JP3892102B2 - Substrate processing method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a method and apparatus for processing a substrate such as a semiconductor substrate or a glass substrate for liquid crystal, and more particularly to a substrate processing method and apparatus for immersing a substrate in a processing tank to perform a water washing process. is there.
[0002]
[Prior art]
  Conventionally, in manufacturing a substrate such as a semiconductor substrate or a liquid crystal glass substrate, the substrate is immersed in a chemical solution or pure water (collectively referred to as “treatment solution”) stored in the treatment vessel, and the treatment solution in the treatment vessel is immersed in the treatment solution. A method or apparatus for performing chemical treatment or water washing treatment on a substrate by sequentially replacing different treatment solutions is generally known.
[0003]
  One example of this type of substrate processing apparatus is an apparatus described in Japanese Patent Laid-Open No. 7-130699. In this substrate processing apparatus, a processing tank is placed in a sealed chamber, and after washing with water is completed, 2-propanol (isopropyl alcohol: “IPA”) vapor is blown into the chamber while the substrate is pulled up from the processing tank. It removes water and processing residues adhering to the substrate. According to this apparatus, when the substrate is taken out from the processing tank, the IPA vapor is condensed on the surface of the substrate, the water adhering to the surface of the substrate is evaporated by this condensation heat, and the IPA film formed on the surface of the substrate by the condensation. As a result, the wettability of the substrate surface is enhanced, and the processing residue is peeled off and removed.
[0004]
[Problems to be solved by the invention]
  However, in the conventional apparatus described above, since IPA vapor is supplied into the sealed chamber while taking out the substrate from the processing tank, it is difficult to remove water and processing residues on the entire surface of the substrate satisfactorily.
[0005]
  That is, in order to remove water and processing residues adhering to the substrate surface, it is important to condense the IPA vapor over the entire surface of the substrate as much as possible, but the IPA vapor is taken out while taking out the substrate as in the conventional apparatus. When the air is blown into the sealed chamber, an air current is generated by the IPA vapor in the sealed chamber, and the IPA vapor condensing part may be biased on the substrate surface due to the air current, or the amount of condensation may be uneven. is there. For example, if the IPA vapor is not partially condensed or the amount of the IPA vapor to be condensed is small, water and processing residue partially remain on the substrate surface, which is dried as it is to reduce the quality of the substrate. Or may cause generation of particles in the next process.
[0006]
  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate processing method and apparatus that can satisfactorily remove water and processing residues after washing treatment over the entire substrate surface.
[0007]
[Means for Solving the Problems]
  To solve the above problem,Claim 1In the substrate processing method of immersing the substrate in a processing tank accommodated in a sealed chamber and subjecting the substrate to a water washing process, the substrate processing method is a state in which the substrate is immersed in the processing tank storing water. Supply organic solvent into the sealed chamberThe inside of the sealed chamber is filled with an organic solvent, and a liquid layer of the organic solvent is formed on the water surface.The supply of the organic solvent into the sealed chamber is stopped, and the substrate is placed in the processing tank in a state where the supply of the organic solvent is stopped.Water inLifted fromThe substrate is pulled up into the sealed chamber filled with the organic solvent from the treatment tank, and then the organic solvent is supplied into the sealed chamber.It was made toThe
[0008]
  According to this method, after supplying the organic solvent into the sealed chamber, the supply of the organic solvent into the sealed chamber is stopped and the substrate is pulled up from the processing layer. In this state, the substrate is pulled up without being dried when passing through the gas-liquid interface. As a result, a liquid film of an organic solvent is formed over the entire substrate surface, thereby improving the wettability of the substrate. For this reason, water and processing residues adhering to the surface of the substrate, in particular, hydrophobic processing residues that are difficult to be removed by washing with water are effectively removed.
