JP3911995B2 - Substrate storage structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate storage structure for storing a printed circuit board on which electronic components are mounted.
[0002]
[Prior art]
As a lighting device for lighting a fluorescent lamp or a discharge lamp that is a light source for illumination, a high-frequency lighting device for lighting at a frequency higher than a power supply frequency by combining electronic components is well known. A high-frequency lighting device is generally configured by mounting electronic components such as semiconductor components and winding components on a printed circuit board, and the mounted printed circuit board is accommodated in a case structure, and the case structure is a lighting fixture. Built in. Among them, there are many cases where the lighting fixture itself is a product as a case structure.
[0003]
Such a high-frequency lighting device is an electronic ballast that has a printed circuit board built in a metal case, which is generally commercialized in Japan, but overseas, the printed circuit board is built in a resin case. The products made have already been commercialized.
[0004]
In particular, in a high-frequency lighting device in which a high-frequency lighting device is built in a resin case, the case structure includes: 1. The resin case is composed of a resin case main body and a resin case lid. 2. A printed circuit board is accommodated in the resin case main body, and a resin case lid is covered; The external structure (lighting fixture) is characterized in that it is connected by attachment means (screws or the like) through an attachment hole provided in the resin case main body.
[0005]
In addition, the resin case can be easily insulated from the external structure and the printed circuit board by storing the printed circuit board in the resin case body and covering the resin case cover. The printed circuit board thus obtained can be directly stored in the resin case main body.
[0006]
[Problems to be solved by the invention]
However, the disadvantages of the resin case structure are: If there is no printed circuit board fixing means and a new fixing means is provided in the case main body, the structure of the case main body will be complicated, resulting in increased molds and increased processing during resin molding, leading to increased costs. 2. The external structure is connected only to the resin case body by attachment means, and there is a possibility that the case body and the case lid will be separated, such as when the instrument vibrates during transportation or when it is handled roughly. is there. If the structure is difficult to separate the case main body and the case lid, there is an increase in molds and processing during resin molding, which may increase costs due to the connection structure.
[0007]
The present invention has been made in view of the above-mentioned reasons, and an object of the present invention is to provide an inexpensive board storage structure that has a printed board fixing means and the case main body part and the case lid part are not easily separated. It is in.
[0008]
[Means for Solving the Problems]
The invention according to claim 1 covers the printed circuit board on which the electronic component is mounted, the case main body portion arranged on the bottom surface so that the plate surfaces are parallel to each other, and the printed circuit board arranged on the case main body portion. The case body portion and the lid portion are provided with one or a plurality of attachment holes communicating with each other, and externally attached by attachment means inserted through the attachment holes. In a housing structure for fixing the case body, the printed circuit board, and the lid to the structure, outer edge portions of mounting holes facing each other provided in the case body and the lid are in contact with each other, and the case body Alternatively, on one of the lid portions, a step surface that is lower than the thickness of the printed circuit board from a position at the same height as the contact surface of the mounting hole, and a rising surface provided in a direction perpendicular to the step surface, The step surface is the pre Abutting with the plate surface of the printed circuit board, the rising surface is formed in at least two places, the rising surfaces are formed in two or more directions, and are in contact with the end portion of the printed circuit board. The other is characterized in that a pressing surface is provided at the same position as the height of the outer edge portion of the mounting hole in parallel to the plate surface of the printed board, and suppresses the vertical movement of the printed board. .
[0009]
According to a second aspect of the present invention, in the first aspect of the invention, the case main body portion and the case lid portion are molded products of a resin material.
[0010]
According to a third aspect of the present invention, in the first aspect of the present invention, a step surface that is lower than the thickness of the printed circuit board from the position of the contact surface of the mounting hole is formed on one of the case main body or the cover portion, and the step surface. To the outer edge of the mounting hole, and a rising surface provided perpendicularly to the outer periphery of the mounting hole, the stepped surface is in contact with the plate surface of the printed circuit board, and the rising surface is in contact with the end portion of the printed circuit board It is characterized by.
[0011]
The invention according to claim 4 is the invention according to claim 1, wherein the printed circuit board is a solder surface on which one surface is mounted with a surface mounting component, and the other surface is a component mounting surface on which a discrete component is mounted, The solder surface is installed to face the bottom surface of the case body, and the case body is provided with a partition wall on the bottom surface that surrounds the surface mount component of the printed circuit board when the printed circuit board is disposed. It is characterized by that.
