JP3819538B2 - Electrostatic chuck device and mounting table - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrostatic chuck device, and more particularly to an electrostatic chuck device for attracting and holding an object to be processed inside a vacuum container of a vacuum processing apparatus.
[0002]
[Prior art]
In various processes such as a semiconductor manufacturing process, a liquid crystal display panel manufacturing process, or an optical disk manufacturing process, a vacuum processing apparatus is used to perform surface treatment of circular or rectangular workpieces such as silicon wafers and glass substrates. . That is, the vacuum processing apparatus performs processing such as sputtering, etching, baking, or ashing on the processing object carried into the vacuum container, and forms a thin film on the surface of the processing object, It is an apparatus for performing fine processing on a thin film formed on the surface of an object.
[0003]
One of the vacuum processing apparatuses is a chemical dry etching apparatus (CDE apparatus). This CDE apparatus activates a process gas in a plasma generation chamber separated from the processing chamber, and then introduces the process gas into the processing chamber. It is an apparatus that introduces and supplies the surface of the object to be processed, and etches the thin film on the surface of the object to be processed by neutral radicals (neutral active species) in the process gas. Here, the process gas includes oxygen gas, CF_FourGas or the like is used.
[0004]
As another example of the vacuum processing apparatus, there is a reactive ion etching apparatus (RIE apparatus). This RIE apparatus converts a process gas supplied to the inside of the processing chamber into a plasma using a high-frequency voltage, and the inside of the processing chamber. The apparatus which performs the etching process of a to-be-processed object using the plasma formed in.
[0005]
Furthermore, another example of the vacuum processing apparatus is a microwave plasma etching apparatus, which generates a microwave excitation plasma by applying a microwave to a process gas supplied to the inside of the processing chamber. Is an apparatus for performing etching by using the above.
[0006]
And the mounting base for mounting a to-be-processed object is provided in the inside of the vacuum vessel of the vacuum processing apparatus mentioned above, The temperature of this mounting base is adjusted with a temperature control mechanism. Therefore, the temperature of the workpiece placed on the mounting table is controlled by heat conduction with the temperature-controlled mounting table. Here, the temperature control of the object to be processed includes heating control and cooling control.
[0007]
In addition, the mounting table is provided with an electrostatic chuck device for attracting and fixing an object to be processed. By applying a DC voltage to the electrostatic chuck device, the object to be processed is electrostatically attracted to the mounting table. Fixed. Thereby, the back surface of the object to be processed and the surface of the mounting table are in close contact with each other, and the in-plane uniformity and efficiency of heat transfer are improved. Further, a gas for heat transfer is introduced to the back surface of the object to be processed that is adsorbed and fixed to the mounting table, and the heat transfer efficiency between the object to be processed and the mounting table is further improved by this gas. The temperature is controlled properly.
[0008]
Next, a conventional electrostatic chuck device will be described. In addition, the conventional electrostatic chuck device includes a unipolar device having only one of a positive electrode and a negative electrode, a bipolar device having a pair of a positive electrode and a negative electrode, and two or more sets. And a multi-polar device having a positive electrode and a negative electrode.
[0009]
FIG. 8 is a process diagram showing a manufacturing method of a conventional bipolar electrostatic chuck device. In FIG. 8, reference numeral 50 indicates an aluminum metal mounting table disposed inside a vacuum vessel of the vacuum processing apparatus. Yes. At least two mounting table through-holes 51 are formed in the mounting table 50, and a power feeding unit 52 is inserted into each of the mounting table through-holes 51. Each power feeding portion 52 is constituted by one insulating bush 53 and one conductive pin 54, and a bush through hole 55 is formed in the insulating bush 53, and the inside of the bush through hole 55 is conductive. Pins 54 are provided.