[0009]
  Also, GroupAfter lifting the plate from the treatment tank, the organic solvent is placed in a sealed chamber.Will reduce the watermark.The
[0010]
  Further, according to claim 2ofSubstrate processingMethodIsThe boardAboveAfter lifting from the treatment tank,The inside of the sealed chamber is depressurized.The
[0011]
  According to this methodAfter lifting the substrate from the treatment tank,BoardDecompressionThe drying efficiency of the substrate is improved because it is exposed to the state.The
[0012]
  The substrate processing apparatus according to claim 3 is a processing tank for storing water, a sealed chamber for storing the processing tank, an organic solvent supply means for supplying an organic solvent into the sealed chamber, and the processing tank. The organic solvent is supplied into the sealed chamber by the organic solvent supply means in a state where the substrate is immersed in the treatment tank, and the inside of the sealed chamber is filled with the organic solvent while the substrate is immersed in the treatment tank. After forming a liquid layer of organic solvent, In the state where the supply of the organic solvent into the chamber is stopped and the supply of the organic solvent is stopped, the handling meansPull up the substrate from the treatment tankLet the liquid layer pass, and lift the substrate from the treatment tank into the sealed chamber filled with an organic solvent.AfterControl means for supplying the organic solvent into the sealed chamber by the organic solvent supply means.The
[0013]
  According to this device, the processingThe organic solvent supply means with the substrate immersed in the treatment tankButSupply organic solvent into the sealed chamberShiAfter the supply of the organic solvent is stopped, the handling means is stopped in a state where the supply of the organic solvent is stopped.ButsubstrateThePull out from the tankTherefore, the inside of the sealed chamber becomes a low-performance organic solvent atmosphere, and the substrate is pulled up without being dried when passing through the gas-liquid interface. As a result, a liquid film of an organic solvent is formed over the entire substrate surface, thereby improving the wettability of the substrate. For this reason, water and processing residues adhering to the surface of the substrate, in particular, hydrophobic processing residues that are difficult to be removed by washing with water are effectively removed.
[0014]
  Also,According to this device, GroupPull the plate out of the processing tankAfterOrganic solventSince the organic solvent is supplied to the substrate by the supply means, the watermark is reduced and the drying efficiency of the substrate is improved.The
[0015]
  Claim 4Substrate processing equipment,in frontIn the sealed chamberInert gasSupplyAnd an inert gas supply unit configured to remove the substrate from the processing tank and then the inert gas supply unit supplies the inert gas into the sealed chamber.Is to supply.
[0016]
  According to this apparatus, after lifting the substrate from the processing tank,Inert gasBy supply meansInert gasIs supplied to the substrate, the watermark is reduced and the drying efficiency of the substrate is improved.
[0017]
  Claim 5The substrate processing apparatus in the sealed chamberDepressurizeDoDecompressionAnd a control means, after the control means has lifted the substrate from the processing tank,DecompressionIn the sealed chamber by meansDepressurizeIt is something to be made.
[0018]
  According to this apparatus, after lifting the substrate from the processing tank,DecompressionBy meansThe inside of the sealed chamber is depressurized to expose the substrate to a depressurized stateBecause, GroupThe drying efficiency of the boardfurtherimproves.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
  Embodiments of the present invention will be described with reference to the drawings.
[0020]
  FIG. 1 schematically shows an example of a substrate processing apparatus according to the present invention. The substrate processing apparatus 10 shown in this figure is a so-called one-bath type substrate that performs surface treatment by immersing a substrate such as a semiconductor wafer in this processing solution while sequentially storing various chemical solutions and pure water in a single processing tank. It is a processing device.
[0021]
  As shown in the figure, the substrate processing apparatus 10 includes a sealed chamber 12, and includes a processing tank 14 for storing a processing liquid in the sealed chamber 12, and also includes an organic solvent vapor supply system and the chamber. It has a configuration including a decompression system for making a vacuum and a supply / exhaust system for the processing liquid.
[0022]
  An opening 16 is formed in the upper portion of the sealed chamber 12, and a door 18 that opens and closes the opening 16 is slidably provided, and the substrate W can be slid through the opening 16. It comes to be put in and out.
