JP3873592B2 - Method for manufacturing piezoelectric device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an improvement in a method for manufacturing a piezoelectric device such as a piezoelectric vibrator or a piezoelectric oscillator, and a cleaning apparatus used in a specific process of such a manufacturing method.
[0002]
[Prior art]
FIG. 12 is a flowchart simply showing a manufacturing process of a conventional piezoelectric device.
[0003]
In the figure, first, a rectangular quartz crystal wafer is cut out from, for example, an artificial quartz crystal as a piezoelectric material (ST1).
[0004]
Next, the quartz wafers stacked and fixed with an adhesive or the like are cut along a predetermined cutting line to form a wafer block. After bonding the end faces of the wafer block to form a flat shape as a whole, the wafer block is further cut along a predetermined cutting line to form a crystal chip block. Using the crystal chip block as a processing unit, after processing the corners, the adhesive is removed to obtain a crystal chip called a blank (ST2).
[0005]
Next, this crystal chip is etched to a predetermined thickness (ST3), and further, an electrode pattern is provided by vapor deposition, for example, to form necessary electrodes on the front and back surfaces of the crystal chip, and a predetermined drive electrode is provided. A crystal vibrating piece is obtained (ST4).
[0006]
This piezoelectric vibrating piece is mounted on a predetermined base (ST5), and a driving voltage is applied to the driving electrode of the piezoelectric vibrating piece to monitor the vibration frequency. For example, the surface is irradiated with a laser beam or an electron beam. Then, by performing plasma etching or the like, the mass of the piezoelectric vibrating piece is decreased, the vibration frequency is increased, and the frequency adjustment is performed to adjust to the desired frequency (ST6).
[0007]
Finally, the lid or the like is vacuum-sealed to the base or sealed in an inert gas atmosphere such as nitrogen gas to complete the piezoelectric vibrator (ST7).
[0008]
[Problems to be solved by the invention]
By the way, in a piezoelectric vibrator formed by such a manufacturing method, when it is incorporated into a predetermined electronic device after completion and a driving voltage is applied, the voltage is particularly lowered due to fluctuations in the driving voltage. In rare cases, the oscillation stopped.
[0009]
That is, as compared with the case where the conventional piezoelectric device is driven by a relatively large driving voltage, the recent piezoelectric device is driven at a low voltage. For this reason, although very rare, a phenomenon that the vibration stops is observed.
[0010]
The present invention has been made to solve the above-described problems, and is a method of manufacturing a piezoelectric device that is resistant to fluctuations in driving voltage and can improve drive level characteristics, and cleaning used in the manufacturing method. An object is to provide an apparatus.
[0011]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a method for manufacturing a piezoelectric device, comprising: cutting a wafer of piezoelectric material to form a predetermined piezoelectric chip; and forming an electrode on the piezoelectric chip to form a piezoelectric vibrating piece. In a method for manufacturing a piezoelectric device in which a piezoelectric package is housed in a predetermined package, the piezoelectric vibrating piece is placed in an alignment jig used for sealing before the piezoelectric vibrating piece is sealed in the package after adjusting the frequency of the piezoelectric vibrating piece. The method includes the step of cleaning the piezoelectric vibrating piece by holding the vibrating piece and immersing the alignment jig in a cleaning tank containing a cleaning liquid.
[0028]
According to the configuration of the first aspect, with respect to the piezoelectric vibrating piece after the electrodes are formed on the piezoelectric chip, after adjusting the frequency, the piezoelectric vibrating piece is cleaned using the sealing alignment jig. This is due to the following reason.
[0029]
According to the research of the present inventor, it has been found that another cause of the deterioration of the drive level characteristics by the piezoelectric device, which has been seen in the past, in particular, the stop of the oscillation is after the frequency adjustment process. In particular, conventionally, the package is sealed in a state where extremely fine foreign matter is attached to the piezoelectric vibrating piece through several steps after the electrode is formed, so that a finished product is obtained. This affects the drive characteristics of the piezoelectric vibrating piece after completion. Therefore, the present inventors pay attention to this sealing step, and before performing this, use the jig to perform cleaning in a state where the bases on which the piezoelectric vibrating pieces are mounted are arranged on the jig. As a result, very fine foreign matter attached to the piezoelectric vibrating piece is removed, so that the piezoelectric vibrating piece is sealed in a clean state so that the oscillation operation can be appropriately performed.
