrate is disposed. The burl pattern prevents a small range of height changes in the clamped substrate.

  In accordance with a further aspect of the present invention, a device manufacturing method is provided. The method of manufacturing the device provides a substrate that is at least partially covered by a layer of radiation-sensitive material, supplies a projection beam of radiation using a radiation system, and patterns the cross-section of the projection beam using patterning means. And projecting a patterned beam of radiation onto a target portion of the layer of radiation-sensitive material, wherein the step of providing a substrate comprises applying a plate member having a nominal size larger than the substrate. A sub-step of clamping the substrate, and a sub-step of mounting the plate member having the clamped substrate on the lithographic apparatus.

  With regard to the use of the device according to the invention, a detailed reference is given here in the manufacture of ICs, but it should be clearly understood that such a device can also be used in many other applications. . For example, the device according to the invention can be used for the manufacture of integrated optical devices, guidance and detection patterns for magnetic domain memories, liquid crystal display panels, thin film magnetic heads and the like. In these alternative applications, the terms “reticle”, “wafer”, and “die” used in the text are replaced by more general terms such as “mask”, “substrate”, and “target part”, respectively. It will be apparent to those skilled in the art that it can be used.

  As used herein, the terms “radiation” and “beam” include not only particle beams such as ion beams or electron beams, but also ultraviolet light (eg, having a wavelength of 365 nm, 248 nm, 193 nm, 157 nm, or 126 nm). And all types of electromagnetic radiation, including EUV (extreme ultraviolet, eg, having a wavelength in the range of 5-20 nm).

  Detailed description of embodiments of the present invention will be given only by way of example with reference to the accompanying drawings. Corresponding parts are designated by corresponding reference numerals throughout the drawings.

Lithographic Apparatus FIG. 1 depicts an exemplary lithographic projection apparatus in which embodiments of the present invention may be used. This apparatus comprises a radiation system Ex, IL for supplying a projection beam PB of radiation (for example DUV radiation), which also comprises a radiation source LA in this particular embodiment, and a mask holder w for holding a mask MA (for example, reticle). And a substrate holding a first object table (mask table) MT connected to a first positioning means for accurately positioning the mask with respect to the item PL, and a substrate W (for example, a resist-coated silicon wafer) A second object table (substrate table) WT provided with a holder and connected to a second positioning means for accurately positioning the substrate with respect to the item PL, and an irradiation portion of the mask MA are used as the target of the substrate W. Projection system (“lens”) PL (which forms an image on part C (eg, consisting of one or more dies) It is constituted by the example, if the refractive lens system). As shown here, the apparatus is of a transmissive type (ie has a transmissive mask). However, in general, a reflection type having a reflection mask, for example, is also possible. Alternatively, the apparatus may use other types of patterning means, such as a programmable mirror array of the type associated with the above.

  The source LA (eg excimer laser) produces a beam of radiation. This beam is supplied to the illumination system (illuminator) IL either directly or after traversing conditioning means such as a beam expander Ex. The illuminator IL comprises adjusting means AM for setting an external and / or internal radiation range (generally corresponding to σ-outer and σ-inner, respectively) of the intensity distribution in the beam. Furthermore, the illuminator IL generally comprises various other components such as an integrator IN and a capacitor CO. In this way, the beam PB irradiated to the mask MA has the desired uniformity and intensity distribution over its cross section.

  With respect to FIG. 1, it is noted that the source LA is in the housing of the lithographic apparatus (this is often the case, for example, when the source is a mercury lamp), but can also be placed away from the lithographic projection apparatus. In this case, the radiation beam produced by the source LA is guided into the device (by a suitable guiding mirror). In this latter scenario, the source LA is often an excimer laser.

  Subsequently, the beam PB collides with the mask MA held on the mask table MT. The beam PB traverses the mask MA and passes through a lens PL that focuses the beam PB on the target portion C of the substrate W. By means of the second positioning means (and the interference measuring means IF), the substrate table WT can be moved precisely, for example to align it with different target portions C in the path of the beam PB. Similarly, the first positioning means can be used to accurately position the mask MA with respect to the path of the beam PB, for example after mechanical removal of the mask MA from the mask library or during a scanning movement. . Generally, the movements of the object table MT and the object table WT are performed by a long stroke module (coarse positioning) and a short stroke module (fine movement positioning). This is not explicitly shown in FIG. However, in the case of a wafer stepper (as opposed to a step-and-scan apparatus), the mask table MT is only connected to a short stroke actuator or is fixed.

