JP3897089B2 - Soldering system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is a soldering operation (partial soldering) in which only a specific region (partial soldering region) is flow soldered in a soldering operation of a plate-like workpiece to be soldered such as a printed wiring board on which electronic parts are mounted. The present invention relates to a multipurpose soldering system capable of performing (working) and the work of performing batch flow soldering on the entire area of the surface to be soldered.
[0002]
For example, non-heat-resistant electronic components that cannot withstand the high-temperature atmosphere associated with reflow soldering operations (for example, lead-type electronic components such as connectors with resin housings) are called partial soldering systems. Soldering is performed by a dedicated flow soldering system.
[0003]
On the other hand, with a printed wiring board that has been designed to be flow soldered from the beginning, the flow soldering system performs a collective flow soldering operation in which the entire surface of the soldered surface is brought into contact with the jet wave of the molten solder. It has been broken.
[0004]
Therefore, it is necessary to provide both a partial soldering system and a collective flow soldering system in a mounting operation in which many types of printed wiring boards are produced by soldering.
[0005]
[Prior art]
Japanese Patent No. 2761204 describes an example of a partial soldering system. That is, the “nozzle is set to have an opening area smaller than the area of the substrate to be soldered” forming the “jet solder”, and “the soldering surface of the substrate is brought into contact with or immersed in the jet solder from the nozzle. In this state, the arm portion is actuated and the substrate is moved in a horizontal plane to perform partial soldering of a predetermined area.
[0006]
In addition, it is a technology that "can improve the sharpness of the solder" by tilting the substrate with a robot when the substrate after soldering in the solder bath is lifted from the jet solder. .
[0007]
[Problems to be solved by the invention]
However, in this conventional technique, the printed wiring board is moved in the horizontal plane while being in contact with the jet wave of the molten solder. In a pitched electronic component, a solder bridge is easily generated between adjacent lead terminals and between lands formed on the printed wiring board around the lead terminals, that is, between adjacent soldered parts. There is a problem that the fillet shape is likely to be non-uniform.
[0008]
In this prior art, after the soldering is completed, the printed wiring board is tilted and lifted when being separated from the jet wave. However, in this case, in the last part of the “predetermined area” for performing the partial soldering Only the solder bridge can be eliminated, but there is a problem that the solder bridge is formed in other portions as described above.
[0009]
Furthermore, when the size of the area of the printed wiring board where the partial soldering is performed is particularly longer than the length of the “nozzle”, the portion of the printed wiring board where the partial soldering is performed is referred to as “jet solder”. It is necessary to repeat the reciprocating movement several times, etc. in the state of contact or immersion, and to bring the molten solder into contact with the entire area. Due to this reciprocating movement, etc., solder bridges and fillet shapes are more uneven. It tends to occur. In addition, the soldering time is increased due to reciprocal movement and the productivity is also lowered.
[0010]
Of course, the collective flow soldering operation as conventionally performed cannot be performed.
[0011]
Also, regarding one soldering system, a technique for applying flux only to a specific area of a printed wiring board, that is, a partial soldering area, or to apply flux to all areas of the surface to be soldered of this printed wiring board. No explanation is given.
[0012]
An object of the present invention is to provide a soldering system corresponding to a multi-purpose soldering operation capable of performing a soldering operation of a specific area of a printed wiring board, that is, a partial soldering operation and a collective flow soldering operation. It is to be realized. Another object of the present invention is to realize a soldering system that does not cause a solder bridge and that can perform partial soldering with a uniform fillet shape of a soldered portion and high productivity.
[0013]
[Means for Solving the Problems]
The soldering system of the present invention can adjust the length of the jet wave of the molten solder in accordance with the shape of the soldering region intended for the purpose, and the adjustment range can also form a jet wave longer than the width of the printed wiring board. It is configured so that the specific area, that is, the entire area of the partial soldering area can be soldered by one-time conveyance of the printed wiring board and the elevation-angle conveyance, and the conventional printing is also performed. It is characterized in that it is configured to be able to perform a collective flow soldering operation of the wiring board.
[0014]
  In accordance with this, the flux is applied only to a specific area of the printed wiring board, that is, a partial soldering area in one system, or the flux is applied to the entire area to be soldered of the printed wiring board. Configured to being.
