JP3874042B2 - Temperature sensor support device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a temperature sensor support device for supporting a temperature sensor for detecting a temperature in a processing chamber of a semiconductor manufacturing apparatus or a processing chamber of another heat treatment apparatus.
[0002]
[Prior art]
In a processing chamber of a heat treatment apparatus, for example, a semiconductor manufacturing apparatus, a thin film is formed on a substrate to be processed such as a silicon wafer, and heat treatment such as etching or annealing is performed. It greatly affects the state. Therefore, a temperature sensor is installed at a required location in the processing chamber to detect the temperature during processing, and temperature control is performed based on the detection result.
[0003]
Conventionally, the temperature inside the processing chamber is detected by inserting a sheath thermocouple from the outside of the processing chamber to detect the amount of light received when the sheath is heated, or by bonding the thermocouple to a silicon chip. The silicon chip is installed and detected at a required location in the processing chamber. In particular, when the processing chamber has an airtight structure, hermetic flanges are used to seal the thermocouple through portions.
[0004]
[Problems to be solved by the invention]
A sheath thermocouple is inserted into the processing chamber. When a metal is used for the sheath, it is vulnerable to thermal shock when heated rapidly. Moreover, when manufacturing a semiconductor, there exists a possibility of causing a metal contamination. When the sheath is made of ceramic or quartz in consideration of thermal shock and metal contamination, there is a problem of lack of responsiveness, a problem with the amount of received light, and a lack of reliability in temperature detection.
[0005]
Next, in the case where the thermocouple is bonded to the silicon chip, there is no means for accurately positioning the silicon chip at a predetermined position in the processing chamber, and there is no means for fixing the silicon chip after positioning. difficult. Furthermore, it is easily affected by the periphery of the sensor, the measurement results vary depending on the set position, and there is a problem in the reproducibility of temperature detection.
[0006]
In view of such circumstances, the present invention is intended to withstand thermal shock when rapidly heated and to further improve the reliability and reproducibility of temperature detection.
[0007]
[Means for Solving the Problems]
The present invention includes a heating chamber for heating a substrate to be processed from both front and back sides, and a temperature detection unit inserted into the heating chamber, and the temperature detection unit is a sensor chip to which a temperature detection end of a thermocouple is bonded. A support rod fixed to a detachable rod support that is airtightly fixed to the heating chamber, the support rod can be inserted into the heating chamber, and a pair of clamps are provided at the tip of the support rod. phased and a support device, the support device is a heat treatment apparatus constructed as to be supported at a predetermined height of the heating chamber together with the to the bunch equity as a sensor chip from the front and back surfaces irradiated with light by the clamp are those according to, and used in the heat treatment apparatus having a heating chamber for heating a substrate to be processed from both sides, is fixed and the sensor chip temperature sensing end of the thermocouple is bonded, hermetically to the heating chamber A support device fixed to a detachable rod support, the support rod can be inserted into the heating chamber, and a pair of clamps are provided at the tip of the support rod to form a unit; and supporting device is intended according to the temperature detection unit configured as to support a predetermined height of the heating chamber together with the to the bunch equity as a sensor chip from the front and back surfaces irradiated with light by the clamp, to be further or Used in a heat treatment apparatus having a heating chamber for heating a processing substrate from both front and back surfaces, a sensor chip to which a temperature detection end of a thermocouple is bonded, and a support rod to a rod support portion that is hermetically fixed to and removable from the heating chamber. And a support device that is unitized by providing a pair of clamps at the tip of the support rod, the support device being unitized by allowing the support rod to be inserted into the heating chamber. By the temperature detection unit configured as to support a predetermined height of the heating chamber as well as lifting the bunch as irradiated with light of the sensor chip from both sides by serial clamp, and detecting the temperature of the heating chamber And a step of heating the substrate to be processed in the heating chamber based on the detected temperature.
[0008]
Since the temperature detection sensor is supported by a unitized temperature sensor support device, it is easy to handle, has good maintainability, and the temperature sensor grip is movable and can absorb the difference in thermal expansion to prevent damage. Since the sensor chip is held by a clamp, it is easy to attach and detach, and the sensor chip is irradiated with light from both the front and back sides, so the detected temperature reflects the heating state in the heating chamber and enables accurate temperature measurement. Become .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0010]
First, referring to FIG. 2 and FIG. 3, a processing chamber of a semiconductor manufacturing apparatus in which the present invention is implemented, particularly a lamp annealing processing apparatus in which rapid high temperature heating is performed will be described.
