JP3839097B2 - Mold structure for easy temperature control - Google Patents
Mold structure for easy temperature control Download PDFInfo
- Publication number
- JP3839097B2 JP3839097B2 JP15301496A JP15301496A JP3839097B2 JP 3839097 B2 JP3839097 B2 JP 3839097B2 JP 15301496 A JP15301496 A JP 15301496A JP 15301496 A JP15301496 A JP 15301496A JP 3839097 B2 JP3839097 B2 JP 3839097B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- heat insulating
- insert piece
- temperature control
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、熱可塑性樹脂の一般射出成形及びガスアシスト成形等の成形法において、各種製品の外装部品、外板、精密部品等の成形品で高品質の表面、寸法精度を要求され、かつハイサイクルが要求される分野の成形方法に適用可能な金型構造に関するものである。
【０００２】
本発明は、特に、各種成形品のウエルドラインやジェッティング等の外観不良、寸法精度不良、無機フィラー充填材料における外観不良を解消するするために金型温度を高くした場合のハイサイクル成形用金型構造に関するものである。
【０００３】
【従来の技術】
従来、エンジニアリングプラスチックの成形において、成形残留応力や成形品外観の問題、無機フィラーを充填した樹脂においてはフィラーの浮きの問題で金型温度を樹脂の熱変形温度よりも５〜２０℃程度低く設定することが多かった。しかしながら、金型の昇温、降温に時間が掛かり過ぎる、１００℃を超える金型温度は上がらない、成形サイクルが長くなるという問題があった。
【０００４】
【発明が解決しようとする課題】
本発明は、従来の射出成形、ガスアシスト成形等における金型において、成形サイクルの短縮に効果のある金型の昇温、降温の温度制御が効率良く短時間内でできる成形用金型構造を提供することを課題とする。
【０００５】
【課題を解決するための手段】
本発明の課題は、射出成形用金型において、金型温度制御を効率良く行うために主型と、製品形状を形成するキャビティと、を別部品にして、該キャビティを入れ駒方式にした金型構造によって解決される。
【０００６】
この金型構造において、前記主型と入れ駒との間には、断熱層を設けることができる。断熱層としては主型と入れ駒との間に、熱伝導率３０Ｗ／ｍ・Ｋ以下の金属材料、例えばステンレス鋼、チタン等の金属を設け、なおかつ該断熱層と入れ駒との間に断熱板、例えばベークライトを設置することで二重構造の断熱層を形成することができる。
【０００７】
本発明にかかる金型構造を利用することにより、車両用のルーフレール、ドアハンドル、グリップ等の自動車部品、ＦＡＸ、コピー等の事務機器、家庭用電気製品のハウジングやシャーシ等に適する成形品が得られる。この金型は、熱可塑性樹脂の射出成形、中空成形部を有するガスアシスト成形等の各種成形法に適用することができる。
【０００８】
本発明で使用する温度を効率良く迅速に昇温、降温させる金型構造は、前述のように、金型の外型を形成する主型と、製品形状を形成するキャビティとコアとを別部品とし、これら両者を入れ駒方式とするものである。
【０００９】
さらに、これら主型と入れ駒との間には、熱伝導率３０Ｗ／ｍ・Ｋ以下の金属材料と断熱板の二重構造からなる断熱層を設置し、なおかつ主型と断熱層の接触面、入れ駒と断熱板の接触面に金型強度上問題のない範囲で空隙を設けることで実現できる。
【００１０】
この際、入れ駒を形成する金属は熱伝導率６０Ｗ／ｍ・Ｋ以上の材料、例えば亜鉛、Be-Cu(ベリリウム−銅）、アルミニウム及びこれらを主成分とする合金、プリハードン鋼で作成する。また、金型温調管路は入れ駒部に直接設け入れ駒部のみ温度制御を行う。
【００１１】
【発明の作用】
本発明によれば、金型温度の昇温、降温が効率良く迅速に行え、作業準備の所要時間を短縮することができる。また、１００℃以上の金型温度も容易にかつ短時間で実現できる。
【００１２】
本発明によれば、成形１サイクルの間に金型温度を昇温、降温させる金型冷熱サイクルにおいて、成形サイクルを長くすることなく実現できる。