[0012]
According to a fifth aspect of the present invention, in the invention according to any one of the first to fourth aspects, the case lid portion is provided with a heat radiating hole that is also used as a display means for indicating display contents by shape.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0014]
(Embodiment 1)
1 to 6 show the first embodiment. As shown in FIG. 1, FIG. 2, FIG. 4, and FIG. 5, the cross section is substantially U-shaped, and both end portions are in the vertical direction compared to the central portion. The case has a short dimension, has an opening on the lower surface, a resin-formed case lid 1, a substantially rectangular printed board 2, and has a substantially U-shaped cross section. 2 is disposed inside, and a resin-formed case body 3 and a screw 4 (illustrated only in FIG. 1) are attachment means for connecting the case lid 1 and the case body 3 to an external structure (lighting fixture). The printed circuit board 2 is disposed between the case lid 1 and the case body 3.
[0015]
The case lid portion 1 includes mounting holes 5 and 5 through which the screws 4 are inserted in the diagonal direction at one end when viewed from the upper surface, and is mounted on the printed circuit board 2 at the other diagonal portion. Opening portions 17 and 17 through which the terminals 15 and 15 are inserted are provided, and a pressing portion that abuts the upper surface of the substrate 14 around the mounting holes 5 and 5 and suppresses the movement of the substrate 14 in the direction perpendicular to the plate surface. 18 and 18 are provided.
[0016]
The printed circuit board 2 includes electronic components 16 and 16 on the substrate 14, and includes notches 23 a and 23 b having semicircular recesses 13 a and 13 b at one end diagonal portion viewed from the upper surface of the substrate 14, and the other Input / output terminals 15 and 15 are provided at the diagonal portions of both ends.
[0017]
The case body 3 is provided with mounting holes 6a and 6b made of cavities inside a cylindrical body standing upright from the bottom surface at one of the opposite end portions viewed from the top surface in order to allow the screw 4 to be inserted in the lower surface direction. A protrusion 11 for arranging the printed circuit board 2 at the other end diagonal portion is provided (in FIG. 1, the protrusion at one end is not shown), and a protrusion for disposing the printed circuit board 2 at the approximate center of both side surfaces. 1 is provided (protruding piece on one side is not shown in FIG. 1), and is provided at the approximate center of both ends of the inner surface of the case lid 1 when the case lid 1 is attached to the approximate center of both ends. Protrusions 10 and 10 that engage with the projecting pieces (not shown) are provided. The upper end of the projecting piece 10 has a tapered shape to facilitate the attachment of the case lid 1.
[0018]
Next, enlarged views of the substrate 14 in the A part and the B part of FIG. 2 are shown in FIGS. Part A has an angle of 45 ° from the short side of one end of the substrate 14 to the long side direction of the substrate 14 at the corner of one end of the substrate 14, and the printed circuit board 2 is arranged in the case body 3. A notch 23a is formed so as to divide the attachment hole 6a into a substantially semicircle, and is coaxial with the attachment hole 6a when the printed circuit board 2 is arranged in the case body 3 at the approximate center of the notch 23a. And a semicircular recess 13a having the same radius is formed. The B portion is formed with a substantially rectangular cutout portion 23b at the diagonal portion of the A portion, and when the printed circuit board 2 is arranged in the case main body portion 3, the cutout portion 23b parallel to the long side of the substrate 14 is formed. The side of the mounting hole 6b is divided into substantially semicircles, and a semicircular recess 13b having the same radius as the mounting hole 6b is formed on the side of the notch 23 parallel to the long side of the substrate 14. is doing.
[0019]
FIG. 5 shows a perspective view of the printed circuit board 2 arranged on the case main body 3. FIG. 6 (a) is an enlarged view of a portion C around the notch 23a and a portion D around the notch 23b. , (B). The attachment hole 6a of the case body 3 is formed with a substantially semicircular cutout having a straight portion parallel to the cutout portion 23a on the substrate 14 side, and the attachment hole 6b is cut parallel to the long side of the substrate 14. A substantially semicircular cutout having a straight portion parallel to the side of the cutout portion 23b is formed on the substrate 14 side. The semicircular recesses 13a and 13b of the substrate 14 are arranged on the step surfaces 7a and 7b formed by end faces of substantially semicircular cutouts of the mounting holes 6a and 6b so as to be coaxial with the mounting holes 6a and 6b. Then, the end portions of the cutout portions 23a and 23b of the substrate 14 are in contact with the rising surfaces 8a and 8b provided perpendicular to the step surfaces 7a and 7b. At this time, since the directions of the rising surfaces 8a and 8b with respect to the substrate 14 are different from each other, the printed circuit board 2 has a structure that is resistant to vibration and displacement in a direction parallel to the plate surface. The position can be fixed.
