JP3888358B2 - Manufacturing method of flat panel radiation detector and flat panel radiation detector - Google Patents

Description

  The present invention relates to an inert resin space or a space for an inert material (space) that is a space for an inert gas or a space for an inert gas formed on the surface and peripheral end surface of a radiation sensitive film in a flat panel radiation detector. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing method of a flat panel radiation detector filled with an inert material such as an inert gas and a flat panel radiation detector, and particularly to avoid insufficient filling of the inert material in the space for the inert material. Related to technology.

  In an X-ray imaging apparatus, a flat panel radiation detector (hereinafter referred to as “FPD” as appropriate) used to detect a transmitted X-ray image of a subject that is generated when the subject is irradiated with X-rays from an X-ray tube. "). As shown in FIG. 10, in this FPD, a radiation sensitive film 51 that exhibits a radiation detection function for FPD is formed on a substrate 52 made of glass or the like, and covers the radiation sensitive film 51. The inert resin space SPa generated between the inner surface of the case 53, the surface of the radiation sensitive film 51 and the peripheral end surface is filled with an inert resin 54 mainly composed of an insulating resin.

  The radiation sensitive film 51 is a direct conversion type radiation sensitive film in which incident X-rays are converted into electric signals, and a bias voltage application electrode 55 is laminated on the surface of the radiation sensitive film 51. The inert resin 54 covers the radiation sensitive film 51 together with the bias voltage application electrode 55.

  In addition, inactive resin and inert gas in this invention are chemically inactive with respect to the radiation sensitive film | membrane 51 and the bias voltage application electrode 55, and are also electrically inactive ( It has electrical insulation).

  The FPD inert resin 54 shown in FIG. 10 is applied as follows. That is, as shown in FIG. 11A, only the frame member 53 </ b> A as a spacer constituting the four-side surface portion of the case 53 is bonded on the substrate 52 so as to surround the radiation sensitive film 51.

  Next, as shown in FIG. 11 (b), after pouring a liquid material LQ for an inert resin whose main component is a resin composition into a space SPa surrounded by a frame material 53A, the upper surface portion of the case 53 is configured. The lid material 53B for the lid to be applied is applied as shown in FIG. 11C to cure the liquid material LQ.

  Then, as shown in FIG. 10, the space SPa between the surface side and the peripheral end surface side of the radiation sensitive film 51 is completed in a state where the inert resin 54 mainly composed of an insulating resin is filled.

  Since the inert resin 54 filled in the space SPa is provided so as to cover the radiation sensitive film 51 and the bias voltage application electrode 55, the inert resin 54 can prevent the radiation sensitive film 51 from being altered. In addition, the withstand voltage can be improved.

  However, the conventional FPD has a problem that insufficient filling of the inert resin 54 with respect to the space SPa occurs.

  That is, insufficient filling occurs due to the air that is entrained when the lid material 53B is tilted and deposited after pouring the liquid material LQ for the inert resin. That is, the entrained air generates bubbles in the inert resin 54 and is insufficiently filled by the amount of bubbles. Bubbles in the inactive resin 54 appear in the X-ray image and cause the image quality to deteriorate, and the resin thickness is reduced at the bubbles, which causes the withstand voltage to decrease.

  In addition, when filling an inert gas instead of an inert resin as an inert material, an inert gas supply port is opened in the lid material 53B in advance, and the lid material 53B is first attached to the inert gas. After supplying and filling, the supply port is sealed.

  However, it is difficult to sufficiently replace the air in the space with the inert gas, resulting in insufficient filling of the inert gas. This insufficient filling of the inert gas also causes deterioration of the radiation-sensitive film 51 and a decrease in withstand voltage.

  This invention is made in view of such a situation, Comprising: The inert resin or inert gas as an inert material with respect to the space for inert materials which is the space for inert resins or the space for inert gas The main object of the present invention is to provide a flat panel type radiation detector manufacturing method capable of avoiding insufficient filling, and to provide a flat panel type radiation detector in which a space for an inert material is filled with an inert material without a shortage. Objective.

