JP3874519B2 - SMD type coil and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an SMD type coil used for general electronic devices such as a mobile phone, a PHS, and a communication device, and a manufacturing method thereof.
[0002]
[Prior art]
In recent years, electronic devices have been pursued to be smaller and lighter with higher performance and more functions. Examples are mobile phones, PHS, and communication devices. Closed magnetic circuit type cylindrical coils used in these electronic devices are also required to be reduced in size and thickness, and surface mounting devices (SMD) are indispensable.
[0003]
An inductor is an impedance element that uses an electromagnetic action generated by passing a current through a conducting wire wound around a core made of a magnetic material such as ferrite or permalloy. The SMD type chip coil is disclosed in Japanese Patent Application No. 9-49586 (filing date, February 19, 1997) previously filed by the present applicant. The outline will be described below with reference to the drawings.
[0004]
FIG. 18 is a perspective view of the chip coil. In the figure, 10 is a chip coil. The chip coil 10 includes an inductance element 11 and a circuit board 12, and the inductance element 11 includes a coil portion 3a in which a coil 3 is wound a predetermined number of turns on a rod-shaped core 2 made of a magnetic material such as ferrite or permalloy, The coil portion 3a is formed by terminal processing with solder to form a winding start end portion 3b and a winding end end portion 3c. The circuit board 12 has a pair of upper surface electrodes 13a and 13b and lower surface electrodes (14a and 14b) opposed to the upper and lower surfaces of an insulating substrate made of glass epoxy resin, etc. 14 are connected via semicircular vertical patterns 15a and (15b) formed by cutting along a cut line. After connecting the winding start end 3b of the inductance element 11 to one upper surface electrode 13a formed on the circuit board 12 and the winding end end 3c to the other electrode 13b by fixing means such as solder 16, The chip coil 10 is configured by covering the entire surface of the inductance element 11 with a thermosetting sealing resin 17.
[0005]
[Problems to be solved by the invention]
However, the structure of the chip coil described above has the following problems. That is, since the chip coil is open loop and no shield measures are taken, there is a problem that the surrounding electronic equipment may malfunction due to electromagnetic noise generated from the coil.
[0006]
The present invention has been made in view of the above-described conventional problems, and its purpose is to mount a closed magnetic circuit type cylindrical coil by being submerged in a coil storage portion formed on a collective insulating substrate, resin-sealed, and divided. A large number of SMD type coils that do not generate a single noise are produced. The present invention provides a closed magnetic circuit, a small, ultra-thin and inexpensive SMD type coil and a manufacturing method thereof.
[0007]
[Means for Solving the Problems]
  In order to achieve the above object, the SMD type coil in the present invention is:An insulating substrate made of glass epoxy resin or the like; an opening formed in the insulating substrate that houses a closed magnetic circuit type cylindrical coil; an electrode pattern for surface mounting formed on the insulating substrate; Two terminals having one end side of the closed magnetic circuit type cylindrical coil connected to the electrode pattern, and an adhesive sheet attached to the lower surface of the insulating substrate so as to close the opening of the through hole,
The closed magnetic path type cylindrical coil isStore in the openingBe doneWithIn the openingThe adhesive sheetsurfaceInPastedPositioningdo itFixationIs,
The two terminals on the electrode patternButConnectionBeen,
Sealed with sealing resinHas beenIt is characterized by this.
[0009]
  Also,An insulating substrate made of glass epoxy resin, etc.,Formed on the insulating substrateAn upper surface electrode pattern, one small piece insulating substrate having a substantially rectangular shape in which a through-hole electrode connected to the upper surface electrode pattern is formed, and the other small piece insulating substrate having substantially the same shape as the one small piece insulating substrate,The two small piece insulating substrates are arranged opposite to each other with a predetermined interval so that both the through-hole electrodes are positioned in the outer direction, and an adhesive sheet is fixed.SaidAn opening formed by opposingly placing the two small-piece insulating substrates on an adhesive sheet, and the closed magnetic circuit type cylindrical coilStore in the openingDoWithExposed in the openingIt is characterized in that it is positioned and fixed on the pressure-sensitive adhesive sheet, a terminal of a closed magnetic circuit type cylindrical coil is connected to an upper surface electrode pattern formed on the one small piece insulating substrate, and sealed with a sealing resin. .
[0010]
Further, after the sealing resin is filled, a plate-like member is placed on the upper surface of the cylindrical bobbin of the closed magnetic path type cylindrical coil and cured to cure the resin.
[0013]
Further, the amount of the sealing resin is characterized in that a part of the cylindrical bobbin of the closed magnetic circuit type cylindrical coil is the same surface as the resin or slightly exposed.
