JP3862832B2 - Work reversing machine and polishing device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a work reversing machine, and more particularly to a work reversing machine that can be used simultaneously for reversing two types of work, dry and wet, and a polishing apparatus using the work reversing machine.
[0002]
[Prior art and problems to be solved by the invention]
In the manufacturing process of a semiconductor wafer, a polishing apparatus that mirrors the surface of the semiconductor wafer is used.
[0003]
FIG. 10 is a schematic plan view showing the internal structure of a general polishing apparatus shown by the applicant of the present application. As shown in the figure, the polishing apparatus includes a polishing unit 130 and a cleaning unit 150.
[0004]
The polishing unit 130 includes a top ring unit 137 having a top ring 135 attached to both sides of a turntable 133, a dressing unit 141 having a dressing tool 139 attached thereto, and a work delivery device 143.
[0005]
The cleaning unit 150 has two transfer robots 151 and 153 movable in the direction of arrow Z in the center, and primary and secondary cleaning machines 155 and 157 and a spin dryer (or a spin with a cleaning function) on one side thereof. (Dryer) 159 is installed in parallel, and a wet work reversing machine 161 and a dry work reversing machine 163 are installed in parallel on the other side.
[0006]
Here, FIG. 11 is a perspective view of a main part showing the inside of the cleaning unit 150 in detail. As shown in the drawing, the periphery of the wet work reversing machine 161 is covered with a waterproof cover 171 for preventing liquid scattering.
[0007]
Each of the transfer robots 151 and 153 is configured by attaching two sets of arm mechanisms 154 to the upper surface thereof. Hands 255, 256, 257, and 258 for holding semiconductor wafers are attached to the tips of the arm mechanisms 154, respectively. The hands 255 and 256 and the hands 257 and 258 are arranged so as to overlap each other.
[0008]
The three hands 255, 256, and 258 are all of the type that holds and holds a semiconductor wafer on the surface thereof, and the other hand 257 is a vacuum suction that holds and holds the semiconductor wafer on the surface thereof. It is a hand with a mechanism.
[0009]
Here, the operation of the entire polishing apparatus will be described with reference to FIGS. 10 and 11. When the cassette 165 containing the semiconductor wafer before polishing is set at the position shown in the figure, the hand 257 of the transfer robot 153 is moved to the cassette 165. The semiconductor wafers are taken out one by one and transferred to the work reversing machine 163 and reversed. Further, the semiconductor wafer is transferred from the work reversing machine 163 to the hand 255 of the transfer robot 151 and transferred to the work transfer device 143 (see FIG. 10) of the polishing unit 130.
[0010]
The semiconductor wafer on the workpiece delivery device 143 is held on the lower surface of the top ring 135 of the top ring unit 137 that rotates as indicated by the arrow P, is moved onto the turntable 133, and is polished on the rotating polishing surface 134. . At this time, the polishing liquid is supplied onto the polishing surface 134 from a supply pipe (not shown), and the semiconductor wafer is polished by relative movement with the polishing surface 134 under the presence of the polishing liquid. As the polishing surface 134, a polishing pad is stuck on a turntable.
[0011]
The polished semiconductor wafer is returned to the workpiece delivery device 143 again, delivered to the workpiece reversing machine 161 by the hand 256 (see FIG. 11) of the transfer robot 151, and inverted while being rinsed with the rinsing liquid. After being transferred to the primary cleaner 155 for cleaning, further transferred to the secondary cleaner 157 by the hand 256 for cleaning, transferred to the spin dryer 159 by the hand 258 and spin dried, the original cassette is then transferred by the hand 257. Return to 165. The reason for rinsing with the work reversing machine 161 is to prevent the semiconductor wafer to which the polishing liquid or the like has adhered from drying.
[0012]
The dressing unit 141 shown in FIG. 10 is appropriately moved on the turntable 133 as indicated by an arrow R, and the rotating dressing tool 139 is pressed against the rotating polishing surface 134 to regenerate (sharp) the polishing surface 134.
[0013]
Incidentally, the two work reversing machines 161 and 163 are installed in the polishing apparatus because the wet work reversing machine 161 cannot use the hand 257 with the vacuum suction mechanism. This will be specifically described below.