[0023]
  The processing tank 14 has an upper opening and is formed in a box shape having a rectangular section with a liquid receiving portion 14a around it. The whole of the processing tank 14 is, for example, PTFE (polytetrafluoroethylene), PVDF (vinylidene fluoride). It is made of a resin material having excellent erosion resistance.
[0024]
  A water supply pipe 20 and a drain pipe 21 constituting a supply / discharge system for the processing liquid are connected to the processing tank 14, respectively. The upstream end of the water supply pipe 20 is connected to a pure water supply source (not shown), while the downstream end is connected to the bottom of the treatment tank 14 and communicates with the treatment tank 14. A valve 22, a mixing valve 24, and a three-way valve 26 are provided in this order from the upstream side.
[0025]
  Chemical liquid supply pipes 28a to 28d are connected to the mixing valve 24, and the upstream ends of these chemical liquid supply pipes 28a to 28d are connected to different types of chemical liquid supply sources (not shown), respectively. In addition, open / close valves 30a to 30d are respectively provided. That is, when one of the on / off valves 30a to 30d is opened while the on / off valve 22 of the water supply pipe 20 is opened, one kind of chemical liquid is mixed with the pure water supplied through the water supply pipe 20. While being supplied to the processing tank 14, only the pure water is supplied to the processing tank 14 by closing all the open / close valves 30 a to 30 d. Thereby, the water supply pipe 20 is shared as a supply path for pure water and each chemical solution.
[0026]
  The drain pipe 21 has an upstream end connected to the liquid receiving portion 14a of the processing tank 14, and a downstream end connected to a waste liquid tank (not shown). Further, the drain pipe 21 is provided with a branch pipe 21 a in the middle thereof, and this branch pipe 21 a is connected to the three-way valve 26 of the water supply pipe 20. That is, when the liquid overflowing from the processing tank 14 to the liquid receiving portion 14a is introduced into the waste liquid tank via the drain pipe 21, for example, when it is necessary to discharge all the processing liquid in the processing tank 14, the three-way valve By switching 26, the processing liquid in the processing tank 14 is introduced into the waste liquid tank via the water supply pipe 20, the three-way valve 26, the branch pipe 21 a and the drain pipe 21.
[0027]
  A vapor supply pipe 32 is provided as an organic solvent vapor supply system. The steam supply pipe 32 has an upstream end connected to a nitrogen gas supply source, and a downstream end connected to the sealed chamber 12 and communicated with the interior thereof, and a pair of three-way valves 34a and 34b are interposed therebetween. A bypass passage 36 is provided via an organic solvent vapor generator 38. And according to switching of each three-way valve 34a, 34b, the supply system of organic solvent vapor | steam so that it can switch to the state which introduce | transduces nitrogen gas into the sealed chamber 12 via the bypass channel 36, and the state which interrupts | blocks this Is configured.
[0028]
  The steam generator 38 is configured to generate alcohol-based organic solvent vapor, in this embodiment, IPA vapor, and nitrogen gas is introduced into the sealed chamber 12 through the bypass passage 36 as described above. Thus, IPA vapor is introduced into the sealed chamber 12 using this nitrogen gas as a carrier gas.
[0029]
  A decompression tube 40 is provided as a decompression system for evacuating the sealed chamber 12. The pressure reducing pipe 40 has an upstream end connected to the sealed chamber 12 and communicated with the inside thereof, while a downstream end is connected to, for example, a water-sealed vacuum pump 44. And an exhaust pipe 47 having a filter (not shown) is connected to the three-way valve 46. Then, in accordance with the switching of the three-way valve 46, the sealed chamber 12 is connected to the vacuum pump 44 so that the inside of the sealed chamber 12 is decompressed, and the sealed chamber 12 is opened to the atmosphere via the exhaust pipe 47. It is supposed to be.