  In order to achieve the first object, the present invention has the following configuration.

  That is, in the manufacturing method of the flat panel radiation detector according to the invention described in claim 1, the space for filling the inert material on the surface side and the peripheral end surface side of the radiation sensitive film for the flat panel radiation detector is provided. A supply flow path for supplying the inert material by covering a case provided with a supply port for supplying a liquid or gel-like inert material and a discharge port for discharging the inert material so as to cover the radiation-sensitive film. And a supply tube of the case, and a connection tube connected to each of the discharge port and the discharge flow path, and the inert material supplied into the space from the supply port of the case overflows from the discharge port and is connected to the discharge side. After the inert material is supplied to at least the connection tube of the tube and the discharge flow path until the inert material is accumulated, the inert material is cured, and after the inert material is cured, the both connection It is an characterized by cutting from the base of the supply port side and the outlet side of the cube.

  [Operation / Effect] In the FPD manufacturing method according to the first aspect of the present invention, the supply port for supplying the inert material so as to form a space filled with the inert material on the surface side and the peripheral end surface side of the radiation-sensitive film. A case provided with a discharge port for discharging the inert material is covered with a radiation sensitive film. In this state, an inert material is supplied from the supply port and filled.

  That is, in the FPD manufacturing method according to the first aspect of the present invention, the case is covered with the radiation-sensitive film before the inert material is supplied, so that insufficient filling occurs when the case is covered with the radiation-sensitive film. There is no worry of biting air. Accordingly, insufficient filling of the inert material with the inert material space is avoided.

  Further, in the case of the FPD manufacturing method according to the first aspect of the present invention, these inert materials are formed so as to form a space for filling a liquid or gel-like inert material on the surface side and the peripheral end surface side of the radiation sensitive film. A case provided with a supply port for filling the material and a discharge port for discharging the material is covered with a radiation-sensitive film. In this state, the inert material is supplied from the supply port and supplied until the inert material overflows from the discharge port. Thereafter, the inert material is cured to fill the space for the inert material with the inert material.

  That is, since the case is covered with the radiation-sensitive film before the inert material is supplied, there is no fear that air that causes insufficient filling will be caught when the case is covered with the radiation-sensitive film. In addition, the liquid or gel-like inert material supplied from the case supply port is supplied to the space for the inert material from the discharge port to the overflow, so that the inert material overflowing from the discharge port causes the air in the space to flow. It is exhausted to the outside and spread enough so that the inert material becomes dense in the space. Therefore, insufficient filling of the inert material into the inert resin space is avoided.

  Furthermore, even if the liquid or gel-like inert material supplied in the space for the inert material shrinks when it hardens, surplus inert material remaining in the supply flow path as the material shrinks Is newly supplied into the space from the supply port and replenished, and excess inert material remaining in the liquid reservoir is pulled back into the space from the discharge port and replenished. Therefore, it is possible to avoid a shortage of local inert material caused by shrinkage when the inert material for the inert resin is cured.

  The invention of claim 2 is the flat panel radiation detector manufacturing method according to claim 1, wherein the supply port is disposed below the case and the discharge port is disposed above the case. In this case, the inert material is supplied.

  [Operation / Effect] In the FPD manufacturing method according to the second aspect of the present invention, in the inert material space, the liquid or gel-like inert material heavier than air is gradually pushed upward while pushing light air upward from below. Since it is filled, the air in the inert material space is surely discharged to the outside by the inert material. As a result, insufficient filling of the inert material can be avoided with high accuracy.

  The invention of claim 3 is the method of manufacturing a flat panel radiation detector according to claim 1 or 2, wherein the inert material is supplied to the space from the supply port by dropping due to its own weight under atmospheric pressure. It is characterized by.