[0014]
That is, the wet work reversing machine 161 for reversing the semiconductor wafer while rinsing the semiconductor wafer as in the above polishing apparatus is covered with a waterproof cover 171 (see FIG. 11) so that the water for rinsing is not scattered around. ing.
[0015]
Here, FIG. 12 is a schematic sectional side view showing a conventional waterproof cover 171 of this type.
As shown in the figure, the waterproof cover 171 is formed so as to cover the entire work reversing machine 161, provided with an opening 175 for inserting a wet hand 256 on the front surface, and opening / closing the opening 175 inside the opening 175. Thus, a shutter 177 that moves up and down is attached.
[0016]
Then, with the shutter 177 open, the hand 256 is inserted from the opening 175 and delivered to the work reversing machine 161. Then, the hand 256 is pulled out and the shutter 177 is closed. In this state, rinsing is performed to prevent drying. Then, the semiconductor wafer is reversed, and then the rinsing is interrupted, the shutter 177 is opened, and the semiconductor wafer is taken out by the hand 256.
[0017]
Here, if the dry semiconductor wafer taken out from the cassette 165 by the hand 257 with the vacuum suction mechanism can be transferred to the wet work reversing machine 161 and reversed, the dry work reversing machine 163 can be used. Is unnecessary and suitable.
[0018]
However, if the hand 257 with a vacuum suction mechanism is inserted into the waterproof cover 171 of the work reversing machine 161 and the semiconductor wafer is delivered, the upper surface of the waterproof cover 171 among the liquid scattered in the waterproof cover 171 during rinsing. Or the liquid adhering to the upper side of the opening 175 falls as water droplets, which adheres to the surface of the hand 257 and is sucked into the vacuum line from the vacuum suction hole, resulting in failure of the vacuum suction mechanism. End up.
[0019]
Therefore, when using the hand 257 with a vacuum suction mechanism, a dry work reversing machine 163 having no rinsing function is required separately. The semiconductor wafer can be taken out and stored from the cassette 165 only by using a hand 257 with a vacuum suction mechanism because of its structure.
[0020]
The present invention has been made in view of the above points, and its purpose is to prevent liquid from adhering to the hand even if a hand with a vacuum suction mechanism is inserted into a work reversing machine with a waterproof cover. An object of the present invention is to provide a work reversing machine and a polishing apparatus that can be used for both hands.
[0021]
[Means for Solving the Problems]
In order to solve the above problems, the present invention provides a work reversing machine having a work reversing mechanism for delivering a work to a robot hand having a structure for holding a work and reversing the received work. The mechanism is surrounded by a waterproof cover for preventing liquid splashing, and the waterproof cover is directly above the portion of the hand that is not covered with the work when the hand is inserted into the waterproof cover. An upper opening mechanism that opens the area is provided so that water droplets attached to the inner surface of the waterproof cover do not fall on the hand of the robot.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First embodiment]
FIG. 1 is a view showing a dry / wet combined work reversing machine 10 according to a first embodiment of the present invention, in which FIG. 1 (a) is a front view and FIG. 1 (b) is an AA view of FIG. It is sectional drawing.
[0023]
As shown in the figure, this dry / wet combination work reversing machine 10 is configured to hold a semiconductor wafer and cover the periphery of a work reversing mechanism 11 for reversing the held semiconductor wafer with a waterproof cover 21 for preventing liquid scattering. ing.
[0024]
In the case of this embodiment, an opening 23 is provided in a portion extending from the upper surface to the front surface of the waterproof cover 21, and a substantially semi-cylindrical screen 25 that closes the opening 23 is attached to the opening 23. The opening 23 and the screen 25 constitute an upper opening mechanism.
[0025]
The screen 25 protrudes from the side surface of one end of the rotary shaft 27, and a rotary drive mechanism (opening / closing means) 29 is attached to the rotary shaft 27. The rotation drive mechanism 29 is configured to rotate the screen 25 in the lower left direction (arrow B direction) from the position shown in FIG.
[0026]
Inside the waterproof cover 21 is provided a rinsing liquid supply means 132 for supplying a rinsing liquid to the semiconductor wafer held by the work reversing mechanism 11.