[0030]
  In the sealed chamber 12, a handling means 48 (shown in FIG. 2) for holding a plurality of substrates W is provided so as to be movable up and down, and the handling means 48 is moved to the lowered end position. As shown by the solid line in the figure, the substrate W is immersed in the processing liquid in the processing tank 14, while the handling means 48 is raised from this position so that the substrate W is taken out of the processing liquid.
[0031]
  Further, a transfer mechanism for transferring the substrate W to and from the handling means 48 is movably provided on the upper outer side of the sealed chamber 12, and the transfer mechanism and the handling means 48 are connected via the opening 16. The substrate W is transferred to and from the substrate processing apparatus 10 so that the substrate W is taken in and out of the substrate processing apparatus 10.
[0032]
  Incidentally, the substrate processing apparatus 10 is provided with a controller 50 as shown in FIG. 2, and each valve of the organic solvent vapor supply system, the decompression system and the processing liquid supply / discharge system, the handling means 48 and the above-mentioned transfer. A mechanism or the like is electrically connected to the controller 50. The controller 50 is provided with a main control means 52, a drive control means 54 and a valve control means 56, a handling means 48 for the drive control means 54, and an organic solvent vapor for the valve control means 56. Each valve such as a supply system is connected.
[0033]
  When the substrate processing apparatus 10 is operated, the main control means 52 controls the handling means 48 via the drive control means 54 and the valves such as the organic solvent vapor supply system via the valve control means 56. Thus, the following processing operation for the substrate W is performed.
[0034]
  Next, the processing operation of the substrate W by the substrate processing apparatus 10 will be described using the flowchart of FIG.
[0035]
  First, the opening 16 of the sealed chamber 12 is opened with the handling means 48 set at the rising end position, and a plurality of substrates W transported above the sealed chamber 12 are collectively handled by the transfer mechanism. Passed to the means 48, the opening 16 is closed. At this time, the inside of the sealed chamber 12 is at atmospheric pressure, and no IPA vapor is supplied. Further, pure water is supplied to the treatment tank 14 and overflowed to the liquid receiving portion 14 a, thereby forming an upward flow of pure water in the treatment tank 14.
[0036]
  When the opening 16 of the sealed chamber 12 is closed, the handling means 48 is moved to the lower end position, and the substrates W are collectively immersed in pure water in the processing bath 14. Then, the substrate W is disposed in such an upward flow of pure water, whereby the substrate W is subjected to a water washing process (steps S1 and S2).
[0037]
  When the substrate W is subjected to the water washing process for a certain time, the chemical liquid is supplied to the processing tank 14 by opening any of the opening / closing valves 30a to 30da of the chemical liquid supply pipes 28a to 28d, and then supplied to the substrate W. On the other hand, chemical treatment is performed. Also at this time, the chemical solution is continuously supplied to the processing tank 14 and overflowed to the liquid receiving portion 14 a, whereby the processing residue is led out of the processing tank 14. Thereafter, the opening and closing valves 30a to 30d are alternately opened one after another, so that different chemical solutions are supplied into the processing tank 14, whereby a plurality of types of chemical processing are sequentially performed on the substrate W (step). S3, 4).
[0038]
  When all the chemical liquid processing is completed, pure water is again supplied to the processing tank 14 and the substrate W is subjected to the water cleaning process. When the water cleaning process is performed for a certain time, the pure water is supplied to the processing tank 14. Stopped (steps S5 and S6).
[0039]
  Then, the IPA vapor is introduced into the sealed chamber 12 for a certain period of time by switching the three-way valves 34a and 34b in the organic solvent vapor supply system (steps S7 and S8). By introducing the IPA vapor in this way, the inner space of the sealed chamber 12 is filled with the IPA vapor, and the IPA vapor is dissolved in the pure water in the treatment tank 14 so that a substantially uniform IPA liquid layer is formed on the pure water surface. It is formed. Note that the IPA vapor introduction time varies depending on the number of substrates W and the like, but in this embodiment, the time is about 10 minutes.