[0010]
When manufacturing this conventional electrostatic chuck device, first, as shown in FIG. 8A, between the mounting table 50 and the insulating bush 53 and between the insulating bush 53 and the conductive material. An adhesive 56 such as a thermosetting epoxy resin system is vacuum-filled between the pins 54 and the filled adhesive 56 is solidified by a heat curing process. Then, the insulating bush 53 is airtightly fixed to the mounting table 50 and the conductive pin 54 is airtightly fixed to the insulating bush 53. Therefore, the mounting table through-hole 51 of the mounting table 50 is hermetically closed, and airtightness between the front surface 50a and the back surface 50b of the mounting table 50 is ensured.
[0011]
Next, as shown in FIG. 8B, the adhesive 56 protruding from the front surface 50a or the back surface 50b of the mounting table 50 is processed by machining, and the amount of the adhesive 56 protruding from the front surface 50a and the back surface 50b is determined. It is suppressed to a predetermined value (for example, 5 μm) or less.
[0012]
Finally, as shown in FIG. 8C, the electrostatic chuck 57 is fixed to the surface 50a of the mounting table 50 with an insulating adhesive. The electrostatic chuck 57 includes a conductive film 58 to which a voltage is applied from the power supply unit 52, and insulating films 59 a and 59 b disposed on both surfaces of the conductive film 58. The conductive film 58 is divided into two parts and insulated from each other, and the power feeding sections 52 apply voltages of different polarities to the conductive films 58.
[0013]
The insulating film 59b on the lower side of the electrostatic chuck 57 is formed with a notch 60 at a position facing the tip of the conductive pin 54 in accordance with the shape of the conductive pin 54. The conductive film 58 is exposed at the notch 60. Then, the exposed conductive film 58 and the tip of the conductive pin 54 are electrically connected by a conductive adhesive or the like. Here, since the electrostatic chuck 57 and the surface 50a of the mounting table 50 are bonded by an insulating adhesive, insulation between the conductive pins 54 and the metal mounting table 50 is ensured. ing.
[0014]
Further, as shown in FIG. 8B, the electrostatic chuck 57 is fixed after the amount of the adhesive 56 protruding from the surface 50a of the mounting table 50 is suppressed to a predetermined value or less. No excessive unevenness is formed on the surface 57a. For this reason, even when the object to be processed is placed on the electrostatic chuck 57 a and is sucked and fixed, and the heat transfer gas is introduced between the back surface of the object to be processed and the surface 57 a of the electrostatic chuck 57, the vacuum is maintained. The amount of leakage of the heat transfer gas into the vacuum chamber of the processing apparatus can be suppressed to such an extent that it does not adversely affect the vacuum processing of the object to be processed.
[0015]
The conventional bipolar electrostatic chuck apparatus including one set of plus and minus electrodes has been described above. However, in the case of a conventional multipolar electrostatic chuck apparatus including two or more sets of plus and minus electrodes. The mounting table through-holes 51 are formed in the mounting table 50 by the number of the poles, and each feeding unit 52 is provided in each formed mounting-table through hole 51. Here, even in the case of the multipolar type, as in the case of the bipolar type, each power supply portion 52 is configured by one insulating bush 53 and one conductive pin 54.
[0016]
[Problems to be solved by the invention]
However, when the conventional electrostatic chuck device is manufactured as described above, the adhesive 56 is vacuumed between the mounting table 50 and the insulating bush 53 and between the insulating bush 53 and the conductive pin 54. A step of filling, a step of heat-curing the filled adhesive 56, and a step of processing the adhesive 56 protruding from the front surface 50a and the back surface 50b of the mounting table 50 by machining are required. There was a problem that productivity was low because of the large number. Furthermore, even if it is a bipolar type or a multi-pole type, the number of manufacturing steps increases because the mounting table through holes 51 and the power feeding parts 52 are required for the number of poles.
[0017]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electrostatic chuck device capable of reducing the number of steps during production and improving productivity, and a mounting table incorporating this device.
[0018]
[Means for Solving the Problems]
An electrostatic chuck device according to a first aspect of the present invention includes an electrostatic chuck portion attached to a surface of a mounting table for mounting an object to be processed, and a mounting table through hole formed through the mounting table. The electrostatic chuck unit includes a conductive film to which a voltage is applied from the power supply unit, and insulating films disposed on both sides of the conductive film. The power supply unit includes an insulating bush fitted in an airtight manner to the mounting table through-hole via the first O-ring, a bush through-hole formed through the insulating bush, And a conductive pin that is airtightly fitted to the bush through hole via a second O-ring.
