JP3898517B2 - Clean room - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a clean room used for semiconductor manufacturing or the like, and more particularly to a structure of a clean room wall and floor.
[0002]
[Prior art]
Conventionally, clean rooms such as semiconductor manufacturing factories and operating rooms are known.
[0003]
[Problems to be solved by the invention]
In conventional clean rooms, the measures for preventing static charge on walls and floors are not perfect, and charges are accumulated on the walls and floors, dust is accumulated due to static electricity, and gas is generated due to organic reaction caused by electrostatic sparks. There has been a problem of causing troubles in semiconductor manufacturing and the like.
[0004]
[Means for Solving the Problems]
Clean room according to claim 1 of the present invention, a sheet-like floor covering having conductivity is attached to extend in wall base surfaces, sheet extending in the sheet-like wall coverings and wall base surface having electrical conductivity The floor finishing material is configured to conduct, and an inclined surface forming member for forming an inclined surface connecting the wall base surface and the floor base surface is provided near the boundary between the wall base surface and the floor base surface. The floor finishing material is extended to the wall base surface so as to be along the inclined surface.
According to a second aspect of the present invention, a sheet-like wall finishing material and a sheet are connected to each other through a conductive connecting member having one end attached to the surface of the sheet-like wall finishing material and the other end attached to the surface of the sheet-like floor finishing material extending to the wall base surface. The floor finish was connected to the conductive state.
According to a third aspect of the present invention, the sealing treatment between one end of the conductive connecting member and the surface of the sheet-like wall finish is gas-sealed between the other end of the conductive connecting member and the surface of the sheet-like floor finish extending to the wall base surface. A sealant with low divergence was applied .
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to FIGS. First, an outline of a clean room of a semiconductor manufacturing factory in the present embodiment will be described with reference to FIG.
The clean room has a three-layer structure. That is, it includes a process area 10 in which precision equipment necessary for semiconductor manufacturing and inspection is installed, an underfloor area 20, and a ceiling area 30. The floor of the process area 10 is a perforated floor (grating) 11, and the ceiling of the process area 10 is a perforated ceiling 12. In the ceiling area 30, an air conditioner 31 and an air cleaning filter 32 are provided. An air circulation space 10A is provided on the side of the process area 10 so that the air is purified by the air cleaning filter 32 and circulates in the respective areas 10, 20, and 30 as indicated by arrows. In addition, a front room equipped with an air shower is provided between the entrance 40 and the outside, and a person entering the clean room enters the clean room after performing air washing in the front room. The front room becomes a sealed space with the door 40a on the clean room side and the door on the outside side. In addition, 41 is an entrance / exit between the air circulation space 10A and the process area 10, 41a is a door of the entrance / exit 41, 42 is a pillar, 43 and 44 are fireproof covering beams, 45 is a double window, 46 is a corridor, 47 is This is a wiring pit for storing wiring.
[0006]
Next, the wall and floor structure of the clean room will be described with reference to FIG. 1 by taking the wall and floor structure in the portion A of the underfloor area 20 in FIG. 2 as an example.
An inclined surface forming member 3 for forming an inclined surface 3 f that connects the wall base surface 2 and the floor base surface 1 is provided near the boundary between the floor base surface 1 and the wall base surface 2 made of concrete. The inclined surface forming member 3 is a long material having a right isosceles triangular cross section. Therefore, the right angle portion of the inclined surface forming member 3 is made to correspond to the corner of the boundary between the wall base surface 2 and the floor base surface 1 and the isosceles portion is bonded to the wall base surface 2 and the floor base surface 1, whereby the wall base surface 2. An inclined surface 3f of 45 ° is formed connecting the floor surface 1 and the floor base surface 1. A conductive vinyl chloride sheet 4 is attached to the floor base surface 1 as a sheet-like floor finish having conductivity. The conductive vinyl chloride sheet 4 is attached with an adhesive so as to extend to the wall base surface 2 along the inclined surface 3f. That is, the conductive vinyl chloride sheet 4 is raised along the inclined surface 3 f and the wall base surface 2. A conductive cloth 5 is attached to the wall base surface 2 as a sheet-like wall finishing material having conductivity by a cloth paste. The conductive cloth 5 is attached so that the lower end 5 u is abutted against the upper end 4 t of the vinyl chloride sheet extending to the wall base surface 2. Thereby, the electroconductive cloth 5 and the electroconductive vinyl chloride sheet 4 will be in a conductive state. 6 is a conductive connecting member made of a long galvalume steel plate, which has one end 6a in the short direction attached to the surface 5a of the conductive cloth 5 by a concrete screw 7A and the other end 6b in the short direction is concrete. The screw 7B is attached to the surface 4a on the upper end 4t side of the conductive vinyl chloride sheet 4 so as to reliably connect the conductive vinyl chloride sheet 4 and the conductive cloth 5 to the conductive state. Between the one end 6a of the conductive connecting member 6 and the surface 5a of the conductive cloth 5, and between the other end 6b of the conductive connecting member 6 and the surface 4a of the conductive vinyl chloride sheet 4, a urethane system with less gas emission, Sealing treatment is performed with a silicon-based sealing agent 8.
[0007]