[0040]
  When the introduction of the IPA vapor is stopped, the handling means 48 is then moved to the rising end position.ThisThus, the substrate W is taken out from the processing tank 14 (step S9). At this time, since the liquid layer of IPA is formed on the surface of the pure water in the treatment tank 14 as described above, the substrate W is taken out through such a liquid layer of IPA. For example, a hydrophobic treatment residue that has not been removed is effectively removed. In addition, as the substrate W is taken out, a uniform IPA liquid film is formed over the entire surface of the substrate W. As a result, the wettability of the substrate surface is enhanced. It flows down into the processing tank 14. Therefore, in the substrate W taken out from the treatment tank 14, the water and the treatment residue after the water washing treatment are favorably removed over the entire surface by these actions.
[0041]
  When the substrate W is taken out from the processing tank 14, the three-way valve 26 is switched in the processing liquid supply / discharge system, the pure water in the processing tank 14 is rapidly drained, and the three-way valves 34a and 34b are switched again. Then, IPA vapor is introduced into the sealed chamber 12 for a predetermined time (steps S10 and S11). Thus, IPA vapor | steam is introduce | transduced in the sealed chamber 12, and IPA vapor | steam condenses on the substrate surface, The pure water contained in the IPA liquid film of a substrate surface is evaporated by the condensation heat. And a watermark reduces and the drying efficiency of a board | substrate improves. Note that the introduction of the IPA vapor at this time is performed for about 5 minutes in the present embodiment.
[0042]
  Next, the three-way valve 46 of the decompression system is switched, the sealed chamber 12 is connected to the vacuum pump 44, and the inside of the sealed chamber 12 is decompressed (step S12). As a result, the IPA on the substrate surface is evaporated and the substrate W is dried.
[0043]
  When the inside of the sealed chamber 12 is depressurized for a certain period of time, the opening / closing valve 46 is switched to open the inside of the sealed chamber 12 to the atmosphere (step S13), the opening 16 is opened, and the substrates W are batched. It is carried out of the sealed chamber 12 by the transfer device. Thus, the processing operation of the substrate W by the substrate processing apparatus 10 is completed.
[0044]
  According to the substrate processing apparatus 10 described above, after the final water washing process with pure water is completed, IPA vapor is supplied into the treatment tank 14 to form an IPA liquid layer on the surface of the pure water. Since the substrate W is taken out through the layer to remove the water and processing residue on the substrate surface as described above, IPA vapor is blown into the sealed chamber while taking out the substrate from the pure water. Compared to this type of conventional apparatus that removes water and processing residues by condensing IPA vapor on the surface, water and processing residues adhering to the substrate can be removed well over the entire substrate surface.
[0045]
  That is, in the conventional apparatus, the introduction of IPA vapor into the sealed chamber 12 generates an IPA vapor air flow in the sealed chamber. For this reason, there is a possibility that the IPA condensation position on the substrate surface is biased due to the influence of the air flow, and the removal effect of processing residues and the like by the IPA is not uniformly exhibited over the entire substrate. On the other hand, according to the substrate processing apparatus 10, the IPA liquid film is uniformly formed over the entire surface of the substrate W by taking out the substrate W from the processing tank 14 through the IPA liquid layer formed on the pure water surface. Therefore, the removal effect of the processing residue by IPA is exhibited almost uniformly over the entire substrate. Therefore, the water and the processing residue adhering to the substrate W are more reliably removed, and the water and the processing residue in the water washing process can be favorably removed over the entire substrate surface.
[0046]
  The substrate processing apparatus 10 of the present embodiment and the conventional apparatus have the same configuration in that IPA vapor is supplied into the sealed chamber, but the processing residue adhering to the substrate surface is removed to a certain level. The time required for this, specifically, the time required to reduce the processing residue adhering to the substrate surface to 30 or less is 15 minutes with the conventional apparatus, but 5 minutes with the apparatus of this embodiment. It has been confirmed experimentally that the removal effect of the treatment residue can be greatly enhanced. And as a result of being able to remove the processing residue efficiently in this way, the consumption of IPA could be reduced to less than half compared with the conventional apparatus.