[0011]
A heating chamber bottom 3 is hermetically provided via a transparent bottom plate 2 at the lower end of the heating chamber wall 1 in which a circular space is formed in the center, and a transparent top plate 4 is provided at the upper end of the heating chamber wall 1. The heating chamber ceiling part 5 is airtightly provided. A cylindrical inner wall 6 is fitted in the space of the heating chamber wall 1, and a heating chamber 7 is defined by the bottom plate 2, the top plate 4, and the inner wall 6.
[0012]
A reflector 8 is provided on the bottom 3 of the heating chamber so as to face the bottom plate 2, and a rod-shaped lamp perpendicular to the paper surface in FIG. 3, for example, a halogen lamp 9, is provided between the reflector 8 and the bottom plate 2. Are provided at a required interval to constitute the lower lamp unit 10. The heating chamber ceiling portion 5 is provided with a reflecting plate 12 facing the top plate 4, and a rod-shaped lamp perpendicular to the paper surface in FIG. 3 between the reflecting plate 12 and the top plate 4, for example, Halogen lamps 9 are provided at a required interval, and constitute an upper lamp unit 13.
[0013]
The heating chamber 7 is provided with an upper soaking plate 14 facing the top plate 4, and a lower soaking plate 15 is provided facing the bottom plate 2. A rotary stage 16 is provided at the center. The rotary stage 16 is supported by a support shaft 17 that extends downward through the heating chamber bottom 3 and is rotated via the support shaft 17. An object to be heated, such as a wafer 18, can be placed on the rotary stage 16. The wafer 18 has a transfer port 19 formed in the heating chamber wall 1 and a through-hole 20 formed in the inner wall 6. The transfer port 19 can be hermetically closed or opened by a gate valve 21.
[0014]
Two sets of rod-shaped temperature detection units 24 and 25 parallel to the loading / unloading direction of the wafer 18 are airtightly attached through the heating chamber wall 1 at symmetrical positions with respect to the center line. The temperature detection units 26 and 27 are mounted in an airtight manner through the heating chamber wall 1 so as to be perpendicular to the loading / unloading direction of 18 and facing each other across the center line.
[0015]
The temperature detection points of the temperature detection units 24, 25, 26, 27 are located at the respective tips, and each temperature detection point is arranged at a position divided into four equal parts on the circumference concentric with the center of the heating chamber 7. The temperature detection results of the temperature detection units 24, 25, 26, and 27 are appropriately used according to the purpose. For example, the temperature detection result of the temperature detection unit 24 is for temperature control, and the temperature detection result of the temperature detection unit 25 is warming. The temperature detection results of the monitoring and temperature detection units 26 and 27 are used for monitoring.
[0016]
The temperature detection units 24, 25, 26, and 27 will be described. Since the temperature detection units 24, 25, 26, and 27 have the same structure, the temperature detection unit 25 will be described below.
[0017]
The fixed clamp 30 is clamped and fixed at the base by two upper and lower clamp holding plates 31, and a substantially L-shaped movable clamp 32 facing the fixed clamp 30 is inserted between the clamp holding plates 31 and via pins 33. It is pivotally attached. Fixed projections 34, 34 projecting toward the movable clamp 32 are formed inside the fixed clamp 30, and a positioning tongue 35 is formed on the inner base of the fixed clamp 30. A movable protrusion 36 that protrudes toward the fixed clamp 30 protrudes from the inner tip of the movable clamp 32, and a positioning tongue 37 is formed at the inner base of the movable clamp 32. A pressure receiving portion 38 is provided in a protruding manner. As will be described later, the sensor chip 40 is held between the fixed clamp 30 and the movable clamp 32.
[0018]
A tip of a support rod 42 is fixed to the clamp holding plate 31, and a slide pipe 43 is slidably fitted to the support rod 42 and a spring 44 is fitted therein. A spring stopper 45 is fixed to the support rod 42 by a bolt 46, and the spring 44 is in a compressed state between the slide pipe 43 and the spring stopper 45, and urges the slide pipe 43 toward the clamp holding plate 31 side. Yes.
