JP3853167B2 - Field replaceable module - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates generally to cooling electronic components, and more particularly toOn-site replacement (hereinafter referred to as on-site replacement)Possible module temperature interface.
[0002]
[Prior art]
  The operation of high speed electronic components generates undesirable heat. For example, high speed computer processor elements such as microprocessors, graphics processors and the like generate undesirable heat that must be removed for efficient operation. When heat is removed, the operating temperature is lowered, the operating speed is increased, and the computing ability is improved. Reliability and usability are also improved.
[0003]
  To meet the higher demands on computing power, processor designs continue to evolve, become more complex, and operate at higher speeds. The more complex the design, the greater the number of transistors, and each transistor becomes a source of more heat during operation. The faster the operation of each transistor, the more heat is generated.
[0004]
  Various cooling methods are known in the prior art. In general, the higher the efficiency of cooling system heat removal, the larger, heavier, and bulky the mechanism that implements that system becomes, and the more difficult it is to place in a computer system.
[0005]
  The large amount of power required to operate a high speed computer system results in a large amount of heat dissipation. Therefore, a cooling technique is required. In some prior art cooling schemes, bulky mechanisms such as heat sinks (including cold plates) that mechanically implement the scheme prevent field replacement of modules including processor modules, board modules or system modules, etc. . Furthermore, there is a problem of thermal boundary resistance between the module and the heat sink.
[0006]
  Generally, thermal boundary resistance is due to incomplete mechanical contact between two opposing surfaces (ie, between the lid of an integrated circuit package (or other field replaceable module) and a heat sink). It is. This incomplete mechanical contact is due to irregular "mountain and valley" collisions on both sides.
[0007]
  The substantial amount of contact that exists only at the location where the mountain hits impedes the flow of heat because the valley space is air or vacuum. The thermal conductivity of air is low.
[0008]
  Due to irregular surface defects, the thermal boundary resistance per unit area is 6.45 square centimeters · ° C./watt (1 square inch · ° C./watt). In typical processor applications, this will be an increase of about 20-30 ° C. Since boundary resistance is a function of area, the smaller the boundary area, the higher the resistance. Therefore, this phenomenon becomes increasingly important in the cooling region of electronic circuits as the heat flux increases and the area occupied by the semiconductor package decreases. The equation of thermal resistance can be expressed by the following equation.
[0009]
  Rinterface = C / A
[0010]
  Here, C is the boundary resistance per unit area, and A is the boundary area.
[0011]
  In the prior art, several different ways of eliminating such irregular surface defects and avoiding the thermal effects of collisions are known.
[0012]
1) Diamond turning surface
  One way to improve the boundary resistance between materials is to substantially remove the uneven surface of the bonding surface. The diamond turning surface has a mirror-like surface generally used for optical elements. The boundary performance is quite high, but it is not very common because it is very expensive. Furthermore, high pressure is required for boundary contact. This method is used only when the vertical axis tolerance is tightly controlled (where the vertical axis is understood to be perpendicular to the main surface of the integrated circuit package (or other field replaceable module) lid. I want to be)
[0013]
2) Heat resistant grease
  Grease with improved heat resistance has been commonly used for many years. This was made in the valley of bumpy surface defectsFill the gap. The conductivity is much lower than that of metal, but much higher than air. Therefore, the thermal resistance C per unit area becomes small. This method is used only when the vertical axis tolerance is strictly controlled.
[0014]
  The problems associated with grease are as follows.
-Grease flows and becomes dirty.
-Grease is difficult to control, and in fact, if there is too much grease, the crests of the two surfaces may not come into contact, increasing the thermal resistance. For this reason, manufacturers do not like to use grease.
-In some cases, the grease may flow out of the boundary region as a result of temperature cycling. This phenomenon is commonly known as “pumping”.
-Grease changes over time and can separate and degrade performance.