[0030]
According to a second aspect of the present invention, in the configuration of the sixth aspect, the alignment jig holds a plurality of bases on which the piezoelectric vibrating reeds are mounted so as not to overlap each other.
[0032]
According to a third aspect of the present invention, the cleaning step is performed in a cleaning liquid having high wettability with respect to the piezoelectric vibrating piece, and is performed by swinging a jig used for the sealing while applying ultrasonic waves. It is characterized by that.
[0033]
The invention of claim 4 is characterized in that the cleaning step is performed while applying ultrasonic waves from at least two different directions to the piezoelectric vibrating piece in the cleaning tank.
[0034]
According to a fifth aspect of the present invention, in the configuration of the tenth aspect, the ultrasonic waves applied from at least two different directions have different frequencies.
[0035]
The invention of claim 6 is characterized in that after the cleaning step, the piezoelectric vibrating piece is dried by vaporizing and applying a cleaning liquid or a replacement liquid.
[0047]
DETAILED DESCRIPTION OF THE INVENTION
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
[0048]
The piezoelectric device manufacturing method of this embodiment is characterized in that a predetermined cleaning process is introduced, unlike the conventional method. Before explaining this manufacturing process, for the convenience of understanding, the configuration of a crystal resonator, which is an example of the piezoelectric device of this embodiment, will be described with reference to FIG.
[0049]
In FIG. 11, a crystal resonator 10 includes a box-like base 12 in which a space portion 12a for accommodating a plate-like crystal vibrating piece 11 is formed, and a plate-like shape joined to the base 12 so as to seal the space portion 12a. The lid body 13 is provided. The quartz crystal resonator element 11 is connected and fixed via an adhesive (not shown) on the electrode 14 disposed on the step portion in which the one end portion 11a is integrally provided in the space portion 12a, and the other end portion 11b is a free end. Has been. The base 12 and the lid 13 are joined via a sealing material (brazing material) 15.
[0050]
Here, in this embodiment, the piezoelectric vibrating piece is the crystal vibrating piece 11 using quartz. However, the piezoelectric vibrating piece is not limited to this. For example, a piezoelectric material such as quartz, LiTaO ₃ , or LiNbO ₃ is used for the piezoelectric vibrating piece. A vibrating piece may be configured.
[0051]
A ceramic such as alumina is used as the material of the base 12, and a metal such as Kovar or a ceramic such as alumina is used as the material of the lid 13. Further, as the material of the sealing material 15, low melting point glass, silver brazing, solder or the like is used.
[0052]
In the crystal resonator 10, first, a base 12 is formed of a ceramic material such as alumina, and an electrode portion is formed by plating or the like so as to correspond to the crystal vibrating piece 11.
[0053]
A quartz crystal vibrating piece 11 having electrodes necessary for driving such as excitation electrodes and connection electrodes as described later is mounted on the electrode portion of the base 12 via conductive adhesives 14a and 14a. Next, frequency adjustment is performed as will be described later by irradiating the surface of the crystal vibrating piece 11 with an electron beam or plasma to adjust the weight.
[0054]
Next, the lid body 13 is placed on the base 12 and sealing is performed by, for example, irradiating an electron beam from above the lid body 13.
[0055]
FIG. 1 is a flowchart simply showing a manufacturing process including a process of forming the crystal vibrating piece 11 in the manufacturing process of the crystal resonator 10 described above.
[0056]
In this manufacturing process, ST10 to ST12 are the same as the conventional manufacturing process described with reference to FIG. 12. First, a rectangular crystal wafer is cut out from, for example, an artificial crystal crystal as a piezoelectric material (ST10).
