JP3909293B2 - Electronics - Google Patents

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Publication number
JP3909293B2
JP3909293B2 JP2003018183A JP2003018183A JP3909293B2 JP 3909293 B2 JP3909293 B2 JP 3909293B2 JP 2003018183 A JP2003018183 A JP 2003018183A JP 2003018183 A JP2003018183 A JP 2003018183A JP 3909293 B2 JP3909293 B2 JP 3909293B2
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JP
Japan
Prior art keywords
plate
sides
cover
substrate
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003018183A
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Japanese (ja)
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JP2004235176A (en
JP2004235176A5 (en
Inventor
真 海老沢
早人 菅原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Automotive Systems Engineering Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Car Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Car Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP2003018183A priority Critical patent/JP3909293B2/en
Publication of JP2004235176A publication Critical patent/JP2004235176A/en
Publication of JP2004235176A5 publication Critical patent/JP2004235176A5/en
Application granted granted Critical
Publication of JP3909293B2 publication Critical patent/JP3909293B2/en
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Description

【0001】
【発明の属する技術分野】
本発明は、電子機器の構成部品の実装方法に関する。
【0002】
【従来の技術】
従来の技術は、アルミワイヤで接続した電子機器のカバーおよびプレートにキバンを固定する方法において、4辺規制の方法や、互いに嵌合させ、固定する方法がほとんどであった。なお、この種の発明に関連するものには、実開平1−95790号公報,実開平6−60183号公報,実開平6−86375号公報,実開平6−86376号公報が挙げられる。
【0003】
【特許文献1】
実開平1−95790号公報
【特許文献2】
実開平6−60183号公報
【特許文献3】
実開平6−86375号公報
【特許文献4】
実開平6−86376号公報
【0004】
【発明が解決しようとする課題】
上記従来技術は、アルミワイヤの信頼性を重視しすぎたため、その中の、4辺規制する方法では、4辺互いの寸法的な干渉を考慮しておらず、組立性に問題があった。また、互いの部品を嵌合させる方法では、組立て工程の簡略性について考慮されておらず、組立て部分が見えずに組立てるといった複雑性があった。本発明の目的は、組立て工程を簡略化することにあり、なおかつ、アルミワイヤボンディングの信頼性も確保するところにある。
【0005】
【課題を解決するための手段】
上記目的を達成するために、カバーとプレートとキバンの固定部を、アルミワイヤの接続が多い端子側2辺に設けたものである。
【0006】
【発明の実施の形態】
以下、本発明の実施例を図1,図2,図3,図4により説明する。
【0007】
本電子機器は、大別してカバー1,プレート2,キバン3,アルミワイヤ4から構成される。図2より、カバー1は、アルミワイヤ4を接続するための端子が3辺に設けられており、その中で、端子数が多い2辺にプレート2を固定するための突き当て部1a〜1cが設けられている。更に、図3より、プレート2は、カバー1の端子が多い2辺に、キバン3を固定するための突き当て部2a〜2cを設けている。これらの部品は、プレート2をカバー1の突き当て部1a〜1cに当てて、接着剤6で固定される。キバン3はプレート2の突き当て部2a〜2cに当てて、接着剤5で固定される。その後、カバー1の3辺の端子とキバン3間にアルミワイヤ4での接続(ボンディング)を行う。
【0008】
カバー1とプレート2の固定は、2辺に突き当てて接着・固定するため、寸法的な変化により、固定が不可になることは無く、縦横2辺に突き当てることで容易に固定が完了する。また、プレート2とキバン3の固定も同様の理由で、縦横2辺に突き当てることで容易に固定が完了する。
【0009】
本電子機器は、使用環境温度が高いため、周囲温度の変化で樹脂の膨張収縮がおこり易く、カバー1の端子とキバン3の接続部分(アルミワイヤ4)が、その影響を一番受けやすい。図4を使って説明すると、このアルミワイヤ4の接続に対し、接続端子の多い2辺にカバー1の突き当て部1a〜1c,プレート2の突き当て部2a〜2cを設けた。これにより、樹脂の膨張時は、アルミワイヤ4の足の間隔が開く方向になるが、その変化は200μm以下に抑えられる。ここで言う200μm以下とは、アルミワイヤ4の劣化・破断寿命を確保できる変化量である。これに対し、樹脂の収縮時は、カバー1,プレート2の突き当て部1a〜1c,2a〜2cに当てているため、樹脂の収縮が抑えられ、アルミワイヤ4の足の間隔が狭くなる変化は見られない。これにより、全体の温度変化による樹脂の膨張収縮の変化量は200μm以下に抑えられるため、アルミワイヤ4の温度変化の膨張収縮での劣化および破断に対する信頼性を確保することができた。
【0010】
更に、カバー1の突き当て部1a〜1cとプレート2の突き当て部2a〜2cは、各々プレート2,キバン3を組付ける際、隠れることがない。突き当て部分が、作業の際、上方から良く見えることは、組立ての誤組みを防止出来るだけでなく、組立ての作業性も容易になり、その結果、作業の信頼性も確保することが出来た。
【0011】
このように、部品の位置決め用の突き当て部位置を変えることで、電気的接続の信頼性および組立て作業の信頼性、両方を確保することが出来た。
【0012】
【発明の効果】
本発明によれば、アルミワイヤの温度変化に対する信頼性を確保しつつ、カバーとプレートとキバンを容易に組立てることができるため、組立て工程の簡略化に効果がある。
【図面の簡単な説明】
【図1】本発明の一実施例の構成図。
【図2】カバー図。
【図3】プレート図。
【図4】樹脂の膨張収縮図。
【符号の説明】
1…カバー、1a,1b,1c…プレートとの突き当て部、2…プレート、
2a,2b,2c…キバンとの突き当て部、3…キバン、4…アルミワイヤ、5,6…接着剤。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounting method for components of an electronic device.
[0002]
[Prior art]
In the conventional techniques, most of the methods for fixing the collar to the cover and plate of the electronic device connected by the aluminum wire are the four-side regulation method and the method of fitting and fixing each other. In addition, what is related to this kind of invention includes Japanese Utility Model Laid-Open No. 1-95790, Japanese Utility Model Laid-Open No. 6-60183, Japanese Utility Model Laid-Open No. 6-86375, Japanese Utility Model Laid-Open No. 6-86376.
[0003]
[Patent Document 1]
Japanese Utility Model Publication No. 1-95790 [Patent Document 2]
Japanese Utility Model Publication No. 6-60183 [Patent Document 3]
Japanese Utility Model Publication No. 6-86375 [Patent Document 4]
Japanese Utility Model Publication No. 6-86376 [0004]
[Problems to be solved by the invention]