[0027]
In the present embodiment, one rinse liquid supply means 132 is provided above and below the workpiece reversing mechanism 11. The two rinsing liquid supply means 132 supply the rinsing liquid to both sides of the semiconductor wafer to be inverted, washing away the abrasive liquid adhering to the surface of the semiconductor wafer, and preventing the semiconductor wafer and the abrasive liquid from drying. Prevents solidification by drying and solidification on the surface of the semiconductor wafer.
[0028]
Although not shown, an exhaust duct for exhausting the internal atmosphere of the space surrounded by the waterproof cover 21 downward is provided in the lower part of the dry / wet combined work reversing machine 10. By sucking the air inside the reversing machine downward by the exhaust duct, the mist generated by rinsing the rinsing water to the semiconductor wafer is prevented from scattering outside the reversing machine 10.
[0029]
The dry / wet combined work reversing machine 10 can process both the dry and wet work reversing machines. Therefore, in the polishing apparatus shown in FIG. 10, two work reversing machines 161 and 163 are used. Can be replaced with one in the present embodiment. Therefore, assuming that the polishing / reversing work reversing machine 10 shown in FIG. 1 is installed in the polishing apparatus shown in FIG.
[0030]
That is, the semiconductor wafer after polishing by the polishing unit 130 is stored in the dry / wet combined work reversing machine 10 by the wet hand 256 (see FIG. 11), the hand 256 is pulled out, and then the screen 25 is closed. Assume that rinsing is performed while inverting the semiconductor wafer in this state. At this time, the rinse liquid scatters and adheres to the entire inner surface of the waterproof cover 21 to form water droplets.
[0031]
Next, when the rotational drive mechanism 29 is driven to rotate the screen 25 downward (arrow B direction), the screen 25 moves to the lower side of the work reversing mechanism 11 as shown in FIG. Then, a wet hand 256 shown in FIG. 11 is inserted from the opening 23 to take out the semiconductor wafer.
[0032]
Next, a dry hand 257 holding and holding the semiconductor wafer before polishing from the cassette 165 is inserted into the opening 23 of the dry / wet work reversing machine 10, and the semiconductor wafer is inserted into the work reversing mechanism 11. Hold it.
[0033]
At this time, the opening 23 is opened in an open state because the screen 25 is rotated downward, so that it adheres to the waterproof cover 21 and the inner surface of the screen 25 during the rinsing to form water droplets. The rinse liquid does not fall on the hand 257. Therefore, there is no possibility that the vacuum suction mechanism provided in the hand 257 is destroyed.
[0034]
As shown in FIG. 3, the dry hand 257 is inserted into the waterproof cover 21 while the semiconductor wafer 100 is sucked and held by the vacuum suction hole 260 on the upper surface thereof, so that the liquid falling on the upper surface of the semiconductor wafer 100 can be obtained. Does not reach the hand 257. Therefore, the size of the opening 23 may be reduced accordingly.
[0035]
Here, FIG. 6 is a diagram comparing the position of the hand 257 with respect to the waterproof cover 21.
[0036]
That is, as shown in FIG. 6A, if the insertion position of the hand 257 into the waterproof cover 21 is configured so that the entire hand 257 including the vacuum suction hole 260 is positioned within the opening 23, Regardless of whether or not the semiconductor wafer 100 is present, the rinse liquid does not fall on the hand 257, which is the safest. However, with this configuration, the semiconductor wafer 100 cannot be inserted deeply into the waterproof cover 21.
[0037]
Therefore, as shown in FIG. 6B, when the screen 25 closes the opening 23, the upper end side of the screen 25 enters the waterproof cover 21 from the opening 23 and overlaps the waterproof cover 21. When the hand 257 is inserted into the opening 23 opened by the rotational movement of the screen 25, the tip of the hand 257, that is, the vacuum suction hole 260 reaches the position just below the overlap portion P. It may be configured.
[0038]
Since the portion of the overlap portion P on the waterproof cover 21 side is covered with the screen 25 during rinsing, it is not wet when the screen 25 is opened. Therefore, even if the hand 257 enters, the liquid does not fall from the portion P of the waterproof cover 21. Therefore, regardless of whether or not the semiconductor wafer 100 is on the hand 257, the liquid does not fall on the hand 257, which is also safe in this case. In addition, the semiconductor wafer 100 can be inserted deeply into the waterproof cover 21, and the waterproof mechanism can be downsized.
