JP3875703B2 - Thin film removal device. - Google Patents

Description

  The present invention relates to a thin film removing apparatus used for removing an unnecessary resist film at an edge of a rectangular LCD substrate having a resist film formed on the surface thereof, for example.

  Generally, in the manufacturing process of a liquid crystal display device (LCD), in order to form, for example, an ITO (Indium Tin Oxide) thin film or an electrode pattern on the surface of a glass substrate, photolithography is performed as in the semiconductor manufacturing process. Predetermined processing is performed by technology. For example, a resist solution coating process for coating a resist solution on the surface of the substrate, an exposure process for exposing a circuit pattern to the formed resist film, and a developing process for developing the substrate after the exposure process are performed.

  Here, when performing the resist solution coating treatment, a so-called spin coating method is widely employed. In this method, a substrate is held on a spin chuck provided in a processing container, and the substrate is rotated by the spin chuck in this state, whereby a resist solution comprising a solvent and a photosensitive resin supplied to the substrate surface is centrifuged. The resist film is applied with a uniform thickness on the substrate surface by diffusing by force.

  However, when the resist solution is applied by the above spin coating method, even if the film thickness is uniform immediately after the application, the surface of the surface after the spin chuck stops rotating and the centrifugal force stops working or as time passes. Due to the influence of tension, the resist solution at the periphery of the substrate may become thicker, or the resist solution may wrap around the periphery of the lower surface of the substrate to form an unnecessary film. If a non-uniform film is formed on the peripheral edge of the substrate in this manner, the resist on the peripheral edge will remain without being completely removed during development of the circuit pattern, etc. In addition, the remaining resist may be peeled off during conveyance to generate particles.

  Therefore, conventionally, a process for removing an unnecessary film on the peripheral edge of the substrate, which is called an edge remover, is performed after applying the resist solution to remove the unnecessary film on the peripheral edge of the substrate.

  The conventional removal apparatus has a configuration as shown in FIG. The removing device 101 includes, for example, an angle-shaped upper head constituent material 102a and a lower head constituent material 102b that are vertically opposed to each other, a nozzle head 102 having a substantially U-shaped longitudinal section, and a base side of the nozzle head 102 And a suction port 103 provided in the main body. Then, as shown in FIG. 13, the upper head constituent material 102a and the lower head constituent material 102b have the edge of the substrate G positioned in the processing space S between the upper head constituent material 102a and the lower head constituent material 102b. When this is done, a needle nozzle 104 for discharging the solvent toward the portion where the unnecessary film is removed is fixed. Each of the needle nozzles 104 is supplied with a solvent under a predetermined pressure from a separate solvent supply source such as a tank 105 by pressure feeding with nitrogen gas.

The conventional needle nozzle 104 has a hollow structure in which a flow portion (not shown) having the same diameter as the discharge port is formed in a thin wire, and the diameter of the discharge port of the needle nozzle 104 generally used is used. Is about 260 μm. The pressure of the nitrogen gas applied to the tank 105 is about 1 kg / cm ^2, so that about 40 cc of solvent per minute is discharged from the needle nozzle 104 to the peripheral portions of the front and back surfaces of the substrate G, thereby unnecessary resist. The film was dissolved and removed. The discharged solvent and the dissolved resist solution are sucked from the suction port 103 and discharged to the outside.

  Then, when actually removing unnecessary films on the peripheral edge of the substrate G, as shown in FIG. 13, the removal devices 101 are arranged at the respective edges of the four sides of the substrate G, and along the longitudinal direction of each side. Then, the solvent is discharged from the needle nozzle 104 to the peripheral portion while moving the removing device 101, so that the unnecessary film on the peripheral portion of each side is removed.

  By the way, the solvent used is highly volatile and its vapor diffuses to the surroundings, so it is necessary to keep it as small as possible from the viewpoint of safety. In addition, reducing the amount of solvent used reduces the running cost and is desirable from this point.

In this regard, in order to reduce the amount of solvent used by the conventional technique, for example, the pressure applied by nitrogen gas is lowered to reduce the discharge amount. However, in the conventional needle nozzle 104, the flow in the needle nozzle 104 is reduced. The pressure loss due to the internal resistance of the road is large,
When the pressure of the nitrogen gas is reduced, the discharge pressure is significantly reduced, and the suction from the suction port 103 cannot be discharged to the predetermined edge, or the suction port 103 with respect to the predetermined edge by the suction. There was a possibility that unnecessary films could not be removed at right angles by discharging in a slanted manner.

