JPH09314611A - Easily temperature controllable mold structure - Google Patents
Easily temperature controllable mold structureInfo
- Publication number
- JPH09314611A JPH09314611A JP15301496A JP15301496A JPH09314611A JP H09314611 A JPH09314611 A JP H09314611A JP 15301496 A JP15301496 A JP 15301496A JP 15301496 A JP15301496 A JP 15301496A JP H09314611 A JPH09314611 A JP H09314611A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- heat insulating
- insert piece
- structure according
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、熱可塑性樹脂の一
般射出成形及びガスアシスト成形等の成形法において、
各種製品の外装部品、外板、精密部品等の成形品で高品
質の表面、寸法精度を要求され、かつハイサイクルが要
求される分野の成形方法に適用可能な金型構造に関する
ものである。TECHNICAL FIELD The present invention relates to a molding method such as general injection molding and gas assist molding of a thermoplastic resin.
The present invention relates to a mold structure applicable to a molding method in a field in which high quality surfaces and dimensional accuracy are required for molded products such as exterior parts, outer plates and precision parts of various products and high cycle is required.
【0002】本発明は、特に、各種成形品のウエルドラ
インやジェッティング等の外観不良、寸法精度不良、無
機フィラー充填材料における外観不良を解消するするた
めに金型温度を高くした場合のハイサイクル成形用金型
構造に関するものである。The present invention is particularly applicable to a high cycle when a mold temperature is raised to eliminate appearance defects such as weld lines and jetting of various molded products, dimensional accuracy defects, and appearance defects in inorganic filler-filled materials. The present invention relates to a molding die structure.
【0003】[0003]
【従来の技術】従来、エンジニアリングプラスチックの
成形において、成形残留応力や成形品外観の問題、無機
フィラーを充填した樹脂においてはフィラーの浮きの問
題で金型温度を樹脂の熱変形温度よりも5〜20℃程度
低く設定することが多かった。しかしながら、金型の昇
温、降温に時間が掛かり過ぎる、100℃を超える金型
温度は上がらない、成形サイクルが長くなるという問題
があった。2. Description of the Related Art Conventionally, in the molding of engineering plastics, the mold temperature is lower than the heat distortion temperature of the resin by the problem of molding residual stress and appearance of the molded product and the problem of floating of the filler in the resin filled with the inorganic filler. In many cases, the temperature was set lower by about 20 ° C. However, there are problems that it takes too much time to raise and lower the temperature of the die, the die temperature exceeding 100 ° C. does not rise, and the molding cycle becomes long.
【0004】[0004]
【発明が解決しようとする課題】本発明は、従来の射出
成形、ガスアシスト成形等における金型において、成形
サイクルの短縮に効果のある金型の昇温、降温の温度制
御が効率良く短時間内でできる成形用金型構造を提供す
ることを課題とする。DISCLOSURE OF THE INVENTION The present invention is a mold for conventional injection molding, gas assist molding, etc., which is effective for shortening the molding cycle and is capable of efficiently controlling the temperature of temperature rising and cooling of the mold in a short time. An object of the present invention is to provide a molding die structure that can be formed inside.
【0005】[0005]
【課題を解決するための手段】本発明の課題は、射出成
形用金型において、金型温度制御を効率良く行うために
主型と、製品形状を形成するキャビティと、を別部品に
して、該キャビティを入れ駒方式にした金型構造によっ
て解決される。SUMMARY OF THE INVENTION An object of the present invention is to provide an injection mold with a main mold and a cavity for forming a product shape as separate parts in order to efficiently control the mold temperature. This is solved by a mold structure in which the cavity is of the insert piece type.
【0006】この金型構造において、前記主型と入れ駒
との間には、断熱層を設けることができる。断熱層とし
ては主型と入れ駒との間に、熱伝導率30W/m・K以
下の金属材料、例えばステンレス鋼、チタン等の金属を
設け、なおかつ熱伝導率の悪い金属と入れ駒の間に断熱
板、例えばベークライトを設置することで二重構造の断
熱層を形成することができる。In this mold structure, a heat insulating layer can be provided between the main mold and the insert piece. As the heat insulating layer, a metal material having a thermal conductivity of 30 W / mK or less, for example, a metal such as stainless steel or titanium is provided between the main mold and the insert piece, and between the metal having a poor thermal conductivity and the insert piece. A double-layered heat insulating layer can be formed by installing a heat insulating plate, for example, Bakelite.