[0019]
An electrostatic chuck device according to a second aspect of the present invention is characterized in that at least two bush through holes are provided, and the conductive pins are provided in the respective bush through holes.
[0020]
According to a third aspect of the present invention, there is provided the electrostatic chuck device according to the third aspect, wherein the insulating bush includes a base portion having a top surface and a projecting portion projecting from a part of the top surface. The base part is formed so as to penetrate both the base part and the projecting part, and the base part has a base part through hole penetrating the base part in a region other than the region where the projecting part is formed. The insulating bush is fixed to the mounting table by a mounting bolt inserted through the base portion through hole.
[0021]
According to a fourth aspect of the present invention, there is provided an electrostatic chuck device in which a female screw is formed in the bush through hole, a male screw is formed in the conductive pin, and the conductive pin is in the bush through hole. It is characterized by being screwed onto
[0022]
According to a fifth aspect of the present invention, there is provided the electrostatic chuck device according to the fifth aspect, wherein the insulating bush includes a base portion having a top surface and a projecting portion projecting from a part of the top surface. The insulating bush is formed so as to penetrate both the base portion and the protruding portion, and a pressing lid is brought into contact with a bottom surface of the insulating bush, and the pressing lid is fixed to the mounting table. Is fixed to the inside of the mounting base through-hole and the conductive pin is fixed to the inside of the bush through-hole.
[0023]
The electrostatic chuck device according to a sixth aspect of the invention is characterized in that a fluororesin layer is formed on the surface of the electrostatic chuck portion.
[0024]
A mounting table according to a seventh aspect of the invention is characterized in that the electrostatic chuck device according to any one of the first to sixth aspects is incorporated.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an electrostatic chuck device according to an embodiment of the present invention and a mounting table in which the device is incorporated will be described with reference to FIGS. The electrostatic chuck device and the mounting table according to the present embodiment are used for a downflow type chemical dry etching apparatus (hereinafter referred to as “CDE apparatus”).
[0026]
In FIG. 1, reference numeral 1 denotes a vacuum vessel of a CDE apparatus. A processing chamber (etching chamber) 2 is formed inside the vacuum vessel 1, and a workpiece W that is a silicon wafer is formed at the bottom of the vacuum vessel 1. A water cooling jacket 3 for controlling the temperature of the airtight is fixed in an airtight manner.
[0027]
An aluminum metal mounting table 4 for mounting the workpiece W is provided on the water cooling jacket 3, and an electrostatic chuck device 5 is incorporated in the mounting table 4. A medium passage 6 constituting a part of the temperature control mechanism is formed inside the water cooling jacket 3, and a medium M such as cooling water whose temperature is adjusted is introduced into the medium passage 6 through the medium pipes 7 and 8. Has been discharged.
[0028]
A process gas introduction pipe 10 is attached so as to penetrate the top plate 9 of the vacuum vessel 1, and the tip of the process gas introduction pipe 10 is connected to a gas dispersion plate 11 provided in the processing chamber 2. ing. The gas dispersion plate 11 forms a shower-like nozzle, and the process gas G introduced into the processing chamber 2 through the process gas introduction pipe 10 is transferred to the surface of the workpiece W by the shower-like nozzle. It is supplied uniformly throughout.
[0029]
A quartz tube 12 is provided in the middle of the process gas introduction tube 10, and a plasma generator 13 is provided so as to surround the quartz tube 12. Then, a microwave is applied from the plasma generator 13 to the process gas G supplied into the quartz tube 12. Then, glow discharge is generated inside the quartz tube 12, plasma is generated, and the process gas G is activated. Here, as the process gas G, for example, CF_FourAnd O₂A mixed gas containing can be used.