  Even if the diameter of the flow part and the discharge port in the needle nozzle 104 is reduced, there is a limit to the reduction in processing, and the problem of pressure loss due to internal resistance still remains, and discharge is performed under stable pressure. It was difficult.

  In view of the above, it has been difficult to simply reduce the amount of solvent used with the prior art. The present invention has been made in view of the above points, and the solvent is applied to a predetermined peripheral portion of the substrate without changing the suction configuration from the suction port or changing the supply system itself by pressurization of nitrogen gas. The purpose is to provide a novel thin film removing apparatus that can discharge at right angles and can greatly reduce the amount of solvent used, and to solve the problem.

  The major problems in the prior art are pressure loss due to the use of a needle nozzle, and processing problems for forming minute diameter discharge holes. Therefore, the inventors have adopted a configuration in which the solvent is discharged without using such a needle nozzle.

In order to solve the above-mentioned problems, the present invention is directed to the unnecessary film by discharging a solvent from a solvent discharge member covering at least a part of the peripheral edge of the unnecessary film on the peripheral edge of the substrate on which the thin film is formed. The solvent discharge member is provided with a solvent reservoir for storing a solvent supplied from a solvent supply source, and the solvent reservoir is formed in the solvent discharge member, and the opening is formed in the substrate. A concave portion that faces and a metal thin plate facing the substrate in parallel with the opening being liquid-tightly closed, and a discharge hole communicating with the solvent reservoir is formed in the thin plate. The portion of the thin plate facing at least the substrate and excluding the discharge holes is a resinous cover for suppressing temperature drop in the vicinity of the discharge holes due to the latent heat of evaporation of the solvent discharged from the discharge holes. characterized in that it is covered, thin film removal It is a device.

  In this thin film removing apparatus, for example, since the discharge member itself such as the nozzle head is provided with a solvent reservoir, the solvent supplied from the solvent supply source is buffered by the solvent reservoir and discharged from the discharge hole. Is done. Therefore, even if the distance between the discharge hole and the solvent reservoir is set short, the solvent is discharged at a stable pressure, and the pressure loss can be greatly suppressed.

The solvent reservoir has a recess formed in the solvent discharge member and having an opening facing the substrate, and a metal thin plate facing the substrate parallel to the opening by liquid-tightly closing the opening. Since the discharge hole communicating with the solvent reservoir is formed in the thin plate, it is possible to easily realize the solvent reservoir that exhibits the above-described effects. Moreover, since the discharge hole is formed by drilling in a thin plate, the length of the discharge hole is the thickness of the thin plate, and pressure loss due to resistance inside the discharge hole during discharge can be almost eliminated. is there. Moreover, since the discharge hole can be formed by simply drilling a metal thin plate, it is easy to form the discharge hole, and it is possible to form a discharge hole with a much smaller diameter than the conventional one. is there. Therefore, even if the diameter of the discharge hole is reduced under the conventional discharge pressure to reduce the solvent discharge amount, the discharged solvent is not drawn to the suction port side.
If the diameter of the discharge hole is 200 μm or less, the effect of the present invention can be enjoyed more remarkably.

  Further, if the thin plate is detachable from the solvent discharge member, maintenance, replacement and the like are facilitated.

By the way, since this type of solvent is highly volatile, it evaporates to some extent when it is ejected. At this time, the ambient temperature is lowered by the latent heat of vaporization. As a result, temperature unevenness occurs at the peripheral edge of the substrate, and as a result, transfer may occur on the substrate due to the temperature unevenness. However, as in the present invention, in this case, if at least the portion of the thin plate facing the substrate and the portion excluding the discharge port is covered with a resinous cover, the resin has a higher thermal conductivity than the metal. Therefore, the temperature drop in the vicinity of the discharge port due to the latent heat of vaporization can be suppressed. Therefore, it is possible to suppress the occurrence of the transfer.