-Moderate pressure is required at the boundary to ensure contact;
[0015]
3) Heat-resistant pad
  The use of pads is currently the most common boundary improvement method. This is generally a silicone-based pad having a heat resistance of 76 to 508 microns (3 to 20 mils) thick. This method is used only when the vertical axis tolerance is moderately controlled. The popularity of such pads has increased in recent years due to their ease of use in manufacturing where the attachment method is properly controlled. Furthermore, it can be pre-attached to the boundary. The problem with this method is that its thermal resistance is about twice that of grease. For many applications this is insufficient. Further, such pads require boundary pressures in excess of 70.3 grams / square millimeter (100 pounds per square inch (100 psi)) to function.
[0016]
4) Gap pad
  This is a boundary pad that fills a gap with a thickness of 1.52 millimeters to 5.08 millimeters (60/1000 to 200/1000 inches (60 to 200 mils)). This provides some limited benefit at boundaries where gap tolerances are not properly controlled. However, a major problem is that the resistance is typically 10-20 times higher than a standard heat resistant pad. Thus, in general, this is not suitable for high heat flux applications. OptimalIn order to demonstrate performanceA moderate boundary pressure is required.
[0017]
5) Phase change material (PCM)
  Another common boundary material is PCM. The most common is paraffin on a thin carrier 51 microns (2 mils) to 127 microns (5 mils) such as aluminum or screen. Such PCM functions on the principle of recirculating at a temperature higher than a certain temperature, such as 51 ° C., to fill the gaps at the boundary. Performance is equivalent to grease. The carrier makes the PCM easier to mount and use during manufacture. A moderate pressure is required at the boundary. This method is only used when the vertical axis tolerance is strictly controlled.
[0018]
6) Metal paste
  Metal pastes are not used commercially because they are electrically conductive and toxic.
[0019]
  In all cases discussed here, some pressure is required to solve the boundary problem. In each case, it is beneficial to minimize the boundary material to reduce the thermal resistance. Furthermore, none of the above solutions are well suited for sliding contact.
[0020]
  For large modules, such as processor modules, board modules, and system modules, liquid cooling methods have been common in which liquid is passed through a cold plate coupled to an integrated finned heat sink. The liquid conduit is generally coupled to the module itself, thus mechanically preventing field replacement of the module. In particular, due to the liquid coupling between the module and the chassis, the liquid conduit coupled to the module must be disconnected before replacing the module. This reduces the efficiency of the field replaceable module replacement method and tends to leak liquid from the cut conduit. In addition, this makes it impossible to “hot swap” modules that have become important in large or mission critical systems that require redundancy due to the need to provide “always on” services. The term “hot swap” as used herein refers to connecting or disconnecting a field-replaceable module to or from a computer system while the computer system is operating without interrupting the computer system. It refers to the ability to do. In other words, the ability to replace a module while the power is on and the system is operating without adverse effects.
[0021]
[Problems to be solved by the invention]
  Therefore, it is adapted to contact the heat sink slidably with low thermal resistance, does not require boundary pressure to ensure contact, can tolerate misalignment, easy to manufacture, maintain and replace Requires field-replaceable modules and cooling technology. There is also a need for a liquid cooling method that does not couple liquid conduits between the module and the chassis, and therefore does not require cutting when replacing field replaceable modules, or without risk of liquid leakage during replacement. is there.
[0022]
[Means for solving the problems]
  The present invention is adapted to slidably contact the heat sink with low thermal resistance and does not require boundary pressure to ensure contact and can tolerate misalignmentExchange on site (hereinafter referred to as on-site exchange) is possibleProvide easy to manufacture, maintain and replaceable modules. All liquid cooling surfaces are incorporated separately within the chassis and / or module, and there is no liquid coupling between the module and the chassis. Therefore, it is not necessary to cut the liquid conduit when replacing field replaceable modules. In addition, during non-replaceable calculations, modules can be hot swapped while the system is operating.
[0023]
  The stand-alone field replaceable module includes a lid that forms a sealing cavity around at least one electronic component on the printed circuit board of the module. This lid provides a stand-alone spray or conduction cooling means for the sealed electronic component.
[0024]
  In a concise and general aspect, the present invention includes an interfit structure between a heat sink and a field replaceable module. Heat sinkAgainst the horizontal main surface of the heat sinkIt includes a major surface having digit members extending in the longitudinal direction. Field replaceable modules are used to transfer heat from the module to the heat sink.Against the horizontal main surface of the moduleIt has a finger-like member that extends in the longitudinal direction and is disposed in interdigitated contact with the finger-like member of the heat sink.