[0057]
After the cut crystal wafer is processed to a predetermined thickness by polishing or the like, these crystal wafers are stacked and fixed with an adhesive or the like, and the laminated wafer is cut along a predetermined cutting line to form a wafer block. After bonding the end faces of the wafer block to form a flat shape as a whole, the wafer block is further cut along a predetermined cutting line to form a crystal chip block. Using the crystal chip block as a processing unit, after processing the corners, the adhesive is removed to obtain a crystal chip called a blank (ST11).
[0058]
Next, this crystal chip is etched and adjusted to a predetermined thickness (frequency) (ST12). Here, conventionally, electrodes are formed on the front and back surfaces of the quartz chip, but in this embodiment, alignment cleaning is performed here (ST13). In this embodiment, ST13 is cleaned using, for example, the cleaning apparatus of FIG. 2 and will be described in detail later.
[0059]
Next, in order to form necessary electrodes on the front and back surfaces of the crystal chip, an electrode pattern is provided by vapor deposition or sputtering to obtain the crystal resonator element 11 having a predetermined drive electrode (ST14). That is, the crystal resonator element 11 described with reference to FIG. 11 is the crystal chip formed with electrodes in this step.
[0060]
As described above, the crystal resonator element 11 is mounted on the base 12 which is a predetermined package (ST15), and a drive voltage is applied to the drive electrode of the crystal resonator element to monitor the vibration frequency. The surface is irradiated with a laser beam or an electron beam, or plasma etching is performed to reduce the mass of the quartz crystal vibrating piece 11, increase the vibration frequency, and adjust the frequency to match the desired frequency ( ST16). In this embodiment, after this frequency adjustment, alignment cleaning is performed (ST17). Since this alignment cleaning is performed using, for example, the cleaning apparatus of FIG. 9, a detailed description will be given later.
[0061]
Finally, the lid 13 is vacuum-sealed on the package or sealed in an inert gas atmosphere such as nitrogen gas to complete the crystal unit 10 (ST18).
[0062]
FIG. 2 shows an example of the cleaning device, and in this case, it is a schematic configuration diagram of the cleaning device used in ST13 of FIG.
[0063]
In the figure, a cleaning device 20 includes a cleaning processing chamber 21 for cleaning a crystal chip, and a sputtering chamber 22 for forming an electrode on the crystal chip that has been cleaned to form a crystal resonator element 11. The cleaning chamber 21 and the vapor deposition (sputtering) chamber 22 are airtightly partitioned by a partition.
[0064]
A plurality of cleaning tanks 23, 24, and 25 are arranged in the cleaning processing chamber 21, and each of the cleaning tanks may be used as a plurality of cleaning tanks in which a cleaning liquid is accommodated, as will be described later. The parts may be used properly as a washing tank and a storage tank for a substitute for drying. Above the plurality of cleaning tanks 23, 24 and 25, a guide means 26a extending along the order of steps is provided, and a swing arm 26b is provided on the guide means 26a. The swing arm 26b has a jig holding arm 26 attached to the tip thereof. The jig holding arm 26 aligns and holds a crystal chip or a crystal vibrating piece, which will be described later. (Referred to as “exclusive jig”) 30 is attached and detached, and a crystal chip is set in the exclusive jig 30 as described later. In this state, the swing arm 26b can swing the dedicated jig 30 in the vertical direction in the drawing, or rotate or rotate around the central axis passing through the vertical direction. Arbitrary swinging can be performed together with the movement of the guide means 26a.
[0065]
The guide means 26a moves the dedicated jig 30 held by the jig holding arm 26 in the direction of the arrow A through the swing arm 26b while performing the cleaning process using the plurality of cleaning tanks 23, 24, and 25. It is made to send to the conveyance conveyor 27. The conveyor 27 conveys the dedicated jig 30 in the direction of arrow D and carries it into the vacuum preliminary chamber 29 from the door 29 a of the vacuum preliminary chamber 29. The vacuum preparatory chamber 29 acts as an air lock, and is hermetically shut off from the cleaning processing chamber 21 by closing the door 29a. The vacuum preparatory chamber 29 is provided with a vacuuming means such as a vacuum pump (not shown), and is evacuated while the dedicated jig 30 is loaded and the door 29a is closed. A door 22a communicating with the vapor deposition (sputtering) chamber 22 is provided on the back side of the vacuum preliminary chamber 29. When the inside of the vacuum preliminary chamber 29 is in a vacuum state, the door 22a is opened, and the dedicated jig 30 is Then, it is carried into the sputter chamber 22 by the transfer conveyor 28 in the vacuum preliminary chamber 29, and proceeds to the electrode forming step (ST14 in FIG. 1) by vacuum deposition as it is.