[0039]
The semiconductor wafer 100 can be further inserted deeply into the waterproof cover 21 by increasing the length of the overlap portion P.
[0040]
In view of safety, it is appropriate to configure as described above. However, when it is not necessary to consider safety so much, as shown in FIG. 6C, only the surface of the hand 257 on which the semiconductor wafer 100 is not mounted is provided. May be inserted so that is located in the opening 23.
[0041]
Since the semiconductor wafer 100 is placed on the hand 257, even if the liquid falls from the waterproof cover 21, the liquid adheres to the semiconductor wafer 100, does not adhere to the hand 257, and does not adhere to the vacuum suction hole 260. Does not penetrate.
[0042]
That is, according to the present invention, it is not necessary to open the entire range directly above the entire upper surface of the hand 257 inserted into the waterproof cover 21, and at least the surface of the hand 257 on which the semiconductor wafer 100 is not mounted moves within the waterproof cover 21. It is sufficient to open just above the range. More preferably, the distal end of the inserted hand 257, that is, the vacuum suction hole 260 may be configured to be positioned immediately below the overlap portion P of the screen 25 and the waterproof cover 21.
[0043]
By the way, in the said embodiment, when the screen 25 opens the opening 23, it is made to move to the arrow B direction of FIG.1 (b), but as shown to Fig.13 (a), the screen 25 is the arrow B direction. The opening 23 may be opened by moving in the opposite direction, that is, in the direction of the arrow D.
[0044]
In this case, as shown in FIG. 13A, when the screen 25 closes the opening 23, the upper end side of the screen 25 overlaps the waterproof cover 21 to form an overlap portion P, and the overlap portion It is desirable to prevent the portion of P on the waterproof cover 21 side from getting wet.
[0045]
Then, the screen 25 is moved in the direction of the arrow D and moved to a position where the screen 25 does not overlap with the overlap portion P of the waterproof cover 21 (or a position moved further) as shown in FIG. If the opening 23 is opened, the portion of the overlap portion P on the waterproof cover 21 side is not wet, and the screen 25 whose inner surface is wet is not located directly below the overlap portion P. The effect of (b), that is, the tip of the hand 257, that is, the vacuum suction hole 260, can be inserted to a position just below the overlap portion P in the waterproof cover 21, and the semiconductor wafer 100 can be inserted deeply, and the waterproof mechanism can be downsized The effect that can be achieved.
[0046]
[Second Embodiment]
4A and 4B are views showing a second embodiment of the present invention, in which FIG. 4A is a front view, and FIG. 4B is a cross-sectional view taken along the line CC in FIG. As shown in the figure, the dry / wet combined work reversing machine 10-2 covers the periphery of the work reversing mechanism 11-2 with a waterproof cover 21-2 for preventing liquid scattering.
[0047]
And the waterproof cover 21-2 concerning this embodiment consists of a cylindrical member long in the vertical direction, the upper end is open | released and becomes the upper opening 40, and the front side from the upper side a of the waterproof cover 21-2 A hand insertion portion 41 having a notch is provided over the front portion.
[0048]
A shielding member 43 that opens and closes the hand insertion portion 41 by sliding in the vertical direction (arrow V direction) is installed below the hand insertion portion 41.
[0049]
Inside the waterproof cover 21-2, there is one rinse liquid supply means 132-2 for supplying a rinse liquid to the semiconductor wafer held by the work reversing mechanism 11-2, one above and below the work reversing mechanism 11-2. It is provided one by one.
[0050]
In the case of this dry / wet combined work reversing machine 10-2, for example, the semiconductor wafer after the polishing by the polishing unit 30 is finished in the dry / wet combined work reversing machine 10-2 by a wet hand 256 (see FIG. 11). Then, the hand 256 is pulled out, the shielding member 43 is raised, the hand insertion portion 41 is closed, and rinsing is performed while inverting the semiconductor wafer in this state.
