JP3773797B2 - Cold plate connection structure and connection method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a connection structure and a connection method of a plurality of cold plates for cooling a heat generating component such as a central processing unit of a computer and an integrated circuit, and more particularly to a connection structure of a cold plate in which the interval between cold plates can be easily changed. .
[0002]
[Prior art]
First, the configuration of a business computer 100 used in an Internet server or the like according to the cold plate connection structure of the present invention will be briefly described with reference to FIGS.
FIG. 4 is a perspective view showing the external appearance of the computer 100.
FIG. 5 is a perspective view of one unit constituting the computer 100 taken out.
FIG. 6 is a plan view showing a schematic configuration of one unit.
[0003]
The business computer 100 used for the Internet server or the like is usually configured by stacking several units to several tens of units 110 as shown in FIG.
Further, as shown in FIGS. 5 and 6, each unit 110 has a heat generating component 114 and a cooling system of the computer 100 such as a central processing unit of the computer 100 and an integrated circuit in a metal case 112 made of an aluminum material or the like. Contained and stored.
[0004]
By the way, if the heat generating components 114 such as the central processing unit and the integrated circuit of the business computer 100 are not forcibly cooled, the temperature may rise to, for example, about 150 ° C. and may not operate normally.
Then, next, the cooling system of the heat generating component 114 of the computer 100 will be described with reference to FIGS.
FIG. 7 is a plan view showing a cooling system of the computer 100 accommodated in one unit 110.
8A and 8B are views showing the shape of the cold plate 120 that cools the heat generating component 114 of the computer 100. FIG. 8A is a front view and FIG. 8B is a side view.
[0005]
As shown in FIG. 7, the cooling system of the computer 100 includes a cold plate 120, a cooling pipe 130 for circulating a refrigerant (brine), a connector 140 for communicating each cooling pipe 130, and a forced circulation of the refrigerant in the cooling pipe 130. A pump 150 for injecting refrigerant into the cooling pipe 130 at any time to remove bubbles in the refrigerant, a radiator 170 for circulating the refrigerant in the cooling pipe 130 to air-cool the refrigerant, and cooling air to the radiator 170 It is comprised from the fan (cross flow fan) 180 which ventilates.
Note that water is mainly used as the cooling system refrigerant (brine) shown in FIG. 7, but other refrigerants such as pure water and antifreeze liquid such as ethylene glycol may be used.
[0006]
The cold plate 120 is fixed by sandwiching two plates 122A and 122B having substantially the same shape formed with a groove 120a for engaging the tubular cooling pipe 130 with the cooling pipe 130 sandwiched between the grooves 120a.
Therefore, as shown in FIGS. 8A and 8B, the cooling pipe 130 passes through the center plane of the cold plate 120.
Normally, the cold plate 120 is made of aluminum from the viewpoint of ease of processing and light weight, and the thermal conductivity, and the cooling pipe 130 is made of copper from the viewpoint of strength.
[0007]
On the other hand, although explanation by illustration is omitted, a heat generating component 114 (see FIG. 5) such as a central processing unit or an integrated circuit is integrated with a printed circuit board via a socket, and this integrated central processing unit or The heat generating component 114 such as an integrated circuit is brought into direct contact with the cold plate 120 and the coolant is circulated through the cooling pipe 130 in the direction of the arrow shown in FIG.
[0008]
In addition, the refrigerant that has absorbed the heat of the heat generating component 114 from the heat generating component 114 of the computer 100 through the cold plate 120 circulates through the cooling pipe 130, is cooled by the radiator 170 that is idled by the fan 180, and is again cooled. It circulates through 130 and is used for cooling the heat generating component 114.
As a result, the heat generating component 114 is always cooled to a temperature range in which it normally operates.
[0009]
The cooling system of FIG. 5 has a structure in which a plurality (3 in the illustrated example) of cold plates 120 are connected to a cooling pipe 130 and a connector 140 that communicates with the cooling pipe 130.
This is because one unit 110 cools the heat generating components 114 of the plurality of computers 100, and corresponds to the size of the printed circuit board to which the heat generating components 114 are attached and the layout in which the heat generating components 114 are attached to the printed circuit board. The interval between the cold plates 120 is set.