[0014]
  In the SMD type coil manufacturing method of the present invention, a plurality of cylindrical bobbins of a closed magnetic circuit type cylindrical coil are accommodated on the plane of a collective insulating substrate made of glass epoxy resin or the like.PenetrateA collective insulating substrate processing step in which a plurality of openings are formed and a plurality of through holes for connecting an upper surface electrode pattern are formed between the columns, and an entire surface of the collective insulating substrate including an inner surface of the through holes by plating. A plating process for forming a plating layer on the electrode, a plating resist is added, exposure and development is performed with a pattern mask, pattern etching is performed, and an electrode pattern forming process for forming a through-hole electrode in the top electrode pattern and the through-hole; Adhesive sheet with a through hole formed at the same position as the through holeThrough the above stepsCollective insulation boardBottomOn the side,So as to close the opening that penetrates,Adhesive sheet attaching step for attaching the through hole and the hole position of the through hole together,The lower surface was blocked by the adhesive sheetSupplying a closed magnetic circuit type cylindrical coil to the opening in the same directionShiThe cylindrical bobbinOf the openingAffixed to the adhesive sheetPositioningA closed magnetic path type cylindrical coil supplying step, a mounting step of connecting the terminal of the closed magnetic path type cylindrical coil to the upper surface electrode pattern of the collective insulating substrate by a fixing means such as soldering, thermocompression bonding, and the like,After each processA resin supply step of placing a resin molding form around the assembly insulating substrate and filling a sealing resin such as epoxy, and an upper surface of a cylindrical bobbin of the closed magnetic path type cylindrical coil in the resin molding form The resin sealing step for curing the filling sealing resin by placing and curing the plate-like member on the surface, and after the sealing resin is cured,After each processLeave the adhesive sheet on the lower surface side of the collective insulating substrate as it is, and use a dicing machine or slicing machine to remove the plate-like member.Through the above stepsCutting that cuts along a cut line that passes through the substantially central portion of the through hole of the collective insulating substrate and a single closed magnetic circuit type cylindrical coil that is orthogonal to the cut line, and divides it into a single SMD type coil. It consists of a process.
[0019]
  In addition, the cylindrical bobbins of a plurality of closed magnetic circuit type cylindrical coils are accommodated on the plane of the collective insulating substrate.PenetrateAn opening, a collective insulating substrate processing step for forming a plurality of through holes for connecting the upper surface electrode pattern, the upper surface electrode pattern, and an electrode pattern forming step for forming a through hole electrode;Through the above stepsOn the back side of the collective insulating substrate,So as to close the opening that penetrates,An adhesive sheet having a through hole formed at the same position as the through holeAfter each processCollective insulation boardunderOn the face sideSo as to close the opening that penetrates,A pressure-sensitive adhesive sheet attaching step for attaching the through holes and the two through holes at the same position;The lower surface was blocked by the adhesive sheetSupplying a closed magnetic circuit type cylindrical coil to the opening in the same directionShi, Stick the cylindrical bobbin on the adhesive sheet surfacePositioningA closed magnetic path type cylindrical coil supplying step, a mounting step of mounting the terminal of the closed magnetic path type cylindrical coil on the upper surface electrode pattern of the collective insulating substrate by a fixing means such as soldering, thermocompression bonding, and the like,After each processA resin molding mold is placed around the assembly insulating substrate, filled with a sealing resin such as epoxy, cured, and cured, and after the sealing resin is cured, on the lower surface side of the assembly insulating substrate Leave the adhesive sheet as it is and use a dicing machine or slicing machine.Through the above stepsCutting that cuts along a cut line that passes through the substantially central portion of the through hole of the collective insulating substrate and a single closed magnetic circuit type cylindrical coil that is orthogonal to the cut line, and divides it into a single SMD type coil. It consists of a process.