[0015]
  That is, the soldering means capable of continuously changing the length of the jet wave of the molten solder that contacts the printed wiring board, the three vertical axes that rotate, and one of the three vertical axes The printed wiring board is moved by a tilting means for tilting the three vertical axes together by positioning the printed wiring board at an arbitrary position on a horizontal plane in an arbitrary direction by an up-and-down axis for moving the three vertical axes. Robot conveying means for inclining at an arbitrary angle with respect to a horizontal plane, and controlling the length of the jet wave and conveying the printed wiring board defined by the position and orientation of the printed wiring board and the inclination angle by the conveying means Control means for controlling the trajectoryThe control means varies the length of the jet wave according to the width or length of a specific area of the printed wiring board andThe printed wiring board defined by the position, orientation, and inclination angleA soldering operation in which a jet wave of the molten solder is brought into contact with only the specific area by controlling a conveyance path, and the length of the jet wave is adjusted to be equal to or larger than the width or length of the printed wiring board and the printed wiring PlankThe printed wiring board defined by the position, orientation, and inclination angleIt is a soldering system which controls a conveyance locus so as to be able to switch between a soldering operation of bringing the jet wave of the molten solder into contact with the entire area of the surface to be soldered of the printed wiring board.
[0016]
  This makes it possible to adjust the length of the molten solder that contacts a specific area of the printed wiring board, that is, the partial soldering area, in accordance with the shape of the partial soldering area. Soldering can be performed by bringing molten solder into contact with the entire region. Therefore, partial soldering with high productivity can be performed. Also, by adjusting the length of the jet wave to be greater than or equal to the width or length of the printed wiring board, normal batch flow soldering can be performed.The
[0022]
  In addition, the printed wiring board unloading trajectory defined by the printed wiring board position, orientation, and inclination angle can be controlled.When the flux is applied to the printed wiring board, it is possible to prevent the flux from spreading and preventing the flux from adhering to unnecessary areas by transporting the printed wiring board horizontally. In addition, although the soldering system provided with the preheating process which dries and pre-activates a flux after apply | coating a flux is normal, this effect | action becomes still more reliable by providing this preheating process.
[0023]
And the conveyance of the said printed wiring board in the state which the printed wiring board is contacting the molten solder can be made into an elevation angle conveyance. Therefore, the separation angle at the separation point where the soldered part is separated from the jet wave of the molten solder becomes large and this separation angle becomes stable, so that no solder bridge is formed, and the stable soldering quality of the fillet shape is achieved. Good partial soldering can be performed.
[0024]
Further, since it is not necessary to use a multi-axis conveying means such as six axes, it becomes possible to relatively improve the accuracy of the conveying position, and it is possible to perform a soldering operation with high repeatability. Further, the conveying means can be configured at low cost. Therefore, it is possible to perform a soldering operation with a stable soldering quality at a low cost.
[0025]
  Of course, since the degree of the transfer elevation angle in the soldering operation can also be adjusted, it is possible to easily set the optimum transfer elevation angle corresponding to the type of the printed wiring board.The
[0027]
DETAILED DESCRIPTION OF THE INVENTION
The soldering system of the present invention can be implemented in the following embodiments. The work to be soldered is a printed wiring board on which a large number of electronic components are mounted.
(1) Configuration
With reference to FIG. 1 and FIG. 2, the embodiment of the soldering system concerning this invention is described. FIG. 1 is a plan view showing a configuration of a soldering system using an industrial robot as a printed wiring board transfer device, and a control system is shown by a symbol diagram. FIG. 2 is a view for explaining the industrial robot and a mechanism for adjusting the elevation angle of the transport plane thereof, and is a view of the industrial robot as viewed from the right side of FIG.
[0028]
That is, the printed wiring board 1 is transported by an industrial robot 3 provided with a handling device 2. In this case, the position on the printed wiring board 1 can be represented by an XY orthogonal coordinate plane, and the transport position by the industrial robot 3 can also be represented by an XY orthogonal coordinate plane. When expressed in dimensions, it can be expressed using the Z axis perpendicular to the XY plane. This industrial robot 3 has at least an A axis 4 and a B axis 5 and rotates the first arm 6 in the direction of arrow a and the second arm 7 in the direction of arrow b corresponding to each axis 4, 5. The printed wiring board 1 can be conveyed to any position on the horizontal plane.