  If a plurality of discharge holes are formed, that is, if a plurality of discharge holes are connected to the solvent reservoir, the solvent can be discharged from each discharge hole with the same discharge pressure. Therefore, when a solvent reservoir is provided in a solvent discharge member such as a nozzle head, only one solvent reservoir is required. That is, the solvent can be discharged from the plurality of discharge holes to the edge portion of the substrate with the same discharge pressure by one solvent reservoir, and the film can be removed more reliably.

  If the solvent discharge member is provided in a moving mechanism that moves along the periphery of the substrate, it is possible to remove unnecessary films on the periphery of the substrate in a straight line parallel to the sides of the substrate by the movement of the moving mechanism. is there.

  In this case, when a plurality of discharge holes are formed, a plurality of discharge holes may be formed along the moving direction in the moving mechanism. That is, a plurality of discharge holes may be formed, and the plurality of discharge holes may be provided at a predetermined interval from the front to the rear in the movement direction by the moving mechanism. Then, by moving the solvent ejection member in and out of the peripheral edge of the substrate by the moving mechanism, for example, the unnecessary film region having a certain width is removed from the inner side to the outer side sequentially. It is possible to continue. Of course, even when there is a single discharge hole, it is possible to sequentially remove unnecessary films from the inside to the outside by moving the solvent discharge member in and out of the peripheral edge of the substrate. Is possible.

  Further, in each of the above thin film removing apparatuses, if a back surface cleaning mechanism is provided to face the back surface of the substrate, the back surface of the substrate can be cleaned simultaneously and individually.

According to the present invention, the pressure loss during solvent discharge can be greatly suppressed, so that it is possible to reduce the amount of solvent used by reducing the diameter of the discharge hole while maintaining the discharge pressure at the same level as before. It is. Further, even if there is a suction port near the discharge hole, it is possible to suppress the discharge direction from being drawn toward the suction port. In addition, it is possible to eliminate almost no pressure loss due to resistance inside the discharge hole when discharging. In addition, it is easy to form a discharge hole having a very small diameter. If it is covered with a resinous cover, it is possible to suppress the temperature drop around the discharge hole and to prevent the transfer based on the temperature difference from occurring on the substrate. Also, the solvent can be discharged from the plurality of discharge holes to the edge of the substrate with the same discharge pressure by one solvent reservoir, or the unnecessary film on the peripheral edge of the substrate can be removed in a straight line parallel to the side of the substrate. Is possible.
For example, by moving the solvent discharge member in and out of the periphery of the substrate by the moving mechanism, it is possible to remove an unnecessary film having a width along the periphery.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. This embodiment is provided in a removing section in a coating / peripheral section removing apparatus incorporated in a coating and developing treatment apparatus. FIG. 1 shows the appearance of the coating and developing treatment apparatus, and FIG. 2 shows the appearance of the coating and developing processing apparatus as seen from the plane.

  As shown in FIGS. 1 and 2, the coating and developing treatment apparatus 1 includes, for example, a loader unit 2 that carries in and out a rectangular LCD substrate G, a first processing unit 3 that processes the substrate G, and the first processing unit 3. A second processing unit 5 connected via the processing unit 3 and the interface unit 4, and an interface for transferring the substrate G between the second processing unit 5 and an exposure apparatus (not shown). Part 7.

  The loader unit 2 is provided with a cassette mounting table 10, which includes, for example, cassettes 11 and 11 for storing unprocessed substrates G, and a cassette 12 for storing processed substrates G, 12 can be placed in a line with the entrance / exit of the substrate G facing the first processing unit 3 side. Further, the loader unit 2 is provided with a sub-transport device 13 that can transport the substrate.

  The sub-transport device 13 is movable in the direction along the transport rail 13a (Y direction) and in the storage direction (Z direction; vertical direction) of the substrates G in the cassettes 11 and 12, and is also rotatable in the θ direction. It is comprised so that.

  In the first processing unit 3, various processing apparatuses that perform a predetermined process on the substrate G are arranged on both sides of the transport rail 16 of the main transport device 15. That is, on one side of the transport rail 16, a scrubber cleaning device 17 that cleans the substrate G taken out from each cassette 11, 11 and a development processing device 18 that performs development processing on the substrate G are arranged side by side. On the other side of the transport rail 16, an ultraviolet ozone cleaning device 19, cooling processing devices 20 and 21 for cooling the substrate G, and a heating processing device 22 for heating the substrate G are appropriately arranged in multiple stages. Loading and unloading of the substrate G to and from these various processing apparatuses is performed by a transfer arm 15 a equipped in the main transfer apparatus 15. The interface unit 4 formed between the first processing unit 3 and the second processing unit 5 described later is provided with a delivery table 23 on which a substrate G can be placed.