  [Operation / Effect] In the FPD manufacturing method of the invention of claim 3, the liquid or gel-like inert material is supplied to the inert material space from the supply port by dropping under its own weight under atmospheric pressure. The active material space can be easily filled with an inert material.

  According to a fourth aspect of the present invention, in the method for manufacturing a flat panel radiation detector according to any one of the first to third aspects, the radiation sensitive film is a direct conversion type in which incident radiation is converted into an electrical signal. A radiation-sensitive film, characterized in that a bias voltage application electrode is laminated on the surface of the radiation-sensitive film.

  [Operation / Effect] In the FPD manufacturing method of the invention of claim 4, the manufactured FPD converts the incident radiation into an electrical signal by a direct conversion type radiation sensitive film, and the surface of the bias voltage applying electrode is Since it is covered with the inert material, the withstand voltage is also improved by the inert material.

  Furthermore, in order to achieve the second object, the present invention has the following configuration.

  That is, the flat panel radiation detector according to the invention of claim 5 is manufactured by the flat panel radiation detector manufacturing method according to any one of claims 1 to 4. .

  [Operation / Effect] In the case of the FPD of the invention of claim 5, the FPD is manufactured by the method for manufacturing a flat panel radiation detector according to any one of claims 1 to 4, and therefore, for a flat panel radiation detector. The space for the inert material on the surface side and the peripheral end surface side of the radiation sensitive film is filled with a liquid or gel-like inert material without a shortage. In addition, since inert gas is supplied and hermetically sealed, the inert gas space on the surface side and peripheral edge side of the radiation-sensitive film for flat panel radiation detectors is filled without insufficiency. Has been.

  According to the FPD manufacturing method and flat panel radiation detector of the present invention, since the case is covered with the radiation-sensitive film before the inert material is supplied, it is inactive when the case is covered with the radiation-sensitive film. There is no worry of entraining air that causes insufficient filling of the material. For example, when liquid or gel-like inert material is supplied from the case supply port and overflows from the case discharge port, air in the inert material space is discharged to the outside by the inert material. Sufficiently spread the active material so that it is dense in the space.

  Therefore, according to the manufacturing method of the flat panel radiation detector of claim 1, insufficient filling of the inert material into the space for the inert material can be avoided.

  Similarly, cover the case with the inert gas supply port on the radiation-sensitive film and make the inside of the space for inert gas formed on the surface side and the peripheral edge side of the radiation-sensitive film lower than the outside. Since the inert gas is supplied from the supply port of the case, the inert gas is quickly supplied and filled from the outside of the high-pressure supply port to the low-pressure inert gas space.

  Therefore, insufficient filling of the inert gas as the inert material in the inert gas space can be avoided.

  The FPD manufacturing method and FPD embodiment of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a cross-sectional view showing the internal structure of the FPD according to the first embodiment, and FIG. 2 is a partial cutaway view of the upper surface side appearance of the FPD according to the first embodiment.

  As shown in FIGS. 1 and 2, the FPD according to the first embodiment is a direct conversion type FPD in which incident radiation (for example, X-rays) is directly converted into an electric signal, and is formed on an insulating substrate 3 such as glass. The radiation sensitive film 1 and the bias voltage application electrode 2 are laminated in this order.

As the radiation sensitive film 1, for example, a semiconductor film such as amorphous selenium (amorphous Se), CdZnTe, CdTe, HgI ₂ , or PbI ₂ is used. As the size of the radiation sensitive film 1, for example, those having a length of 80 to 550 mm, a width of 80 to 550 mm, and a thickness of 0.5 to 3 mm are used.

As the bias voltage application electrode 2, for example, a thin metal such as aluminum is used. Although not shown, a signal readout circuit is formed on the insulating substrate 3, and the radiation sensitive film 1 is formed with the incidence of radiation. A large number of individual electrodes for collecting the generated carriers are arranged on the surface as pixel electrodes in a two-dimensional matrix arrangement (for example, a vertical 1536 × horizontal 1536 vertical matrix arrangement). On the surface on which the individual electrodes are formed, a radiation sensitive film 1 and a bias voltage applying electrode 2 which is a common electrode are laminated.