[0047]
  In addition, the substrate processing apparatus 10 that processes a plurality of substrates W collectively has the following characteristics. That is, when processing a plurality of substrates at once, the conventional apparatus may be affected by an air flow depending on the position of the substrate, so that the removal effect of processing residues and the like by IPA may not be uniformly exhibited between the substrates. However, according to the substrate processing apparatus 10, the IPA liquid film can be uniformly formed on the entire surface of all the substrates W, so that the removal effect of processing residues and the like by the IPA is effective between the substrates. It is almost uniform. Therefore, there is an advantage that the quality of the substrate W can be made uniform.
[0048]
  In addition, the substrate processing apparatus 10 of the said embodiment is an example of the substrate processing apparatus which concerns on this invention, Comprising: The specific structure and control (operation | movement) can be suitably changed in the range which does not deviate from the summary of this invention. .
[0049]
  For example, in the substrate processing apparatus 10, after the final rinsing with pure water, IPA vapor is introduced into the sealed chamber 12, and this vapor is dissolved in pure water to form an IPA liquid layer. However, IPA may be directly poured into the processing tank 14 by using the above-described processing liquid supply / discharge system, or by providing a dedicated supply system. However, according to the above embodiment, there is an advantage that a uniform IPA liquid layer can be easily formed on the pure water surface. Further, since the inside of the sealed chamber 12 is filled with IPA vapor, when the substrate W is taken out, the IPA vapor condenses on the substrate surface and the pure water contained in the IPA liquid film on the substrate surface evaporates. There is an advantage that water can be effectively removed.
[0050]
  In this embodiment, the pure water in the processing tank 14 is quickly drained after the substrate W is taken out of the processing tank 14, but the draining timing is not necessarily immediately after the substrate W is taken out of the processing tank 14. It is not necessary to drain the water at an appropriate timing after the substrate W is pulled up. At this time, it is not always necessary to drain the pure water rapidly, but if it is drained quickly, the processing residue floating in the liquid will not easily adhere to the wall surface of the processing tank 14, and the processing residue inside the processing tank 14 There is an advantage that the residual to can be reduced. Instead of discharging pure water in this way, pure water may be continuously supplied to the treatment tank 14 and overflowed to the liquid receiving part 14a, thereby discharging the processing residue in the liquid.
[0051]
  Moreover, in the said embodiment, although IPA is used as an organic solvent, the kind of organic solvent to be used should just be suitably selected according to the kind of board | substrate etc. to produce, etc. By supplying, a liquid layer is formed on the water surface of the processing tank 14, and when the substrate W is taken out of the processing tank 14, a liquid film is formed on the substrate surface to contribute to the removal of water and processing residues on the substrate surface. Any organic solvent may be used as long as it has a function to achieve this.
[0052]
【The invention's effect】
  As explained above,Claim 1According to this processing method, after supplying the organic solvent into the sealed chamber, the supply of the organic solvent into the sealed chamber is stopped and the substrate is pulled up from the processing layer, so that the substrate is dried when passing through the gas-liquid interface. The organic solvent liquid film is formed over the entire surface of the substrate without increasing the wettability of the substrate. As a result, it is possible to effectively remove water and treatment residues adhering to the surface of the substrate, in particular, hydrophobic treatment residues that are difficult to remove by the water washing treatment.The
[0053]
  Also,ThisAccording to this substrate processing method, after the substrate is lifted from the processing tank, the organic solvent is added to the substrate.MediumSince it is supplied, the watermark is reduced.wear.