【0007】本発明にかかる金型構造を利用することに
より、車両用のルーフレール、ドアハンドル、グリップ
等の自動車部品、FAX、コピー等の事務機器、家庭用
電気製品のハウジングやシャーシ等に適する成形品が得
られる。この金型は、熱可塑性樹脂の射出成形、中空成
形部を有するガスアシスト成形等の各種成形法に適用す
ることができる。By using the mold structure according to the present invention, molding suitable for automobile parts such as roof rails, door handles and grips for vehicles, office equipment such as FAX and copying machines, housings and chassis for household electric appliances, etc. Goods are obtained. This mold can be applied to various molding methods such as injection molding of thermoplastic resin and gas assist molding having a hollow molding portion.
【0008】本発明で使用する温度を効率良く迅速に昇
温、降温させる金型構造は、前述のように、金型の外型
を形成する主型と、製品形状を形成するキャビティとコ
アとを別部品とし、これら両者を入れ駒方式とするもの
である。As described above, the mold structure for efficiently and rapidly raising and lowering the temperature used in the present invention has the main mold forming the outer mold of the mold, the cavity forming the product shape, and the core. Is a separate part, and both of them are of the insertion piece type.
【0009】こらに、これら主型と入れ駒との間には、
熱伝導率30W/m・K以下の金属材料と断熱板の二重
構造からなる断熱層を設置し、なおかつ主型と断熱層の
接触面、入れ駒と断熱板の接触面に金型強度上問題のな
い範囲で空隙を設けることで実現できる。Here, between the main mold and the insert piece,
A heat insulating layer consisting of a double structure of a metal material with a thermal conductivity of 30 W / mK or less and a heat insulating plate is installed, and the mold strength is maintained on the contact surface between the main mold and the heat insulating layer and the contact surface between the insert piece and the heat insulating plate. This can be achieved by providing voids within a range that does not cause a problem.
【0010】この際、入れ駒を形成する金属は熱伝導率
60W/m・K以上の材料、例えば亜鉛、Be-Cu(ベリリ
ウム−銅)、アルミニウム及びこれらを主成分とする合
金、プリハードン鋼で作成する。また、金型温調管路は
入れ駒部に直接設け入れ駒部のみ温度制御を行う。At this time, the metal forming the insert piece is a material having a thermal conductivity of 60 W / mK or more, such as zinc, Be-Cu (beryllium-copper), aluminum and alloys containing these as the main components, and pre-hardened steel. create. Further, the mold temperature control pipe is directly provided in the insert piece portion, and the temperature is controlled only in the insert piece portion.
【0011】[0011]
【発明の作用】本発明によれば、金型温度の昇温、降温
が効率良く迅速に行え、作業準備の所要時間を短縮する
ことができる。また、100℃以上の金型温度も容易に
かつ短時間で実現できる。According to the present invention, the temperature of the mold can be raised and lowered efficiently and quickly, and the time required for work preparation can be shortened. Further, a mold temperature of 100 ° C. or higher can be easily realized in a short time.
【0012】本発明によれば、成形1サイクルの間に金
型温度を昇温、降温させる金型冷熱サイクルにおいて、
成形サイクルを長くすることなく実現できる。According to the present invention, in the mold cooling / heating cycle in which the mold temperature is raised and lowered during one molding cycle,
It can be realized without lengthening the molding cycle.
【0013】[0013]
【実施の形態】以下、実施例を示す添付図を参照しつつ
本発明を詳細に開示する。図1は本発明にかかる金型構
造の断面図である。この金型は、固定側主型1と可動側
主型2との合せ面にキャビティ3が形成される。キャビ
ティ3は固定側入れ駒4と可動側入れ駒5により形成さ
れている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be disclosed in detail below with reference to the accompanying drawings showing embodiments. FIG. 1 is a sectional view of a mold structure according to the present invention. In this mold, a cavity 3 is formed on the mating surface of the fixed main mold 1 and the movable main mold 2. The cavity 3 is formed by a fixed insertion piece 4 and a movable insertion piece 5.
【0014】固定側主型1と入れ駒4および可動側主型
2と入れ駒5との間にそれぞれ断熱層が設けられてい
る。この断熱層は熱伝導率の低い金属であるステンレス
鋼製断熱層6とベークライト製の断熱板である7で構成
されている。A heat insulating layer is provided between the fixed main mold 1 and the insert piece 4, and between the movable main mold 2 and the insert piece 5, respectively. This heat insulating layer is composed of a stainless steel heat insulating layer 6 which is a metal having a low thermal conductivity and a bakelite heat insulating plate 7.