[0020]
Also, a collective insulating substrate processing step for forming an opening for accommodating a cylindrical bobbin of a plurality of closed magnetic circuit type cylindrical coils on a plane of the collective insulating substrate, and a plurality of through holes for connecting an upper surface electrode pattern; An electrode pattern forming step for forming an upper surface electrode pattern of the collective insulating substrate and a through-hole electrode; and an adhesive sheet having substantially the same size as the collective insulating substrate and having no through hole corresponding to the through-hole. Adhesive sheet pasting process to be pasted on the back side of the substrate, and a closed magnetic circuit type cylindrical coil is supplied and positioned in the same direction in the opening formed in the collective insulating substrate, and the cylindrical bobbin is pasted on the adhesive sheet surface A closed magnetic path type cylindrical coil supplying step, a mounting step of connecting the terminal of the closed magnetic path type cylindrical coil to the upper surface electrode pattern of the collective insulating substrate by a fixing means such as soldering, thermocompression bonding, and the like, A resin molding step is arranged around the insulating substrate, and a resin supply step of filling a sealing resin such as epoxy, and an upper surface of the cylindrical bobbin of the closed magnetic path type cylindrical coil in the resin molding die Placing and curing to apply a plate-like member, and curing the filling sealing resin; after curing the sealing resin, the adhesive sheet on the lower surface side of the collective insulating substrate is peeled off while leaving the plate-like member. And a cutting process in which a dicing machine or a slicing machine cuts along two orthogonal cut lines passing through substantially the central part of the through hole of the collective insulating substrate and divides it into a single SMD type coil. The manufacturing method of the SMD type coil characterized by these.
[0021]
Further, after the resin sealing step, a peeling step of removing both the plate-like member and the adhesive sheet on the lower surface side of the collective insulating substrate, and a substantially dicing machine or slicing machine that passes through the substantially central portion of the through hole of the collective insulating substrate. It is characterized by comprising a cut line and a cutting step of cutting along a cut line including one closed magnetic circuit type cylindrical coil orthogonal to the cut line and dividing it into a single SMD type coil. .
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the SMD type coil and the manufacturing method thereof according to the present invention will be described with reference to the drawings. 1 to 11 relate to an SMD type coil and a manufacturing method thereof according to a first embodiment of the present invention, FIG. 1 shows a single SMD type coil, FIG. 1 (a) is a plan view, FIG. 1 (b) is a cross-sectional view taken along line AA in FIG. 1 (a). FIG. 2 is a perspective view of a single SMD coil. FIG. 3 is a cross-sectional view of a closed magnetic circuit type cylindrical coil. FIG. 4 is a partially enlarged perspective view showing a processing step of the collective insulating substrate and an electrode pattern forming step. FIG. 5 is a partially enlarged perspective view of the adhesive sheet that has been punched. FIG. 6 is a partially enlarged perspective view showing a sticking step of sticking an adhesive sheet to a collective insulating substrate and a supplying step of a closed magnetic circuit type cylindrical coil. FIG. 7 is a partially enlarged perspective view showing a solder mounting process. FIG. 8 is a partially enlarged perspective view showing a resin supply process. FIG. 9 is a partially enlarged perspective view showing a resin sealing step. FIG. 10 is a partially enlarged perspective view showing a peeling process. FIG. 11 is a partially enlarged perspective view showing the dicing process. In the figure, the same members as those in the prior art are denoted by the same reference numerals.
[0023]
In FIG. 1, 20 is an SMD type coil. Reference numeral 21 denotes an insulating substrate made of glass epoxy resin or the like, and the insulating substrate 21 has an opening 21a for accommodating a closed magnetic circuit type cylindrical coil 5 described later. Further, an upper electrode pattern 22a, a lower electrode pattern 22b, and a side electrode pattern 22c are formed on the surface of the insulating substrate 21. An adhesive sheet 23 is attached to the lower surface of the insulating substrate 21 so as to close the opening 21a. The closed magnetic path type cylindrical coil 5 is positioned in the opening 21 a and the cylindrical bobbin 4 is attached to the surface of the adhesive sheet 23. The terminals 3b and 3c at the start and end of winding of the closed magnetic circuit type cylindrical coil 5 are soldered to the electrode pattern formed on the insulating substrate 21 and connected by fixing means such as thermocompression bonding.
[0024]
The upper surface of the closed magnetic circuit type cylindrical coil 5 except the upper surface electrode pattern 22a of the insulating substrate 21, the connecting portions of the terminals 3b and 3c, and the opening 21a are filled with a sealing resin 17 such as an epoxy resin and sealed.
[0025]
As shown in FIG. 3, the closed magnetic path type cylindrical coil 5 has a coil core 2 made of a magnetic material such as permalloy, and has flanges 2a and 2b at both ends thereof, and the flange 2a, The slit 2c which processes a coil terminal is formed in 2b, respectively. Reference numeral 3 denotes a coil, which has a coil portion 3a on the coil core 2 (bar-shaped core) by leaving the flange portions 2a and 2b and winding the coil 3 a predetermined number of turns. The core portion 1 is configured by guiding the winding start terminal 3b and the winding end terminal 3c of the coil portion 3a to the slit 2c to perform terminal processing.