[0066]
FIG. 3 is an exploded perspective view simply showing the configuration of the dedicated jig 30.
[0067]
In the figure, a dedicated jig 30 is a jig commonly used for the cleaning in ST13 and the electrode formation in ST14 of FIG.
[0068]
The dedicated jig 30 is configured to sandwich a large number of crystal chips 16 positioned by the outer shape plate 33 between the upper plate 31 and the lower plate 34.
[0069]
FIG. 5 shows a state in which the crystal chip 16 is held between the dedicated jig 30. The outer shape plate 33 of FIG. 3 has a hole 33a having the same inner diameter slightly larger than the outer shape of the crystal chip 16 in the vertical and horizontal directions so that the crystal chips 16 do not overlap each other horizontally and horizontally in the hole 33a. In addition, they are positioned side by side in the state of FIG.
[0070]
Further, the upper plate 31 and the lower plate 34 are masks at the time of electrode formation. As shown in FIG. 4, for example, the upper plate 31 has a through hole corresponding to the shape of the electrode 11 c to be formed on the surface of the crystal chip 16. A hole (a portion excluding the hatched portion) 31a (see FIG. 5) is formed. Similarly, the lower plate 34 is also a mask for electrode formation, and has a through hole 34a (see FIG. 5) for forming electrodes similar to those in FIG.
[0071]
The cover plate 36 shown in FIG. 5 and the base plate 35 of FIG. 3 are members having holes larger than the through holes 31a and the through holes 34a, and from both outer sides of the upper plate 31 and the lower plate 34, It has a function to suppress these.
[0072]
Thereby, a plurality or a large number of crystal chips 16 are arranged as shown in FIG. 3 so that the surfaces on which the electrodes of the individual crystal chips 16 are to be formed are exposed to the outside and are held by the dedicated jig 30. It has become.
[0073]
FIG. 6 shows a state where the dedicated jig 30 holding a large number of crystal chips 16 is set on the jig holding arm 26 as described above.
[0074]
A holding means 41 is formed at the tip (lower end in FIG. 2) of the jig holding arm 26. The holding means 41 is formed with a pair of grooves 42 having a U-shaped cross section with the openings facing each other.
[0075]
Thereby, as shown by the arrow in FIG. 6, the dedicated jig 30 is inserted into the pair of grooves 42 so as to be accommodated and held in the holding means 41 of the jig holding arm 26. Thus, the jig holding arm 26 is arranged in parallel so that a plurality or a large number of crystal chips 16 do not overlap with each other, and the alignment direction is held in the vertical direction. Is held in a state where the surface on which the electrode is to be formed (corresponding to the shape of the electrode 11c in FIG. 4) is exposed to the outside.
[0076]
Next, FIG. 7 is a perspective view schematically showing the configuration of the cleaning tank 23. In the cleaning tank 23, a cleaning liquid or the like to be described later is stored, and the crystal chip 16 stored in the dedicated jig 30 is immersed therein.
[0077]
When the cleaning tank 23 is formed in a rectangular parallelepiped shape, for example, at least the first side wall 23a and the second side wall 23b are respectively provided with ultrasonic generation means 37 and 38 having a built-in horn or the like. ing. Preferably, the frequency of the ultrasonic waves generated by the ultrasonic wave generating means 37 and 38 can be varied, whereby the ultrasonic wave generating means 37 and 38 generate ultrasonic waves having different frequencies. Can be done.
[0078]
Further, a cooling pipe 45 for circulating the cooling water is disposed so as to be in contact with and surround the outer wall of the cleaning tank 23. These facilities may also be provided in the cleaning tanks 24 and 25.