[0029]
Therefore, a so-called XY robot can be used as the biaxial conveying means. As shown in FIG. 2, the orientation of the printed wiring board 1 can be arbitrarily set by providing the C-axis (the pivot axis in the direction of arrow c) 8 as shown in FIG. Furthermore, if the D axis 9 is provided to move the C axis 8 up and down in the direction of the arrow d, the height position of the printed wiring board 1 can be arbitrarily set.
[0030]
  The industrial robot 3 is fixed on the base 11, and one end side 11 a of the base 11 rotates around the support shaft 13 inserted through the bearing 12 in the direction of arrow f in FIG. The A-axis 4 of the industrial robot 3 is configured to be inclined in the direction of arrow e. That is, the bearing12A feed screw 15 driven by an elevation angle adjusting motor 14 having a reduction gear 14a and a rotary encoder 14b (absolute value detection type) is provided on the other end 11b of the base 11 on the side opposite to the base 11; With this mechanism, the degree to which the A-axis 4 of the industrial robot 3 is inclined in the direction of the arrow e is adjusted.
[0031]
The printed wiring board 1 carried into the loader 16 is held by the handling device 2 and is sprayed by the industrial robot 3 with a spray-type flux coating device 18 (flux coating step) → preheating device 19 (preheating step) → soldering device. 20 (soldering step) in order, and after a series of soldering operations are completed, it is unloaded to the unloader 17.
[0032]
In the flux application process, the spray flux application device 18 is provided with an exhaust hood (not shown) and an exhaust filter 23 so as to surround the periphery of the spray nozzle 22, and the spray flow rate and spray timing of the flux are controlled by the spray control device 24. (Control signal P_f ) The spray control device 24 communicates with the main control device 25 (communication signal S)._f ) Controls the spray flow rate and spray timing.
[0033]
In the preheating process, the preheating device 19 has a configuration in which infrared heating and hot air heating including the heater 27 and the fan 28 are used in combination, but may have a configuration using only one of the heating methods. In the preheating process, two preheating devices 19 are configured as a set, and each preheating device 19 is provided with a holder (not shown), and the printed wiring board 1 can be placed on the holder. Has been.
[0034]
In the soldering process, the soldering apparatus 20 is an apparatus for forming a jet wave of molten solder, and details thereof will be described with reference to FIG. FIG. 7 is a view showing a soldering apparatus. Fig.7 (a) is a longitudinal cross-sectional view of a soldering apparatus, FIG.7 (b) is the perspective view which expanded and showed the structure of the blowing part.
[0035]
That is, solder (molten solder) 30 heated by a heater (not shown) is accommodated in a solder bath 31 and sucked from a suction port 34 by a pump 33 driven by a motor 32 to be blown by a blower body 35. The molten solder 30 is jetted from the blower port 36 of the blower body 35 to form a jet wave 37.
[0036]
In addition, the soldering apparatus 20 includes two shutters 39 in the air outlet 36 of the air outlet body 35, and the shutter 39 is driven by each actuator 41 through each connection portion 40, and the air outlet 36. The length and position can be varied. In other words, the length of the jet wave 37 (the length in the horizontal direction in FIG. 7A) can be arbitrarily adjusted by adjusting the length of the air outlet 36.
[0037]
That is, the first shutter 39a and the second shutter 39b are moved from both sides of the air outlet 36 so that the double opening can be adjusted. The first actuator 41a and the first actuator 41a corresponding to the shutters 39a and 39b, respectively. The second actuator 41b adjusts the opening and closing of the shutter 39. Reference numerals 40a and 40b denote connecting portions.
[0038]
On the other hand, the industrial robot 3 is controlled by the robot controller 42 with a control signal P._R Then, the transport coordinates of the handling device 2 are controlled, and the printed wiring board 1 is transported to the instructed position by controlling the transport trajectory and speed in accordance with the work procedure previously taught or programmed. Note that this program can be created by a computer system provided separately and stored in a storage unit (not shown) of the main control device 25, and a conveying operation can be performed in accordance with the data.
[0039]
The main controller 25 is constituted by a computer system, and includes an instruction operation unit 25a such as a keyboard and a display unit 25b such as an LCD. The control is performed while communicating with an external device via the communication port. Communication with the robot controller 42 (communication signal S) is also possible._R ), It is possible to perform control linked to the robot, and in addition to instructing conveyance to the robot, the conveyance state is grasped, and the soldering device 20, the preheating device 19 and the spray are linked to the conveyance state of the printed wiring board 1. It is the structure of the dispersion | distribution process which controls the type | formula flux application | coating apparatus 18. FIG. The external communication port 25c is used when the soldering system is controlled by a LAN.