The prior art described above places too much importance on the reliability of the aluminum wire, and the four-side regulation method does not take into account the dimensional interference between the four sides, and has a problem in assembling. Further, in the method of fitting the parts together, the simplicity of the assembling process is not considered, and there is a complexity of assembling without seeing the assembling part. An object of the present invention is to simplify the assembly process and to ensure the reliability of aluminum wire bonding.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, fixing portions for the cover, the plate, and the collar are provided on the two sides on the terminal side where the aluminum wire is often connected.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to FIGS.
[0007]
This electronic device is roughly composed of a cover 1, a plate 2, a collar 3 and an aluminum wire 4. As shown in FIG. 2, the cover 1 is provided with terminals for connecting the aluminum wire 4 on three sides, and of these, butting portions 1a to 1c for fixing the plate 2 to two sides having a large number of terminals. Is provided. Further, as shown in FIG. 3, the plate 2 is provided with abutting portions 2 a to 2 c for fixing the ribs 3 on the two sides with many terminals of the cover 1. These components are fixed by an adhesive 6 with the plate 2 placed against the abutting portions 1 a to 1 c of the cover 1. The kiban 3 is applied to the abutting portions 2 a to 2 c of the plate 2 and fixed with an adhesive 5. Thereafter, an aluminum wire 4 is connected (bonded) between the terminals on the three sides of the cover 1 and the base 3.
[0008]
The cover 1 and the plate 2 are fixed by abutting and adhering to the two sides, so that the fixing is not impossible due to the dimensional change, and the fixing is easily completed by abutting the two sides in the vertical and horizontal directions. . For the same reason, the plate 2 and the rib 3 can be fixed easily by abutting the two sides in the vertical and horizontal directions.
[0009]
Since this electronic device has a high operating environment temperature, the resin tends to expand and contract due to changes in the ambient temperature, and the connection portion (aluminum wire 4) between the terminal of the cover 1 and the kiban 3 is most susceptible to the influence. If it demonstrates using FIG. 4, the abutting part 1a-1c of the cover 1 and the abutting part 2a-2c of the plate 2 were provided in two sides with many connection terminals with respect to the connection of this aluminum wire 4. FIG. Thereby, when the resin expands, the distance between the legs of the aluminum wire 4 is increased, but the change is suppressed to 200 μm or less. The term “200 μm or less” as used herein refers to the amount of change that can ensure the deterioration / breakage life of the aluminum wire 4. On the other hand, when the resin contracts, since it is applied to the abutting portions 1a to 1c and 2a to 2c of the cover 1 and the plate 2, the resin contraction is suppressed and the distance between the legs of the aluminum wire 4 is narrowed. Is not seen. As a result, the amount of change in expansion and contraction of the resin due to the overall temperature change can be suppressed to 200 μm or less, so that the reliability of the aluminum wire 4 due to the expansion and contraction due to the temperature change and the reliability against fracture can be secured.
[0010]
Further, the abutting portions 1a to 1c of the cover 1 and the abutting portions 2a to 2c of the plate 2 are not hidden when the plates 2 and the kiban 3 are assembled. The fact that the abutting part is visible from above during work not only prevents misassembly of the assembly, but also facilitates the assembly work, and as a result, ensures the reliability of the work. .
[0011]
Thus, by changing the position of the abutting portion for positioning the parts, it was possible to ensure both the reliability of electrical connection and the reliability of assembly work.
[0012]
【The invention's effect】
According to the present invention, it is possible to easily assemble the cover, the plate, and the collar while ensuring the reliability with respect to the temperature change of the aluminum wire, which is effective in simplifying the assembling process.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of an embodiment of the present invention.
FIG. 2 is a cover diagram.
FIG. 3 is a plate diagram.
FIG. 4 is an expansion / contraction diagram of resin.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Cover, 1a, 1b, 1c ... Abutting part with plate, 2 ... Plate,
2a, 2b, 2c: abutting portion with a punch, 3 ... a punch, 4 ... an aluminum wire, 5, 6 ... an adhesive.