[0079]
As a result, as shown in the plan view of FIG. 8 (viewed from above), each ultrasonic wave generating means 37 from two different directions is applied to the dedicated jig 30 immersed in the cleaning tank 23. And ultrasonic waves S1 and S2 are applied. In this case, by adjusting the function of each ultrasonic wave generating means 37 and 38, not only applying ultrasonic waves with the same frequency and the same power, but also dedicated ultrasonic waves S1 and S2 having different frequencies from two different directions. Cleaning can be performed while applying to the jig 30. The temperature of the cleaning liquid is adjusted by the function of the cooling pipe 45 so that the temperature of the cleaning liquid does not rise more than necessary due to the application of ultrasonic waves.
[0080]
The cleaning apparatus 20 in FIG. 2 is configured as described above, and an example of a cleaning method will be described next.
[0081]
In FIG. 2, at least the first cleaning tank 23 contains, for example, an organic solvent such as isopropyl alcohol (IPA) as a cleaning liquid and a liquid having good wettability with respect to the crystal chip 16, and 20 degrees centigrade or more. It is kept in.
[0082]
A jig holding arm 26 is attached to the tip of the swing arm 26b as shown in the figure, and the dedicated jig 30 is held at the tip as described above. Due to the function of the guide means 26a, the dedicated jig 30 is immersed in the cleaning tank 23 through the swing arm 26b and the jig holding arm 26 in a state where the crystal chip is accommodated.
[0083]
In this state, the swing arm 26b swings the dedicated jig 30 in the liquid. As described above, this swinging is performed by appropriately combining up and down movement and rotation or rotation. At the same time, ultrasonic waves with different frequencies, for example, are applied from two different directions to the dedicated jig 30 from the ultrasonic generators 37 and 38 with an output of about 100 W or more. This time is about 10 seconds.
[0084]
As a result, the cleaning is finished, the swing arm 26b is raised, stopped just above the cleaning liquid, and exposed to the vapor of the cleaning liquid for drying. This drying time is about 10 seconds.
[0085]
Thereby, the cleaned quartz chip 16 is moved in the direction of arrow A by the guide means 26 a and sent to the conveyor 27. The conveyor 27 conveys the dedicated jig 30 in the direction of arrow D, and carries it into the vacuum preliminary chamber 29 from the door 29 a of the vacuum preliminary chamber 29. When the dedicated jig 30 is carried into the vacuum preparatory chamber 29, the door 22 that communicates with the vapor deposition (sputtering) chamber 22 is opened after being evacuated with the door 29a closed, and the dedicated jig 30 is opened. Is carried into the vapor deposition (sputtering) chamber 22 by the transfer conveyor 28 in the vacuum preparatory chamber 29, and proceeds directly to the electrode forming step (ST14 in FIG. 1) by vacuum vapor deposition.
[0086]
When the cleaning tanks 23, 24, and 25 are provided with different functions and used properly, the cleaning tank 23 contains a cleaning solution by IPA or the like in the same manner as described above, and a fluorine-based cleaning agent is added to the subsequent cleaning tank 24, for example. Housed as a draining substitute. For example, 3M Hydrofluoroether (HFE) is suitable as the drainage replacement agent. And this HFE is accommodated in the washing tank 24 to a predetermined water level so that the space above it can be used as a vapor layer.
[0087]
In this case, the dedicated jig 30 that has been cleaned in the cleaning tank 23 is exposed to the vapor layer of the cleaning tank 24 containing HFE for about 10 seconds, and then left for 10 seconds without being exposed to steam, thereby cleaning liquid. Can be dried.
[0088]
As described above, in the manufacturing method of the present embodiment, before the electrodes are formed on the crystal chip, the crystal chip 16 is arranged on the dedicated jig 30 and the dedicated jig 30 is used for cleaning. As a result, very fine foreign matter adhering when the quartz chip 16 is arranged on the dedicated jig 30 is washed, and the surface on which the electrode of the quartz chip 10 is to be formed becomes clean.
[0089]
In addition, since the quartz chips 16 are washed in a state where they are arranged on the dedicated jig 30 without overlapping each other, for example, compared to a case where the quartz chips 16 are put together in a basket or the like, a very thin quartz chip is overlapped. , The surface does not fall off and the surface is cleaned cleanly. By forming the electrode in this state, it is possible to avoid the formation of the electrode in a state where extremely fine foreign matters are attached and to appropriately perform the oscillation operation.