[0019]
A piece 47 is fixed to the distal end portion of the slide pipe 43, the slide pipe 43 abuts against the pressure receiving portion 38 via the piece 47, and the movable clamp 32 is centered on the pin 33 with the distal end on the center side. It is energized. The base end portion of the support rod 42 penetrates the spring stopper 45, the split ring 48 is fitted to the base end portion, and the base end portion is fitted to the rod holder 49 and fixed by the push screw 50. Yes. The rod holder 49 has a bobbin shape having flange portions 52 and 53 on the distal end side and the proximal end side, respectively. A boss portion 54 protrudes further on the distal end side, and the base portion of the support rod 42 is fitted to the boss portion 54. . The rod holder 49 is hollow, and a rod holding hole 55 is formed in the boss portion 54 and through holes 56 are formed on both sides of the rod holding hole 55. The holes 56 and 56 communicate with a hollow portion (not shown) of the rod holder 49. An O-ring groove 57 is formed in the front end surface of the flange portion 52, and an O-ring 58 is fitted in the O-ring groove 57.
[0020]
The fixed clamp 30, the movable clamp 32, the support rod 42, and the like constitute a sensor chip support portion 73, the rod holder 49 and the flange 61 constitute a rod support portion 74, and the sensor chip 40 includes the sensor chip support portion 73. And a rod support part 74 so as to be detachably supported by a support device unitized.
[0021]
What is exposed in the heating chamber 7 such as the fixed clamp 30, clamp holding plate 31, movable clamp 32, pin 33, support rod 42, slide pipe 43, etc. is made of quartz in order to avoid metal contamination. Further, the spring 44 and the spring stopper 45 are made of metal, but are located in the periphery of the heating chamber 7, and particularly enter the inside of the heating chamber wall 1 and are not irradiated with light. Not.
[0022]
A flange 61 is hermetically fixed to the rod holder 49 by a bolt 60 with an O-ring 62 interposed. An O-ring groove 63 is formed in the front end surface of the flange 61, and the O-ring 62 is fitted in the O-ring groove 63. Two conductive wires 64 and 65 are inserted into the flange 61 in an airtight manner, and both ends of the conductive wires 64 and 65 are bent in a hook shape.
[0023]
A temperature detecting end 67 of a thermocouple is embedded and bonded in the center of the sensor chip 40 and functions as a temperature sensor. Thermocouple wires 68, 68 extending from the temperature detection end 67 are covered with quartz tubes 69, 69. The thermocouple wires 68 and 68 covered with the quartz tube 69 are inserted through the gaps between the clamp holding plate 31 and the clamp holding plate 31 and through the through holes 56 and 56. The base ends of the thermocouple wires 68, 68 are connected to the hook portions of the conductive wires 64, 65 by screws 70, 70.
[0024]
The sensor chip 40 has both corners on the clamp holding plate 31 side in contact with the positioning tongue 35 and the positioning tongue 37, respectively, and is positioned in the axial direction. Further, the fixing projection 34 is applied by the biasing force of the spring 44. , 34 and the movable protrusion 36 are gripped with an appropriate force.
[0025]
For attachment to the heating chamber wall 1, the tip side from the boss 54 is inserted into the heating chamber 7, and the flange 52 is fixed with a bolt. An O-ring 58 is interposed between the flange portion 52 and the heating chamber 7 so as to be airtight.
[0026]
The sensor chip 40 is gripped by the fixed clamp 30 and the movable clamp 32, whereby the dimension from the flange portion 52 is mechanically determined and further held at a predetermined height.
[0027]
The operation will be described below.
[0028]
The gate valve 21 is opened, and the wafer 18 is placed on the rotary stage 16 through the transfer port 19. The gate valve 21 closes the transfer port 19 and the lamp 9 and the lamp 9 are heated. The rotating stage 16 rotates during heating. The lamp 9 and the lamp 9 first heat the upper soaking plate 14, the lower soaking plate 15 and the rotary stage 16, and the wafer 18 is heated via the upper soaking plate 14, the lower soaking plate 15 and the rotating stage 16. To do. For this reason, the heating unevenness of the lamp 9 and the lamp 9 is eliminated, and the wafer 18 is heated uniformly.