Claims (1)

複数の第1端子を備えたカバーと、
前記カバーに接着剤で固定され、該カバーにより一方の主面の全体が覆われたプレートと、
前記プレートの上に接着剤で固定され、複数の第2端子を備えた基板と、
前記カバーの前記複数の第1端子と前記基板の前記複数の第2端子とを接続する複数のボンディングワイヤとを有し、
前記複数の第1端子及び前記複数の第2端子は、前記基板及び前記プレートの4辺のうち3辺側に設けられており、
前記複数のボンディングワイヤは、前記基板の前記3辺を交差して、該第1端子と該第2端子とを接続し、
前記カバーの中の前記プレートを配置する領域には、前記プレートの位置決め用に、該プレートの4辺のうち隣り合う2辺に突き当てられるように配置された第1突き当て部が3つのみ設けられ、
前記プレートの上には、前記基板の位置決め用に、該基板の4辺のうち隣り合う2辺に突き当てられるように配置された第2突き当て部が3つのみ設けられ
前記プレート及び前記基板の前記隣り合う2辺は、前記ボンディングワイヤが交差する前記3辺のうち、前記第1端子及び前記第2端子の数が他の1辺より多い2辺であり、
3つの前記第1突き当て部は、前記プレートの前記隣り合う2辺のうち長辺側に2つ、及び、短辺側に1つ設けられており、
3つの前記第2突き当て部は、前記基板の前記隣り合う2辺のうち長辺側に2つ、及び短辺側に1つ設けられていることを特徴とする電子機器。
A cover having a plurality of first terminals ;
A plate that is fixed to the cover with an adhesive, and is covered entirely by the cover with one main surface ;
A substrate fixed with an adhesive on the plate and provided with a plurality of second terminals ;
And a plurality of bonding wires for connecting the plurality of second terminals of the substrate and the plurality of first terminals of said cover,
The plurality of first terminals and the plurality of second terminals are provided on three sides of the four sides of the substrate and the plate,
The plurality of bonding wires crossing the three sides of the substrate to connect the first terminal and the second terminal;
In the area where the plate is arranged in the cover, there are only three first abutting portions arranged so as to abut against two adjacent sides of the four sides of the plate for positioning the plate. Provided,
On the plate, for positioning the substrate, only three second abutting portions arranged to be abutted against two adjacent sides of the four sides of the substrate are provided ,
The two adjacent sides of the plate and the substrate are two sides where the number of the first terminal and the second terminal is larger than the other one of the three sides where the bonding wires intersect,
Three of the first butting portions are provided on the long side of the two adjacent sides of the plate, and one on the short side,
The two second abutting portions are provided on the long side of the two adjacent sides of the substrate, and one on the short side .
JP2003018183A 2003-01-28 2003-01-28 Electronics Expired - Lifetime JP3909293B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003018183A JP3909293B2 (en) 2003-01-28 2003-01-28 Electronics

Publications (3)

Publication Number Publication Date
JP2004235176A JP2004235176A (en) 2004-08-19
JP2004235176A5 JP2004235176A5 (en) 2005-04-14
JP3909293B2 true JP3909293B2 (en) 2007-04-25

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Family Applications (1)

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JP2003018183A Expired - Lifetime JP3909293B2 (en) 2003-01-28 2003-01-28 Electronics

Country Status (1)

Country Link
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