[0051]
At this time, the rinse liquid scatters and adheres to the entire inner surface of the waterproof cover 21-2. In the case of this embodiment, the upper surface of the waterproof cover 21-2 is the upper opening 40, and the position of the upper opening 40 is configured so that the waterproof cover 21-2 is elongated in the vertical direction. Therefore, the scattered rinse liquid does not reach the upper opening 40 and there is no possibility of scattering outside.
[0052]
Next, the shielding member 43 is lowered to open the hand insertion portion 41, and the hand 256 is inserted from the hand insertion portion 41 to take out the semiconductor wafer.
[0053]
On the other hand, a dry hand 257 that holds and holds the semiconductor wafer before polishing from the cassette 165 shown in FIG. 11 is inserted from the hand insertion portion 41, and the work reversing mechanism 11-2 grips the semiconductor wafer.
[0054]
At this time, the upper portion is the upper opening 40 and the hand insertion portion 41 is notched, so that the upper portion is in an open state with nothing. Accordingly, the rinsing liquid that adheres to the inner surfaces of the waterproof cover 21-2 and the shielding member 43 and becomes water droplets during the rinsing does not fall on the hand 257.
[0055]
Also in this embodiment, it is not necessary to provide the upper opening 40 that opens the entire range directly above the entire upper surface of the hand 257, and at least the surface of the hand 257 on which the semiconductor wafer 100 is not placed is within the waterproof cover 21-2. Any opening that opens right above the moving range may be used.
[0056]
In the second embodiment, the shielding member 43 is formed in a flat plate shape, but the shape of the shielding member 43 can be variously modified. For example, the shielding member 43 is formed in a cylindrical shape so as to surround the workpiece reversing mechanism 11-2. Also good. That is, in this case, the work reversing mechanism 11-2 is doubly surrounded by the cylindrical shielding member 43 and the cylindrical waterproof cover 21-2.
[0057]
[Third embodiment]
FIG. 5 is a view showing a third embodiment of the present invention, where FIG. 5 (a) is a front view and FIG. 5 (b) is a schematic side sectional view. The dry / wet combined work reversing machine 10-3 covers the periphery of the work reversing mechanism 11-3 with a waterproof cover 21-3 for preventing liquid scattering.
[0058]
The waterproof cover 21-3 includes left and right waterproof covers 21-3a and 21-3b that are divided into two at the center, and the left and right waterproof covers 21-3a and 21-3b have lower ends. It is configured to open to the left and right around the central rotation shaft 51.
[0059]
That is, the right and left waterproof covers 21-3a and 21-3b are configured to open as shown by the alternate long and short dash lines so as to open a space immediately above the portion into which the hand is inserted. The left and right waterproof covers 21-3a and 21-3b constitute an upper opening mechanism.
[0060]
Inside the waterproof cover 21-3, one rinse liquid supply means 132-3 is provided above and below the work reversing mechanism 11-3.
[0061]
Also in this embodiment, when the dry hand 257 is inserted, the upper portion is in an open state with nothing. Therefore, the rinsing liquid that has adhered to the inner surface of the waterproof cover 21-3 during the rinsing process and formed water droplets does not fall on the hand 257, and can be shared with the wet hand.
[0062]
In the case of the embodiment shown in FIG. 5, the left and right waterproof covers 21-3a and 21-3b are configured to open around the rotation shaft 51. However, both the waterproof covers 21-3a and 21-3b are, for example, horizontally left and right. It is possible to make various modifications such as moving to the center or opening about another rotation axis.
[0063]
Also in this embodiment, it is not necessary to open the left and right waterproof covers 21-3a and 21-3b so as to open the entire range directly above the upper surface of the hand 257, and at least the semiconductor wafer 100 of the hand 257 is mounted. What is necessary is just to open only the part which does not have a surface which opens in the waterproof covers 21-3a and 21-3b just above the range which moves.
[0064]
[Fourth embodiment]
FIGS. 7A and 7B are diagrams showing a fourth embodiment of the present invention, in which FIG. 7A is a schematic side sectional view, and FIG. 7B is a schematic front sectional view. The dry / wet combined work reversing machine 10-4 surrounds the work reversing mechanism 11-4 with a waterproof cover 21-4 for preventing liquid scattering.
