JP3921838B2 - Electronics - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device casing having, for example, an external terminal such as a high-frequency conversion circuit on a side wall.
[0002]
[Prior art]
Conventionally, as shown in FIG. 3, an electronic device casing (hereinafter referred to as an F plate) is formed by combining four side surfaces with a metal frame portion 100, and at least one of these four side surfaces. An external terminal 101 such as a high-frequency conversion circuit is disposed on the side surface. The F plate is provided with a pair of upper and lower lid portions 102 (only the upper lid portion 102 is shown in FIG. 3) so as to close the region surrounded by the four side surfaces. .
[0003]
In such an F plate, the frame portion 100 on which the external terminals 101 are disposed needs to have a predetermined strength. For this reason, the frame part 100 in which the external terminal 101 is provided has a bent part 103 formed by bending the upper end side inward. As described above, the frame portion 100 is improved in strength against external force in the twist direction and bending force in the longitudinal direction by bending the upper end side.
[0004]
Moreover, in this F plate, the cover part 102 is a shape which obstruct | occludes the area | region enclosed by four side surfaces. And this lid part 102 is subjected to a squeezing process over the entire peripheral part to improve the strength. That is, the lid portion 102 is formed with a step at the peripheral edge portion of the main surface serving as the upper surface of the F plate, and the central portion is convex as compared with the peripheral edge portion.
[0005]
The lid portion thus configured forms the main surface of the F plate by being fitted into the upper end portion of the frame portion that constitutes the four side surfaces.
[0006]
As described above, the F plate has the high strength of the frame portion on which the external terminal 101 is disposed by forming the bent portion 103, and the lid portion is subjected to the squeezing process. 102 has high strength.
[0007]
[Problems to be solved by the invention]
By the way, the F plate as described above tends to be thinned. That is, the above-described F plate is designed in a direction in which the frame portion 100 is thinned by reducing the height of the frame portion 100.
[0008]
However, in the frame portion 100 in which the external terminals 101 are disposed, it is necessary to form a bent portion 103 for improving the strength. Therefore, an interval between the upper end portion indicated by H in FIG. Don't be. In other words, in the F plate, if the interval indicated by H in FIG. 3 is not greater than or equal to a predetermined value, the bent portion 103 cannot be formed by bending, and the strength of the frame portion 100 in which the external terminals 101 are disposed is increased. Will fall. For this reason, in the F plate described above, the interval indicated by H in FIG. 3 is maintained at a predetermined value.
[0009]
Therefore, the F plate described above must be thinned while maintaining the interval indicated by H in FIG. 3 at a predetermined value. In other words, the F plate described above has a problem in that it cannot be thinned while maintaining the strength of the frame portion 100 in which the external terminals 101 are disposed.
[0010]
Therefore, the present invention has been made in view of the above-described problems, and an object of the present invention is to provide an electronic device casing that is significantly thinned while maintaining the strength of the frame portion on which the external terminals are disposed. To do.
[0011]
[Means for Solving the Problems]
In the electronic device according to the present invention that has solved the above-described problems, a side surface is formed by a metal frame portion having a substantially rectangular shape, and a lid portion that closes a region surrounded by the frame portion is attached, An electronic apparatus having a casing in which an external terminal is disposed on at least one side surface of the frame portion, wherein the lid portion is disposed on the frame portion and the one side surface on which the external terminal is disposed. The main surface is formed at a position higher than the region including the peripheral portion by applying a squeezing process to the peripheral portion excluding the contact portion, and the main surface is in contact with the upper end portion of the one side surface of the frame portion, The peripheral portion is in contact with the upper end portion of the other side surface excluding the one side surface of the frame portion.
[0012]
The electronic device casing according to the present invention configured as described above has a lid portion that is formed by squeezing a portion that contacts the frame portion other than the frame portion where the external terminals are disposed. That is, in this electronic device casing, the lid portion is not subjected to the squeezing process on the portion in contact with the frame portion on which the external terminal is disposed. For this reason, in this electronic device housing, the height of the lid can be kept low. Further, in this electronic device casing, since the frame portion in which the external terminals are disposed has a bent portion that is bent toward the region surrounded by the side surface, the frame portion in which the external terminals are disposed. The strength of can be increased.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of an electronic device casing according to the present invention will be described in detail with reference to the drawings.