  In the second processing unit 5, a coating / peripheral part removing device 27 is disposed on one side of the main transport device 25 across the transport rail 26, and the substrate G is disposed on the other side of the transport rail 26. A hydrophobic treatment device 28 that performs the hydrophobic treatment, a cooling treatment device 29 that cools the substrate G, and heat treatment devices 30 and 30 are arranged in multiple stages. The main transfer device 25 is equipped with a transfer arm 25a for loading and unloading the substrate G to and from various processing devices belonging to the second processing unit 5.

  In order to adjust the tact between the coating and developing treatment apparatus 1 and the exposure apparatus (not shown), cassettes 31 and 31 for temporarily storing and waiting the substrate G, and the substrate G can be placed on the interface unit 7. A transfer table 32, cassettes 31 and 31, transfer table 32, and a sub-transfer device 33 capable of transferring the substrate G to the exposure apparatus are provided.

  The coating and developing treatment apparatus 1 is configured as described above. Next, details of the coating / peripheral edge removing device 27 will be described. In the coating / peripheral part removing device 27, a resist coating part 41 and a peripheral part removing part 51 are arranged adjacent to each other in a casing 27a. The resist coating unit 41 moves the resist nozzle 44 above the center of the substrate G adsorbed and held by the spin chuck 43 in a rotating cup 42 as a processing container to supply a resist solution, and rotates the substrate G by the spin chuck 43. Thus, the resist solution on the substrate G is diffused and applied. The substrate G thus coated with the resist solution is transported to the peripheral edge removing unit 51 by the pair of transport arms 46 that move along the transport rail 45.

  The peripheral edge removing unit 51 has a mounting table 52 on which the transported substrate G can be freely mounted, and is arranged so that the vicinity of each corner of the substrate G mounted on the mounting table 52 is a home position. The thin film removing device 61 according to the present embodiment is provided. Basically, each thin film removing device 61 has the same configuration. Each thin film removing device 61 is attached to a moving mechanism M that is movable along each corresponding side of the substrate G, that is, each peripheral edge.

  As shown in FIG. 5, the thin film removing apparatus 61 according to the present embodiment includes an upper head 63 and a lower head 64 that are substantially angled as solvent ejection members with a suction member 62 having a suction port 62a interposed therebetween. A space between the upper head 63 and the lower head 64 forms a processing space S. On the lower surface side of the upper head 63, a concave portion 65 is formed that opens to a surface facing the lower head 64, that is, a portion facing the processing space S into which the substrate G is inserted later.

  A metal, for example, stainless steel thin plate 66 that liquid-tightly closes the opening of the recess 65 is attached to the lower surface of the upper head 63, and a discharge hole 67 formed in the thin plate 66 is removed on the lower surface side of the thin plate 66. A synthetic resin cover 68 is attached to cover the part. Since the thin plate 66 and the cover 68 are fixed to the upper head 63 by bolts 69a and embedded nuts 69b, the thin plate 66 and the cover 68 are detachable from the upper head 63.

  In the present embodiment, the thin plate 66 has a thickness of 0.2 mm, and the discharge hole 67 employs a circular hole having a diameter of 50 μm. The form of the discharge hole 67 is not limited to such a circular hole, and an arbitrary form such as a triangular, square, or other polygonal shape can be adopted. The discharge holes 57 are formed in a total of four locations along a side of the substrate G at a predetermined pitch D, that is, in a direction along the peripheral edge of the substrate G. In this embodiment, D is set to 4 mm. Of course, the number of the discharge holes 67 and the pitch D can be arbitrarily set.

  A space formed by the recess 65 and the thin plate 66 constitutes a solvent reservoir X. The solvent reservoir X is supplied from a solvent supply source 71 such as a tank installed outside through the pressurization of nitrogen gas or other inert gas so that the solvent is communicated with the flow path 72 and the solvent reservoir X. It is supplied under a predetermined pressure through part 73. The supply unit 73 can be set at an arbitrary position of the upper head 63 as long as it can be supplied to the solvent reservoir X.