[0065]
As with the waterproof cover 21-2 shown in FIG. 4, the waterproof cover 21-4 has an upper opening 40-4 at the upper end, and a hand insertion portion 41-4 made of a hole on the front. Is provided.
[0066]
In the case of this embodiment, a cylindrical shielding member 45 is provided inside the waterproof cover 21-4 so as to be movable up and down so as to surround the work reversing mechanism 11-4. The rinsing liquid supply means 132-4 is installed inside the shielding means 45 one above each below the work reversing mechanism 11-4.
[0067]
In the dry / wet combination work reversing machine 10-4, as shown in FIG. 8, a wet hand 256 (FIG. 11) is inserted from the hand insertion portion 41-4 and transferred to the workpiece reversing mechanism 11-4, and after the hand 256 is pulled out, the shielding member 45 is raised to the state shown in FIG. Rinse.
[0068]
The rinse liquid splashed at this time is shielded by the shielding member 45, and does not splash outside.
[0069]
Next, the shielding member 45 is lowered to the state shown in FIG. 8, and the hand 256 is inserted from the hand insertion portion 41-4 to take out the semiconductor wafer.
[0070]
Next, the hand 257 holding the semiconductor wafer in the dry state is inserted from the hand insertion portion 41-4, and the semiconductor reversing mechanism 11-4 grips the semiconductor wafer.
[0071]
At this time, since there is nothing in the upper portion of the hand 257, the rinse liquid does not fall on the hand 257.
[0072]
In the case of this embodiment, since the rinsing liquid does not scatter at least in the hand insertion portion 41-4 of the waterproof cover 21-4 and the vicinity thereof due to the structure of the shielding member 45, the shield shown in FIG. There is no need to install the member 43. Of course you may install.
[0073]
The present invention is not limited to the above-described embodiments, and various modifications such as the following are possible.
(1) As shown in FIG. 9A, the upper portion of the waterproof cover 21-5 may be formed in an arc shape in accordance with the shape of the arc-shaped screen 25-5. If comprised in this way, the rinse liquid adhering to this waterproof cover 21-5 will fall easily along the waterproof cover 21-5.
[0074]
(2) As shown in FIG. 9B, the hand insertion portion 41-6 of the waterproof cover 21-6 may be a hole instead of a notch (see 41 in FIG. 4). In this case, the shielding member 43-6 does not scatter the rinsing liquid on the inner surface of the waterproof cover 21-6 around the hand insertion portion 41-6 and the hand insertion portion 41-6, particularly on the upper portion of the hand insertion portion 41-6. This prevents the rinse liquid from dripping onto the hand.
[0075]
{Circle around (3)} In the above embodiments, the case where the present invention is applied to a polishing apparatus has been described. However, the present invention can also be applied to a work reversing machine attached to various apparatuses other than the polishing apparatus.
[0076]
(4) The work to be reversed by the work reversing machine is not limited to a semiconductor wafer, but may be another work such as an LCD or a compact disk.
[0077]
(5) In each of the above embodiments, the rinsing liquid supply means is provided above and below the workpiece reversing mechanism. It is sufficient if a rinsing liquid can be supplied to the front and back surfaces.
[0078]
【The invention's effect】
As described above in detail, according to the present invention, even if a drying hand is inserted after using a liquid such as a rinsing liquid in the waterproof cover, the liquid does not drip on the hand. It has an excellent effect that a work reversing machine that can be used for both dry and wet hands and a polishing apparatus using the work reversing machine can be provided.
[Brief description of the drawings]
FIG. 1 is a view showing a dry / wet combined work reversing machine according to a first embodiment of the present invention, in which FIG. 1 (a) is a front view and FIG. 1 (b) is an AA view of FIG. It is sectional drawing.
FIG. 2 is an operation explanatory diagram of a dry / wet combined work reversing machine 10;
FIG. 3 is a view showing a state in which a semiconductor wafer 100 is sucked and held on a dry hand 257;
4A and 4B are diagrams showing a second embodiment of the present invention, in which FIG. 4A is a front view, and FIG. 4B is a cross-sectional view taken along the line CC in FIG.