[0025]
  The field replaceable module fingers are particularly adapted and arranged to be in sliding contact with the heat sink fingers to provide ease of maintenance and replacement of the field replaceable modules. For example, according to the present invention, a first field replaceable module is slid out of mating contact with the heat sink, and then a second field replaceable module is slid out of the mating contact with the heat sink. By doing so, the second field replaceable module can be replaced with the first field replaceable module. As described in detail herein, the interdigitated contact is about 0.065 square centimeters.degree. C./watt while allowing for substantial vertical misalignment of the heat sink and field replaceable module fingers. It has a substantially low thermal resistance in the range of (about 1/100 square inch.degree. C./watt) to about 1.3 square centimeters.degree. C./watt (about 2/10 square inches.degree. C./watt). Furthermore, low thermal resistance is advantageously provided regardless of the requirements of the boundary pressure applied to ensure contact.
[0026]
  The invention will be better understood by the following detailed description, made with reference to the drawings, in which like reference numerals are used to indicate like elements.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
  FIG. 1 illustrates the present invention.Can be exchanged on site (hereinafter referred to as on-site exchange)The preferred embodiment of the module 100. In this embodiment, the module 100 includes one or more bare dies or packaged electronic components 101 that are sealed by a lid 102.(See FIG. 5). Regular finger-like members 103 extend laterally from the main surface of the lid 102..
[0028]
  FIG. 2 shows a field replaceable module according to the present invention.(Hereinafter also referred to as module)FIG. 3 is a sectional view of the first embodiment of FIG. 100, FIG. 3 is a plan view thereof, and FIG. 4 is an exploded perspective view thereof. In this embodiment, the module 100 is a spray cooling module and the lid 102 is an interior that completely covers the electronic component 101 when it is placed over the electronic component 101.(Sealing)Cavity 110Have. The cavity 110 of the lid 102 is on itOne or more electronic components 101 are sealed by a printed circuit board 104 positioned. This has the advantage of realizing confinement of electromagnetic interference noise (EMI), which is generally difficult to confine with large modules. Sealant can be epoxy orSolderPreferably, it may be mechanical by an O-ring or a gasket.
[0029]
  In the embodiment of FIGS. 2, 3 and 4, the lid 102 is liquid cooled. In particular, the lid 102 includes a cooling plate 102a having a flow path 125 through which a cooling liquid (eg, an inert fluorine compound or other known cooling liquid) is circulated. The flow path 125 is preferably a manifold as shown in FIG. The spray pump 122 is coupled to the flow path 125 by a fluid conduit 123 and sends coolant into the flow path 125. The flow path 125 includes a plurality of spray nozzles on the inner lid plate 102b that sprays liquid into the cavity 110.105 (see FIG. 4)Combined with The spray nozzle 105 is preferably positioned to spray liquid on each electronic component 101.
[0030]
  FIG. 4 is an exploded perspective view of the lid 102 representing the manifold 125 that distributes the coolant. Manifold 125 is a distribution channel116 (see FIG. 11)It communicates with each spray nozzle 105 via Manifold 125 and distribution channel are plates(Cooling plate)Machined to extend into 102a, 102b and can be made of copper, aluminum, stainless steel, or other materials. Copper that is resistant to corrosion is preferred. plate102a, 102bIs brazed to the lid 102 so that there is no fluid leakage.
[0031]
  A mechanism in place of the flow path 125 can be created. In this embodiment, folded fin stock is used instead of distribution channels to circulate the fluid. The folded fin stockOf the two plates 102a, 102b of the lid 102 so that there is no fluid leakage.Brazed in between.
[0032]
  In the embodiment of FIGS. 2, 3 and 4, the module 100 is a stand-alone module with a pump 122. pump122 through conduit 124A cooling liquid is circulated in the sealing cavity 110 through the flow path and the spray nozzle 105. Heat from the electronic component 101 evaporates the liquid and becomes vapor. The inner lid plate 102b is cooled by the plate 102a as will be discussed later, and the vapor condenses on the inner surface 107 of the inner lid plate 102b. As it condenses, the heat of the steam moves from the steam to the inner lid plate 102b and then to the plate 102a and the longitudinal fingers 103 as discussed later. The condensed liquid is returned from the sealed cavity 110 to the pump 122 via conduit 123, thereby forming a continuous liquid loop.