[0026]
Reference numeral 4 denotes a cylindrical bobbin made of a metal magnetic material such as permalloy or iron having a thickness of about 0.1 to 0.2 mm, for example. The cylindrical bobbin 4 is a bottomed cylindrical case into which the core portion 1 is inserted. The narrowed portions 4 a and 4 b that are convex on the inner diameter side of the cylindrical portion are provided on both end flange portions 2 a and 2 b of the core portion 1. It is formed at a corresponding position where it abuts. The inner diameters of the narrowed portions 4 a and 4 b are set so as to be press-fitted and fixed to both end flange portions 2 a and 2 b of the core portion 1. Thus, the closed magnetic path type cylindrical coil 5 is completed.
[0027]
The SMD type coil 20 completed as described above leaves the adhesive sheet 23 on the lower surface to prevent a short circuit with the wiring pattern of the mother board, and it is easy to sort the finished product with the sensor by coloring the adhesive sheet 23. That is. Even if the pressure-sensitive adhesive sheet 23 is left on the back surface of the SMD type coil 20, the pressure-sensitive adhesive sheet 23 is extremely thin and can be easily electrically connected to a wiring pattern of a mother board (not shown) such as a printed board by soldering or the like. Since the completed SMD type coil 20 forms a closed magnetic circuit with a cylindrical bobbin, noise does not occur. Compared with the conventional product, it can be made small and thin over the entire thickness, width and length.
[0028]
Next, a method for manufacturing the SMD type coil having the above configuration will be described with reference to FIGS. In FIG. 4, reference numeral 21 </ b> A denotes a collective insulating substrate made of glass epoxy resin or the like that is taken in large numbers. In the process of processing the collective insulating substrate 21A, a plurality of rows of openings 21a for accommodating the cylindrical bobbins 4 of the plurality of closed magnetic circuit type cylindrical coils 5 are formed at predetermined positions on the plane of the collective insulating substrate 21A. A plurality of elongated hole through holes 24 are formed between the rows of the portions 21a by machining means such as NC cutting or pressing. The long hole through holes 24 between the rows are formed on a cut line in the X direction to be described later.
[0029]
Next, in the electrode pattern forming step, after cleaning the entire surface of the collective insulating substrate 21A, a copper plating layer is formed on the entire surface by electroless plating. Further, in the etching process, a plating resist is added, and a pattern mask is used. Through exposure and development, the upper electrode pattern 22a and the lower electrode pattern 22b (FIG. 1) of the collective insulating substrate 21A are formed, and the through hole electrode 22c that connects the upper and lower electrode patterns 22a and 22b to the wall surface of the long hole through hole 24. (Side electrode pattern in FIG. 1) is formed. On the electrode pattern thus formed, a nickel plating layer is formed by electrolytic plating, and further a gold plating layer is formed thereon by electrolytic plating, thereby completing the electrode pattern.
[0030]
In FIG. 5, reference numeral 23 denotes an adhesive sheet, and a plurality of elongated through holes 23a are formed at the same positions as the elongated hole through holes 24 formed in the collective insulating substrate 21A.
[0031]
In addition, in the case of the SMD type coil of the type which peeled the adhesive sheet 23 stuck on the back surface after the resin sealing process which will be described later, and then divided into a single unit in the dicing process, an elongated hole-like through hole 23a is formed in the adhesive sheet 23. Needless to say, there is no need to form.
[0032]
In FIG. 6, the adhesive sheet attaching step aligns the elongated hole-like through hole 23a of the adhesive sheet 23 with the elongated hole through hole 24 of the collective insulating substrate 21A, and places it on the back side of the collective insulating substrate 21A. Adhesive sheet 23 is affixed.
[0033]
Next, in the closed magnetic path type cylindrical coil supplying step, the closed magnetic path type cylindrical coil 5 is supplied and positioned in the same direction by an automatic mounting machine or manually in the opening 21a formed in the collective insulating substrate 21A. The shaped bobbin 4 is affixed to the adhesive sheet 23 surface.
[0034]
In FIG. 7, in the mounting process, the terminals 3b and 3c of the closed magnetic circuit type cylindrical coil 5 are connected to the upper surface electrode pattern 22a formed on the collective insulating substrate 21A by a fixing means such as soldering by solder 16 or thermocompression bonding. To do.
[0035]
In FIG. 8, in the resin supply process, care is taken that the sealing resin 17 is not filled in the long hole through hole 24, and a resin molding mold is formed around the inner side of the long hole through hole 24 of the collective insulating substrate 21A. 25 is placed and filled with a sealing resin 17 such as epoxy. It goes without saying that the sealing resin 17 may be injected by surrounding the periphery with a tape instead of placing the resin molding mold 25. When a plate-like member described later is placed on the upper surface of the cylindrical bobbin 4 of the closed magnetic circuit type cylindrical coil 5 and surrounded by a tape, a resin injection port is provided in a part of the tape and sealed. Resin 17 is injected.