【００１３】
【実施の形態】
以下、実施例を示す添付図を参照しつつ本発明を詳細に開示する。図１は本発明にかかる金型構造の断面図である。この金型は、固定側主型１と可動側主型２との合せ面にキャビティ３が形成される。キャビティ３は固定側入れ駒４と可動側入れ駒５により形成されている。
【００１４】
固定側主型１と入れ駒４および可動側主型２と入れ駒５との間にそれぞれ断熱層が設けられている。この断熱層は熱伝導率の低い金属であるステンレス鋼製断熱層６とベークライト製の断熱板である７で構成されている。
【００１５】
固定側主型１及び可動側主型２とステンレス鋼６との間には金型強度上問題の無い範囲で空隙８を設けてある。また、固定側入れ駒４及び可動側入れ駒５と断熱板７との間に金型強度上問題の無い範囲で空隙９を設けてある。
【００１６】
この金型の温度制御を行うために金型温調管路１０と熱電対１１を固定側入れ駒４（図示していない）及び可動側入れ駒５に設けてある。
【００１７】
実施例１
実施例１では、温調機TURBU-TD-U4-H（（株）シスコ製）を使用し、１００℃の加圧した熱水を１２００ l／hrで本発明の金型に巡回させ、金型表面温度の昇温速度の測定と金型冷却機グラシエシリーズ ポータブルチラーNXGW-10（（株）シスコ製）を使用し３℃の冷水を１０００ l／hrで本発明の金型に巡回させ金型表面温度の降温速度を測定した。比較例として同じ金型で入れ駒構造を取らない場合での同じ実験を行い比較した。
【００１８】
昇温速度につては本発明は比較例の３０倍の速度であり、降温速度については本発明は比較例の２０倍の速度であった。表１にその結果を示す。
【００１９】
【表１】
実施例２
実施例２では、温調機TURBU-TD-U4-H（（株）シスコ製）を使用し、１４０℃の加圧した熱水を１２００ l／hrで本発明の金型に巡回させ、金型表面温度が何度になるかを評価した。比較例として、同じ金型で入れ駒構造を取らない場合での同じ実験を行い比較した。
【００２１】
本発明の金型にとれば、熱水巡回開始後３分後にキャビティー表面温度は１４０℃になったのに対し、比較例では熱水巡回開始後１時間たって１００℃であった。表２に実施例２の金型表面温度の結果を示す。
【００２２】
【表２】
【発明の効果】
本発明によれば、金型の昇温、降温を効率良く短時間で可能になり成形準備の作業時間を短縮できる。また、１００℃以上の金型温度についても確実に設定温度通りにできる。その結果、ハイサイクル成形が可能となる。
【図面の簡単な説明】
【図１】本発明にかかる金型構造の断面図である。
【符号の説明】
１ 固定側主型
２ 可動側主型
３ キャビティー
４ 固定側入れ駒
５ 可動側入れ駒
６ 断熱層（ステンレス鋼）
７ 断熱板
８ 主型と断熱層との空隙
９ 入れ駒と断熱板との空隙
10 金型温調管路
11 熱電対[0001]
BACKGROUND OF THE INVENTION
The present invention requires a high quality surface and dimensional accuracy in molded products such as exterior parts, outer plates, and precision parts of various products in molding methods such as general injection molding and gas assist molding of thermoplastic resins. The present invention relates to a mold structure applicable to a molding method in a field requiring a cycle.
[0002]
In particular, the present invention is a metal mold for high cycle molding when the mold temperature is raised in order to eliminate appearance defects such as weld lines and jetting of various molded products, dimensional accuracy defects, and appearance defects in inorganic filler-filled materials. It relates to the type structure.