The device represented here can be used in two different modes.
1. In the step mode, the mask table MT is basically kept stationary. The entire image of the mask is then projected onto the target portion C in one operation (ie, one “flash”). The substrate table WT can then be shifted in the x and / or y direction and a different target portion C can be illuminated by the beam PB.
2. In the scan mode, basically the same scenario is applied, except that the predetermined target portion C is not exposed in one “flash”. Instead, the mask table MT is movable at a velocity v in a predetermined direction (so-called “scanning direction”, eg the y direction), so that the beam PB scans the mask image. At the same time, the substrate table WT moves in the same direction or in the opposite direction at a speed V = Mv. Here, M is the magnification of the lens PL (generally, M = 1/4 or 1/5). Thus, it becomes possible to expose a relatively large target portion C without compromising the resolution.

  Such a lithographic apparatus is adapted for use with a substrate (wafer) of a specific size, for example having a nominal diameter of 150 mm, 200 mm or 300 mm and having a shape with, for example, one or two flats or notches. . In particular, the substrate table is adapted to receive such a wafer and is provided with a burl pattern of appropriate size and shape and positioning pins for fixing the notch or flat portion of the intended substrate. Here, as usual, the substrate is held on the substrate table in a vacuum, and the vacuum nozzle covers the entire area of the substrate, enabling a uniform clamping force and avoiding distortion of the substrate. In addition, the focal plane of the projection system and various sensors such as alignment sensors and level sensors is set to a specific level, and a substrate table that generally operates only in a limited range perpendicular to the plane of the substrate is The upper surface of the substrate having a predetermined thickness is positioned at the specific level. If a substrate that is too thin or too thick is used, the substrate table cannot function well to position the substrate top surface at the focal point of the projection system and various sensors.

Substrate Holder FIG. 2 is an exploded view of a substrate holder and a substrate according to an embodiment of the present invention. The substrate holder 10 includes a plate member 11, and positioning pins 12, 13 and a permanent magnet 14 are fixed thereto. The positioning pins 12 and 13 and the permanent magnet 14 form a clamp together with the clamp ring 15 to hold the substrate W firmly in place.

  As an example, the substrate holder 10 may be used in a lithographic projection apparatus or in other substrate handling apparatus designed to handle substrates with a nominal diameter of 150 nm (6 ″) and a thickness of 500 μm, with a nominal diameter of 100 nm (4 ″). And a substrate having a thickness of 140 μm can be processed. In addition to dimensioning to secure the substrate table WT of the lithographic projection apparatus and placing the substrate W at an appropriate height, the substrate holder 10 is relatively flexible and considerably curved due to its thickness. It is possible to keep the substrate W, which is to be flat, so that exposure is possible. This is achieved by the substrate W being clamped by the clamp ring 15 at its full or near full circumference and with a burl pattern that is sufficiently beneficial to prevent height changes in a small range. The The clamp ring prevents the substrate W from moving by the wafer stepper during handling of the substrate holder. Further, a vacuum system is used by the exposure chuck to clamp both the substrate holder 10 and the substrate W. This is accomplished using a hole that penetrates the bottom of the plate member that conducts vacuum from the substrate holder 10 to the underside of the substrate W.

  As can be understood more clearly in FIG. 4, the substrate W is provided with a first flat portion F <b> 1, and a second flat portion F <b> 2 can be further provided. Positioning pins 12 (effectively two pins) are provided, so that the flat portion F1 is in contact with the pins, and the substrate W is accurately placed on the substrate holder 10. The substrate holder 10 similarly has a flat portion 17 for determining the position of the substrate holder 10 on the substrate table WT. The positioning pins 13 are in contact with points on the wafer edge of the other flat portion F2 to achieve accurate alignment. A recess may be provided on the underside of the clamp ring 15 for the purpose of receiving the locating pins 12, 13 and / or the magnet 14.

  The positioning pins 12 and 13 and the flat portions F1, F2, and 17 do not require the substrate position to be reliably aligned within the overlay requirements of the lithography process to be performed, but the substrate W is aligned with the alignment marker provided thereon. It will be appreciated that it is only necessary to place it within the capture range of the alignment system of the lithographic apparatus. In still other embodiments, the substrate W has a different number and / or combination of flats and / or cuts, and the lithographic apparatus has a different number and / or combination of flats and / or cuts. Received the substrate. In that case, the positioning pins 12 and 13 on the substrate holder need to be disposed so as to engage with any flat portion and notch portion provided on the substrate in order to accurately position the substrate. On the other hand, the plate member 11 needs to have a flat portion and a cutout portion so as to engage with any positioning means provided on the substrate table of the lithographic apparatus. The positioning pins 12 and 13 align the wafer W on the surface of the plate member 11, but the burl pattern aligns the wafer W outside the surface direction.

  In this embodiment, the plate member 11 is made of a standard 150 mm (6 ″) silicon wafer, and the positioning pins 12 and 13 are made of ferritic stainless steel and are attached to the plate member 11 by epoxy resin. Nd-plated NdFeB permanent magnet with clamp ring made of two layers of ferritic stainless steel, the use of two layers can easily provide a recess for receiving the magnet and / or positioning pin Through-holes or cut-outs are created in the ring to form a low layer, which is much easier than making a blind shot in a thin ring, and one layer is steel selected by its magnetism. The other steel is selected according to strength It is. Naturally, it is also possible to minimize the clamp height using a single layer to the clamp.