[0010]
[Problems to be solved by the invention]
By the way, the conventional cold plate connection structure sets the interval between each cold plate according to the size and layout of the printed circuit board to which the heat generating parts of the computer are attached, and fixes the cold plate to the cooling pipe, The cooling pipe is structured to communicate with a connector.
[0011]
In this conventional cold plate connection structure, there is no particular problem with the spacing of each cold plate when attaching heat generating components that are the main part of the computer in the initial setting. In order to improve the performance of commercial computers, the central processing unit is strengthened, the central processing unit is changed to an integrated circuit, and conversely, the integrated circuit is changed to a central processing unit. Or may need to be changed.
[0012]
At this time, when the size and layout of the printed circuit board incorporating the heat generating parts such as the central processing unit and the integrated circuit are different, in the conventional connection structure in which the cold plate is fixed to the cooling pipe, the interval between the cold plates is There was a problem that it was difficult to re-adjust according to the size and layout of the printed circuit board, and it was not possible to flexibly cope with the increase of computers.
[0013]
The present invention solves the above-mentioned problems (problems), and it is easy to change the intervals of a plurality of cold plates that mainly cool the heat generating components such as a central processing unit of a computer and an integrated circuit, and the heat generating components can be easily replaced. An object of the present invention is to provide a cold plate connecting structure.
[0014]
[Means for Solving the Problems]
In order to solve the above-described problem, the cold plate connection structure of the present invention is the connection structure according to claim 1, wherein the brine is connected to circulate a plurality of cold plates that cool the heat generating components of the computer . The plurality of cold plates are connected to each other via one or more cooling pipes, and each of the plurality of cold plates is slidably attached to the cooling pipe, and an interval between the plurality of cold plates is set. The configuration is configured to be changeable.
[0015]
With this configuration, it is possible to easily adjust the mounting interval of each cold plate, so it is easy to replace heat-generating components with different printed circuit board sizes and layouts, and a cold plate that can easily cope with enhancement of computer performance, etc. It can be set as a connection structure.
[0016]
The cold plate connection structure according to claim 2, wherein the plurality of cold plates are connected to a plurality of cold plates that cool the heat generating parts of the computer so that the brine circulates. It is connected in a skewered manner through one or two or more cooling pipes that penetrate, and each of the plurality of cold plates is slidably attached to the cooling pipe, and the interval between the plurality of cold plates can be changed. The configuration is made.
[0017]
With this configuration, even with the cold plate connection structure that allows the cold plates to communicate with each other by passing through the cooling pipe, the mounting interval of each cold plate can be easily adjusted, and the heat generating parts with different printed circuit board sizes and layouts can be used. Replacement can be simplified, and a cold plate connection structure that can easily cope with enhancement of the performance of the computer can be obtained.
[0018]
According to a third aspect of the present invention, there is provided a structure in which the cold plate coupling structure according to the third aspect of the present invention has good heat conduction at the contact surface between the cold plate and the cooling pipe.
[0019]
If comprised in this way, the heat conduction of a cold plate will become favorable and the cooling efficiency by the cold plate of the heat-emitting component of a computer will improve.
[0020]
According to a fourth aspect of the present invention, there is provided a cold plate connecting structure in which a thermal conductive agent is applied to a contact surface between the cold plate and the cooling pipe.
[0021]
If comprised in this way, the cooling efficiency of a cold plate can be improved easily.
[0034]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, first to third embodiments of the cold plate connecting structure of the present invention will be sequentially described with reference to FIGS. 1 to 3.
FIG. 1 is a plan view showing a first embodiment of a cold plate coupling structure according to the present invention.
[0035]
As shown in FIG. 1, in the cold plate connecting structure 10 of the present embodiment, each of a plurality of (three in the illustrated example) cold plates 20 is provided with two cooling pipes 30 penetrating the cold plate 20. The plurality of cold plates 20 are slidably attached to the cooling pipe 30 while ensuring thermal conductivity with a predetermined friction, as shown by arrows in FIG.
[0036]
That is, according to the cold plate connection structure 10 of the present embodiment, the intervals between the plurality of cold plates can be easily changed.
As a result, when the heat generating component 114 (see FIG. 5) such as the central processing unit of the computer 100 (see FIG. 4) and the integrated circuit used in the Internet server or the like is replaced, the heat generating component 114 is integrated. It can easily cope with changes in the size and layout of printed circuit boards.