[0036]
In FIG. 9, in the resin sealing step, the plate-like member 26 is placed on the upper surface of the cylindrical bobbin 4 of the closed magnetic path type cylindrical coil 5 in the resin molding mold 25 so as to be cured and filled and sealed. Cure the stop resin. The plate member 26 is placed in order to make the surface of the filled internal resin uniform. The amount of the sealing resin 17 is such that a part of the cylindrical bobbin 4 of the closed magnetic circuit type cylindrical coil 5 is on the same surface as the resin or slightly exposed.
[0037]
In FIG. 10, in the peeling step, after the sealing resin 17 is cured, the plate-like member 26 is peeled off, and the resin molding mold 25 is removed, and the adhesive sheet 23 on the lower surface side of the collective insulating substrate 21A is left as it is. Thus, the SMD type coil assembly 20A is formed.
[0038]
In FIG. 11, the dicing process is performed by a dicing machine or a slicing machine, a cut line 27 in the X direction passing through the substantially central portion of the long hole through hole 24 of the collective insulating substrate 21A, and a single closed magnetic circuit type cylindrical shape orthogonal to the cut line 27. It cuts along the cut line 28 of the Y direction containing a coil (5), and is divided | segmented into the single-piece | unit SMD type | mold coil 20. FIG.
[0039]
In FIG. 2 described above, the reason why the adhesive sheet 23 is left on the lower surface side of the divided SMD type coil 20 is to prevent a short circuit with the wiring pattern of the mother board when mounted on the mother board as described above. When the front and back of the finished product are sorted, if the adhesive sheet 23 is colored, it is easy to sort with a sensor. According to this manufacturing method, since the closed magnetic circuit type cylindrical coil 5 is positioned by the adhesive sheet 23, it can be mounted by a very general mounter, so that no dedicated device is required. The position of the closed magnetic path type cylindrical coil 5 is determined by the accuracy of the mounter and is not affected by the accuracy of the guide hole as in the prior art.
[0040]
As described above, the SMD type coil according to the second embodiment of the present invention has a plate shape placed after injecting a sealing resin in order to make the surface of the internal resin filled in the resin molding mold uniform. The member is left as it is without peeling off. That is, it is a product having both a plate-like member and an adhesive sheet. This is advantageous in that, when another electronic component is placed close to the upper part of the SMD type coil, it is useful for preventing a short circuit and at the same time, the mounting is ensured.
[0041]
The SMD type coil according to the third embodiment of the present invention is obtained by removing the adhesive sheet on the back side from the SMD type coil described in the second embodiment, leaving the upper plate member. Can be thin.
[0042]
The SMD type coil according to the fourth embodiment of the present invention is obtained by removing the adhesive sheet on the back side from the SMD type coil described in the first embodiment, that is, the plate member and the adhesive. It is a product with both sheets removed, and can be made thinner.
[0043]
In the above-described SMD type coil, the plate-like member was peeled after the resin sealing step, but the sealing step of the plate-like member is performed by sealing without using the plate-like member during the resin sealing step. Needless to say, it is unnecessary.
[0044]
In the above-described SMD type coil of the present invention, an SMD type coil in which through holes are formed at the four corners of the substrate and the electrode pattern is simplified as shown in FIGS. To do.
[0045]
12A is a plan view of an SMD type coil according to the fifth embodiment of the present invention, FIG. 12B is a cross-sectional view taken along the line BB of FIG. 12A, and FIG. 12 is a perspective view of FIG. In the figure, 30 is an SMD type coil, and 31 is one small piece insulating substrate having a substantially rectangular shape made of glass epoxy resin or the like. On the upper surface of the one small piece insulating substrate 31, there are formed upper surface electrode patterns 31a and 31b and through-hole electrodes 31c and 31d connected to the upper surface electrode patterns 31a and 31b, respectively. Reference numeral 32 denotes another small piece insulating substrate made of glass epoxy resin or the like having substantially the same shape as the one small piece insulating substrate 31. On the other small piece insulating substrate 32, through-hole electrodes 32c and 32d are formed. 33 is an adhesive sheet. The two small-piece insulating substrates 31 and 32 are arranged on the adhesive sheet 33 so that the through-hole electrodes face outward to form an opening 34 for accommodating the cylindrical bobbin 4 of the closed magnetic circuit type cylindrical coil 5. .