[0033]
  FIG. 5 is a cross-sectional view of a second embodiment of a field-replaceable module 100 according to the present invention, and FIG. 6 is a plan view thereof. In this embodiment, the module 100 is a conduction module and the lid 102 comprises an internal cavity 110 that completely covers the electronic component 101 when the lid 102 is placed over the electronic component 101. The lid 102 is also positioned on the one or more electronic components 101 such that the inner surface 107 of the lid 102 contacts as much as possible with the electronic components 101 in the cavity 110. In order to improve the boundary resistance between the inner surface 107 of the lid 102 and the upper surface of the electronic component 101, a boundary improving material 130 such as heat resistant grease, heat resistant pad, gap pad, phase change material or epoxy is used. The boundary improving material 130 makes conductive contact between the top of the electronic component 101 and the inner surface 107 of the lid 102 at a pressure sufficient to improve boundary resistance. Preferably, the lid 102 is sealed by the printed circuit board 104 so as to constitute a sealing cavity 110 containing the electronic component 101. This has the additional advantage of providing confinement of electromagnetic interference (EMI) that is generally difficult to accommodate in large modules. Sealant can be epoxy orSolderHowever, it may be mechanical by an O-ring or a gasket.
[0034]
  The finger member 103 is preferably created by machining or cold forging the lid surface. The lid 102 can be made of copper, aluminum, stainless steel, or other materials.
[0035]
  Preferably, the longitudinal dimension of each finger is a dimension in the range of about 6.4 millimeters (about one-quarter inch) to about 25.4 millimeters (about one inch). The lateral dimensions of each finger (and corresponding adjacent kerf) are in the range of about 0.5 millimeters (about 20 mils) to about 1.3 millimeters (about 50 mils).Thereby,A preferred number of fingers of about 10 to 20 per inch is provided laterally of the major surface of the lid 102.
[0036]
  In the preferred embodiment, the module 100 includes a printed circuit board 104. Each additional integrated circuit package (eg, memory module 121) and one or more electronic components 101 (eg, a packaging microprocessor)SolderOr electrically coupled with conductive traces on the printed circuit board 104 to electrically couple between the memory 121 and the microprocessor 101 and to conduct electrical signals therebetween.
[0037]
  The field replaceable module 100 includes a printed circuit board 104 and a bare die or packaged electronic component 101 sealed by a lid 102 and is preferably formed as shown in FIG. However, the module 100 of the present invention can be applied to any, all, or any of the electronic components on the printed circuit board 104.With thingsIt should be understood that the combination 102 can be formed using a lid 102 and is not strictly limited to the embodiments as described above.
[0038]
  FIG. 7 and FIG.For heat sink 111FIG. 3 is a perspective view of a preferred embodiment showing a slidable manner and how to achieve ease of manufacture, maintenance and replacement of the module 100 of the present invention. As shown in FIGS. 7 and 8, the heat sink 111 and the field-replaceable module 100 areMating with each other. The heat sink 111 is placed in a cooling plate 112 having regular finger members 114 extending in the longitudinal direction.Can be formedpreferable. The finger member 114 is sized and manufactured in a manner similar to the finger member 103 of the lid 102 of the module 100 described above. Although the heat sink 111 is preferably formed in the cooling plate 112, the present invention is not limited to such an embodiment, and any other heat sink may be used as long as it includes a regular finger member 114 extending in the longitudinal direction. It should be understood that the embodiments can be used to advantage.
[0039]
  As shown in the figure, the finger members 103 of the lid 102 of the module 100 are disposed so as to be mutually fitted with the finger members 114 of the heat sink 111 in order to transfer heat from the module 100 to the heat sink 111. The finger-like member 103 of the lid 102 can be adapted and arranged to slidably contact the finger-like member 114 of the heat sink 111, in particular, in order to realize the ease of maintenance and replacement of the module 100. preferable. FIG. 7 shows the process of sliding the module 100 into place. Figure 8 shows that this process is complete and the module 100 is in place.Indicates a rare state.
