JP3877417B2 - Structure of rectangular thin electronic component packaging - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is, for example, a thermal print head in which a heating resistor is formed on the surface of a rectangular ceramic substrate, or an integrated circuit in which various electronic components are mounted on the surface of a rectangular insulating substrate. The present invention relates to a structure of a packaging body for packaging rectangular thin electronic parts using corrugated cardboard such as circuit elements.
[0002]
[Prior art]
Conventionally, a packaging material made of a synthetic resin film has been used to package the rectangular thin electronic component. However, there are problems such as disposal of the packaging material and circuit destruction of the electronic component due to static electricity.
Therefore, recently, paper products that are easy to dispose of and are not charged with static electricity have been used as packaging materials.
[0003]
That is, a loading hole for the rectangular thin electronic component is formed in the corrugated cardboard superposed on the upper surface of the paper plate forming the bottom, and the width dimension and the length dimension of the loading hole for the rectangular thin electronic component are determined. The rectangular thin electronic component is housed one by one in the loading hole.
[0004]
The loading hole for storing the electronic parts is sealed with a thin sheet for packaging or a cover plate provided on the upper surface of the cardboard, or the entire laminated body is a thin sheet packaging bag. Or it is sealed by putting it in a box or the like.
In this case, conventionally, a rectangular loading hole in the corrugated cardboard has a corrugated medium shin where two opposite inner faces of the four inner faces of the loading hole are sandwiched between both front and back liners of the cardboard. The other two inner surfaces facing each other extend in substantially parallel to the step direction in the corrugated shin, and are formed so as to extend substantially perpendicular to the step direction in the corrugated shin.
[0005]
[Problems to be solved by the invention]
However, in this way, the rectangular loading hole in the corrugated cardboard is arranged so that two opposite inner faces of the four inner faces of the rectangular loading hole are substantially parallel to the direction of the step in the corrugated center of the corrugated cardboard. If the structure is such that the remaining two opposite inner surfaces extend in a direction substantially perpendicular to the direction of the step in the corrugated corrugation of the corrugated cardboard, A corrugated cross-section of the inner shin appears on two inner surfaces of the inner surface that extend substantially perpendicular to the step direction of the corrugated corrugation of the corrugated cardboard. Of the four inner surfaces of the rectangular loading hole, but two of the inner surfaces extending substantially parallel to the direction of the step in the corrugated corrugation of the corrugated cardboard. Since the corrugated cross section of the inner shin does not appear on the surface, the thin electronic component housed in the loading hole will sink into the gap between the front and back liners of the cardboard. In addition, there is a large risk that the electronic parts cannot be easily taken out from the loading holes in the cardboard.
[0006]
In addition, in an electronic component having a lead terminal for connection to the outside among the electronic components, when this is housed in the loading hole in the cardboard, the lead terminal in the electronic component forms a bottom of the loading hole. There is also a problem that the lead terminal is bent and deformed because it comes into contact with the upper surface of the body and the inner surface of the loading hole in the cardboard.
[0007]
This invention makes it a technical subject to provide the structure of the package which eliminated these problems.
[0008]
[Means for Solving the Problems]
Claim 1 of the present invention is that the former problem among the above technical problems, that is, there is a high possibility that the electronic component is damaged such as deformation, and the electronic component is easily taken out from the loading hole in the cardboard. In order to eliminate the situation that can not be
“A cardboard is placed on the top surface of a paper plate that forms the bottom, and a loading hole for accommodating an electronic component comprising a rectangular thin substrate is placed in the cardboard. In a package formed by punching at least one rectangular shape having dimensions close to the width dimension and the length dimension in the substrate of the electronic component so that the substrate fits ,
The rectangular loading hole in the cardboard is drilled so that all four inner surfaces of the loading hole are inclined with respect to the direction of the step in the center of the cardboard. ".
[0009]
Further, claim 1 in the present invention is to solve the latter problem in addition to the former problem, that is, when the lead terminal is provided in the electronic component, the lead terminal is bent and deformed.