  Further, in the FPD of Example 1, the inert resin 4 is filled in a space SPA for the inert resin provided between the surface side and the peripheral end surface side of the radiation sensitive film 1. Specifically, a case 5 constituted by a frame member 5A used as a spacer and an upper plate 5B is covered and fixed in close contact with the insulating substrate 3, and the surfaces and side end surfaces of the radiation sensitive film 1 and the bias voltage application electrode 2 are fixed. A space SPA for the inert resin is formed between them.

  The case 5 has a supply port 6 and a discharge port 7 for filling the inert resin 4 at corners opposite to the diagonal of the upper plate 5A. Connecting tubes 8 and 9 are inserted into the supply port 6 and the discharge port 7, and the space SPA is filled with an inert resin 4 mainly composed of an insulating resin.

  Therefore, since the inert resin 4 is filled in the space SPA so as to cover the radiation sensitive film 1 and the bias voltage application electrode 2, the inert resin 4 prevents the radiation sensitive film 1 from being altered and has a withstand voltage. To improve.

  During radiation detection, if a high voltage is supplied to the bias voltage application electrode 2 with the electric cable EB, a radiation detection signal is output from the individual electrode via the signal readout circuit as radiation enters. The When the FPD of Example 1 is for X-ray detection of an X-ray fluoroscopic apparatus, for example, a two-dimensional transmission X-ray image projected on the radiation sensitive film 1 according to an X-ray detection signal output from the FPD An X-ray fluoroscopic image corresponding to the intensity distribution can be created.

  Next, the FPD manufacturing process of the above embodiment will be described with reference to the flowchart of FIG. 3 showing the FPD manufacturing process.

  [Step S1] As shown in FIG. 4A, a direct conversion type FPD radiation sensitive film 1 and a bias voltage are formed on the surface of an insulating substrate 3 on which a signal readout circuit (not shown) and individual electrodes are formed. The application electrode 2 is formed in order.

  [Step S2] As shown in FIG. 4B, a case 5 composed of a frame member 5A and an upper plate 5B is prepared. The case 5 is provided with a supply port 6 and a discharge port 7 for the liquid material for the inert resin at opposite corners, and the supply port 6 and the discharge port 7 are respectively connected to the connection tubes 8 and 8. 9 is inserted.

  [Step S3] As shown in FIG. 4 (c), the surface of the radiation sensitive film 1 and the bias voltage application electrode 2 formed by laminating and covering the insulating substrate 3 with the case 5 covered and sealed on the insulating substrate 3. A space SPA for an inert resin is formed between the side end surfaces. The space SPA is in a state where it communicates with the supply port 6 and the discharge port 7 alone. The gap of the space SPA to be formed is in the range of about 0.5 to 5.0 mm.

  The electric cable EB for supplying a high voltage to the bias voltage application electrode 2 is removed by passing through a gap between the insulating substrate 3 and the case 5 or by relaying with an electric connector that is airtightly attached to the frame member 5A. Pull out to.

  [Step S <b> 4] As shown in FIG. 5, the connection tube 8 of the supply port 6 is connected to the supply tube (supply channel) 11 of the liquid material supply device 10. A storage tube (drainage reservoir) 12 for storing excess liquid material overflowing from the outlet 7 is connected to the connection tube 9 of the outlet 7. Further, as shown in FIG. 6, the case is placed on the tilt base BS so that the supply port 6 of the case 5 is in the lowermost position and the discharge port is in the uppermost position. The tilt angle θ of the tilt base BS is set to be in the range of 10 to 30 °, for example.