[0040]
  In FIG. 8, when viewed from the area occupied by the lid 102 with respect to the printed circuit board 104, the contact points fitted to each other are substantially the lengths of the finger members 114 of the heat sink and the finger members 103 of the module 100. From about 0.065 square centimeters.degree. C./watt (about 0.01 square inches.degree. C./watt) to about 1.29 square centimeters.degree. Having a substantially low thermal resistance in the range of In the case of the present invention, such low thermal resistance eliminates the burden of using heat resistant grease or heat resistant pads and the attendant difficulties. Furthermore, the low thermal resistance described above is provided independent of the requirements of the boundary pressure applied to ensure contact.
[0041]
  Due to the low thermal resistance, the operating temperature of the cooling plate 112 is maintained in the range of about 60 ° C to 70 ° C. The cooling plate draws more than 130 watts of heat from the lid 102 of the module 100 as the coolant is circulated through the cooling plate 112 to achieve a typical 35 ° C. ambient temperature. It should be understood that the cold plate 112 can handle more heat by increasing the fluid flow rate or using a larger heat exchanger. The preferred flow rate is about 0.38 liters (about 1/10 gallon) to about 0.76 liters (about 2/10 gallons) per minute for each integrated circuit package; It should be understood that there is no limit.
[0042]
  The heat exchanger 113 has a cooling plate 112 for extracting heat.With fluid communicationThermally coupled. The heat exchanger 113 design may be tube-in-fin, plate cold plate, or other suitable design. The heat exchanger 113 can preferably be manufactured from copper or aluminum, stainless steel or a composite. Each of the cooling plate 112 and the heat exchanger 113 has channels 116, 118 for circulating, for example, water, ethylene glycol mixed with water, an inert fluorine compound, or other suitable coolant known to those skilled in the art. Includes each. The channels 116, 118 can be either serpentine liquid conduits or fin stock through which liquid is passed.
[0043]
  As shown in FIG. 8, the present invention includes a pair of flow paths 115 and 117 coupled to the flow path 116 of the cooling plate 112 and the flow path 118 of the heat exchanger 113 for circulating the fluid.Prepare. In a preferred embodiment, the fluid conduits 115, 117 are hollow copper tubes of about 6.4 millimeters (quarter inch) (or about 12.7 millimeters (1/2 inch)) in diameter or another suitable Made of material.
[0044]
  In a preferred embodiment, an electric pump 119 is coupled in series with one of the fluid conduits 117 to facilitate fluid circulation. A variety of electric pumps provide desirable results. In order to completely seal the fluid circulation, it is preferable to use a magnetically coupled pump. Such pumps are generally available from manufacturers such as Iwaki Welchem and Gorman Rupp.
[0045]
  It should be understood that in the sliding embodiment shown in FIGS. 7 and 8, the steps as shown are reversible and reproducible. By removing the first module from the state of being in contact with the cooling plate 112 by sliding, and by sliding the second module to be in contact with the cooling plate 112,The second moduleIt can be easily replaced with the first module. This replacement can be accomplished without interfering with the flow path 115, 117, heat exchanger 113, and pump 119 mechanisms associated with the cold plate 112. This aspect of the present invention is particularly advantageous when the durability of the rigid conduit is required without sacrificing the ease of replacement of the module 100.
[0046]
  FIG.Or FIG.FIG. 9 is a detailed view of FIGS. 7 to 8 showing the mechanism and interdigitated contact of the heat sink 111 and module lid 102 shown in FIG. The cold plate 112 is manufactured from a clamshell mechanism of two thinner component plates 112a, 112b having serpentine channels or cavities that circulate the heat transfer coolant. This was theorized by the inventor to efficiently transfer heat to the fluid, and the serpentine channel 116 has a diameter of about 4.1 millimeters (about 0.16 inches) to about 5.1 millimeters (about 0 millimeters). Preferred diameter in the range of 2 inches). Smaller channel diameters may provide beneficial results, but the preferred channel diameter should be thick enough to maintain the structural integrity of the component plate and efficient heat transfer from the component plate. I need.