[0046]
The closed magnetic path type cylindrical coil 5 is positioned in the opening 34 and fixed by attaching the cylindrical bobbin 4 to the surface of the adhesive sheet 33. The terminals 3b and 3c of the closed magnetic circuit type cylindrical coil 5 are connected to the upper surface electrode patterns 31a and 31b formed on the one small piece insulating substrate 31 by soldering with solder 16 or fixing means such as thermocompression bonding.
[0047]
Except for the through-hole electrodes 31c, 31d and 32c, 32d of the two small-piece insulating substrates 31 and 32, on the upper surface of the closed magnetic circuit type cylindrical coil 5, the connection portion of the coil terminals 3b and 3c, the opening 34 and the upper surface of the through-hole. A sealing resin 17 such as an epoxy resin is filled and sealed. In order to prevent the sealing resin 17 from being filled into the through-hole electrodes 31c, 31d and 32c, 32d, the upper surface of the through-hole is previously masked with a mask member (not shown). The mask is filled with sealing resin 17.
[0048]
The SMD type coil 30 completed as described above does not have the adhesive sheet 33 at the four through-hole electrodes 31c, 31d and 32c, 32d, but the adhesive sheet 33 is extremely thin. Electrical connection such as solder can be easily made with the pattern. As described above, the adhesive sheet 33 is left on the lower surface of the SMD type coil 30 to prevent a short circuit with the wiring pattern of the mother board, and because the adhesive sheet 33 is colored, the front and back of the finished product can be easily selected by the sensor. It is. The completed SMD type coil 30 can be further reduced in size and thickness.
[0049]
Next, a method for manufacturing the SMD type coil having the above configuration will be described with reference to FIGS. In FIG. 13, reference numeral 40 denotes a collective insulating substrate made of a glass epoxy resin or the like to be obtained in large numbers. The processing steps of the collective insulating substrate 40 are the same as those in the first embodiment described above, and the cylindrical bobbins 4 of the plurality of closed magnetic circuit type cylindrical coils 5 are placed at predetermined positions on the plane of the collective insulating substrate 40. A plurality of openings 34 to be accommodated are formed, and a plurality of through holes 40a for connecting the upper surface electrode pattern are formed between the openings 34 by a processing means such as NC cutting or pressing.
[0050]
Next, the electrode pattern forming step is a step of forming the upper surface electrode pattern 40b and the through-hole electrode 40c on the collective insulating substrate 40 and is the same as that of the first embodiment described above, and a description thereof will be omitted.
[0051]
In FIG. 14, 33 is an adhesive sheet, and a plurality of through holes 33 a are formed at the same positions as the through holes 40 a formed in the collective insulating substrate 40.
[0052]
In the case of an SMD type coil that peels off the adhesive sheet 33 attached to the back surface after the resin sealing process and divides it into a single body in the dicing process, it is not necessary to form the through hole 33a in the adhesive sheet 33.
[0053]
In FIG. 15, in the adhesive sheet attaching step, the through holes 33 a of the adhesive sheet 33 and the through holes 40 a of the collective insulating substrate 40 are aligned, and the adhesive sheet 33 is attached to the back surface of the collective insulating substrate 40.
[0054]
Next, since the closed magnetic circuit type cylindrical coil supply step and the mounting step shown in FIG. 16 are the same as those in the first embodiment described above, description thereof will be omitted.
[0055]
Next, the resin supply process is the same as that in the first embodiment described above except that the sealing resin 17 is not filled in the through hole 40a, and is previously masked with a mask member.
[0056]
Since the resin sealing step and the dicing step are the same as those in the first embodiment described above, description thereof will be omitted.
[0057]
As in the fifth embodiment described above, in the single SMD type coil 30, as described in the first to fourth embodiments, the adhesive sheet is left on the lower surface of the substrate, and the cylindrical bobbin A type of product that peels the upper plate-shaped member. Products that leave both adhesive sheets and plate-like members. A product that peels the adhesive sheet and leaves a plate-like member. The product which peels both an adhesive sheet and a plate-shaped member can be considered.
[0058]
【The invention's effect】
As described above, according to the present invention, a plurality of closed magnetic circuit type cylindrical coil storage portions are formed on a collective insulating substrate to be obtained in large numbers, an adhesive sheet is attached, and the cylindrical bobbin is placed on the adhesive sheet. Since it can be mounted with an ordinary mounter, a dedicated device is not required and it is not affected by the accuracy of the guide hole as in the prior art. Therefore, compared with the conventional product, it can be reduced in size and thickness in all thicknesses, widths and lengths, and can be satisfied as an electronic component oriented toward lightness and shortness. Moreover, various products are completed by the combination of a plate-shaped member and an adhesive sheet. In particular, by mounting a closed magnetic circuit type cylindrical coil and taking noise countermeasures, reliability can be improved, productivity can be improved, and an inexpensive SMD type coil and a manufacturing method thereof can be provided.