  The lower head 64 has exactly the same structure as the upper head 63, and the solvent reservoir X is formed by a thin plate 66 in which a recess 65 and a discharge hole 67 are formed. The thin plate 66 covers the cover except for the discharge hole 67. 68. The solvent reservoir X is pressurized with nitrogen gas or the like from a solvent supply source 71 and sent through a flow path 72 and a supply unit 73 under a predetermined pressure.

  The suction member 62 communicates with a suction means (not shown) such as a vacuum generator, for example, and the atmosphere in the processing space S is sucked and exhausted from the suction port 62a by suction by the suction means.

  As described above, the four thin film removing devices 61 according to the above configuration can be moved along the edge of each side of the substrate G by driving the moving mechanism M, and further, in the vertical direction, before and after the substrate G. It is also movable in the direction.

  The thin film removing apparatus 61 according to the present embodiment is configured as described above. Next, the operation and the like will be described. First, the substrate G to be processed from the cassette 11 of the cassette mounting table 10 in the coating and developing treatment apparatus 1. Is taken out by the sub-transport device 13, and then the substrate G is transferred to the transport arm 15a of the main transport device 15. Thereafter, the substrate G is sequentially transferred to the ultraviolet ozone cleaning device 19, the scrubber cleaning device 17, and the hydrophobic treatment device 28, and predetermined processing is sequentially performed in these devices. Then, the substrate G that has been subjected to the hydrophobization process is transported to the coating / peripheral edge removing device 27 by the transport arm 25a.

  In the coating / peripheral part removing device 27, first, a resist solution is applied to the substrate G by a spin coating method in the resist coating unit 46. Thereafter, the resist solution film, that is, the substrate G on which the resist film is formed, is transported by the transport arm 46 to the mounting table 52 of the peripheral edge removing unit 51.

  When the substrate G is mounted on the mounting table 52, each thin film removing device 61 moves one end of each edge of the substrate G to each processing space S as shown in FIG. Move to the predetermined start position. The front side thin film removing apparatus 61 shown in FIG. 4 will be described as an example. The thin film removing apparatus 61 moves to the START position shown in the figure.

Thereafter, when the solvent in the processing space S is sucked from the suction port 62a and the solvent is supplied from the solvent supply source 71 to the solvent reservoir X at a predetermined pressure, for example, 1 kg / cm ² , FIG. As shown in FIG. 8, the solvent is ejected at right angles to the unnecessary resist film on the front and back surfaces of the peripheral portion of the substrate G from the respective ejection holes 67 of the upper head 63 and the lower head 64 in a thin thread form. R is dissolved and removed. The discharged solvent, dissolved resist solution, mist of each solution, etc. are discharged from the suction port 62a. Then, by moving each thin film removing device 61 along each side of the substrate G by the moving mechanism M, the unnecessary resist film on the peripheral edge of each side of the substrate G is dissolved and removed in a straight line along the thin film removing device 61. It is going to be done. In accordance with the example shown in FIG. 4, the unnecessary resist film R on the peripheral portion is removed by moving the thin film removing device 61 along the peripheral portion from the START position to the END position.

  The resist film may be removed by reciprocating the thin film removing device 61 several times while shifting the solvent discharge position toward the edge of the substrate G. In this case, in FIG. 4, the thin film removing device 61 is moved from the START point to the END point, and after the resist film is cut off, the solvent discharge is shifted in the direction indicated by the dotted arrow in FIG. The operation of moving from END to END is performed. That is, each time the movement from the START point to the END point, the solvent discharge position is appropriately shifted in the direction indicated by the dotted arrow. In this case, for example, with respect to the thin film removing device 61 on the near side in FIG. 4, an operation of shifting the thin film removing device 61 itself for each movement may be performed toward the near side in the X direction.

  In such dissolution and removal, the discharged solvent is discharged from the solvent reservoir X through the discharge hole 67 formed in the thin plate 66 in a direction perpendicular to the resist film of the substrate G. Since there is almost no discharge at a predetermined pressure that is stable. Therefore, even when the atmosphere is sucked from the suction port 62a, the resist film R is discharged almost vertically, so that the unnecessary resist film R can be dissolved and removed in a suitable shape.