[0003]
[Prior art]
Conventionally, in molding of engineering plastics, the mold temperature is set to about 5 to 20 ° C. lower than the thermal deformation temperature of the resin due to the problems of molding residual stress and molded product appearance, and the problem of floating of the filler in the resin filled with inorganic filler. There were many things to do. However, there are problems that it takes too much time to raise and lower the mold, the mold temperature exceeding 100 ° C. does not rise, and the molding cycle becomes longer.
[0004]
[Problems to be solved by the invention]
The present invention provides a molding die structure capable of efficiently controlling the temperature rise and fall of a mold, which is effective in shortening the molding cycle, in a conventional injection molding, gas assist molding, etc. within a short time. The issue is to provide.
[0005]
[Means for Solving the Problems]
An object of the present invention is to provide an injection mold in which a main mold and a cavity for forming a product shape are separated from each other in order to efficiently control the mold temperature, and the cavity is inserted into a piece type. Solved by mold structure.
[0006]
In this mold structure, a heat insulating layer can be provided between the main mold and the insert piece. Between the main type and placed piece is as a heat insulating layer, heat insulation between the thermal conductivity of 30 W / m · K or less of a metallic material, such as stainless steel, a metal such as titanium is provided, and yet put the heat insulating layer frame A double-layer heat insulating layer can be formed by installing a plate such as bakelite.
[0007]
By using the mold structure according to the present invention, it is possible to obtain molded products suitable for automobile parts such as vehicle roof rails, door handles, grips, office equipment such as FAX and copy, housings and chassis of household electric appliances, and the like. It is done. This mold can be applied to various molding methods such as injection molding of a thermoplastic resin and gas assist molding having a hollow molding part.
[0008]
As described above, the mold structure for raising and lowering the temperature used in the present invention efficiently and quickly is a separate part of the main mold that forms the outer mold of the mold, the cavity that forms the product shape, and the core. Both of them are set to the insert piece method.
[0009]
Furthermore, between these main mold and put piece, a heat insulating layer composed of a double structure of the heat conductivity of 30 W / m · K or less metallic material and the heat insulating plate is placed, yet contacted the main mold and the heat insulating layer This can be realized by providing a gap on the surface, the contact surface between the insert piece and the heat insulating plate within a range where there is no problem in mold strength.
[0010]
At this time, the metal forming the insert piece is made of a material having a thermal conductivity of 60 W / m · K or more, such as zinc, Be—Cu (beryllium-copper), aluminum, an alloy containing these as a main component, or pre-hardened steel. In addition, the mold temperature control pipe is directly provided in the insert piece portion, and only the insert piece portion controls the temperature.
[0011]
[Effects of the Invention]
According to the present invention, the mold temperature can be raised and lowered efficiently and quickly, and the time required for work preparation can be shortened. Also, a mold temperature of 100 ° C. or higher can be realized easily and in a short time.
[0012]
According to the present invention, in a mold cooling / heating cycle in which the mold temperature is raised and lowered during one molding cycle, it can be realized without lengthening the molding cycle.
[0013]
Embodiment
Hereinafter, the present invention will be disclosed in detail with reference to the accompanying drawings showing embodiments. FIG. 1 is a sectional view of a mold structure according to the present invention. In this mold, a cavity 3 is formed on a mating surface between the fixed main mold 1 and the movable main mold 2. The cavity 3 is formed by a fixed side insertion piece 4 and a movable side insertion piece 5.
[0014]
Thermal insulation layers are provided between the fixed-side main mold 1 and the insert piece 4 and between the movable-side main mold 2 and the insert piece 5. This heat insulating layer is composed of a stainless steel
[0015]
A gap 8 is provided between the fixed-side main mold 1 and the movable-side main mold 2 and the
[0016]
In order to control the temperature of the mold, a mold temperature control line 10 and a thermocouple 11 are provided in the fixed side insertion piece 4 (not shown) and the movable side insertion piece 5.