[0054]
  Also,Claim 2According to this substrate processing method, since the substrate is exposed to a reduced pressure state after the substrate is lifted from the processing tank, the drying efficiency of the substrate can be further improved.The
[0055]
  Claim 3Substrate processingapparatusAccording toAfter the substrate is immersed in the processing tank, the organic solvent supply means supplies the organic solvent into the sealed chamber, then the supply of the organic solvent is stopped, and the handling means processes the substrate with the supply of the organic solvent stopped. Since the substrate is pulled up, the substrate is pulled up without being dried when passing through the gas-liquid interface, and a liquid film of an organic solvent is formed over the entire surface of the substrate, thereby improving the wettability of the substrate. As a result, water and processing residues adhering to the surface of the substrate, in particular, hydrophobic processing residues that are difficult to be removed by washing with water are effectively removed.CanThe
[0056]
  Also,ThisAfter the substrate is lifted from the processing tank,Organic solvent is supplied to the substrate by organic solvent supply meansSoCan reduce the watermark,The drying efficiency of the substrate can be improved.
[0057]
  Claim 4Substrate processing equipmentSince the inert gas is supplied to the substrate by the inert gas supply means after the substrate is lifted from the processing tank, the watermark can be reduced and the drying efficiency of the substrate is improved.CanThe
[0058]
  Claim 5After the substrate is pulled out of the processing tank,Pressure reducing meansBySince the inside of the sealed chamber is decompressed and the substrate is exposed to a decompressed state,Increased substrate drying efficiencyfurtherCan be improvedThe
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing an example of a substrate processing apparatus according to the present invention.
FIG. 2 is a block diagram showing a control system of the substrate processing apparatus.
FIG. 3 is a flowchart showing an example of a substrate processing operation in the substrate processing apparatus.
[Explanation of symbols]
  10 Substrate processing equipment
  12 Sealed chamber
  14 Treatment tank
  20 Water supply pipe
  21 Drain pipe
  21a Branch pipe
  28a to 28d Chemical liquid supply pipe
  30a-30d Open / close valve
  32 Steam supply pipe
  40 Pressure reducing tube
  44 Vacuum pump
  47 Exhaust pipe
  48 Handling means
  50 controller
  52 Main control means
  54 Drive control means
  56 Valve control means
  W substrate

Claims (5)

In a substrate processing method in which a substrate is immersed in a processing tank accommodated in a sealed chamber and the substrate is washed with water, an organic solvent is stored in the sealed chamber in a state where the substrate is immersed in the processing tank in which water is stored. In a state where the sealed chamber is filled with an organic solvent, a liquid layer of the organic solvent is formed on the water surface, the supply of the organic solvent into the sealed chamber is stopped, and the supply of the organic solvent is stopped. The substrate is lifted from the water in the processing tank to pass through the liquid layer, the substrate is lifted from the processing tank into the sealed chamber filled with the organic solvent, and then the organic solvent is supplied into the sealed chamber. And a substrate processing method. 2. The substrate processing method according to claim 1, wherein after the substrate is lifted from the processing tank, the inside of the sealed chamber is depressurized . A processing tank for storing water; a sealed chamber for housing the processing tank; an organic solvent supply means for supplying an organic solvent into the sealed chamber; a handling means for lifting the substrate from the processing tank; and a substrate in the processing tank. The organic solvent is supplied into the sealed chamber by the organic solvent supply means while the sealed chamber is immersed, the inside of the sealed chamber is filled with the organic solvent, and a liquid layer of the organic solvent is formed on the water surface. With the supply of the organic solvent stopped and the supply of the organic solvent stopped, the substrate is lifted from the treatment tank by the handling means and passed through the liquid layer, and filled with the organic solvent from the treatment tank. after pulling up the substrate into the sealed chamber has, and a control means for supplying the organic solvent into the sealed chamber by the organic solvent supply means The substrate processing apparatus according to claim and. 4. The substrate processing apparatus according to claim 3, further comprising an inert gas supply unit configured to supply an inert gas into the sealed chamber, wherein the control unit lifts the substrate from the processing tank and then the inert gas. A substrate processing apparatus, wherein an inert gas is supplied into the sealed chamber by a supply means . The apparatus according to claim 3 or claim 4, further comprising a decompression means for decompressing the said sealed chamber, said control means, after pulling up the substrate from the processing bath, the sealed chamber by the pressure reducing means A substrate processing apparatus for reducing the pressure inside.

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