JP3895634B2 - Functional material immobilization method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for selectively immobilizing a functional material in a specific region in the metal industry, the chemical industry, the electronics industry, the machine industry, the microelectromechanical technology field, the precision machining technology field, and the like.
[0002]
[Prior art]
Conventionally, several methods have been used as a method for selectively immobilizing a specific functional material only in a specific region. First, as a method of selectively fixing only to a specific region, a mask is formed with a photoresist by photolithography, and then a functional material to be fixed is selectively attached only to a portion without a resist pattern. Thereafter, a lift-off method for removing the resist is used. After attaching a functional material to the entire surface of the base material, patterning a photoresist on the upper surface by a photolithography process, forming a pattern with a mask, and then selectively removing the functional material in unnecessary areas The method of doing is also often used.
[0003]
On the other hand, as an immobilization method, a method of using an adhesive or a pressure-sensitive adhesive, or a method of immobilizing a functional material and a region to be immobilized directly is often used. Further, a method of immobilizing a material by electrostatic adsorption instead of chemical bonding may be used.
[0004]
[Problems to be solved by the invention]
However, there are several problems with the conventional method for fixing functional materials. First, when a photolithography process is used as a method for selectively fixing only to a specific region, an organic solvent is generally used to develop or remove a resist. There is a problem that it cannot be used for immobilizing a material to be modified.
[0005]
In addition, when using an adhesive or pressure-sensitive adhesive as the immobilization method, it is difficult to perform immobilization with high accuracy if the area where the material is to be immobilized is a minute area. There is a problem that it is difficult to uniformly fix the distribution and the like. In the case where the functional material and the base material are directly fixed by chemical bonding, the range in which the functional material and the base material can be used is limited depending on the type of the base material and the functional material. There is. Furthermore, when it fixes by electrostatic adsorption | suction, the subject that the holding power is not so large also exists.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the following method is used in the functional material immobilization method of the present invention. First, the material to be immobilized is encapsulated in a capsule having a hydrophilic surface. Subsequently, only the region on which the material on the substrate is to be fixed is covered with a material in which thiol groups such as gold and silver are easy to chemically bond. Next, the material containing both the thiol group (-SH group) and the silanol group (-Si (OR ₂ ) _n H _3-n group, 1 ≤ n ≤ 3) on the surface of the capsule encapsulating the functional material. Are chemically bonded. Here, since the capsule surface is hydrophilic, a bond is generated by a chemical reaction between the —OH group and the silanol group.
[0007]
Finally, this capsule is chemically bonded only to the region to be immobilized. Since the thiol group is present on the surface of the capsule by the previous step, the capsule is fixed by the chemical bond between the metal and the thiol group. Since a capsule is not fixed in a region where a metal material that easily forms a chemical bond with a thiol group such as gold or silver does not exist, it is possible to provide selectivity with or without a metal material.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1)
In the present embodiment, a method for fixing to a substrate material having a gold layer formed on the surface using a silica capsule will be described with reference to FIG.
[0009]
First, the functional material 102 to be immobilized on the substrate 104 is encapsulated in the silica capsule 101. The functional material 102 is encapsulated in the silica capsule 101 by forming the silica capsule 101 in a solution containing the functional material 102 so that the functional material 102 is included at the time of capsule formation, and the silica capsule There is a method in which 101 is made porous and the functional material 102 is impregnated after the capsule is formed, but any of these methods may be used.
[0010]
Next, the silica capsule 101 is immersed in an appropriate solvent containing 3-mercaptopropyltrimethoxysilane, and left at an appropriate temperature for a certain period of time, whereby -OH groups bonded to the surface of the silica capsule 101 and The silanol groups in 3-mercaptopropyltrimethoxysilane are reacted to chemically bond them together to introduce thiol groups on the surface of the silica capsule 101 (FIG. 1 (1)). As a solvent for causing this reaction, toluene, ethanol, acetone or the like can be used, but other solvents can also be used. Moreover, although it is common to perform temperature in the range of room temperature-80 degreeC, it is not limited to this range.
[0011]
On the other hand, the gold layer 105 is selectively formed only on the region to be fixed on the substrate 104 to be fixed (FIG. 1 (2)). As a method for selectively forming the gold layer 105, a gold layer 105 is formed on the entire substrate 104 by a thin film forming technique such as vacuum deposition, sputtering, CVD, plating, etc., and then the gold layer 105 is formed with a photoresist by photolithography. It is possible to use a process in which only the portion where the metal is to be left is covered and the unnecessary gold layer 105 is etched. On the other hand, the surface of the substrate 104 is covered in advance only with a portion where the gold layer 105 is not desired to be formed by photolithography, and then a thin film such as vacuum deposition, sputtering, CVD, plating, etc. A step of depositing gold by a forming technique and finally removing the photoresist can also be used.
[0012]
Finally, the substrate 104 on which the gold layer 105 is patterned is immersed in an appropriate solvent containing the silica capsule 103 into which the thiol group is introduced, and left at an appropriate temperature for a certain period of time. The thiol group present on the surface of the silica capsule 103 into which the group is introduced is chemically bonded. Thereafter, the substrate 104 is taken out and washed to remove unbonded capsules.
[0013]
Through the above steps, the functional material 102 contained in the silica capsule 101 can be selectively immobilized only on the gold layer 105 of the substrate 104. In this embodiment, silicon oxide is used as the capsule material. However, any material other than silicon oxide (for example, silicon oxide) may be used as long as it is hydrophilic and has a —OH group bonded to the surface. It is also possible to use titanium oxide) . In addition, as a material to be chemically bonded on the capsule,
Chemical formula 1 HS-R ₁ -Si (OR ₂ ) _n H _3-n
Where R ₁ is (CH ₂ ) _m (m ≧ 1)
R ₂ is CH ₃ or (CH ₂ ) _l CH ₃ (l ≧ 1)
1 ≤ n ≤ 3
Any material other than 3-mercaptotrimethoxysilane may be used as long as it satisfies the above conditions. Furthermore, as a material for covering the region to be immobilized on the substrate, a material other than gold can be used as long as it is a material that is easily chemically bonded to the thiol group.
[0014]
【The invention's effect】
By using the functional material immobilization method of the present invention, it is not necessary to directly pattern the functional material by a photolithography process by previously patterning the metal material in the region to be immobilized on the substrate in advance. As a result, it is possible to fix a material that is chemically modified by an organic solvent.
[0015]
In addition, since the functional material is included in the capsule and the capsule and the substrate are chemically bonded, whether or not the capsule can be immobilized does not depend on the type of the material. In addition, unlike electrostatic bonding, it is fixed by chemical bonding, so that the holding force can be increased.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing a procedure of a method for immobilizing a functional material according to an embodiment of the present invention.
[Explanation of symbols]
101 silica capsule
102 Functional materials
103 Silica capsules with thiol groups
104 substrate
105 gold layer