[0047]
  The cold plate 112 must be large enough to thermally couple with the lid 102 of the module 100, and must be large enough to provide and couple to a fluid conduit. For example, in the case of a lid 102 having dimensions of about 7.62 centimeters (about 3 inches) by 12.7 centimeters (about 5 inches), the opposite major surfaces of the cooling plate are respectively Preferably, the length has dimensions of about 9.53 centimeters (about 3.75 inches) by about 14.6 centimeters (about 5.75 inches). Of course, in view of the principles of the present invention, it should be understood that the size of the cooling plate 112 varies with the size of the lid 102.
[0048]
  FIG.Horizontal to the heat sink 111 with respect to the printed circuit board 104FIG. 10 is a detail view of FIG. 9 after a directional misalignment has occurred. In order to reduce the thermal resistance while allowing the lateral displacement of the finger-like members 114 and 103 of the heat sink 111 and the lid 102 of the module 100, the interdigitated contact between the heat sink 111 and the module 100 is used. For example, in a preferred embodiment, in view of the area occupied by the lid 102 projected onto the printed circuit board 104, the interdigitated contact is, for example, about 2.5 millimeters (about 0.1 inch) lateral in FIG. Even with directional misalignment, it has a low thermal resistance in the range of about 0.065 square centimeters.degree. C./watt (about 0.01 square inches.degree. C./watt).
[0049]
  FIG. 11 is an exploded perspective view of FIG. The clamshell mechanism of the two thinner component plates 112a, 112b, sealed to the cold plate 112,It is shown as an exploded part, 116 in the figure isA meandering channel extending for circulating coolant. The serpentine channel 116 is machined to extend into the component plates 112a, 112b and can be made of copper, aluminum or stainless steel. Copper is preferred to resist corrosion. A preferred length of the channel is about 50.8 centimeters (about 20 inches). The component plates 112a, 112b are brazed to the cold plate 112 to seal against fluid leakage.
[0050]
  Depending on the desired temperature of the cold plate, Another configuration of channel 116 can be made. In this embodiment, folded fin stock is used instead of serpentine channel 116 to circulate fluid. The folded fin stock is brazed between the two component plates 112a, 112b of the cold plate to seal the cold plate so that there are no leaks.
[0051]
  FIG. 12 shows another embodiment of the present invention. In FIG. 12, the module 100 includes three finger members each extending in the longitudinal direction, each covering one or more electronic components (not shown) for interdigitated contact with the heat sink 111.Lids 202a, 202b, 202c are provided.
[0052]
  13, 14, 15 and 16 together illustrate a preferred embodiment of the present invention. FIG. 13 is a perspective view of a preferred embodiment of a field replaceable module 200 that is a stand-alone module and includes a lid 202 that seals the entire printed circuit board 204 and all electronic components.
[0053]
  FIG. 14 is a cross-sectional view of a field replaceable module 200 similar to the conduction module of FIGS. As shown in FIG. 14, a large number of electrically interconnected integrated circuits and other electronic components 201 that make up the subsystem are all in the sealed cavity 210 of one lid 202 of the module 200. It is mounted on the circuit board 204. The lid 202 is sealed to the printed circuit board 204 and forms a sealed cavity 210 so that EMI can be confined as described above. All of the integrated circuits and other electronic components 201 of the printed circuit board 204 are thermally coupled by the major surface 207 of the lid 202 and the boundary improvement material 230, and the fingers 203 extend longitudinally therefrom. The module 200 may also be configured as a spray cooling module as previously described and illustrated in FIGS.
[0054]
  FIG. 15 is a perspective view of a stand-alone field replaceable module 200 in a slide mechanism with a heat sink 211. The heat sink 211 is incorporated into the chassis (not shown in FIG. 15, but 300 in FIG. 16) and is liquid coupled to the pump and heat exchanger 302 (FIG. 16) via a conduit. The heat sink 211 has a size enough to cool the entire module 200, or the heat sink 211 has a finger-like member 214 extending in the lateral direction. The finger-like member 214 of the heat sink 211 is disposed in a state of mutual fitting contact with the lid 202 of the module 200 so as to be slidable. Field replaceable module 200 includes backplane connectors 208 and 209 that couple to connectors 308 and 309 of backplane 305, respectively, to provide power and bus connections and / or any other electrical connection. Yes.