[Brief description of the drawings]
FIG. 1 relates to an SMD type coil according to a first embodiment of the present invention. FIG. 1 (a) is a plan view of the SMD type coil, and FIG. 1 (b) is an AA view of FIG. It is line sectional drawing.
FIG. 2 is a perspective view of the SMD type coil of FIG. 1;
3 is a cross-sectional view of the closed magnetic circuit type cylindrical coil mounted in FIG. 1. FIG.
FIG. 4 is a partially enlarged perspective view showing a process of forming a collective insulating substrate and an electrode pattern forming process in the SMD type coil manufacturing method according to the first embodiment of the present invention.
FIG. 5 is a partially enlarged perspective view of a pressure-sensitive adhesive sheet that has been punched according to the SMD type coil manufacturing method of the first embodiment of the present invention.
6 is a partially enlarged perspective view showing an attaching process of attaching the adhesive sheet of FIG. 5 to the collective insulating substrate of FIG. 4 and a supplying process of a closed magnetic circuit type cylindrical coil.
7 is a partially enlarged perspective view showing a mounting process in FIG. 6 for connecting by fixing means such as soldering and thermocompression bonding.
FIG. 8 is a partially enlarged perspective view showing a resin supply process in which a resin molding mold is placed in FIG. 7;
FIG. 9 is a partially enlarged perspective view showing a resin sealing process in which a plate-like member is placed in FIG. 8;
FIG. 10 is a partially enlarged perspective view showing the step of peeling the plate-like member after removing the mold for resin molding in FIG. 9;
11 is a partially enlarged perspective view showing a dicing process in FIG. 10. FIG.
12A and 12B relate to an SMD type coil according to a fifth embodiment of the present invention. FIG. 12A is a plan view of the SMD type coil, and FIG. 12B is a cross-sectional view taken along line BB in FIG. It is line sectional drawing.
FIG. 13 is a partially enlarged perspective view showing a process of forming a collective insulating substrate and an electrode pattern forming process in the SMD type coil manufacturing method according to the fifth embodiment of the present invention.
FIG. 14 is a partial enlarged perspective view of a pressure-sensitive adhesive sheet that has been punched in a manufacturing method of an SMD type coil according to a fifth embodiment of the present invention.
15 is a partially enlarged perspective view showing an attaching process of attaching the adhesive sheet of FIG. 14 to the collective insulating substrate of FIG. 13 and a supplying process of a closed magnetic circuit type cylindrical coil.
FIG. 16 is a partially enlarged perspective view showing a mounting process in FIG. 15 for connecting by fixing means such as soldering and thermocompression bonding.
17 is a perspective view of the SMD type coil of FIG. 12. FIG.
FIG. 18 is a perspective view of a conventional chip coil.
[Explanation of symbols]
1 core
2 Coil core
3 coils
3b winding start terminal
3c End-of-winding terminal
4 cylindrical bobbins
5 Closed magnetic circuit type cylindrical coil
16 Solder
17 Sealing resin
20, 30 SMD type coil
20A SMD type coil assembly
21 Insulating substrate
21A, 40 Collective insulating substrate
21a, 34 opening
22a, 31a, 31b Upper surface electrode pattern
22b Bottom electrode pattern
22c Side electrode pattern
23, 33 Adhesive sheet
24 long hole through hole
25 Mold for resin molding
26 Plate member
27 Cut line in X direction
28 Y direction cut line
31 One small insulating substrate
32. The other small insulating substrate
31c, 31d, 32c, 32d Through-hole electrode

Claims (5)

And Ru insulating substrate name of glass epoxy resin or the like,
An opening formed in the insulating substrate and containing a closed magnetic circuit type cylindrical coil; and
An electrode pattern for surface mounting formed on the insulating substrate;
Two terminals on one end side of the closed magnetic circuit type cylindrical coil connected to the electrode pattern;
Provided with a pressure-sensitive adhesive sheet attached to the lower surface of the insulating substrate so as to close the opening that penetrates ,
It said closed magnetic circuit type cylindrical coil is fixed attached to and positioned on the adhesive sheet surface in the opening while being accommodated in the opening, the two terminals are connected to the electrode patterns,
SMD type coils, characterized in that it is sealed with a sealing resin. An insulating substrate made of glass epoxy resin or the like ;
An upper surface electrode pattern formed on the insulating substrate ;
One small piece insulating substrate having a substantially rectangular shape in which a through-hole electrode connected to the upper surface electrode pattern is formed,
The other small insulating substrate having substantially the same shape as the one small insulating substrate;
An adhesive sheet for fixing the two small piece insulating substrates facing each other with a predetermined interval so that both of the through-hole electrodes are positioned outward, and the two small piece insulating substrates on the adhesive sheet And an opening formed by disposing the