[0040]
That is, the main control device 25 conveys the printed wiring board 1 to the spray type flux coating device 18 while communicating with the robot control device 42, and when this printed wiring board 1 is conveyed to the spray type flux coating device 18, the spray control device. 24 is a spray timing control signal (communication signal S_f ) And a flux can be applied to the target area of the printed wiring board 1. An example of this flux application will be described later.
[0041]
Similarly, the main control device 25 conveys the printed wiring board 1 on which the flux application has been completed to the preheating device 19 while communicating with the robot control device 42, and the printed wiring board 1 is held in a holder (not shown) of the preheating device 19. The printed wiring board 1 is preliminarily heated, in particular, on its flux application surface. Usually, since a considerable amount of time (about several minutes) is required until the temperature of the printed wiring board 1 rises to a target preheating temperature (for example, 120 ° C.), the industrial robot 3 has another time during this period. Let the work be done.
[0042]
That is, the pre-heated printed wiring board 1 is soldered to a required time or a target temperature (a separate means is provided for measuring with an infrared radiation thermometer (not shown) and communicating / notifying the main controller 25). 20 and the next printed wiring board 1 is carried out from the loader 16 to the spray flux applying device 18.
[0043]
The reason why the two preheating devices 19a and 19b are provided as one set in the preheating device 19 is that a considerable amount of time is required for the preheating of the printed wiring board 1, so that either one of the preheating devices is always preheated by the first-in first-out method. The printed wiring board 1 is placed on the holders of the devices 19a and 19b and is put on standby while preheating, and the work in the subsequent soldering device 20 and the work in the spray-type flux coating device 20 are continued during the standby. This is so that it can be done.
[0044]
That is, the conveyance of the printed wiring board 1 by the industrial robot 3 is performed as follows.
(1) Loader 16 → Spray-type flux coating device 18 → Preheating device 19a
(2) Loader 16 → Spray-type flux coating device 18 → Preheating device 19b
(3) Preheating device 19a → soldering device 20 → unloader 17
(4) Loader 16 → Spray-type flux coating device 18 → Preheating device 19a
(5) Preheating device 19b → soldering device 20 → unloader 17
(6) Loader 16 → Spray-type flux coating device 18 → Preheating step 19b
By repeating the steps (3) to (6) below, a series of soldering operations can be performed with the downtime of the industrial robot 3 being minimized.
[0045]
The main control device 25 also controls the soldering device 20. That is, the motor 32 that drives the pump 33 of the soldering apparatus 20 is driven by the inverter 44 by an induction motor, and the rotational speed thereof is adjusted and controlled (control signal P_fmThis inverter is configured to be able to communicate with the communication signal S_fmThe main control device 25 adjusts the rotational speed of the motor 32 to adjust the flow rate of the molten solder 30 to be supplied to the blower body 35.
[0046]
Further, the first shutter 39a and the second shutter 39b for adjusting the length of the air outlet 36 and the length of the jet wave 37 are opened and closed by the first actuator 41a and the second actuator 41b. 41 is provided with an absolute type linear encoder (not shown) for communication with the main controller 25 (communication signal S)._w1, S_w2), The length of the air outlet 36 can be directly feedback controlled.
[0047]
That is, a jet wave 37 having a length instructed by a program is formed in advance, and a soldered region (described later in FIG. 3) of the printed wiring board 1 held by the industrial robot 3 or its soldering. This is a mechanism in which the entire area of the surface is brought into contact with the jet wave 37 and the printed wiring board 1 is soldered.
[0048]
When the printed wiring board 1 and the jet wave 37 are in contact with each other, the main controller 25 controls the elevation angle adjusting motor 14 to tilt the industrial robot 3 and convey the printed wiring board 1 at an elevation angle. It is.
[0049]
That is, the motor 14 for adjusting the elevation angle is configured such that a motor that is easy to control, such as a stepping motor, is controlled via the drive unit 45, and an absolute value type encoder 14 b provided coaxially with the feed screw 15 The tilt angle of the robot 3 can be easily calculated. That is, the industrial robot 3 is controlled to tilt at a target angle based on the communication signal Sθ between the main controller 25 and the drive unit 45 and the drive signal Pθ of the motor 14 by the drive unit 45.