[0030]
The activated process gas is introduced into the processing chamber 2 through the process gas introduction pipe 10 and is uniformly supplied to the entire surface of the workpiece W through the gas dispersion plate 11. Then, the thin film on the surface of the workpiece W is etched by neutral radicals (neutral active species) in the process gas. Here, the processing chamber 2 is evacuated by a vacuum pump (not shown) through the exhaust pipe 14, and the pressure inside the processing chamber 2 is measured by the pressure gauge 15.
[0031]
FIG. 2 is a longitudinal sectional view showing the mounting table 4 and the electrostatic chuck device 5. As shown in FIG. 2, the electrostatic chuck device 5 is provided with the electrostatic chuck portion 16 attached to the surface 4 a of the mounting table 4. And a power supply unit 18 fitted in a mounting table through hole 17 formed so as to penetrate the mounting table 4. The mounting table through hole 17 includes a stepped portion 17a.
[0032]
As shown in FIG. 1, the CDE apparatus includes a cooling gas supply mechanism 19 for supplying a cooling gas to the back side of the workpiece W. The cooling gas supply mechanism 19 includes the mounting table 4 and A cooling gas introduction pipe 20 that penetrates the electrostatic chuck 16 and opens below the workpiece W is provided. A pressure gauge 21 and a gas flow rate control valve 22 are provided in the middle of the cooling gas introduction pipe 20.
[0033]
Further, a discharge pipe 23 is branched from the middle of the cooling gas introduction pipe 20 downstream of the gas flow control valve 22, and a variable valve 24 is provided in the middle of the discharge pipe 23. Then, usually, the measured value of the pressure gauge 21 is fed back to automatically adjust the opening of the gas flow control valve 22, and the pressure is maintained at around 1000 Pa.
[0034]
FIG. 3 is an enlarged vertical cross-sectional view showing the power feeding unit 18 of the electrostatic chuck device 5 incorporated in the mounting table 4 and the electrostatic chuck unit 16 therearound. As shown in FIG. The chuck portion 16 is configured in a multilayer structure by a plurality of thin film members.
[0035]
That is, the electrostatic chuck portion 16 includes a pair of conductive films 25 formed of a metal thin film, and these conductive films 25 are insulated from each other by an insulating adhesive 26. These conductive films 25 function as electrode plates to which a voltage from the power feeding unit 18 is applied. Insulating films 27a and 27b formed of a polymer organic material such as a polyimide resin film are disposed on both surfaces of the conductive film 25. The insulating films 27a and 27b form a pair of conductive films 25. The whole surface is covered.
[0036]
The lower insulating film 27 b is bonded to the surface 4 a of the mounting table 4 with an insulating adhesive 26. Further, a fluororesin film 28 is adhered to the surface of the upper insulating film 27a, that is, the surface on which the workpiece W is placed, using an adhesive, and the insulation is made of a polymer organic material such as a polyimide resin film. The protective films 27a and 27b are protected.
[0037]
As a modification, the insulating films 27 a and 27 b are formed of a ceramic material, and the ceramic insulating films 27 a and 27 b and the metal conductive film 25 are baked without using the adhesive 26. It can also be joined directly by knotting. In this case, it is not necessary to provide the protective fluororesin film 28 on the surface of the upper insulating film 27a.
[0038]
The power feeding unit 18 of the electrostatic chuck device 5 includes an insulating bush 29 made of an insulating material fitted in the mounting table through hole 17. 4 shows a plan view of the insulating bush 29. As can be seen from FIGS. 4 and 3, the insulating bush 29 includes a base portion 30 made of a cylindrical member and a top surface 30a of the base portion 30. And a protruding portion 31 made of a columnar member having an elliptical or oval cross section. The outer peripheral portion of the top surface 30 a of the base portion 30, that is, the remaining portion where the protruding portion 31 is not formed is in contact with the stepped portion 17 a of the mounting table through hole 17.