Claims (4)

Selectively immobilizing a specific material in a specific region,
Encapsulating the specific material in a capsule having -OH groups bonded to the surface;
Coating only a region where the material on the substrate is to be immobilized with a metal material chemically bonded to a thiol group ;
On the surface of the capsule,
Chemical formula 1 HS-R ₁ -Si (OR ₂ ) _n H _3-n
Where R ₁ is (CH ₂ ) _m (m ≧ 1)
R ₂ is CH ₃ or (CH ₂ ) _l CH ₃ (l ≧ 1)
1 ≤ n ≤ 3
Chemically bonding a material represented by:
A method of immobilizing a functional material comprising the step of selectively chemically bonding only the region coated with a metal material chemically bonded to the thiol group , the capsule obtained by chemically bonding the material represented by the chemical formula 1 . The step of chemically bonding the material represented by the chemical formula 1 to the surface of the capsule includes the step of bonding —OH group bonded to the capsule surface to —Si (OR ₂ ) _n H in the material represented by the chemical formula 1. _The method for immobilizing a functional material according to claim 1, wherein the functional material is a step utilizing a chemical bond by a reaction with a _3-n group.   The step of selectively chemically bonding the capsule obtained by chemically bonding the material expressed by the chemical formula 1 only to the region covered with the metal material is performed on the metal atom on the surface of the metal material and the material expressed by the chemical formula 1. The method for immobilizing a functional material according to claim 2, wherein the functional material is chemically bonded to the -SH group contained therein. Selectively immobilizing a specific material in a specific region,
Encapsulating the specific material in a capsule whose surface is formed of either silicon oxide or titanium oxide;
Coating only a region where the material on the substrate is to be immobilized with a metal material chemically bonded to a thiol group;
On the surface of the capsule,
Chemical formula 1 HS-R ₁ -Si (O-R ₂ ) _n H _3-n
However, R ₁ Is (CH ₂ ) _m (m ≧ 1)
R ₂ Is CH _Three Or (CH ₂ ) _l  CH _Three (l ≧ 1)
1 ≦ n ≦ Three
Chemically bonding a material represented by:
A method of immobilizing a functional material comprising a step of selectively chemically bonding only the region coated with a metal material chemically bonded to the thiol group, the capsule chemically bonded to the material represented by the chemical formula 1 .

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