[0017]
Example 1
In Example 1, a temperature controller TURBU-TD-U4-H (manufactured by Cisco Corporation) was used, and hot water pressurized at 100 ° C. was circulated to the mold of the present invention at 1200 l / hr. Measurement of mold surface temperature rise rate and mold cooler Gracie series portable chiller NXGW-10 (manufactured by Cisco) using 3 ° C chilled water circulating through the mold of the present invention at 1000 l / hr. The cooling rate of the mold surface temperature was measured. As a comparative example, the same experiment was conducted in the case where the same mold was not used and the frame structure was not taken.
[0018]
The temperature rising rate of the present invention was 30 times that of the comparative example, and the temperature lowering rate of the present invention was 20 times that of the comparative example. Table 1 shows the results.
[0019]
[Table 1]
Example 2
In Example 2, a temperature controller TURBU-TD-U4-H (manufactured by Cisco) was used, and hot water pressurized at 140 ° C. was circulated to the mold of the present invention at 1200 l / hr. The mold surface temperature was evaluated. As a comparative example, the same experiment was carried out in the case where the same mold was not used and the frame structure was not taken.
[0021]
According to the mold of the present invention, the cavity surface temperature reached 140 ° C. 3 minutes after the start of hot water circulation, whereas in the comparative example, the temperature was 100 ° C. 1 hour after the start of hot water circulation. Table 2 shows the results of the mold surface temperature of Example 2.
[0022]
[Table 2]
【The invention's effect】
According to the present invention, it is possible to efficiently raise and lower the temperature of a mold in a short time, and the working time for molding preparation can be shortened. In addition, a mold temperature of 100 ° C. or higher can be reliably set to the set temperature. As a result, high cycle molding is possible.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a mold structure according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Fixed side main type | mold 2 Movable side main type | mold 3 Cavity 4 Fixed side insertion piece 5 Movable
7 Insulation plate 8 Gap between main mold and heat insulation layer 9 Gap between slot and insulation plate
10 Mold temperature control line
11 Thermocouple
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15301496A JP3839097B2 (en) | 1996-05-24 | 1996-05-24 | Mold structure for easy temperature control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15301496A JP3839097B2 (en) | 1996-05-24 | 1996-05-24 | Mold structure for easy temperature control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09314611A JPH09314611A (en) | 1997-12-09 |
| JP3839097B2 true JP3839097B2 (en) | 2006-11-01 |
Family
ID=15553081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15301496A Expired - Lifetime JP3839097B2 (en) | 1996-05-24 | 1996-05-24 | Mold structure for easy temperature control |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3839097B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3977565B2 (en) * | 1999-05-06 | 2007-09-19 | 小野産業株式会社 | Mold for synthetic resin molding, mold temperature control device and mold temperature control method |
| JP4627887B2 (en) * | 2001-01-17 | 2011-02-09 | 三井化学株式会社 | Mold for plastic injection molding |
| EP1225020B1 (en) * | 2001-01-17 | 2007-01-17 | Ono Sangyo Co., Ltd. | Mold device for injection molding of synthetic resin |
| US6861021B2 (en) | 2002-04-16 | 2005-03-01 | General Electric Company | Molding tool construction and molding method |
| JP4493360B2 (en) * | 2004-02-10 | 2010-06-30 | 三菱樹脂株式会社 | Mold structure for injection molding |
| CN101287580B (en) * | 2005-09-21 | 2011-08-03 | 三菱重工业株式会社 | Mold, mold temperature regulation method, mold temperature regulation device, injection molding method, injection molding machine, and thermoplastic resin sheet |
| JP5215445B2 (en) * | 2011-10-17 | 2013-06-19 | ファナック株式会社 | Injection molding machine with adapter plate with temperature control piping |
| JP5568105B2 (en) * | 2012-03-01 | 2014-08-06 | 住友ゴム工業株式会社 | Injection mold and method for producing rubber product using the same |
-
1996
- 1996-05-24 JP JP15301496A patent/JP3839097B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09314611A (en) | 1997-12-09 |
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