[0014]
The electronic device casing shown in this embodiment is a so-called F plate 1 having a high-frequency generation circuit and the like inside as shown in FIG. The F plate 1 is formed in a box shape having a substantially rectangular parallelepiped shape as a whole, and has an external terminal 2 on one side surface 1a. The external terminal 2 is fitted and fixed in an opening (not shown) formed in one side 1a, and connects various circuits disposed in the F plate 1 to the outside.
[0015]
In the F plate 1, four metal frame portions 3 including the one side surface 1 a on which the external terminals 2 are disposed are combined to form a side wall. In the F plate 1, the height of one side surface 1 a on which the external terminal 2 is disposed is larger than the heights of the other three side surfaces. In other words, in the F plate 1, a step is formed between one side surface 1a where the external terminal 2 is disposed and the other side surface.
[0016]
Furthermore, one side surface on which the external terminal 2 is disposed has a bent portion 4 formed by bending the upper end portion thereof. By forming the bent portion 4, the strength of the side surface 1a is improved with respect to the bending force applied in the longitudinal direction and the force applied in the twisting direction. Accordingly, the one side surface 1a on which the external terminal 2 is disposed has improved strength against unexpected force due to the formation of the bent portion 4, and has shape stability.
[0017]
At this time, in one side face 1a on which the external terminal 2 is disposed, the distance between the upper end portion and the opening portion indicated by H in FIG. 1 is set to a predetermined value in order to perform bending. That is, in order to bend the metal frame 3, it is necessary to form a predetermined interval from the position to be bent to the position of the opening as indicated by H in FIG.
[0018]
Furthermore, in this F plate, the cover part 5 is arrange | positioned so that the area | region enclosed by the four frame parts 3 may be obstruct | occluded. The lid portion 5 is subjected to squeezing processing on a peripheral edge portion 5a excluding a portion in contact with one side surface 1a on which the external terminal 2 is disposed. For this reason, the lid 5 is formed with a step at the peripheral edge 5a excluding a portion in contact with the main surface 1a. As described above, by applying the squeezing process to a predetermined region of the lid portion 5, the lid portion 5 has improved strength against a force applied in the twisting direction and the bending direction. Therefore, the lid 5 has improved strength against unexpected external force and has shape stability.
[0019]
And in this cover part 5, the main surface 5b will be formed in the position higher than the area | region containing the peripheral part 5a by forming a level | step difference in the peripheral part 5a as mentioned above. Moreover, this cover part 5 has the clamping piece 6 which folds the outer side of the peripheral part 5a to which the drawing process was performed. This clamping piece 6 is formed in order to clamp the side wall composed of the four frame parts 3 and fix the lid part 5 itself when the lid part 5 is attached.
[0020]
When attaching the lid portion 5 to the side wall, the upper end portion of the side surface 1a on which the external terminal 2 is disposed is brought into contact with the vicinity of the end portion of the main surface 5b, and the other frame portion is brought into contact with the peripheral portion 5a. The upper end of 3 is brought into contact. At this time, as described above, the sandwiching piece 6 formed on the peripheral edge portion 5a subjected to the narrowing process sandwiches the side wall. Thereby, the cover part 5 will be attached to a side wall.
[0021]
At this time, the step between the peripheral portion 5a and the main surface 5b in the lid 5 is formed to be substantially equal to the step between the upper end portion of the one side surface 1a and the upper end portion of the other frame portion 3. For this reason, the cover part 5 can block | close the area | region enclosed by four frame parts reliably, without forming a clearance gap between frame parts.
[0022]
In the F plate 1 configured as described above, the main surface 5b of the lid 5 serves as a reference surface for thickness. Therefore, in order to reduce the thickness of the F plate, it is necessary to position the reference plane lower.