[0055]
  FIG. 16 is connectable to the backplane 305 (for bus and power connection) and holds field-replaceable modules 200a, 200b, 200c arranged in interdigitated contact with each heat sink 211a, 211b, 211c, respectively. 1 is a perspective view of a system chassis 300 of a computer system including a plurality of slots 304a, 304b, and 304c that are configured to operate. The heat sinks 211a, 211b, and 211c include finger-like members 214 that are interfitted with the finger-like members 203 of the modules 200a, 200b, and 200c, and are configured integrally with the chassis 305.
[0056]
  The heat exchanger / pump 302 includes equipment necessary for cooling the heat sinks 211a, 211b, and 211c. In a preferred embodiment, the heat exchanger / pump 302 is thermally coupled in fluid communication with the heat sinks 211a, 211b, 211c to extract heat to cool the coolant and heat sink 211a, 211b, 211c in the chassis 300. A cooling ventilation system and an electric pump (not shown) that are circulated simultaneously. The design of the heat exchanger 302 may be a tube-in-fin, plate cold plate or other suitable design and has been previously described with respect to FIGS.
[0057]
  In FIG. 16, modules 200a and 200b are shown mounted in chassis 300 and connected to backplane 305. The module 200c is shown in FIG.A mode to show andShown in a similar manner. Of course,This exchange process, Module 200cAs shown in FIG.Backplane connectors 208 and 209 to backplane connectors 308 and 309 (FIG. 15) on backplane 305InsetCompleted when electrical connection. Thus, in FIG. 16, module 200c replaces the previous field replaceable module that slid into slot 304c and occupied that slot, or slides out of slot 304c and another field replaceable module. Replaced with. During the sliding motion, the module 200c is not installed in the chassis and is therefore not connected to the backplane 305.
[0058]
  From the foregoing description and exemplary figures, it will be appreciated that the embodiments shown in FIGS. 13, 14, 15 and 16 provide the following advantages. First, the field-replaceable modules 200, 200a, 200b, 200c are completely stand alone. There is no liquid coupling between the module and the chassis, so there is no need to disconnect the liquid conduit when changing modules. This facilitates “hot swapping” of critical modules (ie, replacing modules that are powered on and running) in large systems or systems that require redundancy to achieve “always” operation To. Second, the lid 202 seals the entire printed circuit board 204, thereby confining the EMI to the module itself and preventing EMI between slots (or between modules). Traditionally this has been achieved only at the chassis level.
[0059]
  As described above, the present inventionmoduleIs adapted to contact the heat sink with low thermal resistance and does not require boundary pressure to ensure contact and can tolerate misalignment. Also easy to manufacture, easy to maintain,And on-site replacementProvide ease. The invention is within the scope of the claims,In the embodimentIt can be implemented in a situation different from that specifically shown and exemplified.
[0060]
  While the invention has been described in terms of exemplary embodiments, those skilled in the art will recognize that various changes and modifications can be made to the exemplary embodiments without departing from the spirit or scope of the invention. It is to be understood that the scope of the invention is not limited in any way to the exemplary embodiments, and the invention is limited only by the appended claims.
[Brief description of the drawings]
FIG. 1 is a perspective view of a field replaceable module of the present invention.
FIG. 2 shows a cross section of a first embodiment of a field replaceable module according to the inventionAnd corresponds to a cross section taken along line II in FIG.It is an enlarged view.
FIG. 3 is a plan view of a first embodiment of a field replaceable module according to the present invention.
4 is an exploded perspective view of a first embodiment of a field replaceable module according to the present invention. FIG.
FIG. 5 shows a second embodiment of a field replaceable module according to the present invention.Similar to FIG.It is sectional drawing.
FIG. 6 is a plan view of a second embodiment of a field replaceable module according to the present invention.
FIG. 7 is a perspective view of an embodiment showing aspects of the sliding structure of the present invention.