[0090]
In addition, since the electrode 30 can be formed as it is by bringing the dedicated jig 30 into the vapor deposition (sputtering) chamber 22, it is not necessary to transfer the crystal chip 16 to another jig when forming the electrode. There is no risk of adhesion.
[0091]
Moreover, according to the cleaning method described above, the cleaning effect is enhanced by using a cleaning liquid that has high wettability with respect to the quartz chip. Further, in the cleaning liquid, the quartz chip is swung and an ultrasonic wave is applied, so that the extremely fine foreign matter attached thereto is effectively cleaned. Moreover, ultrasonic waves are applied to the crystal chip 16 from at least two different directions in the cleaning tank 23, and the frequency of the ultrasonic waves generated by the ultrasonic wave generation means 37 and 38 can be varied. Therefore, preferably, ultrasonic waves with different frequencies are applied. For this reason, the quartz chip 16 is subjected to a plurality of vibrations with different frequencies and is more effectively cleaned.
[0092]
Further, since the crystal chip 16 after cleaning is dried by vaporizing and applying a cleaning liquid or a replacement liquid in the cleaning device 20, the crystal chip 16 after cleaning is moved to another facility or the like. Compared with hot air drying, etc., there is no fear of contamination by other equipment, and it can be immediately moved to the next process, so there is no risk of recontamination due to the standing time.
[0093]
FIG. 9 is a schematic configuration diagram showing an example of a cleaning apparatus 50 used for ST17 alignment cleaning in the manufacturing process described with reference to FIG. 1, that is, alignment cleaning after frequency adjustment.
[0094]
In FIG. 9, since the location which attached | subjected the code | symbol same as the washing | cleaning apparatus 20 of FIG. 2 is a common structure, the overlapping description is abbreviate | omitted and it demonstrates centering on difference.
[0095]
The inside of the cleaning device 50 is also divided into two. Although the cleaning apparatus 50 includes the cleaning processing chamber 21 in common with the cleaning apparatus 20, an adjacent section is a sealing chamber 52 due to a difference in process.
[0096]
The cleaning device 50 carries a crystal vibrating piece, which is a piezoelectric vibrating piece after frequency adjustment, and becomes a processing target. What is different from the cleaning apparatus 20 in the cleaning processing chamber 21 is that a dedicated jig 55 is provided and a cleaning jig cover removal unit 54 is provided.
[0097]
In order to explain the cleaning jig 55, reference is made to FIG.
[0098]
As illustrated, the dedicated jig 55 includes two members 57 and 58. Each of the two plate-like members 57 and 58 is formed with a through hole. When the plate-like members 57 and 58 are overlapped with each other, each through-hole has an inner surface facing each other on the inner peripheral side. Directional stepped portions 57a and 58a are formed. As a result, the base on which the crystal vibrating piece 11 is mounted is accommodated in the formed recess 59 as shown in the figure. That is, in ST15 of FIG. 1, the piezoelectric vibrating reed 11 mounted on the base 12 which is a package is sandwiched between the plate-like members 57 and 58 together with the base 12, and the stepped portions 57a and 58a described above. Are held in contact with the upper end surface and the lower surface of the base 12 to hold the crystal vibrating piece 11 mounted on the base 12. In this state, the crystal vibrating piece 11 is exposed through the through hole 56.
[0099]
Since the cleaning process in the apparatus is the same as that in the apparatus of FIG.
[0100]
After the cleaning, the quartz crystal resonator element 11 is opened into the sealing chamber entrance door 52a, carried into the sealing chamber 52, and sealed with the lid 13 as shown in FIG. 11 (ST18).
[0101]
In addition, since various conditions associated with the cleaning process are the same as in the case of the cleaning apparatus of FIG. 2, it is possible to exhibit the same operational effects as in the case of FIG.
[0102]
The present invention is not limited to the above-described embodiment.