  In addition, since the solvent reservoir X also functions as a header, the same amount of solvent is discharged from the discharge holes 67 formed at four locations on the upper head 63 and the lower head 64, respectively, at the same pressure. . Therefore, also from this point, it is possible to carry out a preferable dissolution and removal operation of the unnecessary resist film R.

In addition, since the diameter of the discharge hole 67 is 50 μm, which is much smaller than the conventional diameter, naturally the amount of solvent discharged under the same discharge pressure as in the prior art is reduced. According to the knowledge of the inventors, when a conventional needle nozzle having a diameter of 260 μm was used, a solvent of 40 cc / min was discharged at a discharge pressure of 1 kg / cm ² , but 50 μm as in the present embodiment. According to the discharge hole 67 having the diameter, the amount of the solvent discharged to the amount of about 1/10 with the discharge pressure of 1 kg / cm ² can be reduced.

  By the way, in this embodiment, since stainless steel is used as the thin plate, it is possible to form the discharge hole 67 having an extremely small diameter. However, since stainless steel has a high heat transfer coefficient, it is volatile. It can be easily cooled by the latent heat of vaporization when the solvent evaporates, and sometimes the ambient atmosphere in the processing space S is cooled to cause a temperature difference from the atmosphere, and transfer to the substrate G is caused by the temperature difference. It is done. However, in the present embodiment, since the synthetic resin cover 68 covers the thin plate 66, transfer based on the temperature difference due to the latent heat of vaporization is prevented.

  Further, since the thin plate 66 and the cover 66 are fixed by bolts 69, they can be attached to and detached from the upper head 63 and the lower head 64, and maintenance, cleaning, replacement, etc. can be easily performed. In addition, from a structural point of view, the solvent reservoir X can be simply constructed by forming the recess 65 in the upper head 63 and the lower head 64 and closing the opening liquid-tightly with a thin plate 66 having a discharge hole 67 formed therein. Manufacturing is also easy.

Of course, the present invention is not limited to the above-described embodiment, and various embodiments can be proposed without departing from the scope of the invention.
For example, in the above embodiment, as shown in FIG. 6, the discharge holes 67 are provided on the straight line along the moving direction of the thin film removing device 61 at a predetermined interval. However, the present invention is not limited to this. For example, the configuration shown in FIG.

  That is, in the configuration shown in FIG. 9, the plurality of first to fourth ejection holes 67a to 67d are provided so as to gradually approach the outer edge 74 of the substrate G from the front to the rear in the traveling direction of the thin film removing device 61. ing. In such a configuration, first, the resist liquid film is cut by discharging the solvent from the first discharge hole 67a, and then the outer edge of the substrate G by discharging the solvent from the second to fourth discharge holes 67a to 67d. 74 can be removed. That is, a single unnecessary movement from the START point to the END point makes it possible to remove unnecessary wide resist films.

  According to such a configuration, since the solvent is not sprayed only on the same portion, the phenomenon that the edge of the residual resist film swells due to swelling can be prevented. That is, in the case where it is difficult for the solvent to evaporate from the resist liquid film as in the case of the LCD substrate G, if the solvent is continuously sprayed on the same part, the solvent is absorbed into the resist liquid film in this part, and this may cause swell. In contrast, the above configuration can prevent such a phenomenon from occurring. Further, unlike the embodiment described above, it is not necessary to move the thin film removing device 61 itself in a direction orthogonal to the side of the substrate G.

  In order to prevent this swelling, it is also effective to provide a reduced-pressure drying apparatus 80 (DV) between the resist coating part 41 and the peripheral part removing part 51 as shown in FIG. The vacuum drying apparatus 80 receives the LCD substrate G coated with the resist solution from the resist coating unit 41 via the arm 46, and depressurizes the atmosphere around the LCD substrate G to remove the solvent contained in the resist solution. It has the function of evaporating and drying this resist solution

  The substrate G dried under reduced pressure by the reduced pressure drying apparatus 80 is delivered to the peripheral portion removing unit 51 by the arm 46. Since the resist film on the substrate G has already been dried to some extent, when the resist film is removed using the thin film removing device 61, there is an effect that less swelling occurs.