FIG. 8 is a perspective view of an embodiment showing aspects of the sliding structure of the present invention.
FIG. 9 is a partially enlarged view of FIG. 8;
FIG. 10Of the cold plate against the lidFIG. 10 is a partially enlarged view corresponding to FIG. 9 after a positional shift has occurred.
11 is an exploded perspective view of FIG. 9. FIG.
FIG. 12 shows the present invention.Another of modulesIt is a perspective view which shows embodiment.
FIG. 13 shows the present invention.Another on the lidIt is a perspective view of an embodiment.
14 is a cross-sectional view of the embodiment shown in FIG.
FIG. 15BackplaneThe slide type of the present inventionMounted structure moduleIt is a perspective view which shows an aspect.
FIG. 16 is a perspective view of the chassis of the present invention showing a stand-alone, hot-swappable embodiment containing a plurality of field replaceable modules of the present invention.
[Explanation of symbols]
  100,200 Field replaceable module
  101,201 electronic components
  102,202 lid
  102a, 112 cooling plate
  103, 114, 203, 214 Finger-shaped member
  104,204 Printed circuit board
  105 Spray nozzle
  110,210 cavity
  111, 112, 211 heat sink
  122 spray pump
  123,124 Fluid conduit
  125 channel (liquid channel)
  130,230 Boundary improvement material (heat transfer mechanism)
  208,209 connector (module electrical connector)
  300 chassis
  305 Backplane (Electric backplane)
  308,309 connector (backplane electrical connector)

Claims (9)

A module that is electrically connectable to a computer system for operation and that is easily field replaceable at the field of the computer system, the printed circuit board and one electrically connected to the printed circuit board Or a lid having a plurality of electronic components and an internal cavity, and sealing at least one of the electronic components in the internal cavity, and a plurality of finger-like members extending longitudinally from the main surface of the lid And a built-in liquid cooling system that transfers heat from the electronic components sealed in the internal cavity to the lid,
A built-in liquid cooling system includes a liquid channel formed inside the lid, at least one spray nozzle coupled between the liquid channel and the internal cavity, and cooling circulating in the liquid channel. A field replaceable module comprising: a liquid; and a spray pump for circulating the coolant in a liquid flow path, thereby spraying the coolant from the at least one spray nozzle into the internal cavity. A chassis, a power backplane having a backplane electrical connector, a heat sink having a main surface fixedly mounted on the chassis and having fingers extending longitudinally therefrom, and a field replaceable module. ,
The field replaceable module includes a module electrical connector connectable to the backplane electrical connector, a printed circuit board electrically connected to the module electrical connector, and a 1 electrically connected to the printed circuit board. One or more electronic components, a lid forming a sealed cavity on at least one of the electronic components, and a built-in heat transfer for transferring heat from the at least one electronic component to the lid Mechanism and
Said lid has a main surface having a finger-like members extending therefrom in the longitudinal direction, in order to transfer heat to the heat sink from the field-replaceable modules, mutually and finger member of the heat sink A computer system fitted and slidably arranged .   The computer system of claim 2, wherein the heat sink comprises a cold plate having a channel extending therefrom for circulating a coolant.   The computer system of claim 2, wherein the heat transfer mechanism includes a boundary improvement material coupled in conductive contact between the electronic component and the lid.   The computer system of claim 2, wherein the built-in heat transfer mechanism comprises a built-in liquid cooling system in which the liquid used is not coupled outside the field replaceable module.   The built-in liquid cooling system circulates in the liquid flow path, a liquid flow path formed inside the lid, at least one spray nozzle coupled between the liquid flow path and the internal cavity. 6. The coolant of claim 5, comprising a coolant and a spray pump that circulates the coolant into the liquid flow path and thereby sprays the coolant from the at least one spray nozzle into an internal cavity. Computer system. The computer system of claim 2, wherein the module electrical connector can be electrically connected to or disconnected from the backplane electrical connector of the power backplane without interrupting the power backplane. Said lid, said printed circuit cormorants covering all of one or more electronic components on a substrate, field-replaceable module of claim 1. It said lid, one or sales is covering all of the plurality of electronic components, computer system according to claim 2 on the printed circuit board.

Images