[0020]
And the axial length of the mounting holes 6a, 6b of the rising surfaces 8a, 8b is formed longer than the plate thickness of the substrate 14, and the upper surface of the substrate 14 is the outer edges 24a of the mounting holes 6a, 6b. It becomes lower than 24b. Therefore, when the case lid 1 is attached to the upper surface of the case main body 3, the pressing portions 18 and 18 of the case lid 1 abut against the outer edge portions 24a and 24b and do not contact the upper surface of the substrate 14. When the screw 4 is connected to the external structure through the mounting holes 5 and 5 and the mounting holes 6a and 6b, the stress is caused by the outer edge portions 24a and 24b of the mounting holes 6a and 6b of the case body 3. And the pressing portions 18 and 18 of the case lid portion 1 that are in contact with the outer edge portions 24a and 24b, but not the substrate 14. Further, the vibration of the substrate 14 in the direction perpendicular to the plate surface is limited by suppressing the contact portions 18 and 18 of the case lid portion 1 in contact with the upper surface of the substrate 14 to be displaced.
[0021]
In the first embodiment, the stepped surfaces 7a and 7b and the rising surfaces 8a and 8b of the printed circuit board 2 are provided in the mounting holes 6a and 6b of the case body 3, but the mounting holes 5 of the case lid 1 are provided. , 5 may be provided.
[0022]
(Embodiment 2)
FIG. 7 shows the second embodiment, and the same elements as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted.
[0023]
In recent years, in the printed circuit board 2, electronic components mounted on the substrate 14 are increasingly mounted on the solder surface, which is the lower surface of the substrate 14, due to demands for downsizing. Furthermore, in order to reduce the size of the case structure composed of the case lid 1 and the case main body 3, the design of the electronic component to be mounted has to be designed with a small margin, and the heat generated from the component can be prevented. Consideration is needed.
[0024]
In the second embodiment, the heat generating component 19 that has been conventionally mounted on the component mounting surface that is the upper surface of the substrate 14 is mounted on the solder surface of the substrate 14. A heat radiating part 21 sandwiched between partition plates 21 and 21 erected in parallel with the short side of the case main body part 3 is formed on the inner surface of the case main body part 3. Filler is injected.
[0025]
When the printed circuit board 2 is arranged inside the case main body 3, the heat generating component 19 is located in the heat radiating portion 21, and the heat generated in the heat generating component 19 is made of silicon resin or the like injected into the heat radiating portion 21. The temperature rise of the heat generating component 19 can be reduced by conducting to the case main body 3 via the filler.
[0026]
(Embodiment 3)
8 and 9 show the third embodiment, and the same elements as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted.
[0027]
As described in the third embodiment, in recent years, due to the demand for miniaturization, it is necessary to consider the heat generation of components.
[0028]
Therefore, in the third embodiment, the heat generated in the heat-generating component is dissipated by providing the heat radiation hole 20 also serving as the display means having the shape of characters, pictures, symbols, etc. on the upper surface of the case lid 1. The heat is dissipated through the hole 20, and the model number, lot number. Etc. can be displayed.
[0029]
(Embodiment 4)
10 and 11 show the fourth embodiment, and the same elements as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted.
[0030]
FIG. 10 shows a perspective view of the printed circuit board 2 arranged on the case main body 3. FIG. 11 (a) is an enlarged view of the E part around the notch 23a and the F part around the notch 23b. , (B).
[0031]
In section E, the corner of one end of the substrate 14 has an angle of 45 ° with respect to the long side direction of the substrate 14 from the short side of one end of the substrate 14, and the printed circuit board 2 is disposed in the case body 3. A notch 23a is formed so as to divide the attachment hole 6a into a substantially semicircle, and is coaxial with the attachment hole 6a when the printed circuit board 2 is arranged in the case body 3 at the approximate center of the notch 23a. In addition, a semicircular recess 13a having substantially the same radius as the outer portion of the cylindrical body forming the attachment hole 6a is formed. The B portion is formed with a substantially rectangular cutout portion 23b at the diagonal portion of the A portion, and when the printed circuit board 2 is arranged in the case main body portion 3, the cutout portion 23b parallel to the long side of the substrate 14 is formed. The side divides the attachment hole 6b into a substantially semicircle, and is substantially the same as the outer portion of the cylindrical body that is coaxial with the attachment hole 6b and forms the attachment hole ba on the side of the notch 23 parallel to the long side of the substrate 14. A semicircular recess 13b having the same radius is formed.