(2) Flux application mode
Next, with reference to FIG. 3 thru | or FIG. 6, how a flux is apply | coated to a printed wiring board is demonstrated.
[0050]
3A and 3B are diagrams for explaining the flux application mode example 1. FIG. 3A is a plan view showing a state in which the printed wiring board is held horizontally and conveyed onto the spray nozzle, and FIG. ) Viewed from the right side, (c) is a diagram for explaining the point in time when the spraying of the flux is started, and is a plan view corresponding to (a), and (d) is a diagram viewed from the right side. It is.
[0051]
The coating mode example-1 shown in FIG. 3 has a connector 47 mounted on the printed wiring board 1 and a soldered portion 49 formed between the lead terminal 48 and a soldering land (not shown) of the soldered surface 1a. In this example, the flux 50 is applied only to the mounting region of the connector 47.
[0052]
The position of the connector 47 and the position of the spray nozzle 22 are indicated by coordinates such as XY coordinates.
[0053]
  That is, when the printed wiring board 1 is transported in the transport locus H direction and the front end coordinates of the mounting coordinates of the connector 47 reach the position corresponding to the coordinates of the spray nozzle 22, spraying of the flux 50 is started from the spray nozzle 22. When the rear end coordinates of the mounting coordinates reach, spraying stops and the connector47It operates so that the flux 50 may be applied only to the mounting area. These coordinates are instructed by a program in advance.
[0054]
In this case, the transport path H of the printed wiring board 1 is transported linearly on the vertical plane while maintaining a constant distance from the spray nozzle 22 as shown in FIG. Then, by adjusting the distance between the spray nozzle 22 and the printed wiring board 1, the width of the spray area 51 on the printed wiring board 1 and the width of the application area of the flux 50 (lateral width in FIG. 3C) can be adjusted. . Therefore, if the conveyance locus changes the distance from the spray nozzle 22, it is applied even if the shape of the flux application region on the printed wiring board 1 is an irregular shape (for example, a trapezoidal shape or a polished shape). It is possible.
[0055]
  Next, FIG.PaintIt is a figure for demonstrating the cloth mode example-2, and is an example which applies a flux to the whole region of the to-be-soldered surface of the printed wiring board 1. FIG. 4A is a plan view showing a state in which the printed wiring board is held horizontally and conveyed onto the spray nozzle, and FIG. 4B is a view of FIG. 4A as viewed from the right side. (c) is a figure explaining the time of spraying of flux, and is a plan view corresponding to (a), and (d) is a figure when (c) is viewed from the right side.
[0056]
That is, as shown in FIGS. 4 (a) and 4 (b), the printed wiring board 1 conveyed along the conveyance locus H is laterally moved on the spray nozzle 22 in a horizontal plane as shown in FIGS. 4 (c) and 4 (d). This is an application mode example in which the spray region 51 of the flux 50 on the printed wiring board 1 covers the entire soldered surface 1a of the printed wiring board 1 by being conveyed while being reciprocally moved. In this case, since the flux 50 can be repeatedly applied, the uniformity of the application is greatly improved.
[0057]
Moreover, FIG. 5 is a figure for demonstrating the flux application | coating example-3, and shows the case where a flux is apply | coated to the whole area | region of a printed wiring board, Fig.5 (a), (b), (c) It is an example of the conveyance locus | trajectory of the printed wiring board 1 in a horizontal surface.
[0058]
That is, the example shown in FIG. 5A is an example in which the printed wiring board 1 is conveyed while reciprocating in the vertical direction on a horizontal plane, and FIG. 5B is a rectangular shape in the horizontal direction on the horizontal plane. FIG. 5C shows an example in which the printed wiring board 1 is conveyed while being reciprocally moved in a square shape in a vertical direction on a horizontal plane.
[0059]
4 and FIG. 5 shows an example in which the flux 50 is applied to the entire area of the printed wiring board 1. For example, the right half area of the large-sized printed wiring board 1 is shown. Even in the case where the flux 50 is applied only to the central region, it is possible to apply an application mode example by reciprocating movement shown in FIGS. 4 and 5. That is, it can be realized by adjusting the reciprocal amplitude.