  The liquid material supply device 10 includes a liquid material tank 13 supported above the supply tube 11, and the upper end of the supply tube 11 is connected to the lower end of the liquid material tank 13. When the valve 14 is opened, the liquid material for the inert resin in the liquid material tank 13 is supplied from the supply port 6 to the space SPA via the supply tube 11. As the liquid material for the inert resin to be put into the liquid material tank 13, for example, a material obtained by vacuum degassing of an epoxy resin composition added with a filler or the like as required is used.

  [Step S5] With the start of the supply of the liquid material, the valve 14 of the liquid material supply apparatus 10 is opened. As shown in FIG. 7A, the liquid material LQ supplied from the supply port 6 to the space SPA gradually accumulates upward from the bottom of the space SPA. As the liquid material LQ accumulates, the air in the space SPA is pushed up by the liquid material LQ and discharged from the discharge port 7.

  [Step S6] After the space SPA is filled with the liquid material LQ, the supply of the liquid material continues, and as shown in FIG. 7B, the liquid material LQ overflows from the discharge port 7 into the storage tube 12. Accumulate. Then, when the liquid material in the supply tube 11 and the liquid material in the storage tube 12 have the same height, the supply and filling of the liquid material LQ is completed.

  Therefore, the liquid material LQ having a larger liquid volume than the space SPA is charged into the liquid material tank 13 before the liquid material is supplied.

  [Step S7] The liquid material LQ in the space SPA is cured. At this time, the insulating substrate 3 may be lowered from the tilt base BS together with the case 5 to be in a horizontal state to cure the liquid material LQ.

  When the curing of the liquid material LQ filled in the space SPA is completed, the supply tube 11 and the storage tube 12 are separated at the bases of the connection tubes 8 and 9 to complete the FPD of the first embodiment.

  Therefore, in the opposite corners of the completed FPD, there remains a trace of filling the supply port 6 and the discharge port 7 with the liquid material LQ and processing it flush with the upper plate 5A. In addition, you may perform the process of coating so that it may become difficult to understand this processed surface with the upper plate 5A.

  As described above, in the case of the FPD manufacturing method according to the first embodiment, the case 5 is insulated so as to provide a gap between the surface and side surfaces of the radiation sensitive film 1 and the bias voltage application electrode 2 formed on the insulating substrate 3. After covering the substrate 3 and being in close contact with it, the space SPA formed is filled with the inert resin 4, thereby avoiding air entrainment that causes insufficient filling of the liquid material LQ for the inert resin. .

  Further, the liquid material LQ is supplied from the supply port 6 in a state where the supply port 6 of the case 5 is inclined so that the discharge port 7 is positioned at the lowermost position and the discharge port 7 is positioned at the uppermost position. By allowing the air to overflow, the air in the space SPA can be pushed out. That is, the liquid material LQ for the inactive resin can be densely distributed in the space SPA, and insufficient filling of the inactive resin 4 into the inactive resin space SPA can be avoided.

  Furthermore, in the case of the FPD manufacturing method according to the first embodiment, even if the liquid material LQ supplied and filled in the space SPA contracts when it hardens, the surplus remaining in the supply tube 11 as the material contracts. Since the liquid material is newly supplied from the supply port 6 into the space SPA and replenished, excess liquid material remaining in the storage tube 12 is drawn back from the discharge port 7 into the space SPA and replenished. It is possible to avoid a local shortage of resin due to shrinkage when the liquid material LQ is cured. At the same time, in the space SPA, the liquid material for the inert resin that is heavier than air spreads upward while pushing light air upward from the bottom, so the air in the space SPA is the liquid material for the inert resin. It is reliably pushed out by LQ.

  In Example 2, an FPD manufacturing method in which an inert gas space SPA is filled with an inert gas will be described. In the case of the present embodiment, the inert gas space SPB on the surface side and peripheral end surface side of the radiation sensitive film 1 for FPD is filled with an inert gas instead of being filled with the inert resin 4. Since the other parts are the same as those in the first embodiment, the same reference numerals are given to the same parts, and different parts will be specifically described.

  FIG. 8 is a cross-sectional view illustrating the internal structure of the FPD according to the second embodiment.