Therefore, when enhancing the performance of the computer 100, the main part of the computer 100 can be easily changed.
[0037]
In the cold plate connection structure 10 of the present embodiment, a thermal conductive agent such as grease is applied to the contact surface between the cold plate 20 and the cooling pipe 30.
As described above, when the heat conduction at the contact surface between the cold plate 20 and the cooling pipe 30 is well formed, the heat of the cold plate 20 can be obtained even when a gap is generated between the cold plate 20 and the cooling pipe 30. The conduction is improved and the cooling efficiency of the heat generating component 114 of the computer by the cold plate 20 is improved.
[0038]
Next, FIG. 2 is a plan view showing a second embodiment of the cold plate coupling structure 12 of the present invention.
[0039]
As shown in FIG. 2, in the cold plate coupling structure 12 of the present embodiment, each of a plurality of (three in the illustrated example) cold plates 22 respectively communicates two cooling pipes 32 and the cooling pipes. Connected through a connector 40.
Further, as shown in FIG. 2, each connector 40 is formed in a bellows-like shape that can be expanded and contracted.
Or although description by illustration is abbreviate | omitted, you may make it a connector comprise a flexible material (synthetic resin, a metal, etc.).
Even if it comprises in this way, since the refrigerant | coolant circulates in the cooling pipe 32 at substantially atmospheric pressure, there is no problem in the circulation of the refrigerant.
[0040]
That is, according to the cold plate connection structure 10 of the present embodiment, the relative positions of the plurality of cold plates can be easily changed by appropriately deforming the telescopic connector 40.
As a result, when the heat generating component 114 (see FIG. 5) such as the central processing unit of the computer 100 (see FIG. 3) or the integrated circuit used in the Internet server or the like is replaced, the heat generating component 114 is integrated. It can easily cope with changes in the size and layout of printed circuit boards.
Therefore, when enhancing the performance of the computer 100, the heat generating component 114 of the computer 100 can be easily changed.
[0041]
FIG. 3 is a plan view showing a third embodiment of the cold plate coupling structure 14 of the present invention.
[0042]
In the cold plate coupling structure 14 of the present embodiment, as shown in FIG. 3, each of a plurality (three in the illustrated example) of cold plates 24 is coupled via two cooling pipes 34.
Further, the cold plate 24 and the cooling pipe 34 are respectively made of the same aluminum material, and the cooling pipe 34 has a part 34a formed in a bellows-like shape, and a telescopic shape, as shown in FIG. Yes.
[0043]
That is, according to the cold plate connection structure 14 of the present embodiment, the relative positions of the plurality of cold plates 24 can be easily changed by appropriately deforming the telescopic cooling pipe 34.
As a result, when replacing heat-generating parts such as a central processing unit of the computer 100 (see FIG. 4) and an integrated circuit used for an Internet server or the like, the size of the printed circuit board integrally formed with the heat-generating parts is changed. Can be easily accommodated.
Therefore, when enhancing the performance of the computer 100, the main part of the computer 100 can be easily changed.
[0044]
By the way, in the cold plate connection structure of the present embodiment, as described above, the cooling pipe 34 and the cold plate 24 are made of the same material, so that a part of the manufacturing process of the cooling pipe 34 and the cold plate 24 can be shared. Therefore, it becomes possible to reduce the manufacturing cost.
Further, when aluminum is used as the constituent material of the cold plate 24 and the cooling pipe 34, the cold plate connection structure 14 that is easy to form, lightweight, and excellent in cooling performance can be obtained.
[0045]
In the present embodiment, the cold plate 24 is manufactured by pressing two aluminum plates 25 provided with grooves 24a for engaging the cooling pipe 34. At this time, the cooling pipe 34 is inserted into the grooves 24a. If the aluminum plate 25 is pressed and the cooling pipe 34 is caulked in the groove 24a in a state where the is attached, it is possible to obtain a cold plate connecting method that greatly reduces the cost.
[0046]
The connection structure of the cold plate of the present invention is not limited to the above embodiment, and various modifications can be made.
For example, in the first embodiment, grease is applied to the contact surface between the cold plate and the cooling pipe to improve heat transfer efficiency, but this is another example of a member having good heat conduction. You may make it improve cooling efficiency by mounting | wearing.