[0103]
The present invention is not limited to the piezoelectric vibrator, and can be applied to various piezoelectric devices such as a piezoelectric oscillator using a piezoelectric chip.
[0104]
Further, for example, various conditions can be appropriately employed for the cleaning liquid, the cleaning time, and the like, and each configuration of the above-described cleaning apparatus can be appropriately changed.
[0105]
Furthermore, some of the conditions and configurations of the above-described embodiment can be omitted as appropriate.
[0106]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a method for manufacturing a piezoelectric device that is resistant to fluctuations in driving voltage and can improve drive level characteristics, and a cleaning apparatus used in this manufacturing method. it can.
[Brief description of the drawings]
FIG. 1 is a flowchart briefly showing an example of a method for manufacturing a piezoelectric device according to an embodiment of the present invention.
FIG. 2 is a schematic configuration diagram showing an example of a cleaning apparatus that performs ST13 cleaning according to the flowchart of FIG. 1;
3 is an exploded perspective view showing a dedicated jig used in the cleaning apparatus of FIG. 2. FIG.
4 is an explanatory diagram for explaining the operation of the dedicated jig of FIG. 3. FIG.
5 is a schematic cross-sectional view of a state in which a crystal chip is held by a dedicated jig shown in FIG.
6 is a schematic perspective view showing a configuration of a jig holding arm of the cleaning apparatus of FIG. 2. FIG.
7 is a schematic perspective view showing a configuration of a cleaning tank of the cleaning apparatus in FIG. 2. FIG.
8 is a schematic plan view for explaining the function of the cleaning tank of the cleaning apparatus of FIG. 2. FIG.
FIG. 9 is a schematic configuration diagram showing an example of a cleaning apparatus that performs ST17 cleaning according to the flowchart of FIG. 1;
10 is a schematic partial cross-sectional view showing a dedicated jig used in the cleaning apparatus of FIG.
FIG. 11 is a partially cut perspective view showing a crystal resonator as an example of the piezoelectric device of the present invention.
FIG. 12 is a flowchart simply showing an example of a conventional method of manufacturing a piezoelectric device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Crystal oscillator 11 Crystal vibrating piece 12 Base 13 Lid 20 Cleaning apparatus 21 Cleaning process chamber 22 Sputtering chamber 23 Cleaning tank 24 Cleaning tank 25 Cleaning tank 26a Guide means 26b Oscillating arm 26 Jig holding arm 30 Dedicated jig 50 Cleaning Equipment 55 Dedicated jig

Claims (6)

In a method of manufacturing a piezoelectric device in which a piezoelectric material wafer is cut to form a predetermined piezoelectric chip, an electrode is formed on the piezoelectric chip to form a piezoelectric vibrating piece, and the piezoelectric vibrating piece is accommodated in a predetermined package.
Before the piezoelectric vibrating piece is sealed in the package after adjusting the frequency of the piezoelectric vibrating piece, the piezoelectric vibrating piece is held in an alignment jig used for sealing, and the cleaning solution is contained in a cleaning tank containing cleaning liquid. A method for manufacturing a piezoelectric device, comprising the step of immersing an alignment jig to clean the piezoelectric vibrating piece.   2. The method of manufacturing a piezoelectric device according to claim 1, wherein the alignment jig holds a plurality of bases on which the piezoelectric vibrating reeds are mounted so as not to overlap each other.   The cleaning step is performed in a cleaning liquid having high wettability with respect to the piezoelectric vibrating piece, and is performed by swinging a jig used for the sealing while applying ultrasonic waves. Item 3. A method for manufacturing a piezoelectric device according to Item 1 or 2.   4. The piezoelectric device according to claim 1, wherein the cleaning step is performed while applying ultrasonic waves from at least two different directions to the piezoelectric vibrating piece in the cleaning tank. 5. Manufacturing method.   5. The method of manufacturing a piezoelectric device according to claim 4, wherein the ultrasonic waves applied from at least two different directions have different frequencies.   6. The method of manufacturing a piezoelectric device according to claim 1, wherein after the cleaning step, the piezoelectric vibrating piece is dried by vaporizing and applying a cleaning liquid or a replacement liquid.

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