JP3808618B2 - Manual prober alignment method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is a manual prober used when performing a circuit characteristic test of a circuit board having a circuit formed on the surface of a thin plate such as an IC wafer or a liquid crystal plate. Alignment method In particular, a manual prober that improves the operability of alignment work when supporting a thin plate and moving it manually. Alignment method About.
[0002]
[Prior art]
Generally, the manual prober 1 is configured as shown in FIGS.
[0003]
2 in the figure is a base surface plate. A Z-axis base 3 is provided behind the base surface plate 2 (to the right in FIG. 3). The Z-axis base 3 is formed in a vertical wall shape rising from the base surface plate 2. A Z-up lever 4 for raising and lowering a base plate 7 (described later) supported by the Z-axis base 3 so as to be slidable in the vertical direction is provided on the Z-axis base 3. A Z slide plate 5 is fixed to the front surface of the Z-axis base 3. Z slide guides 6 are slidably attached to both sides of the Z slide plate 5. A base plate 7 is fixed to the Z slide guide 6. Thereby, the base plate 7 is supported by the Z-axis base 3 through the Z slide guide 6 and the Z slide plate 5 so as to be movable up and down. The base plate 7 is for covering the upper surface of the base surface plate 2 and supporting a probe 13 and the like which will be described later. A purge plate 9 is provided on the lower surface of the base plate 7 via a spacer 8. The purge plate 9 is used to cover an upper side surface of a chuck top 29 (to be described later) and maintain the upper side surface of the chuck top 29 at a constant temperature during high / low temperature measurement. A ring plate 11 is fixed to the upper surface of the base plate 7. The ring plate 11 is made of an iron-based plate material and can attract a magnet. A manipulator 12 is attached on the ring plate 11. A magnet is built in the manipulator 12, and the manipulator 12 is fixed to the ring plate 11 with this magnet. The manipulator 12 supports a probe 13 extending on the surface of the semiconductor wafer 20 on the chuck top 29. The manipulator 12 is provided with a moving mechanism (not shown) in the X, Y, and Z directions so that the probe 13 can be finely adjusted. The base plate 7 is provided with a notch hole 14, and the probe 13 is inserted from the notch hole 14 to the surface of the semiconductor wafer 20.
[0004]
A microscope scanner 17 having an XY movement mechanism is attached to the upper end portion of the Z-axis base 3. One end of a microscope arm 18 is fixed to the microscope scanner 17 so that the microscope arm 18 can be finely adjusted in the X and Y directions. A microscope 19 is attached to the other end of the microscope arm 18. The position of the microscope 19 is adjusted by a microscope scanner 17.
[0005]
On the upper surface of the base surface plate 2, a semiconductor wafer 20 as a measurement object is supported and moved on the base surface plate 2, and a stage portion 21 fixed at the measurement position and the movement of the stage portion 21 are guided. A guide mechanism 22 is provided.
[0006]
The stage unit 21 is located on the lowermost stage base 25, on the upper side of the stage base 25, on the Y fine adjustment mechanism 26 for finely adjusting the Y-axis direction, and on the upper side of the Y fine adjustment mechanism 26, An X fine adjustment mechanism 27 that finely adjusts the X-axis direction, a θ fine adjustment mechanism 28 that finely adjusts the rotation direction, and a θ fine adjustment mechanism 28 that finely adjusts the rotation direction. The chuck top 29 is configured to support the semiconductor wafer 20 placed thereon.
[0007]
An air bearing mechanism (not shown) is incorporated in the stage base 25. The stage portion 21 can freely move on the base surface plate 2 by this air bearing mechanism. Further, a base grip 31 is fixed to the stage base 25. The base grip 31 is used by an operator to move the stage unit 21 to an arbitrary position on the base surface plate 2 by holding it by hand. A drive handle 32 is rotatably attached to the base grip 31. The drive handle 32 is connected to the θ fine adjustment mechanism 28 via a belt 32A, and by rotating the drive handle 32, the chuck top 29 can be interlocked to make θ fine adjustment. Furthermore, the base grip 31 is provided with a first grip switch 33 and a second grip switch 34. The grip switches 33 and 34 are switches that respectively control an air bearing mechanism and a brake mechanism (not shown) of a Y-axis guide 42 and an X-axis guide 45 described later. By appropriately operating the grip switches 33 and 34, the stage 21 is moved to an air bearing state, and when released, each brake mechanism is activated and the air bearing state is released. Further, the stage base 25 is evacuated. The base platen 2 is fixed.