According to the above, since the conductive vinyl chloride sheet 4 and the conductive cloth 5 are electrically connected by the butting between the conductive vinyl chloride sheet 4 and the conductive cloth 5, the conductive vinyl chloride sheet 4 conducts the conductive treatment. The conductivity of the conductive treatment floor 14 and the conductive treatment wall 15 subjected to the conductive treatment by the conductive cloth 5 is secured, and the conductive treatment floor 14 and the conductive treatment wall 15 are grounded by grounding the conductive treatment floor 14 and the conductive treatment wall 15. Becomes a uniform potential, so that the charging current can be quickly released to the ground. Therefore, it is possible to obtain a clean room having a wall and floor having an excellent antistatic effect capable of preventing accumulation of static electricity that causes trouble in semiconductor manufacturing. Further, since the conductive vinyl chloride sheet 4 and the conductive cloth 5 are electrically connected by the metal concrete screws 7A and 7B and the conductive connecting member 6, the conductivity of the conductive processing floor 14 and the conductive processing wall 15 is further increased. Further, a wall floor having an excellent antistatic effect can be obtained. If the conductivity of the conductive treatment floor 14 and the conductive treatment wall 15 is not ensured, the conductive treatment floor 14 and the conductive treatment wall 15 cannot be made to have a uniform potential. Can't escape quickly to earth.
Further, the inclined surface 3f of the inclined surface forming member 3 can prevent dust accumulation near the boundary between the conductive processing floor 14 and the conductive processing wall 15 and facilitates cleaning work.
Moreover, since the sealing agent 8 with little gas divergence is used, generation of gas that causes trouble in semiconductor manufacturing can be suppressed.
[0008]
The upper end 4t of the conductive vinyl chloride sheet and the lower end 5u of the conductive cloth may be made to overlap each other.
In the above description, the concrete wall base is described. However, when the present invention is adopted for the board wall base, a veneer plywood or the like may be provided on the base material for screwing the conductive connecting member 6. Moreover, in the case of the board wall base attached by the GL method etc. to the surface side of shaping | molding concrete, such as ALC (lightweight aerated concrete), what is necessary is just to use the long metal screw which reaches to shaping | molding concrete.
In the above description, the wall floor structure portion of the underfloor area 20 in FIG. 2 has been described as an example, but the present invention can also be applied to the wall floor structure portion of the front chamber.
The present invention can also be applied to a wall floor structure in the process area 10 where a metal grating floor is not employed.
The present invention can also be applied to a wall floor structure of a clean room such as an operating room, thereby reducing static electricity and gas causing malfunction of a computer machine in the operating room.
[0009]
【The invention's effect】
According to the first aspect of the present invention, since the conductivity of the conductive treatment wall and the conductive treatment floor of the clean room is ensured, a clean room having an excellent antistatic effect is obtained and the inclined surface forming member is provided. Dust accumulation near the boundary between the wall and the conductive treatment floor can be prevented, and cleaning work is facilitated.
According to the second aspect, since the sheet-like wall finishing material and the sheet-like floor finishing material are connected to each other through the conductive connecting member in a surely conductive state, the conductivity of the conductive treatment wall and the conductive treatment floor is further improved. Furthermore, a clean room having an excellent antistatic effect can be obtained.
According to the third aspect of the present invention, since the sealing process is performed with a sealing agent with little gas divergence, a gas generation preventing effect can be obtained .
[Brief description of the drawings]
FIG. 1 is a sectional view showing a structure of a wall and a floor of a clean room according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing an outline of a clean room according to the embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Floor base surface, 2 Wall base surface, 3 Inclined surface formation member, 3f Inclined surface, 4 Conductive vinyl chloride sheet (sheet-like floor finishing material which has conductivity), 5 Conductive cloth (Sheet-like wall finish which has conductivity) Material), 6 conduction connection member, 6a one end of conduction connection member, 6b other end of conduction connection member, 8 sealing agent.

Claims (3)

Sheet floor covering having conductivity is attached to extend in wall base surface, the sheet-like floor covering extending in a sheet-like wall coverings and wall base surface having electrical conductivity and is configured to conduct In addition, an inclined surface forming member is provided in the vicinity of the boundary between the wall base surface and the floor base surface to form an inclined surface that connects the wall base surface and the floor base surface, and the sheet-like floor finish is placed on the inclined surface. A clean room that is extended to the wall surface .   One end side is attached to the surface of the sheet-like wall finish, and the other end is attached to the surface of the sheet-like floor finish extending to the wall base surface, and the sheet-like wall finish and the sheet-like floor finish are connected via a conductive connecting member. The clean room according to claim 1, which is connected in a conductive state. Sealing agent with less gas emission between the sealing connection between one end of the conductive connecting member and the surface of the sheet-like wall finish and between the other end of the conductive connecting member and the surface of the sheet-like floor finish extending to the wall base surface The clean room according to claim 2, wherein the clean room is provided .

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