[0047]
In the second embodiment, the connector of the cooling pipe has been described as a bellows-like connector, but for example, a connector formed of a flexible material may be used.
[0048]
In each of the first to third embodiments, the internal structure of the flow path of the cold plate refrigerant has been described as the cooling pipe penetrating the cold plate. However, the cold plate refrigerant is circulated. A cooling pipe may be attached only in the vicinity of the inlet and outlet, and the inside of the cold plate may be formed with a refrigerant flow path communicating with the cooling pipe.
Further, the number of cooling pipes and the mounting position of the cold plate are not limited to those in the above embodiment.
[0049]
【The invention's effect】
Since the cold plate connection structure and the cold plate connection method of the present invention are configured as described above, they have the following excellent effects.
(1) The cold plate connecting structure according to the present invention is the connecting structure for connecting the plurality of cold plates for cooling the heat generating parts of the computer so that the brine circulates. Are connected via one or more cooling pipes, and each of the plurality of cold plates is slidably attached to the cooling pipe, and the interval between the plurality of cold plates can be changed. With this configuration, the mounting interval of each cold plate can be easily adjusted, so it is easy to replace heat-generating components with different printed circuit board sizes and layouts, and a cold plate connection structure that can easily cope with enhancement of computer performance, etc. It can be.
[0050]
(2) In the connection structure in which the brine is circulated through the plurality of cold plates for cooling the heat generating parts of the computer as described in claim 2, the plurality of cold plates penetrate each of the plurality of cold plates. It is connected in a skewered manner through one or more cooling pipes, and each of the plurality of cold plates is slidably attached to the cooling pipe, and the interval between the plurality of cold plates can be changed. With this configuration, even with the cold plate connection structure that allows the cold plates to communicate with each other by passing through the cooling pipe, the mounting interval of each cold plate can be easily adjusted, and heat-generating components with different printed circuit board sizes and layouts can be replaced. Calls that are simple and can easily handle increased computer performance It can be a coupling structure of the plate.
[0051]
(3) As described in claim 3, when the heat conduction of the contact surface between the cold plate and the cooling pipe is good, the heat conduction of the cold plate becomes good, and the heat generating parts of the computer Cooling efficiency is improved by the cold plate.
[0052]
(4) As described in claim 4, when the heat conductive agent is applied to the contact surface between the cold plate and the cooling pipe, the cooling efficiency of the cold plate can be easily improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing a main configuration of a first embodiment of a cold plate coupling structure according to the present invention;
FIG. 2 is a plan view showing a main configuration of a second embodiment of a cold plate coupling structure according to the present invention;
FIG. 3 is a plan view showing a main configuration of a third embodiment of a cold plate coupling structure according to the present invention;
FIG. 4 is an external perspective view of a computer.
FIG. 5 is a perspective view of one unit constituting the computer.
FIG. 6 is a plan view showing a schematic configuration of one unit.
FIG. 7 is a plan view showing a cooling system of a computer housed in one unit.
FIGS. 8A and 8B are diagrams showing a cold plate for cooling a heat generating component of the computer, in which FIG. 8A is a front view and FIG. 8B is a side view.
[Explanation of symbols]
10, 12, 14: Cold plate connection structure 20, 22, 24: Cold plate 24a: Cold plate groove 30, 32, 34: Cooling pipe 40: Connector 100: Computer

Claims (4)

In a connection structure that connects multiple cold plates that cool the heat generating parts of the computer so that the brine circulates,
The plurality of cold plates are connected to each other via one or more cooling pipes, and each of the plurality of cold plates is slidably attached to the cooling pipe, and an interval between the plurality of cold plates is set. A cold plate coupling structure characterized in that it can be changed. In a connection structure that connects multiple cold plates that cool the heat generating parts of the computer so that the brine circulates,
The plurality of cold plates are connected in a skewered manner through one or more cooling pipes penetrating each of the plurality of cold plates, and each of the plurality of cold plates is slidable on the cooling pipe. A cold plate coupling structure, wherein the cold plate is attached and the interval between the plurality of cold plates is changeable.   The cold plate connection structure according to claim 1, wherein the heat conduction at a contact surface between the cold plate and the cooling pipe is excellent. The cold plate connection structure according to claim 1 , wherein a heat conductive agent is applied to a contact surface between the cold plate and the cooling pipe.

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