  In the FPD of Example 2, a space SPB provided between the surface side and the peripheral end surface side of the radiation sensitive film 1 is filled with an inert gas GS. Specifically, a case 15 constituted by a frame member 15A used as a spacer and an upper plate 15B is covered and fixed in close contact with the insulating substrate 3, and the surfaces and side end surfaces of the radiation sensitive film 1 and the bias voltage application electrode 2 are fixed. A space SPB for the inactive resin is formed between them.

The case 15 has a through-hole formed in a corner portion of the upper plate 15 </ b> A, and the through-hole serves as an inert gas supply port 16. As the inert gas GS to be used, helium gas (He), nitrogen gas (N ₂ ), or the like is used. Also in the case of the FPD of Example 2, the inert gas GS prevents the radiation-sensitive film 1 from being altered and improves the withstand voltage.

  When the FPD of Example 2 is manufactured, as shown in FIG. 9A, the gas cylinder 17 in which the inert gas is stored is opened and closed in the supply port 16 of the case 15 that is covered and fixed to the insulating substrate 3. It connects to the supply port 16 via the valve 18. Further, the vacuum pump 19 is connected to the supply port 16 through the opening / closing valve 20. A gas pressure gauge 21 for measuring the degree of vacuum (gas pressure) is connected. Then, with the open / close valve 18 closed, only the open / close valve 20 is opened and the vacuum exhaust pump 19 is operated, and the degree of vacuum of the space SPB is measured by the gas pressure gauge 21 while exhausting the space SPB.

  When the space SPB reaches an appropriate degree of vacuum, as shown in FIG. 9B, the opening / closing valve 20 is closed and only the opening / closing valve 18 is opened to supply the inert gas GS in the gas cylinder 17 to the supply port 16. To space SPB. Inert gas quickly flows from the supply port 16 into the space SPB, which has been reduced in pressure due to the differential pressure by evacuation. After supplying and filling the inert gas, the supply port 16 is hermetically sealed to complete the FPD of Example 2.

  As described above, in the case of the FPD manufacturing method according to the second embodiment, the inside of the inert gas space SPB formed by the case 15 provided with the inert gas supply port 16 is evacuated to a substantially vacuum state. Since the inert gas is supplied from the supply port 16 of the case 15 after the pressure is lowered, the inert gas is quickly supplied and filled from the outside of the supply port 16 having a higher pressure to the space SPB having a lower pressure. Therefore, according to the FPD manufacturing method of the second embodiment, insufficient filling of the space SPB with the inert gas GS can be avoided.

  Further, in the FPD manufactured in Example 2, the inert gas space SPB is filled with the inert gas GS without shortage.

  Furthermore, in the case of the FPD manufacturing method according to the second embodiment, the pressure difference between the space SPB and the outside of the supply port 16 can be sufficiently increased by evacuating the inert gas space SPB. Is supplied and filled more quickly into the inert gas space SPB.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In each of the above embodiments, the case 5 and 15 are attached to the insulating substrate 3 by the frame members 5A and 15A and the upper plates 5B and 15B. The attachment of 15 may be such that the frame members 5A and 15A are attached to the insulating substrate 3 first, and 5B and 15B are attached to the upper plate of the frame members 5A and 15A later.

  (2) In the case of each of the above embodiments, the cases 5 and 15 are constructed by assembling the two members of the frame members 5A and 15A and the upper plates 5B and 15B. It is also possible to adopt a configuration in which a single member is formed as a single unit.

  (3) In each of the above embodiments, the radiation-sensitive film 1 is a direct conversion type, but the radiation-sensitive film may be an indirect conversion type. When an indirect conversion type radiation-sensitive film is used, the radiation-sensitive film only converts incident radiation into light, so the photoelectric conversion film that converts the converted light of the radiation-sensitive film into an electrical signal is used as the radiation-sensitive film. In addition to being provided on the lower side, the bias voltage application electrode is omitted.