【0015】固定側主型1及び可動側主型2とステンレ
ス鋼6との間には金型強度上問題の無い範囲で空隙8を
設けてある。また、固定側入れ駒4及び可動側入れ駒5
と断熱板7との間に金型強度上問題の無い範囲で空隙9
を設けてある。A gap 8 is provided between the fixed-side main mold 1 and the movable-side main mold 2 and the stainless steel 6 within a range where there is no problem in terms of mold strength. In addition, the fixed insertion piece 4 and the movable insertion piece 5
Between the heat insulating plate 7 and the heat insulating plate 7 within a range where there is no problem in mold strength.
Is provided.
【0016】この金型の温度制御を行うために金型温調
管路10と熱電対11を固定側入れ駒4(図示していな
い)及び可動側入れ駒5に設けてある。A mold temperature control conduit 10 and a thermocouple 11 are provided on the fixed side insert piece 4 (not shown) and the movable side insert piece 5 in order to control the temperature of the die.
【0017】実施例1 実施例1では、温調機TURBU-TD-U4-H((株)シスコ
製)を使用し、100℃の加圧した熱水を1200 l/
hrで本発明の金型に巡回させ、金型表面温度の昇温速度
の測定と金型冷却機グラシエシリーズ ポータブルチラ
ーNXGW-10((株)シスコ製)を使用し3℃の冷水を1
000 l/hrで本発明の金型に巡回させ金型表面温度の
降温速度を測定した。比較例として同じ金型で入れ駒構
造を取らない場合での同じ実験を行い比較した。Example 1 In Example 1, a temperature controller TURBU-TD-U4-H (manufactured by Cisco Co., Ltd.) was used, and hot water pressurized at 100 ° C. was 1200 l /
The mold of the present invention is circulated in hr, the temperature of the mold surface temperature is measured, and the mold cooler Glacier series portable chiller NXGW-10 (manufactured by Cisco Corp.)
The mold of the present invention was circulated at 000 l / hr and the rate of temperature decrease of the mold surface temperature was measured. As a comparative example, the same experiment was performed with the same mold without the insert piece structure, and the comparison was made.
【0018】昇温速度につては本発明は比較例の30倍
の速度であり、降温速度については本発明は比較例の2
0倍の速度であった。表1にその結果を示す。The heating rate of the present invention is 30 times that of the comparative example, and the cooling rate of the present invention is 2 times that of the comparative example.
The speed was 0 times. The results are shown in Table 1.
【0019】[0019]
【表1】 [Table 1]
【0020】実施例2 実施例2では、温調機TURBU-TD-U4-H((株)シスコ
製)を使用し、140℃の加圧した熱水を1200 l/
hrで本発明の金型に巡回させ、金型表面温度が何度にな
るかを評価した。比較例として、同じ金型で入れ駒構造
を取らない場合での同じ実験を行い比較した。Example 2 In Example 2, a temperature controller TURBU-TD-U4-H (manufactured by Cisco Co., Ltd.) was used, and hot water pressurized at 140 ° C. was 1200 l / l.
The mold of the present invention was circulated in hr and the mold surface temperature was evaluated. As a comparative example, the same experiment was carried out in the case where the same mold was used and the insert piece structure was not used, and the results were compared.
【0021】本発明の金型にとれば、熱水巡回開始後3
分後にキャビティー表面温度は140℃になったのに対
し、比較例では熱水巡回開始後1時間たって100℃で
あった。表2に実施例2の金型表面温度の結果を示す。According to the mold of the present invention, after the hot water patrol is started, 3
After a minute, the surface temperature of the cavity reached 140 ° C., whereas in the comparative example, it was 100 ° C. one hour after the start of the hot water circulation. Table 2 shows the results of the mold surface temperature of Example 2.
【0022】[0022]
【表2】 [Table 2]
【0023】[0023]
【発明の効果】本発明によれば、金型の昇温、降温を効
率良く短時間で可能になり成形準備の作業時間を短縮で
きる。また、100℃以上の金型温度についても確実に
設定温度通りにできる。その結果、ハイサイクル成形が
可能となる。According to the present invention, it is possible to efficiently raise and lower the temperature of the mold in a short time, and it is possible to shorten the working time for the molding preparation. Further, the mold temperature of 100 ° C. or higher can be surely kept at the set temperature. As a result, high cycle molding becomes possible.