[0023]
By the way, in this F plate, in order to form the bending part 4 reliably as mentioned above, it is necessary to make the space | interval H in the one side surface in which the external terminal 2 was arrange | positioned into a predetermined value. In other words, in the F plate, when the diameter dimension of the external terminal 2 is defined, there is a limit in reducing the height of one side surface.
[0024]
However, in this F plate, the main surface 5b of the lid portion 5 is disposed so as to be in contact with the one side surface 1a, so that it is made as thin as possible. On the other hand, in the case of using a lid portion that is formed over the entire collection as in the conventional F plate, the main surface formed with a predetermined thickness on the upper end portion of one side surface. Therefore, sufficient thinning cannot be achieved.
[0025]
Thus, in the F plate 1 shown in the present embodiment, since the bent portion 4 can be formed on the one side surface 1a on which the external terminal 2 is disposed, the one side surface 1a has high strength, and one Since the upper end portion of the side surface 1a and the main surface 5b of the lid portion 5 are in contact with each other, the thickness is reduced.
[0026]
On the other hand, in the F plate 1 shown in the above-described embodiment, the main surface 5b that is in contact with the upper end portion of the one side surface 1a on which the external terminal 2 is disposed is not subjected to squeezing. The present invention is not limited to such a configuration. As shown in FIG. 2, the main surface 5b contacting the upper end portion of the one side surface 1a on which the external terminal 2 is disposed is intended to improve the strength. The groove processing may be formed.
[0027]
The lid 5 shown in the element 2 has a concave groove 7 formed by pressing or the like on a main surface 5b that comes into contact with the upper end of one side surface 1a on which the external terminal 2 is disposed. The concave groove 7 can improve the mechanical strength of the lid 5 without changing the height of the main surface 5b.
[0028]
For this reason, when the lid portion 5 shown in FIG. 2 is used, the F plate achieves a desired thickness reduction and further improves the strength.
[0029]
【The invention's effect】
As described above in detail, in the electronic device casing according to the present invention, the frame portion in which the external terminal is disposed has a bent portion, and the frame portion other than the frame portion in which the external terminal is disposed; The squeezing process is given to the part which touches. For this reason, in this electronic device housing, a reduction in thickness is achieved while maintaining a high mechanical strength.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a main part shown as an example of an electronic device casing according to the present invention.
FIG. 2 is a perspective view of a main part of a lid shown as another example.
FIG. 3 is an exploded perspective view of a main part of a conventional electronic device casing.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 F plate 2 External terminal 3 Frame part 4 Bending part 5 Lid part 6 Clamping piece

Claims (5)

A housing in which a side surface is formed by a metal frame portion having a substantially rectangular shape, a lid portion for closing a region surrounded by the frame portion is attached, and an external terminal is disposed on at least one side surface of the frame portion. An electronic device having a body,
The lid portion is disposed on the frame portion, and is squeezed on a peripheral portion excluding a portion in contact with the one side surface on which the external terminal is disposed, and is mainly positioned at a position higher than a region including the peripheral portion. The main surface is in contact with the upper end portion of the one side surface of the frame portion, and the peripheral portion is in contact with the upper end portion of the other side surface except the one side surface of the frame portion. Electronic equipment.   The said frame part has the bending part formed by bending toward the area | region enclosed by the side surface in the upper end part of the said one side surface in which the said external terminal was arrange | positioned. The electronic device described.   In the frame portion, the height of the one side surface on which the external terminal is disposed is larger than the height of the other side surface, and a step is formed between the one side surface and the other side surface. The electronic device according to claim 1, wherein the electronic device is provided.   The said lid | cover part is formed so that a level | step difference may be formed in the said main surface and the said peripheral part, and it may be formed so that it may become substantially equal to the level | step difference of the said frame part. Electronics.   5. The electronic apparatus according to claim 1, wherein a concave portion is formed in the lid portion in parallel with the one side surface on which the external terminal is disposed.

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