[0060]
Moreover, FIG. 6 is a figure for demonstrating the flux application | coating example 4 and shows the case where a flux is applied by moving a printed wiring board, moving a spray nozzle, FIG. An example in which the printed wiring board 1 is moved in the transport locus H direction while reciprocating the spray nozzle 22 in the direction of arrow α, (b) shows the printed wiring board 1 being moved circularly in the direction of arrow β. This is an example of moving in the transport locus H direction. As shown in these figures, the combination of the spray nozzle 22 and the transport locus H of the printed wiring board 1 makes it possible to apply the flux 50 more uniformly.
(3) Example of preheating mode
As described in (1) above, the printed wiring board 1 to which the flux 50 is applied is placed on a holder (not shown) of the preheating device 19 by the industrial robot 3, so that a predetermined predetermined value is obtained. For a period of time and temperature. Then, the flux 50 is dried and pre-activated.
[0061]
The preheating time and temperature are optimally selected depending on the type of the printed wiring board 1.
[0062]
The temperature of the printed wiring board 1 heated by the preheating is determined by the temperature of the heater 27, the temperature of the hot air, and the preheating time, and these parameters are usually matched with the preheating time and the preheating temperature of the printed wiring board 1. Adjusted.
(4) Example of soldering mode
Next, the aspect in the soldering operation will be described with reference to FIGS.
[0063]
FIG. 8 is a plan view for explaining an example of a soldering mode, and is a plan view showing the periphery of a solder blowing port. FIG. 8A is a plan view showing an example of partial soldering, and FIG. 8B is a plan view showing an example of collective flow soldering. FIG. 9 is a side view for explaining an example of soldering, and is a view showing a vertical plane when FIG. 1 is viewed from the right side. FIG. 10 is a side view showing another example of soldering, and in FIG. 1, the first arm 6 is rotated from the right side so that the C-axis 8 is positioned below the soldering device 20. FIG.
[0064]
That is, a combination of the transport trace H of the printed wiring board 1 viewed from the upper surface shown in FIGS. 8A and 8B and the transport trace H of the printed wiring board 1 in the vertical plane shown in FIGS. The wiring board 1 is soldered.
[0065]
In the example of FIG. 8A, the length of the blow port 36 of molten solder and the length of the jet wave 37 are set to the same length as the width of the connector 47 mounted on the printed wiring board 1, and the printed wiring board. 1 is conveyed in the conveyance path H direction, the lead terminal 48 of the connector 47 and the land of the printed wiring board 1 are brought into contact with the jet wave 37 of the molten solder 30, and the lead terminal 48 of the connector 47 and the printed wiring board 1 Molten solder 37 is supplied between the lands, that is, the soldered portion 49, and a partial soldering operation of the connector 47 to the printed wiring board 1 is performed.
[0066]
In the soldering process for performing this soldering operation, the A-axis 4 of the industrial robot 3 is moved at an angle θ as shown in FIG._S Tilt the printed wiring board 1 at an elevation angle θ_C Then, soldering is performed by contacting with the jet wave 37 of the molten solder 30 while transporting in the transport locus H direction. As a result, the separation angle of the separation point where the soldered portion 49 separates from the jet wave 37 of the molten solder 30 is increased and the separation angle is stabilized, so that no solder bridge is formed and the fillet shape is formed. Good partial soldering with stable soldering quality can be performed.
[0067]
This elevation angle θ_C The optimum value is selected depending on the mounting design state of the printed wiring board 1. That is, an optimum value is selected and set depending on the type of the printed wiring board 1.
[0068]
Further, if the C-axis 4 can be moved up and down, that is, moved in the direction of the arrow c in FIG. 10, as shown in FIG. 10, only the region of the soldered portion 49 on which the connector 47 is mounted, that is, the partial soldering region is jetted. Alternatively, the printed wiring board 1 can be moved up and down so as to be in contact with the sheet 37 and can be transported as a transport locus H.
[0069]
On the other hand, in the example of FIG. 8B, the length of the air outlet 36 and the length of the jet wave 37 are set to be longer than the width of the printed wiring board 1, and the printed wiring board 1 is moved in the direction of the conveyance locus H. By carrying it, the soldered surfaces thereof are brought into contact with the jet wave 37 at once, and a collective flow soldering operation is performed.
[0070]
Similarly to the example of FIG. 8A, the A-axis 4 of the industrial robot is moved at an angle θ as shown in FIG._S Tilt the printed wiring board 1 at an elevation angle θ_C Then, soldering is performed by contacting the jet wave 37 of the molten solder 30 while transporting in the direction of the transport trajectory H. The reason for this is also the same, the separation angle of the separation point where the soldered portion 48 separates from the jet wave 37 of the molten solder 30 is increased and the separation angle is stabilized, no solder bridge is formed, and the fillet is formed. This is because batch soldering with a stable shape and good soldering quality is performed.