【図面の簡単な説明】[Brief description of drawings]
【図1】本発明にかかる金型構造の断面図である。FIG. 1 is a sectional view of a mold structure according to the present invention.
1 固定側主型 2 可動側主型 3 キャビティー 4 固定側入れ駒 5 可動側入れ駒 6 断熱層(ステンレス鋼) 7 断熱板 8 主型と断熱層との空隙 9 入れ駒と断熱板との空隙 10 金型温調管路 11 熱電対 1 Fixed-side main mold 2 Movable-side main mold 3 Cavity 4 Fixed-side insert piece 5 Movable-side insert piece 6 Insulation layer (stainless steel) 7 Insulation plate 8 Void between main mold and insulation layer 9 Insert piece and insulation plate Air gap 10 Mold temperature control pipe 11 Thermocouple
Claims (9)
を効率良く行うために主型と、製品形状を形成するキャ
ビティと、を別部品として形成し、該キャビティを入れ
駒方式にすることを特徴とする、温度制御容易な金型構
造。1. In an injection molding die, a main die and a cavity for forming a product shape are formed as separate parts in order to efficiently control the die temperature, and the cavity is made into an insert piece type. The mold structure is characterized by easy temperature control.
ることを特徴とする請求項1に記載の金型構造。2. The mold structure according to claim 1, wherein a heat insulating layer is provided between the main mold and the insert piece.
W/m・K以下の金属材料による断熱層を設け、かつ前
記熱伝導率の悪い金属と前記入れ駒との間に適宜材質の
断熱板を設置することにより形成される二重構造の断熱
層を具備することを特徴とする請求項1または2のいず
れかに記載の金型構造。3. A thermal conductivity of 30 between the main mold and the insert piece.
A double layer heat insulating layer formed by providing a heat insulating layer made of a metal material of W / m · K or less and installing a heat insulating plate made of an appropriate material between the metal having poor thermal conductivity and the insert piece. The mold structure according to claim 1 or 2, further comprising:
型強度上問題の無い範囲で空隙を設けることを特徴とす
る、請求項1ないし3のいずれかに記載の金型構造。4. The mold structure according to claim 1, wherein a void is provided in a contact surface between the main mold and the heat insulating layer within a range where there is no problem in mold strength. .
金型強度上問題の無い範囲で空隙を設けることを特徴と
する、請求項1ないし4のいずれかに記載の金型構造。5. The contact surface between the heat insulating plate and the insert piece,
The mold structure according to any one of claims 1 to 4, wherein voids are provided in a range where there is no problem in mold strength.
路は、前記入れ駒に独立し、かつ型強度上問題の無い範
囲で数多く設けることを特徴とする、請求項1ないし5
のいずれかに記載の金型構造。6. The mold temperature control conduit for controlling the mold temperature is provided independently from the insert piece and provided in a large number within a range in which there is no problem in mold strength. 5
The mold structure according to any one of 1.
60W/m・K以上の材料によって形成されすることを
特徴とする、請求項1ないし6のいずれかに記載の金型
構造。7. The mold structure according to claim 1, wherein the metal forming the insert piece is made of a material having a thermal conductivity of 60 W / m · K or more.
m・K以上の金属材料が、亜鉛、Be-Cu(ベリリウムー
銅)、アルミニウム及びこれらを主成分とする合金、プ
リハードン鋼のいずれかあることを特徴とする、請求項
7に記載の金型構造。8. The thermal conductivity of the insert piece is 60 W /
The mold structure according to claim 7, wherein the metal material having m · K or more is any one of zinc, Be-Cu (beryllium-copper), aluminum, an alloy containing these as main components, and pre-hardened steel. .