  In the above-described embodiment, the upper and lower heads 63 and 64 are formed in the same shape, but it is not necessary to configure the upper and lower heads 63 and 64 in the same shape. For example, as shown in FIG. 11, only the lower head 64 may be formed to protrude longer, and the discharge holes 83 and 84 may be added to the protruding side. According to such a configuration, the back surface of the substrate G can be cleaned in a wider range.

  Further, it is not necessary to discharge the solvent from the upper head 63 and the lower head 64 at the same timing. For example, in the case of back surface cleaning, the START point, END in FIG. The solvent may be discharged from the lower head 64 toward the back surface of the substrate G only near the point.

  The embodiment has been embodied as an apparatus for removing an unnecessary resist film on the peripheral portion of an LCD substrate. However, the present invention is not limited to this, and various thin films formed on other types of substrates. Can be applied to a device that removes the solvent by discharging a solvent, that is, a solution for dissolving the thin film.

It is a perspective view which shows the external appearance of the coating and developing treatment apparatus by which the thin film removal apparatus concerning this Embodiment is employ | adopted. FIG. 2 is a plan view of the coating and developing treatment apparatus of FIG. 1. It is a top view which shows the mode inside the coating and peripheral part removal apparatus which has a thin film removal apparatus concerning this Embodiment. It is a perspective view of the peripheral part removal part explaining the movement of the thin film removal apparatus concerning this Embodiment. It is a longitudinal cross-sectional view of the thin film removal apparatus concerning this Embodiment. It is the sectional view on the AA line of FIG. It is a longitudinal cross-sectional view of the thin film removal apparatus concerning this Embodiment when the unnecessary resist film on a board | substrate is removed. It is a principal part expanded longitudinal cross-sectional view of the thin film removal apparatus of FIG. It is explanatory drawing which shows the example which shifted the position of each discharge hole to the edge part side of the board | substrate from the moving direction front of a thin film removal apparatus to back. It is a top view which shows the mode inside the peripheral part removal apparatus which has a reduced pressure drying apparatus. It is explanatory drawing of the longitudinal cross-section of the thin film removal apparatus of the structure where the lower head protruded rather than the upper head. It is a longitudinal cross-sectional view of the thin film removal apparatus concerning a prior art. It is explanatory drawing explaining a motion of the thin film removal apparatus concerning a prior art. The

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Application | coating development processing apparatus 27 Application | coating and peripheral part removal apparatus 51 Peripheral part removal part 61 Thin film removal apparatus 62 Suction member 62a Suction port 63 Upper head 64 Lower head 65 Recessed part 66 Thin plate 67 Discharge hole 68 Cover 69 Bolt 71 Solvent supply source 72 Flow Path 73 Supply section G Substrate S Processing space X Solvent reservoir

Claims (7)

An apparatus for removing the unnecessary film by discharging a solvent from a solvent discharge member covering at least a part of the peripheral edge with respect to an unnecessary film on the peripheral edge of the substrate on which the thin film is formed,
The solvent discharge member is provided with a solvent reservoir for storing a solvent supplied from a solvent supply source,
The solvent reservoir is a recess formed in the solvent discharge member and having an opening facing the substrate;
A metal sheet that closes the opening in a liquid-tight manner and faces the substrate in parallel;
A discharge hole communicating with the solvent reservoir is formed in the thin plate,
At least the portion of the thin plate facing the substrate and excluding the discharge holes is covered with a resinous cover for suppressing temperature drop in the vicinity of the discharge holes due to the latent heat of evaporation of the solvent discharged from the discharge holes. A thin film removal device characterized by The thin film removing apparatus according to claim 1, wherein the thin plate is detachable from the solvent discharge member. The thin film removing apparatus according to claim 1, wherein a diameter of the discharge hole is 200 μm or less . The thin film removing apparatus according to claim 1, wherein a plurality of discharge holes are formed . 5. The thin film removing apparatus according to claim 1, wherein the solvent discharge member is provided in a moving mechanism that moves along a peripheral edge of the substrate . 6. The thin film removing apparatus according to claim 5 , wherein a plurality of discharge holes are formed, and the plurality of discharge holes are provided at predetermined intervals from the front to the rear in the moving direction of the moving mechanism. . The thin film removing apparatus according to any one of claims 1 to 6, further comprising a back surface cleaning mechanism facing the back surface of the substrate .

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