[0071]
In the collective flow soldering operation, the entire area of the surface to be soldered (the lower surface in FIG. 9) of the printed wiring board 1 is brought into contact with the jet wave 37, so that the printed wiring board 1 is exemplified as shown in FIG. It is not necessary to carry with the vertical movement.
[0072]
Further, the conveyance path H of the printed wiring board 1 shown in FIG. 8 is linear, and in the case of the arm-type industrial robot 3 illustrated in FIG. 2, the A axis 4, the B axis 5, and the C axis 8. Although three pivot axes are required, if a Cartesian coordinate type XY robot is used, a linear transport locus H as illustrated in FIG. 8 can be realized with only two axes. Of course, in this case, it is necessary to arrange the flux application step, the preheating step, and the soldering step in a planar shape.
[0073]
Note that the A-axis 4 of the industrial robot 3 is tilted at an angle θ after the preheating operation._S If tilted only, the angle of elevation θ_S The printed wiring board 1 can be conveyed. (5) Example of control of jet wave length and jet wave height
With reference to FIG. 11, how the main control device controls the length of the blowing port of the soldering device and the rotational speed of the motor will be described. FIG. 11 is a data table showing the relationship between the length of the air outlet and the rotation speed of the motor for controlling the jet wave height to be constant. In other words, even if the length of the air outlet 36 is varied and adjusted, the condition of the rotational speed of the motor 32 and the pump 33 for keeping the height of the jet wave 37 constant is obtained and converted into data, and the data table is stored in the main controller 25. As stored.
[0074]
That is, in order to maintain the wave height of the jet wave 37 at a constant value even when the length of the blower port 36 is changed, the flow rate per unit time of the molten solder 30 jetted from the blower port 36 is set to this blower port 36. It is necessary to vary according to the length. For example, when the length of the blowing port 36 is relatively long, the jet wave height cannot be kept constant unless the flow rate per unit time of the molten solder 30 jetted from the blowing port 36 is relatively increased. .
[0075]
The relationship between the length of the air outlet 36 for keeping the jet wave height constant and the rotational speed of the motor 32 and hence the rotational speed of the pump 33 (a parameter of the pump delivery capacity) depends on the type of the pump 33 and the shape of the air outlet body 35. If parameters such as the size of the air outlet 36 are determined, there is a fixed relationship inherent to it. Therefore, by measuring this relationship in advance and creating a data table and storing it in a storage unit (not shown) of the main controller 25, the main controller 25 makes the jet wave height constant. Can be controlled.
[0076]
This relationship is generally proportional, but may be approximated by a function for strictness, and the rotational speed of the motor 32 may be controlled according to this function.
[0077]
That is, as illustrated in FIG. 1, it is the main control device 25 that adjusts the length of the air outlet 36 of the soldering device 20 and adjusts and controls the rotational speed of the pump 33, that is, the motor 32. The main controller 25 instructs the inverter 44 the rotational speed of the motor 32 corresponding to the length of the air outlet 36 while referring to the data table (communication signal S)._fm), The length of the jet wave 37 can be adjusted while keeping the jet wave height constant.
(6) Selection of soldering procedure according to the type of printed wiring board
The main controller 25 stores data indicating whether the printed wiring board 1 is a type of soldering, that is, a printed wiring board 1 that performs a partial soldering operation, or a printed wiring board 1 that performs a collective flow soldering operation. In the printed wiring board 1 that performs the partial soldering operation, the coordinate data of the partial soldering area in the printed wiring board 1, the width and length data of the printed wiring board 1 in the printed wiring board 1 that performs the collective flow soldering, And the like are stored in advance in a storage unit (not shown) of the main controller 25.
[0078]
In this soldering system, by instructing the type of the printed wiring board 1 with the instruction operation unit 25a of the main controller 25, a soldering operation corresponding to the printed wiring board 1 is performed. That is, the application mode in the flux application step, the heating temperature in the preheating step, and the soldering mode in the soldering step are selected, and a series of soldering operations are performed.