[0029]
During the heating, the sensor chip 40 is also heated, and the temperature during the heating is detected by the temperature detection end 67. The sensor chip 40, the fixed clamp 30, and the movable clamp 32 are thermally expanded by heating, and displacement due to a difference in thermal expansion occurs. However, the movable clamp 32 is movable and the thermal expansion difference is displaced, and the displacement is the slide pipe. 43 is absorbed by the axial displacement of 43 and the bending change of the spring 44. Thus, the fixed clamp 30, the movable clamp 32, and the sensor chip 40 are not damaged by thermal expansion.
[0030]
Further, the sensor chip 40 is in contact with the fixed clamp 30 and the movable clamp 32 at a part of the fixed projection 34, the positioning tongue 35, the movable projection 36, and the positioning tongue 37. less, Thus also the sensor chip 40 itself can be made small thermal capacity, good thermal responsiveness to rapid heating, since even subjected to irradiation of light at both sides, the detected temperature is a heating condition of the heating chamber Reflecting, accurate temperature measurement becomes possible.
[0031]
The detection results of the four temperature detection units 24, 25, 26, 27 are for temperature control for the temperature detection unit 24, for overtemperature monitoring for the temperature detection unit 25, and for monitoring for the temperature detection units 26, 27. Used for.
[0032]
To perform maintenance and inspection of the temperature detection unit, the temperature detection unit is attached and detached from the outside of the lamp annealing apparatus. If a spare temperature detection unit is provided, it is not necessary to stop the heating furnace during maintenance and inspection, and the operating rate is improved.
[0033]
【The invention's effect】
As described above, according to the present invention, since the temperature detection sensor is supported by the unitized temperature sensor support device, it is easy to handle, has good maintainability, and can be supported at the required height of the heating chamber. Therefore, the temperature detection sensor can be heated from both the front and back sides, and the temperature sensor itself can have a small heat capacity, and the temperature response can be accurately measured with good response to heating. It can absorb the difference in thermal expansion and prevent damage, and the rod support part has an airtight structure, so it can be easily attached to and detached from the heating chamber, and the temperature detector is also easy to attach and detach. .
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing an embodiment of the present invention.
FIG. 2 is a plan view of a lamp annealing apparatus provided with a temperature sensor support device according to the present invention.
FIG. 3 is an elevational sectional view of the same lamp annealing apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Heating chamber wall 7 Heating chamber 10 Lower lamp unit 13 Upper lamp unit 18 Wafer 24 Temperature detection unit 25 Temperature detection unit 26 Temperature detection unit 27 Temperature detection unit 30 Fixed clamp 32 Movable clamp 40 Sensor chip 42 Support rod 43 Slide pipe 44 Spring 49 Rod holder 61 Flange 67 Temperature detection end 68 Thermocouple element 73 Sensor chip support 74 Rod support

Claims (3)

A heating chamber that heats the substrate to be processed from both the front and back sides, and a temperature detection unit that is inserted into the heating chamber . The temperature detection unit includes a sensor chip to which a temperature detection end of a thermocouple is bonded, and the heating A support device in which a support rod is fixed to a rod support portion that is hermetically fixed to a chamber and is detachable, the support rod can be inserted into the heating chamber, and a pair of clamps are provided at the tip of the support rod to form a unit has the door, the heat treatment the support apparatus characterized by being configured as supporting the heating chamber of predetermined height while lifting the sensor chip so as irradiated with light from both sides the bunch by the clamp apparatus. Used in a heat treatment apparatus having a heating chamber that heats the substrate to be processed from both the front and back sides, and supported by a sensor chip to which the temperature detection end of a thermocouple is bonded, and a rod support that is airtightly fixed to the heating chamber and removable. A support device in which the rod is fixed and the support rod can be inserted into the heating chamber, and a pair of clamps are provided at the tip of the support rod, and the support device is unitized by the clamp. temperature detection unit, characterized by being configured as supporting a predetermined height of the heating chamber as well as lifting the bunch as irradiated with light chips from both sides. Used in a heat treatment apparatus having a heating chamber for heating a substrate to be processed from both the front and back surfaces, a sensor chip to which a temperature detection end of a thermocouple is bonded, and a support rod to a rod support portion that is hermetically fixed to the heating chamber and is detachable And a support device that is unitized by providing a pair of clamps at the tip of the support rod, and the support device is provided with the sensor chip by the clamp. the by the temperature detection unit configured as to support a predetermined height of the heating chamber while the bunch equity as irradiated from both sides of the light, and detecting the temperature of the heating chamber, the detected temperature And a step of heating the substrate to be processed in the heating chamber.

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