As can be understood from FIG. 3, when an image is attempted to be projected within the inner circumferential distance d _{1 of} the clamp ring, the height T of the clamp ring 15 blocks the projection beam PB. The exact value of the distance S ₁ is based on the thickness T and the numerical aperture (NA) of the projection lens PL. This determines the outermost ray angle of the projection beam. The width of the non-imaged ring is equal to S ₁ plus the maximum overlap width O _max between the clamp ring 15 and the wafer W. With proper selection of T and O _max , the width of the non-imaged portion of the substrate that is considered a shadow of the clamp ring can be as high as a 3 mm normal edge bead. In the lithographic apparatus of the optical axis coincidence level, the leveling sensor beam LS-B has an inclination angle shallower than the projection beam. This means that the shadow of the clamp ring with respect to the leveling sensor beams LS-B and _SLB is wider, and the vertical part of the larger part of the wafer surface cannot be measured. This problem can be avoided by inferring from leveling measurement performed inside the substrate W. In FIG. 4, the image formable region is indicated by a cross hatch, and the shadow boundary of the level sensor beam is indicated by a dotted line.

  A loading tool 20 for placing the wafer W on the substrate holder 10 is shown in FIG. The loading tool includes a platform 21 on which the plate member 11 is arranged, for example, by a wafer handling robot (not shown in FIG. 5) or manually. The platform 21 is provided with a positioning bar 22 for engaging the flat portion 17 of the plate member 11 to enable correct positioning of the plate member. Once the plate member 11 is correctly placed, the wafer W is placed on the burl pattern with respect to the positioning pins. Once again, this is performed by a wafer handling robot or manually. Thereafter, the wafer W is clamped in a vacuum and kept in an accurate position. Meanwhile, the clamp ring 15 is held on the annular vacuum chuck 23 by vacuum. The annular chuck 23 has a locator hole that engages with a locator pin 25 provided on the platform 21 when the annular chuck 23 is inverted and lowered on the platform 21. Thereby, the clamp ring is accurately arranged on the substrate W. The vacuum is then released, leaving the clamp ring held by the magnet 14 on the plate member and removing the annular chuck. Next, the substrate holder 11 and the held substrate W are delivered to the lithography apparatus by, for example, a wafer handling robot.

In order to accurately place the wafer handling robot plate member 11 on the platform 21, it is possible to use the wafer handling robot described above (known as a wafer handling tool) and place the substrate W on the plate member 11. This wafer handling robot can also be used for accurate placement. Manual handling may cause contamination of the wafer W and is less accurate than alignment accuracy using a robot. Therefore, it is preferable to use a wafer handling robot rather than manual handling.

  FIG. 6 is a bottom perspective view of a specific example of the wafer handling tool 30. This tool comprises a central flat recessed area 31 and a peripheral portion 32 extending from the surface of the central recessed area 31. The peripheral portion 32 is divided into three sections A, B, and C in this embodiment, and a vacuum can be generated at the edge of the wafer. In this embodiment, the vacuum is generated using a circumferential slot 33 formed in the peripheral portion 32. Sections A and B of the peripheral portion 32 are smaller than section C. In this embodiment, each of sections A and B spans a peripheral range of about 30 ° and portion C spans a peripheral range of about 160 °.

  Each of the three peripheral portions A, B, and C shown in FIG. 6 can be connected by a hole in the tool to a vacuum connector 34 that is connected to a vacuum pump system or the like.

  The vacuum slot (or more generally the chamber) in the peripheral portion 32 is preferably arranged so that only the outer edge of the wafer is in contact with the tool in use. The central recessed area 31 prevents the wafer from contacting other parts of the tool. As can be seen in FIG. 6, gaps 35, 36 are provided at specific locations around the tool. This is to allow the wafer to be pressed against a fixed point on the wafer holder surface. For example, in a wafer having flat portions F1 and F2, the tool 30 can pick up the wafer with the flat portion F1 exposed at the gap 36 and the flat portion F2 exposed at one of the gaps 35. This is also useful for placing the wafer on the plate member 11 again. The gaps 35 and 36 are also useful for visually confirming that the wafer is accurately aligned with respect to the reference pins 12,13.

  The tool is preferably made of a plastic material. This is because such materials are easy to manufacture and do not damage the wafer surface. Polyacetals such as polyoxymethylene (POM) are particularly suitable.