[0039]
Further, as shown in FIGS. 3 and 4, the base portion 30 of the insulating bush 29 is formed with a pair of base portion through holes 32 in a region other than the region where the protruding portion 31 is formed. The part through hole 32 is arranged at a position facing the projecting part 31. As shown in FIG. 3, a mounting bolt 33 with a hexagonal hole is inserted into the base portion through-hole 32, and the insulating bush 29 is fixed to the mounting table 4 by the two mounting bolts 33.
[0040]
Note that a female screw hole 45 for screwing the mounting bolt 33 is cut in the mounting table 4. The head of the mounting bolt 33 is embedded in the insulating bush 29 so that it does not protrude from the back surface 4 b of the mounting table 4.
[0041]
Further, as shown in FIG. 3, a groove 34 is formed on the outer surface of the protruding portion 31 of the insulating bush 29 over the entire circumference, and the first O-ring made of fluorine-based rubber is formed in the groove 34. 35 is inserted. The first O-ring 35 ensures airtightness between the insulating bush 29 and the mounting table 4.
[0042]
As shown in FIGS. 3 and 4, the insulating bush 29 is formed with a pair of bush through holes 36 so as to penetrate both the base portion 30 and the protruding portion 31, and these bush through holes 36. Are arranged on the longitudinal axis of the cross section of the protrusion 31. The bush through hole 36 has a stepped portion 36a. Each of the pair of bush through holes 36 is provided with a conductive pin 37, and the conductive pin 37 has a shoulder portion 37 a corresponding to the step portion 36 a of the bush through hole 36. A groove 37b for a driver is formed at the end portion.
[0043]
A groove portion 38 is engraved on the outer surface of the conductive pin 37 over the entire circumference, and a second O-ring 39 made of fluorine rubber is fitted in the groove portion 38. The second O-ring 39 ensures airtightness between the conductive pin 37 and the insulating bush 29.
[0044]
A female screw 40 is formed in the bush through hole 36, while a male screw 41 is formed in the conductive pin 37. The conductive pin 37 is connected to the bush through hole by the female screw 40 and the male screw 41. 36 is screwed.
[0045]
Further, as shown in FIG. 3, a pair of cutout portions 42 are formed in the lower insulating film 27 b so as to face the tip of the conductive pin 37 according to the shape of the conductive pin 37. The pair of conductive films 25 are exposed at these notches 42. The exposed conductive film 25 and the tip of the conductive pin 37 are electrically connected by a conductive adhesive or the like. Here, the lower insulating film 27 b is bonded to the surface 4 a of the mounting table 4 with an insulating adhesive 26, and the conductive pin 37 is attached to the mounting table 4 via the insulating bush 29. Therefore, the insulation between the conductive pin 37 and the metal mounting table 4 is ensured.
[0046]
1 is connected to each of the pair of conductive films 25 via the pair of conductive pins 37, and each conductive film 25 is electrically connected to each conductive film 25 by the DC power supply 43. Voltages having different polarities are applied through the sex pins 37, respectively. When positive and negative voltages are applied to each conductive film 25, the workpiece W is attracted and fixed to the mounting table 4 by electrostatic force. In addition, by providing an ammeter 44 between the conductive film 25 and the DC power supply 43, it is possible to observe the current flowing through the conductive film 25, thereby detecting the presence or absence of the workpiece W. Can do.
[0047]
As a modification, three or more bush through holes 36 may be formed in one insulating bush 29, and three or more conductive pins 37 may be provided in one insulating bush 29.
[0048]
As described above, according to the electrostatic chuck device and the mounting table according to the present embodiment, the airtightness between the mounting table 4 and the insulating bush 29 is ensured by the first O-ring 35, and the insulating bush 29. Since the second O-ring 39 ensures the airtightness between the conductive pin 37 and the conductive pin 37, the heat-curable adhesive is vacuumed in order to ensure the airtightness as in the conventional electrostatic chuck device. There is no need for filling, and therefore heat curing processing after vacuum filling and machining processing of the protruding portion are also unnecessary, and therefore the number of processes at the time of manufacturing the electrostatic chuck device and the mounting table is significantly larger than before. It will decrease, and the productivity will be greatly improved.