“ A loading hole for accommodating electronic components comprising a cardboard that is superposed on the top surface of a paper plate that forms the bottom, and that has a rectangular thin substrate and lead terminals that protrude outwardly from the substrate. At least one of the width and length of the electronic component in a rectangular shape close to the width and length of the electronic component so that the substrate of the electronic component fits in the loading hole. In a package formed by punching,
A rectangular loading hole in the cardboard is drilled such that all four inner surfaces of the loading hole are inclined with respect to the direction of the step in the center of the cardboard, and the plate-like body and the cardboard to out the portion corresponding to the lead terminal of the electronic component, is bored the lead terminal fits through hole. ".
[0010]
【The invention's effect】
According to claim 1, the corrugated cardboard is provided with a rectangular loading hole so that all four inner surfaces of the loading hole are inclined with respect to the direction of the step in the center of the corrugated cardboard. Since the corrugated cross section of the center of the corrugated cardboard appears on all four inner surfaces of the loading hole, the board of the thin electronic component housed in the loading hole is used for both the front and back liners of the corrugated cardboard. It is possible to reliably prevent dive into the gap portion between them.
[0011]
As a result, it is possible to reliably reduce the possibility that the electronic component housed in the loading hole in the cardboard may be damaged such as deformation, and that the electronic component cannot be easily removed from the loading hole in the cardboard. Has an effect.
Further, as in claim 2, the rectangular loading hole in the cardboard is drilled so that all four inner surfaces of the loading hole are inclined with respect to the direction of the step in the center of the cardboard. Then, by making a through hole into which the lead fits in a portion corresponding to the lead terminal in the electronic component of the plate-like body and the cardboard, the lead terminal in the electronic component is made into the plate-like body and the cardboard. It can be stored in a state of being fitted in the drilled through hole, and the lead terminal can be prevented from coming into contact with the plate-like body and the cardboard.
[0012]
As a result, in addition to the effect of the first aspect, even when the electronic component is provided with a lead terminal, the lead terminal has an effect that can be reliably packaged without being bent and deformed.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, drawings when an embodiment of the present invention is applied to packaging of a thermal print head will be described.
In FIG. 1, symbol A indicates a thermal print head, and this thermal print head A is formed on a ceramic head substrate A1 having a width dimension W0 and a length L0, and a top surface of the head substrate A1. The heating resistor A2 for printing and a plurality of lead terminals A3 mounted on both ends of the head substrate A1 so as to protrude outward from the head substrate A1 .
[0014]
In FIG. 1, reference numeral 1 denotes a paper plate-like body that forms the bottom of the package of the present invention. In the present embodiment, the plate-like body 1 is made of corrugated cardboard.
Further, reference numeral 2 denotes a corrugated cardboard that is superimposed on the upper surface of the plate-like body 1.
The cardboard 2 is provided with the two loading holes 3. Each of the loading holes 3 has a width dimension W1 and a length dimension L1 of the head substrate A1 of the thermal print head A and a width dimension W0 of the thermal print head A so that the head substrate A1 of the thermal print head A can be fitted therein. It is configured in a rectangular shape close to the length dimension L0.
[0015]
In this case, each of the loading holes 3 has an appropriate angle θ (for example, 45 degrees) with respect to the direction of the step in the center of the corrugated cardboard, where all four inner side surfaces 3a, 3b, 3c, 3d in the loading hole 3 are. Drill so as to be inclined at an angle with respect to the direction of the step in the middle shin. In addition to this, through holes 4 and 5 are formed in the portions of the lead terminals A3 at both ends of the head substrate A1 of the thermal print head A in the plate-like body 1 and the corrugated board 2, respectively. The lead terminal A3 is fitted in the holes 4 and 5, and is configured not to contact the plate-like body 1 and the cardboard 2.
[0016]
When the plate-like body 1 is made of cardboard as described above, the direction of the step is inclined obliquely in the direction opposite to the direction of the step in the cardboard 2, thereby making this plate-like board-like body. Therefore, it is possible to reduce the tendency of the corrugated board 2 to bend and deform easily by tilting the direction of the corrugated board 2 in which the thermal print head A is accommodated.
[0017]
In this configuration, after the corrugated cardboard 2 is overlaid on the upper surface of the plate-like body 1 (both may be fixed with an adhesive or the like in this superposed state), the inside of each loading hole 3 in the corrugated board 2 Next, the thermal print head A is accommodated.