The advantage of this tool is that it allows handling of the wafer from the top rather than the bottom. This is possible by using a peripheral vacuum chamber 33 that does not interact with the usable central portion of the wafer. This tool is for example
-The wafer needs to be placed on a surface that the back tool cannot afford,
-The wafers need to be removed from the bonded surfaces, or standard tools cannot afford
-Can be used in a variety of situations where it is impossible or undesirable to handle the wafer due to reasons such as the presence of devices or other sensitive components on the backside of the wafer. The design of the peripheral vacuum chamber of the tool makes it very fragile and thin wafers can be handled reliably. Furthermore, it can be seen that the tool itself is useful for flattening curved wafers. This makes positioning after the wafer much easier and more reliable.

  While the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that other methods can be implemented without departing from the scope of the present invention. This detailed description is not intended to limit the invention.

1 shows a lithographic projection apparatus in which an embodiment of the invention is used. It is the exploded view which showed the substrate holder based on embodiment of this invention with the board | substrate. FIG. 3 is a cross-sectional view of a portion of the substrate holder of FIG. 2 with the substrate clamped. FIG. 3 is a plan view of a substrate showing an area that can be imaged and measured when the substrate is held by the substrate holder of FIG. 2. FIG. 3 is a perspective view of a tool for attaching a substrate to the substrate holder of FIG. 2. It is the perspective view which looked at the wafer handling tool from the lower side.

Claims (12)

A plate member having a first nominal size acceptable in the lithographic apparatus, and a clamp for holding a second nominal size substrate smaller than the first nominal size ;
The plate member has one or more positioning pins;
The positioning pin is provided so that the substrate is disposed at a predetermined position and / or direction of the plate member when the substrate is in contact with the positioning pin.
The clamp is composed of a ring made of a magnetic material similar to the outer contour of the substrate and having an inner contour smaller than the outer contour, and a plurality of magnets fixed to the plate member,
Holding the substrate in a predetermined position by the positioning pins and the clamp;
Substrate holder.
Before chrysanthemums lamp is adapted to hold a pre-Symbol substrate of the second nominal size at its substantially entire periphery,
The substrate holder according to claim 1. In use, the non-imaged portion of the second substrate is a peripheral portion about 3 mm wide ,
The substrate holder according to claim 1, wherein the substrate holder is a substrate holder. Before Kipu rate member comprises a silicon wafer of a standard nominal size the clamp is mounted,
Substrate holder according to any one of claims 1 to 3, characterized in that. Before Kipu rate member is substantially circular in a plane, having one or more flat portions or notches optionally,
Substrate holder according to any one of claims 1 to 4, characterized in that. Before Symbol first nominal size is at 150 mm, 200 mm, 300 mm or or more, before Symbol second nominal size is 100mm to or less than this,
The substrate holder according to claim 5. The plate member is provided with one or more flat portions or notches,
The positioning pin, the flat portion or the notch portion of the substrate is desirably matches the flat portion or the notch portion of the plate member is disposed in a predetermined direction,
Characterized in that,
Substrate holder according to 請 Motomeko 1. In the plate member, a precise bar pattern is disposed in a portion where the substrate is disposed .
A substrate holder according to any one of the preceding claims. Placing the plate member on the platform;
Place the correct orientation of the substrate on said plate member,
Placing the clamp on the chuck;
Lowering the chuck on the platform to accurately place the clamp on the substrate, thereby clamping the substrate to the plate member ;
9. A method for operating a substrate holder according to any one of claims 1 to 8 . The step of lowering the chuck aligns the pins of the platform and the holes of the chuck to accurately align the clamp, the substrate, and the plate member .
The method of claim 9 . Providing a substrate that is at least partially covered by a layer of radiation-sensitive material,
A step of supplying a projection beam of radiation using a radiation system,
A step of Ru gives a pattern in its cross-section of the projection beam using a patterning means,
And projecting the patterned beam of radiation onto a target portion of the layer of radiation-sensitive material,
Consisting of
The step of providing the substrate includes substeps of clamping the substrate to a plate member having a larger nominal size than the substrate, and placing the plate member having the clamped substrate on the lithographic apparatus. and sub-step, Ri consists of,
The sub-step of clamping the substrate to the plate member comprises a plate member having a first nominal size acceptable in a lithographic apparatus and a clamp for holding a second nominal size substrate smaller than the first nominal size The plate member has one or more positioning pins, and the positioning pins are positioned at a predetermined position of the plate member and / or when the substrate is in contact with the positioning pins. The clamp is fixed to the plate member and a ring made of a magnetic material having an inner contour that is similar to and smaller than the outer contour of the substrate. The substrate is arranged on the plate member of a substrate holder composed of a plurality of magnets, and the positioning pins and the claws are arranged. Holding the substrate in place by flop,
A device manufacturing method characterized by the above.
In the step of clamping the substrate to the plate member, the substrate is clamped at substantially the entire periphery thereof.
The device manufacturing method of claim 11, wherein the this.