[0049]
Further, according to the electrostatic chuck device and the mounting table according to the present embodiment, since the two conductive pins 37 are incorporated in one insulating bush 29, the mounting table through-hole 17 to be formed in the mounting table 4 is used. For example, in the case of a bipolar type, only one is required, and the number of processes in manufacturing the electrostatic chuck device is further reduced, and the productivity is further improved.
[0050]
Furthermore, since the insulating bush 29 is formed by the base portion 30 of the columnar member and the protruding portion 31 protruding from a part of the top surface 30a of the base portion 30, in order to insert the mounting bolt 33 As a result, the area where the insulating bush 29 and the electrostatic chuck portion 16 come into contact with each other is reduced, and the area covered by the mounting table 4 cooled by the water-cooling jacket 3 is reduced. Regarding the cooling effect of the workpiece W, a negative influence on the in-plane uniformity of the cooling effect can be suppressed.
[0051]
Modified example
Next, a modification of the present embodiment will be described with reference to FIGS. In this modification, the configuration for fixing the insulating bush 29 to the mounting table through hole 17 and the configuration for fixing the conductive pin 37 to the bush through hole 36 are changed.
[0052]
As shown in FIG. 5, the insulating bush 29 of the electrostatic chuck device according to the present modification has a lower protrusion 30 c formed on the bottom surface 30 b of the base portion 30, and the bush through hole 36 is formed on the lower side. The protrusion 30c is penetrated. As shown in FIG. 6, the lower protrusion 30c is formed in a cylindrical shape.
[0053]
A pressing lid 46 is in contact with the bottom surface 30b of the base portion 30 and the surface of the lower protruding portion 30c. As shown in FIG. 7, a recess 47 into which the lower protrusion 30c is fitted is formed on the upper surface of the presser lid 46, and a pair of presser cover through holes is formed in the portion where the recess 47 is formed. 48 is formed.
[0054]
Further, the lower end portion of the conductive pin 37 is provided with a small-diameter end portion 37c having a smaller diameter than the central portion. The small-diameter end portion 37c is inserted into the presser cover through hole 48, and the conductive pin 37 The lower shoulder 37d is in contact with the surface of the recess 47 of the pressing lid 46. In this way, the lower shoulder portion 37d of the conductive pin 37 is brought into contact with the surface of the concave portion 47 of the presser lid 46 (peripheral portion of the presser cover through hole 48), whereby the conductive pin 37 is connected to the bush through hole 36. Fixed inside.
[0055]
A pair of bolt mounting holes 49 are formed in the outer peripheral portion of the pressing lid 46, and the pressing lid 46 is fixed to the mounting table 4 by the mounting bolts 33 inserted through the bolt mounting holes 49. An insulating bush 29 is fixed inside the mounting table through hole 17 via a lid 46.
[0056]
As described above, according to this modification, the conductive pin 37 is fixed to the inside of the bush through hole 36 by the holding lid 46 fixed to the mounting table 4, so that the conductive pin 37 is fixed to the bush through hole. It is not necessary to fix to 36 by screw connection. Therefore, this modification is particularly effective when the insulating bush 29 is made of a material that is difficult to be threaded, such as ceramic.
[0057]
In the above-described embodiment and its modifications, the case where the electrostatic chuck device and the mounting table are incorporated into the CDE device has been described as an example. However, the electrostatic chuck device and the mounting table according to the present invention may be various vacuums other than the CDE device. It can be incorporated into a processing device.
[0058]
【The invention's effect】
As described above, according to the electrostatic chuck device and the mounting table incorporating this device according to the present invention, the airtightness between the mounting table and the insulating bush is ensured by the first O-ring, and the insulating bush Since the second O-ring ensures airtightness between the conductive pin and the conductive pin, it is necessary to vacuum-fill with a thermosetting adhesive to ensure airtightness as in the conventional electrostatic chuck device. Therefore, the heat curing process after vacuum filling and the machining process of the protruding part are also unnecessary, and therefore, the number of processes at the time of manufacturing the electrostatic chuck device and the mounting table is greatly reduced as compared with the prior art, An excellent effect is obtained in that the productivity is significantly improved as compared with the prior art.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing a CDE device incorporating an electrostatic chuck device and a mounting table according to an embodiment of the present invention.