入れ駒部に直接設けることを特徴とする、請求項1ない
し8のいずれかに記載の金型構造。9. The mold structure according to claim 1, wherein the mold temperature control pipe is directly provided in a receiving piece portion forming a cavity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15301496A JP3839097B2 (en) | 1996-05-24 | 1996-05-24 | Mold structure for easy temperature control |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15301496A JP3839097B2 (en) | 1996-05-24 | 1996-05-24 | Mold structure for easy temperature control |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09314611A true JPH09314611A (en) | 1997-12-09 |
JP3839097B2 JP3839097B2 (en) | 2006-11-01 |
Family
ID=15553081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15301496A Expired - Lifetime JP3839097B2 (en) | 1996-05-24 | 1996-05-24 | Mold structure for easy temperature control |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3839097B2 (en) |
Cited By (8)
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---|---|---|---|---|
WO2000067979A1 (en) * | 1999-05-06 | 2000-11-16 | Mitsui Chemicals, Incorporated | Synthetic resin forming metal mold, metal mold temperature regulating device, and metal mold temperature regulating method |
EP1225020A1 (en) * | 2001-01-17 | 2002-07-24 | Ono Sangyo Co., Ltd. | Mold device for injection molding of synthetic resin |
JP2002210783A (en) * | 2001-01-17 | 2002-07-30 | Mitsui Chemicals Inc | Mold for injection-molding synthetic resin |
US6861021B2 (en) | 2002-04-16 | 2005-03-01 | General Electric Company | Molding tool construction and molding method |
JP2005224978A (en) * | 2004-02-10 | 2005-08-25 | Mitsubishi Plastics Ind Ltd | Injection mold structure |
WO2007034815A1 (en) * | 2005-09-21 | 2007-03-29 | Mitsubishi Heavy Industries, Ltd. | Mold, mold temperature regulation method, mold temperature regulation device, injection molding method, injection molding machine, and thermoplastic resin sheet |
CN103042666A (en) * | 2011-10-17 | 2013-04-17 | 发那科株式会社 | Injection molding machine with combination plate of temperature adjustment pipe |
CN103286916A (en) * | 2012-03-01 | 2013-09-11 | 住友橡胶工业株式会社 | Mold for injection molding, and manufacturing method for rubber product molded by using same |
-
1996
- 1996-05-24 JP JP15301496A patent/JP3839097B2/en not_active Expired - Lifetime
Cited By (15)
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---|---|---|---|---|
US6936206B1 (en) | 1999-05-06 | 2005-08-30 | Mitsui Chemicals, Inc. | Synthetic resin molding mold, apparatus for and method of adjusting a temperature of the mold |
KR100426743B1 (en) * | 1999-05-06 | 2004-04-14 | 미쯔이카가쿠 가부시기가이샤 | Synthetic resin forming metal mold, product molded by the mold, and method of molding synthetic resin |
WO2000067979A1 (en) * | 1999-05-06 | 2000-11-16 | Mitsui Chemicals, Incorporated | Synthetic resin forming metal mold, metal mold temperature regulating device, and metal mold temperature regulating method |
CN100372666C (en) * | 1999-05-06 | 2008-03-05 | 三井化学株式会社 | Synthetic resin forming metal mold device and method for regulating temperature of mold |
EP1225020A1 (en) * | 2001-01-17 | 2002-07-24 | Ono Sangyo Co., Ltd. | Mold device for injection molding of synthetic resin |
JP2002210783A (en) * | 2001-01-17 | 2002-07-30 | Mitsui Chemicals Inc | Mold for injection-molding synthetic resin |
US6861021B2 (en) | 2002-04-16 | 2005-03-01 | General Electric Company | Molding tool construction and molding method |
JP2005224978A (en) * | 2004-02-10 | 2005-08-25 | Mitsubishi Plastics Ind Ltd | Injection mold structure |
JP4493360B2 (en) * | 2004-02-10 | 2010-06-30 | 三菱樹脂株式会社 | Mold structure for injection molding |
WO2007034815A1 (en) * | 2005-09-21 | 2007-03-29 | Mitsubishi Heavy Industries, Ltd. | Mold, mold temperature regulation method, mold temperature regulation device, injection molding method, injection molding machine, and thermoplastic resin sheet |
JP4865719B2 (en) * | 2005-09-21 | 2012-02-01 | 三菱重工業株式会社 | Mold, mold temperature adjusting method, mold temperature adjusting apparatus, injection molding method, injection molding machine, and thermoplastic resin sheet |
CN103042666A (en) * | 2011-10-17 | 2013-04-17 | 发那科株式会社 | Injection molding machine with combination plate of temperature adjustment pipe |
CN103286916A (en) * | 2012-03-01 | 2013-09-11 | 住友橡胶工业株式会社 | Mold for injection molding, and manufacturing method for rubber product molded by using same |
JP2013180495A (en) * | 2012-03-01 | 2013-09-12 | Sumitomo Rubber Ind Ltd | Injection mold and method of producing rubber product using the same |
CN103286916B (en) * | 2012-03-01 | 2016-05-04 | 住友橡胶工业株式会社 | Die injection moulding and use the manufacture method of the rubber product of this mould |
Also Published As
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