[0032]
The semicircular recesses 13a and 13b of the substrate 14 are in contact with the side surfaces of the outer portion of the cylindrical body forming the attachment holes 6a and 6b. At this time, the side surface of the outer portion of the cylindrical body forming the mounting holes 6a and 6b with which the semicircular concave portions 13a and 13b are in contact constitutes the rising surfaces 8a and 8b, and the rising surfaces 8a and 8b with respect to the substrate 14 are formed. Since the directions are different from each other, the printed circuit board 2 has a structure that is resistant to vibration, displacement, and the like in the direction parallel to the plate surface, and can fix the position in the direction parallel to the plate surface.
[0033]
And the level | step difference surface of the board | substrate 14 provided in the inner surface of the case main-body part 3 so that the upper surface of the board | substrate 14 arrange | positioned at the inner surface of the case main-body part 3 may become lower than the outer edge parts 24a and 24b of the attachment holes 6a and 6b. (Not shown) is formed. Therefore, when the case lid 1 is attached to the upper surface of the case main body 3, the pressing portions 18 and 18 of the case lid 1 abut against the outer edge portions 24a and 24b and do not contact the upper surface of the substrate 14. When the screw 4 is connected to the external structure through the mounting holes 5 and 5 and the mounting holes 6a and 6b, the stress is caused by the outer edge portions 24a and 24b of the mounting holes 6a and 6b of the case body 3. And the pressing portions 18 and 18 of the case lid portion 1 that are in contact with the outer edge portions 24a and 24b, but not the substrate 14. Further, the vibration of the substrate 14 in the direction perpendicular to the plate surface is limited by suppressing the contact portions 18 and 18 of the case lid portion 1 in contact with the upper surface of the substrate 14 to be displaced.
[0034]
【The invention's effect】
The invention according to claim 1 covers the printed circuit board on which the electronic component is mounted, the case main body portion arranged on the bottom surface so that the plate surfaces are parallel to each other, and the printed circuit board arranged on the case main body portion. The case body portion and the lid portion are provided with one or a plurality of attachment holes communicating with each other, and externally attached by attachment means inserted through the attachment holes. In a housing structure for fixing the case body, the printed circuit board, and the lid to the structure, outer edge portions of mounting holes facing each other provided in the case body and the lid are in contact with each other, and the case body Alternatively, on one of the lid portions, a step surface that is lower than the thickness of the printed circuit board from a position at the same height as the contact surface of the mounting hole, and a rising surface provided in a direction perpendicular to the step surface, The step surface is the pre Abutting with the plate surface of the printed circuit board, the rising surface is formed in at least two places, the rising surfaces are formed in two or more directions, and are in contact with the end portion of the printed circuit board. On the other hand, a pressing surface is provided at the same position as the height of the outer edge of the mounting hole in parallel to the plate surface of the printed board, and a holding surface that suppresses the vertical movement of the printed board is provided. It is possible to provide a printed circuit board storage structure that is strong in longitudinal and lateral vibrations without being directly subjected to stress when connected to the external structure. Further, even when the case lid is removed, the external structure is attached to the printed circuit board. There is an effect that it can be securely attached in the vertical direction and the horizontal direction without directly applying stress at the time of connection. In addition, the printed circuit board has a structure that is strong against vibration and displacement in the direction parallel to the plate surface, and has an effect that the position in the direction parallel to the plate surface can be fixed.
[0035]
According to a second aspect of the invention, in the first aspect of the invention, the case main body and the case lid are molded products of a resin material, so that they can be easily insulated from the external structure, and the electronic component is mounted. The printed circuit board can be directly stored in the resin case, and the number of parts and the number of assembly steps can be reduced compared to a metal case that requires insulation means between the printed circuit board and the case. .
[0036]
According to a third aspect of the present invention, in the first aspect of the present invention, a step surface that is lower than the thickness of the printed circuit board from the position of the contact surface of the mounting hole is formed on one of the case main body or the cover portion, and the step surface. To the outer edge portion of the mounting hole, the rising surface is provided vertically, the stepped surface is in contact with the plate surface of the printed circuit board, and the rising surface is in contact with the end portion of the printed circuit board. The mounting hole of the case main body can be used together with the storage part and the step part, and there is an effect that it is possible to reduce the cost by suppressing the increase in mold and the processing during molding.