[0079]
【The invention's effect】
  As described above, according to the soldering system of the present invention,By controlling the conveyance path defined by the position, orientation and inclination angle of the printed wiring board with high accuracy,A single soldering system can perform both partial soldering and batch flow soldering of printed wiring boards.With good qualityWill be able to do. Therefore, a complex soldering production process for various types of printed wiring boards can be configured on a single production line, and changes in these work modes can be handled only by changing or adding software or data. become able to. In addition, the production cost can be reduced.
[0082]
In addition, since the printed wiring board is transported at an elevation angle by tilting the industrial robot, it is possible to perform soldering work with good solderability with an industrial robot having a small number of axes (number of coordinates). become able to. In other words, it is possible to perform soldering work with good conveyance coordinate accuracy, that is, coordinate accuracy with a small number of axes (coordinate number), and therefore, it is possible to perform soldering work with high repeatability by using a low-cost industrial robot. Soldering work with stable quality can be performed.
[0083]
  further, DepartmentRegardless of the shape (particularly size) of the partial soldering area and the type of soldering work such as batch flow soldering, the immersion depth of the printed wiring board in the jet wave can be kept constant. Thus, stable soldering process conditions can be maintained, and stable soldering quality can be maintained regardless of the type of printed wiring board.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a soldering system using an industrial robot as a printed wiring board transfer device.
FIG. 2 is a diagram for explaining a mechanism for adjusting an elevation angle of an industrial robot and its conveyance plane;
FIG. 3 is a diagram for explaining a flux application mode example-1.
FIG. 4 is a diagram for explaining a flux application mode example-2;
FIG. 5 is a diagram for explaining a flux application mode example-3;
FIG. 6 is a diagram for explaining a flux application mode example-4;
FIG. 7 is a view showing a soldering apparatus.
FIG. 8 is a plan view for explaining an example of a soldering mode.
FIG. 9 is a side view for explaining an example of a soldering mode.
FIG. 10 is a side view for explaining another example of soldering.
FIG. 11 is a diagram showing the relationship between the length of the air outlet for controlling the jet wave height to be constant and the rotational speed of the motor.
[Explanation of symbols]
1 Printed wiring board
1a Surface to be soldered
2 Handling device
3 Industrial robots
4 A-axis
5 B-axis
6 First arm
7 Second arm
8 C axis
9 D axis
11 base
11a One end side
11b The other end side
12 Bearing
13 Spindle
14 Motor
14a Reduction gear
14b Rotary encoder
15 Lead screw
16 Loader
17 Unloader
18 Spray-type flux applicator
19 Preheating device
20 Soldering equipment
22 Spray nozzle
23 Exhaust filter
24 Spray control device
25 Main controller
25a Instruction operation unit
25b Display section
25c External communication port
27 Heater
28 fans
30 Molten solder
31 Solder bath
32 motor
33 Pump
34 Suction mouth
35 Blowhole
36 Air outlet
37 Jet waves
39 Shutter
39a First shutter
39b Second shutter
40 connections
40a 1st connection part
40b Second connection
41 Actuator
41a First actuator
41b Second actuator
42 Robot controller
44 Inverter
45 Drive unit
47 connector
48 Lead terminal
49 Parts to be soldered
50 flux
51 Spray area

Claims (1)

Soldering means capable of continuously changing the length of the molten solder jet wave contacting the printed wiring board, three rotating vertical axes, and one of the three vertical axes moving up and down The printed wiring board is placed on a horizontal plane by tilting means for tilting the three vertical axes together by positioning the printed wiring board at an arbitrary position in an arbitrary position on the horizontal plane by a vertical axis to be moved and at an arbitrary height. A robot conveyance means for inclining at an arbitrary angle, a length of the jet wave, and a conveyance locus of the printed wiring board defined by the position and orientation of the printed wiring board and the inclination angle by the conveyance means. for example Bei and control means for controlling,
The length of the jet wave is varied by the control means in accordance with the width or length of a specific area of the printed wiring board, and the printed wiring board is defined by the position, orientation, and inclination angle of the printed wiring board. A soldering operation for controlling the transport locus of the molten solder so that the jet wave of the molten solder is brought into contact with only the specific region, and adjusting the length of the jet wave to be equal to or greater than the width or length of the printed wiring board. Soldering for controlling the transport locus of the printed wiring board defined by the position, orientation and inclination angle of the printed wiring board to bring the molten solder jet wave into contact with the entire area of the soldered surface of the printed wiring board A soldering system characterized in that the operation is controlled to be switchable.

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