  (4) In the second embodiment, both the vacuum evacuation and the inert gas are performed at the supply port 16 of the case 15. However, in addition to the inert gas supply port 16, the case 15 is evacuated. A configuration may also be employed in which a mouth is provided separately and vacuum exhaust and inert gas are performed separately.

  (5) In the above embodiments, X-rays are exemplified as the radiation detected by the FPD. However, the present invention can also be applied to FPDs that detect radiation other than X-rays.

  (6) Although the supply port 6 and the discharge port 7 are provided in the upper plate 5A in the first embodiment, they may be provided in the frame material 5B. In this case, it is preferable to provide each of the corner portions of the frame member 5B opposite to each other. With this configuration, the same effects as those of the first embodiment can be obtained. Also in the case of the second embodiment, the supply port 16 may be provided in the frame member 15B.

  (7) In each of the above embodiments, the liquid material LQ is supplied and filled as the inert material filling the case 5, but a gel-like material may be used in addition to the liquid.

1 is a cross-sectional view showing an FPD according to Example 1. FIG. 1 is a plan view showing an FPD according to Embodiment 1. FIG. 3 is a flowchart showing a manufacturing process of the FPD according to the first embodiment. FIG. 6 is an explanatory diagram illustrating a manufacturing process of the FPD according to the first embodiment. It is a perspective view which shows the connection condition of the liquid material supply apparatus in the manufacturing process of FPD which concerns on Example 1. FIG. 6 is a cross-sectional view showing a manufacturing process of the FPD according to Embodiment 1. FIG. 6 is a cross-sectional view showing a manufacturing process of the FPD according to Embodiment 1. FIG. 6 is a cross-sectional view showing an FPD according to Embodiment 2. FIG. FIG. 10 is an explanatory diagram illustrating a manufacturing process of an FPD according to a second embodiment. It is sectional drawing which shows the conventional FPD. It is explanatory drawing which shows the manufacturing process of the conventional FPD.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Radiation sensitive film 2 ... Bias voltage application electrode 4 ... Inactive resin 5,15 ... Case 6, 16 ... Supply port 7 ... Discharge port 11 ... Supply tube (supply flow path)
12 ... Reservoir tube (drainage reservoir)
GS ... Inert gas LQ ... Liquid material for inert resin SPA ... Space for inert resin SPB ... Space for inert gas

Claims (5)

Supply port for supplying a liquid or gel-like inert material and an inert material so as to form a space filled with the inert material on the surface side and peripheral end surface side of the radiation-sensitive film for flat panel radiation detectors Cover the case with a discharge port that discharges the radiation sensitive film,
A connection tube is connected in communication with each of the supply channel for supplying the inert material and the supply port of the case, and the discharge port and the discharge channel,
After the inert material supplied into the space from the supply port of the case overflows from the discharge port and is supplied until the inert material accumulates in at least the connection tube of the discharge side connection tube and the discharge flow path, Cure the active material,
After the inert material is hardened, the flat tube type radiation detector is manufactured by cutting from the base on the supply port side and the discharge port side of the connection tubes.   2. The method of manufacturing a flat panel radiation detector according to claim 1, wherein a supply port is disposed below the case and an inert material is supplied in a state where a discharge port is disposed above the case. A method of manufacturing a flat panel radiation detector.   3. The flat panel radiation detector manufacturing method according to claim 1, wherein the inert material is supplied to the space from the supply port by dropping due to its own weight under atmospheric pressure. A method for manufacturing a radiation detector.   The flat panel radiation detector manufacturing method according to any one of claims 1 to 3, wherein the radiation sensitive film is a direct conversion type radiation sensitive film in which incident radiation is converted into an electric signal. A method of manufacturing a flat panel radiation detector, wherein a bias voltage application electrode is laminated on the surface of the radiation sensitive film.   A flat panel radiation detector produced by the method for producing a flat panel radiation detector according to any one of claims 1 to 4.

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