In this case, each of the loading holes 3 in the corrugated cardboard 3 is inclined by an angle θ as appropriate with respect to the direction of the corrugated cardboard 3 in the inner surface 3a, 3b, 3c, 3d of the loading hole 3. As a result, the corrugated cross section at the center of the corrugated cardboard appears on the four inner side surfaces 3a, 3b, 3c, 3d of each loading hole 3 of the corrugated cardboard 2. Therefore, it is possible to reliably prevent the head substrate A1 of the thermal print head A accommodated in each loading hole 3 from entering the gap portion between the front and back liners of the cardboard 2.
[0018]
On the other hand, each lead terminal A3 in the thermal print head A accommodated in each loading hole 3 is fitted in the through holes 4 and 5 formed in the plate-like body 1 and the cardboard 2, and the plate-like body 1 and the corrugated board. Therefore, it is possible to reliably reduce the occurrence of bending deformation in each lead terminal A3.
Further, a cutout portion 6 is provided on one inner side surface 3a of each loading hole 3 to put a fingertip on the thermal print head A stored in the loading hole 3 when it is taken out.
[0019]
The through hole 4 formed in the plate 1, the loading hole 3 and the through hole 5 formed in the corrugated cardboard 2 are a thin sheet 7 or bottom plate for packaging provided on the lower surface of the plate 1, and Sealing is performed by sealing with a thin packaging sheet 8 or a cover provided on the upper surface of the cardboard 2, or by placing the entire laminate in a thin packaging bag or box made of packaging. Is done.
[0020]
Further, the present invention is not limited to the case of sealing as described above. As shown in FIG. 6, a plurality of laminated bodies each containing a thermal print head A after the corrugated board 2 is overlaid on the plate-like body 1 are provided. After stacking, sealing with a thin sheet 7 or bottom plate for packaging and a thin sheet 8 for packaging or a lid, or putting them all in a thin sheet packaging bag or box It may be made to seal by doing so.
[0021]
Furthermore, the integrated circuit element has a configuration in which various electronic components are mounted on the surface of a thin insulating substrate and lead terminals are mounted on the side surfaces of the thin insulating substrate, as in the thermal print head A. Needless to say, the present invention can be applied not only to the packaging of the thermal print head A but also to the packaging of the integrated circuit element.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing an embodiment of the present invention.
FIG. 2 is a perspective view showing a state in which a thermal print head is stored.
3 is an enlarged sectional view taken along line III-III in FIG.
4 is an enlarged sectional view taken along line IV-IV in FIG. 2;
5 is an enlarged sectional view taken along line VV in FIG. 2;
FIG. 6 is a perspective view showing a case of packaging in a plurality of layers.
[Explanation of symbols]
A thermal print head A1 head substrate A3 lead terminal 1 plate-like body 2 corrugated cardboard 3 loading hole 3a, 3b, 3c, 3d inner surface of loading hole 4,5 through hole 7,8 thin sheet for packaging

Claims (2)

A cardboard is stacked on the upper surface of a paper plate forming the bottom, and a loading hole for accommodating an electronic component comprising a rectangular thin substrate is placed on the cardboard, and the substrate in the electronic component is placed in the loading hole. In the package formed by punching at least one of the width dimension and the length dimension so as to fit into a rectangular shape having a dimension close to the width dimension and the length dimension of the substrate of the electronic component ,
A rectangular thin electronic component packaging, wherein a rectangular loading hole in the cardboard is formed such that all four inner surfaces of the loading hole are inclined with respect to the direction of the step in the center of the cardboard. Body structure. A cardboard is stacked on the top surface of a paper plate forming the bottom, and a loading hole for accommodating an electronic component comprising a rectangular thin substrate and a lead terminal projecting outward from the substrate is provided on the cardboard. At least one or more holes are formed in a rectangular shape having dimensions close to the width and length of the electronic component substrate so that the substrate of the electronic component fits into the loading hole. In the package formed by
A rectangular loading hole in the cardboard is drilled such that all four inner surfaces of the loading hole are inclined with respect to the direction of the step in the center of the cardboard, and the plate-like body and the cardboard to out the portion corresponding to the lead terminal in the electronic component, the structure of a rectangular thin electronic component package, characterized in that the lead terminals were bored fits through hole.

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