Said closed magnetic circuit type cylindrical coils with being accommodated in the opening affixed to the adhesive sheet surface in the opening is fixed by the positioning, the closed magnetic circuit type on the upper surface electrode patterns formed on the one piece insulating substrate and the terminal of the cylindrical coil is connected, SMD type coils, characterized in that it is sealed with a sealing resin. 3. The SMD type according to claim 1, wherein a part of the cylindrical bobbin of the closed magnetic path type cylindrical coil is the same surface as the resin or is slightly exposed. coil. A plurality of through openings are formed on the plane of the collective insulating substrate made of glass epoxy resin or the like to be taken, and a plurality of closed magnetic path type cylindrical coils are formed to pass therethrough, and an upper surface electrode is formed between the rows. A collective insulating substrate processing step for forming a plurality of through holes for pattern connection;
A plating step of forming a plating layer on the entire surface of the collective insulating substrate including the inner surface of the through hole by plating;
An electrode pattern forming step of adding a plating resist, exposing and developing with a pattern mask, performing pattern etching, and forming a through-hole electrode in the top electrode pattern and the through-hole;
Adjust the position of the through hole and the through hole on the adhesive sheet with the through hole at the same position as the through hole so as to close the through opening on the lower surface side of the collective insulating substrate that has undergone the above steps. Adhesive sheet pasting process to paste,
The adhesive of the closed magnetic circuit type cylindrical coil to the opening lower surface is closed by a sheet fed in the same direction, a closed magnetic circuit type cylindrical coil supplying step of positioning and attaching a tubular bobbin to the adhesive sheet surface of the opening When,
A mounting step of connecting the terminal of the closed magnetic circuit type cylindrical coil to the upper surface electrode pattern of the collective insulating substrate by a fixing means such as soldering and thermocompression bonding;
A resin supply step of placing a resin molding form around the assembled insulating substrate that has undergone the above steps and filling a sealing resin such as epoxy,
A resin sealing step of curing the filling sealing resin by placing and curing the plate-like member on the upper surface of the cylindrical bobbin of the closed magnetic path type cylindrical coil in the mold for resin molding;
After the sealing resin is cured, the pressure-sensitive adhesive sheet on the lower surface side of the collective insulating substrate that has undergone each of the above steps is left as it is, and a peeling step for peeling the plate member;
A cutting line that passes through the substantially central portion of the through hole of the collective insulating substrate that has undergone each of the above steps by a dicing machine or a slicing machine, and a cutting line that includes one closed magnetic circuit type cylindrical coil orthogonal to the cutting line. A method for producing an SMD type coil comprising a cutting step of cutting and dividing into a single SMD type coil. And opening through housing the cylindrical bobbin of the plurality of closed magnetic circuit type cylindrical coil on a plane of the set insulating substrate, a set insulating substrate processing step of forming a plurality of through holes for the upper electrode pattern connected,
An electrode pattern forming step of forming the upper surface electrode pattern and a through-hole electrode;
Wherein the back surface side collective insulating substrate after each step, the so as to close the opening through the lower surface of the set insulating substrate a pressure-sensitive adhesive sheet obtained by forming a through hole at the same position as the through hole has undergone the respective processes Adhesive sheet attaching step for attaching the through hole and the through hole together so as to close the opening that penetrates the side,
A closed magnetic circuit type cylindrical coil feed step of the closed magnetic circuit type cylindrical coil fed in the same direction, to affix the cylindrical bobbin to the adhesive sheet surface positioned in an opening lower surface is closed by the adhesive sheet,
A mounting step of mounting the terminal of the closed magnetic circuit type cylindrical coil on the upper surface electrode pattern of the collective insulating substrate by a fixing means such as soldering or thermocompression bonding;
A resin sealing step in which a mold for resin molding is arranged around the assembled insulating substrate that has undergone the above steps, filled with a sealing resin such as epoxy, cured, and cured,
After the sealing resin is cured, the adhesive sheet on the lower surface side of the collective insulating substrate is left as it is, and a cutting line that passes through a substantially central portion of the through hole of the collective insulating substrate that has undergone the above-described steps with a dicing machine or a slicing machine, A method of manufacturing an SMD type coil comprising a cutting step of cutting along a cut line including one closed magnetic circuit type cylindrical coil orthogonal to the cut line and dividing the cut line into a single SMD type coil.

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