[0037]
The invention according to claim 4 is the invention according to claim 1, wherein the printed circuit board is a solder surface on which one surface is mounted with a surface mounting component, and the other surface is a component mounting surface on which a discrete component is mounted, The solder surface is installed to face the bottom surface of the case body, and the case body is provided with a partition wall on the bottom surface that surrounds the surface mount component of the printed circuit board when the printed circuit board is disposed. Therefore, there is an effect that heat generation of a heat generating component such as a surface mounting component can be efficiently reduced with a small amount of filler, and filling during processing can be performed reliably.
[0038]
The invention according to claim 5 is the invention according to any one of claims 1 to 4, wherein the case cover portion is provided with a heat radiating hole that also serves as a display means that indicates the display contents by shape. By combining this with the heat dissipation hole, display and heat dissipation can be simultaneously performed at low cost.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a first embodiment of the present invention.
FIG. 2 is an exploded perspective view 1 showing a storage state of Embodiment 1 of the present invention.
FIG. 3 is a partially enlarged view 1 showing Embodiment 1 of the present invention.
FIG. 4 is a perspective view showing Embodiment 1 of the present invention.
FIG. 5 is an exploded perspective view 2 showing a storage state of the first embodiment of the present invention.
FIG. 6 is a partially enlarged view 2 showing Embodiment 1 of the present invention.
FIG. 7 is an exploded perspective view showing Embodiment 2 of the present invention.
FIG. 8 is a perspective view showing Embodiment 3 of the present invention.
FIG. 9 is an exploded perspective view showing a storage state of Embodiment 3 of the present invention.
FIG. 10 is an exploded perspective view showing a storage state of Embodiment 4 of the present invention.
FIG. 11 is a partially enlarged view showing Embodiment 4 of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Case cover part 2 Printed circuit board 3 Case main-body part 6a, 6b Mounting hole 7a, 7b Step surface 8a, 8b Rising surface 13a, 13b Semicircular recessed part 14 Board | substrate 23a, 23b Notch

Claims (5)

A printed circuit board on which electronic components are mounted, a case main body that is disposed on the bottom surface so that the printed circuit boards are parallel to each other, and a case main body that covers the printed circuit board that is disposed on the case main body. The case main body portion and the lid portion are provided with one or a plurality of attachment holes that communicate with each other, and the case main body portion is attached to the external structure by attachment means inserted through the attachment holes. In the housing structure for fixing the printed circuit board and the lid portion, the outer edge portions of the mounting holes facing each other provided in the case main body portion and the lid portion come into contact with each other, and either the case main body portion or the lid portion, A step surface lower than the thickness of the printed circuit board from a position at the same height as the contact surface of the mounting hole and a rising surface provided in a direction perpendicular to the step surface are provided, the step surface of the printed circuit board Board surface and this The rising surface has at least two places, the rising surfaces are formed in two or more directions and come into contact with the end portion of the printed circuit board, and the mounting hole is formed on the other of the case main body portion or the lid portion. A board storage structure comprising a pressing surface that is formed in parallel to the plate surface of the printed board at the same position as the height of the outer edge of the printed board and suppresses the vertical movement of the printed board. The substrate storage structure according to claim 1, wherein the case main body and the case lid are molded products of a resin material. Provided on one side of the case main body or the lid portion in a perpendicular manner continuously from the position of the contact surface of the mounting hole to a step surface lower than the thickness of the printed circuit board and from the step surface to the outer edge of the mounting hole. 2. The substrate storage structure according to claim 1, wherein the rising surface is provided, the stepped surface is in contact with a plate surface of the printed circuit board, and the rising surface is in contact with an end portion of the printed circuit board. One surface of the printed circuit board is a solder surface on which a surface mounting component is mounted, the other surface is a component mounting surface on which a discrete component is mounted, and the solder surface faces the bottom surface of the case body. The board storage structure according to claim 1, wherein the case body is provided with a partition wall on a bottom surface that surrounds a surface mounting component of the printed board when the printed board is disposed. . 5. The substrate storage structure according to claim 1, wherein the case lid portion is provided with a heat radiating hole that also serves as a display means for indicating display contents by shape.

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