FIG. 2 is a longitudinal sectional view showing an electrostatic chuck device and a mounting table according to the embodiment.
FIG. 3 is an enlarged vertical cross-sectional view illustrating a power feeding unit and an electrostatic chuck unit around the power feeding unit of the electrostatic chuck device according to the embodiment;
FIG. 4 is a plan view showing an insulating bush of the electrostatic chuck device according to the embodiment;
FIG. 5 is a longitudinal sectional view showing a power feeding unit of an electrostatic chuck device according to a modification of the embodiment.
6A and 6B are diagrams showing an insulating bush of the electrostatic chuck device according to the modification, where FIG. 6A is a perspective view, FIG. 6B is a plan view, and FIG.
7A and 7B are diagrams showing a holding lid of the electrostatic chuck device according to the modification, where FIG. 7A is a perspective view, and FIG. 7B is a bottom view.
FIG. 8 is a process diagram showing a method of manufacturing a conventional bipolar electrostatic chuck device.
[Explanation of symbols]
1 Vacuum container
2 treatment room
4 mounting table
4a Surface of mounting table
5 Electrostatic chuck device
16 Electrostatic chuck
17 Mounting base through hole
18 Power feeding unit
25 Conductive film
26 Insulating adhesive
27a, 27b Insulating film
28 Fluororesin film
29 Insulating bush
30 Base part
30a Top surface of base
30b Bottom of base
31 Projection
32 Base part through hole
33 Mounting bolt
35 First O-ring
36 Bushing through hole
37 Conductive pin
39 Second O-ring
40 Female thread in bush through hole
41 Male thread of conductive pin
46 Holding lid
W Workpiece (silicon wafer)

Claims (7)

An electrostatic chuck portion attached to the surface of the mounting table for mounting the object to be processed, and a power feeding unit provided inside the mounting table through hole formed through the mounting table,
The electrostatic chuck portion includes a conductive film to which a voltage is applied from the power feeding unit, and insulating films disposed on both surfaces of the conductive film,
The power feeding section includes an insulating bush fitted in the mounting base through hole with a first O-ring airtightly, a bush through hole formed through the insulating bush, and the bush through hole. And an electrically conductive pin fitted in an airtight manner via a second O-ring. The electrostatic chuck device according to claim 1, further comprising at least two bush through holes, wherein the conductive pins are provided in the bush through holes, respectively. The insulating bush includes a base portion having a top surface, and a protruding portion projecting from a part of the top surface,
The bush through hole is formed so as to penetrate both the base portion and the protruding portion,
In the base portion, a base portion through hole is formed in a region other than the region where the protruding portion is formed so as to penetrate the base portion,
The electrostatic chuck device according to claim 1, wherein the insulating bush is fixed to the mounting table by a mounting bolt inserted through the base portion through hole. The female bush is formed in the bush through hole, the male screw is formed in the conductive pin, and the conductive pin is screwed into the bush through hole. The electrostatic chuck apparatus as described in any one of Claim 1 thru | or 3. The insulating bush includes a base portion having a top surface, and a protruding portion projecting from a part of the top surface,
The bush through hole is formed so as to penetrate both the base portion and the protruding portion,
A pressing lid is brought into contact with the bottom surface of the insulating bush, and the pressing lid is fixed to the mounting table, thereby fixing the insulating bush in the mounting table through hole and passing the conductive pin through the bush. 3. The electrostatic chuck device according to claim 1, wherein the electrostatic chuck device is fixed inside the hole. The electrostatic chuck device according to claim 1, wherein a fluororesin layer is formed on a surface of the electrostatic chuck portion. A mounting table on which an object to be processed is mounted, wherein the electrostatic chuck device according to claim 1 is incorporated.

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