5A and 5B are views showing a third embodiment of the present invention, in which FIG. 5A is a front view, and FIG. 5B is a schematic side sectional view.
6 is a diagram showing a comparison of the insertion position of the hand 257 into the waterproof cover 21. FIG.
7A and 7B are diagrams showing a fourth embodiment of the present invention, where FIG. 7A is a schematic side sectional view, and FIG. 7B is a schematic front sectional view.
FIG. 8 is an operation explanatory diagram of the dry / wet combined work reversing machine 10-4.
FIGS. 9A and 9B are diagrams showing other embodiments, respectively.
FIG. 10 is a schematic plan view showing the internal structure of a polishing apparatus invented by the present applicant.
FIG. 11 is a perspective view of a main part showing details of the inside of the cleaning unit 150;
12 is a schematic sectional side view showing a conventional waterproof cover 171. FIG.
FIGS. 13A and 13B are diagrams showing another moving method of the screen 25 according to the first embodiment.
[Explanation of symbols]
10 Dry / Wet Combined Work Reversing Machine
11 Work reversing mechanism
21 waterproof cover
23 Opening
25 screens
29 Rotation drive mechanism (open / close drive means)
10-2 Dry / Wet Combined Work Reversing Machine
11-2 Work reversing mechanism
21-2 Waterproof cover
40 Upper opening
41 Hand insertion part
10-3 Dry / Wet Combined Work Reversing Machine
11-3 Work reversing mechanism
21-3 Waterproof cover
21-3a Left waterproof cover
21-3b Right waterproof cover

Claims (7)

In a work reversing machine having a work reversing mechanism for delivering and reversing the received work with a robot hand having a structure for holding the work,
The work reversing mechanism is surrounded by a waterproof cover for preventing liquid scattering, and the waterproof cover has at least a portion of the hand that is not covered by the work when the hand is inserted into the waterproof cover. A work reversing machine characterized in that an upper opening mechanism that opens an area directly above is provided so that water droplets adhering to the inner surface of the waterproof cover do not fall on the hand of the robot. The upper opening mechanism is provided with an opening for opening a portion extending from the upper surface to the front surface of the waterproof cover, and a screen for closing the opening is attached to the opening, and the area of the waterproof cover is opened by moving the screen. The work reversing machine according to claim 1, wherein the work reversing machine is configured by providing an opening / closing drive means. The screen is configured such that when the screen closes the opening, the upper end side of the screen enters the waterproof cover through the opening and overlaps the waterproof cover, and the screen is moved and opened from the opening. The work reversing machine according to claim 2, wherein the tip of the hand inserted into the waterproof cover is configured to reach a position directly below a portion where the screen and the waterproof cover overlap. The upper opening mechanism is configured to divide the waterproof cover into two vertically and to open the region of the waterproof cover by opening the divided left and right waterproof covers left and right. The work reversing machine according to 1. In a work reversing machine having a work reversing mechanism for delivering a work to and from a robot hand and reversing the received work,
The work reversing mechanism is surrounded by a waterproof cover for preventing splashing of liquid, and an upper opening is provided on the upper surface of the waterproof cover, and the waterproof cover has a hand insertion portion including a hole or a notch for inserting the hand. A work reversing machine provided with a shielding member formed on the inner side of the waterproof cover so as to be movable up and down so that water does not scatter in the vicinity of the hand insertion portion and the vicinity thereof. A work reversing mechanism for reversing the work,
Rinsing liquid supply means for supplying a rinsing liquid to the work held by the work reversing mechanism;
A cover surrounding the workpiece reversing mechanism;
A work reversing machine comprising:
The work reversing machine is
When a robot hand for transporting a workpiece enters the cover and the workpiece is transferred between the workpiece reversing mechanism and the hand, at least above the portion of the hand not covered by the workpiece. A work reversing machine characterized in that the area is open. A top ring that holds at least the workpiece, a turntable having a polishing surface that polishes the surface of the workpiece held on the top ring, a robot having a hand that transfers the workpiece, and the workpiece between the hand A work reversing machine for delivering and reversing the received work,
A polishing apparatus using the work reversing machine according to claim 1 as the work reversing machine.

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