[0008]
The Y fine adjustment mechanism 26 is provided with a Y-direction adjusting microhead 35. The X fine adjustment mechanism 27 is provided with an X direction adjusting microhead 37. When measuring the semiconductor wafer 20 at high and low temperatures, a hot chuck (not shown) incorporating a temperature adjustment mechanism is mounted as the chuck top 29.
[0009]
The guide mechanism 22 includes a Y-direction guide portion 38, an X-direction guide portion 39, and the air bearing mechanism (not shown). The Y-direction guide portion 38 includes a Y-axis rail 41 disposed on each of the left and right sides of the base surface plate 2 and a Y-axis guide 42 slidably attached to each Y-axis rail 41. . One end of the X-direction guide portion 39 is fixed to each Y-axis guide 42 of the Y-direction guide portion 38, supported by the two Y-axis guides 42 and moved in the Y-axis direction, and the X-axis guide 43 The X-axis guide 45 is slidably attached to the rail 43. The stage base 25 of the stage unit 21 is fixed to the X-axis guide 45, and the movement of the stage unit 21 in the Y direction is guided by the Y direction guide unit 38, and the movement in the X direction is guided by the X direction guide unit 39, respectively. It has become so.
[0010]
Each of the Y-axis guide 42 and the X-axis guide 45 is provided with a brake mechanism (not shown) operated by the grip switches 33 and 34.
[0011]
Further, a shield case 46 that covers the entire manual prober 1 is provided as necessary. The shield case 46 is provided with a door 46A.
[0012]
In the manual prober 1 configured as described above, the semiconductor wafer 20 is inspected as follows.
[0013]
When the shield case 46 is provided, the operator opens the door 46A of the shield case 46.
[0014]
The grip switches 33 and 34 of the stage unit 21 are pressed to release the brake and the air bearing state, and the stage unit 21 is moved while being guided by the guide mechanism 22. In this guide mechanism 22, the Y direction is guided by the Y direction guide portion 38 and the X direction is guided by the X direction guide portion 39, and the stage portion 21 moves stably.
[0015]
As a result, the stage unit 21 is moved to the hand, and the hands are released from the grip switches 33 and 34, thereby releasing the air bearing state of the stage unit 21 and evacuating and locking the brake. Thereby, the stage part 21 is fixed on the base surface plate 2. In this state, the semiconductor wafer 20 is placed on the chuck top 29 of the stage unit 21, the vacuum switch 36 is turned on, and the semiconductor wafer 20 is fixed to the chuck top 29 by evacuation.
[0016]
Next, the grip switches 33 and 34 are pushed by hand to release the brake and to be in an air bearing state, so that the measurement site of the semiconductor wafer 20 placed on the chuck top 29 of the stage unit 21 is positioned directly below the microscope 19. An operator visually moves the stage unit 21 (first step). At this time, the stage unit 21 is supported by the Y-direction guide unit 38 and the X-direction guide unit 39 of the guide mechanism 22 and moves stably. When the positioning of the stage unit 21 is completed, the stage unit 21 is fixed by releasing the hand from the grip switches 33 and 34.
[0017]
Next, the microscope scanner 17 adjusts so that the center of the objective lens of the microscope 19 is positioned at the center of the cutout hole 14 of the base plate 7. Next, the microscope 19 is focused on the measurement surface of the semiconductor wafer 20. At this time, as a second step, the Y-direction adjusting microhead 35 and the X-direction adjusting microhead 37 are rotated so that the measurement position of the semiconductor wafer 20 falls within the field of view of the microscope 19. Tweak the. Further, the drive handle 32 is rotated to finely adjust the θ of the chuck top 29.
[0018]
At the time of high / low temperature measurement, the temperature of the chuck top 29 is set. In the case of high temperature measurement, the chuck top 29 covered with the purge plate 9 is heated to a set temperature. In the case of low temperature measurement, the chuck top 29 is cooled to a set low temperature, but nitrogen is interposed between the chuck top 29 and the purge plate 9 in order to prevent condensation of the semiconductor wafer 20 and the probe 13 and the like. Fill with gas or dry air.
[0019]
Next, the probe 13 is attached to the manipulator 12, and the manipulator 12 is mounted on the ring plate 11. Adjustment of the manipulator 12 in the X, Y, and Z directions is performed so that the probe 13 is in contact with the measurement position of the semiconductor wafer 20. Next, the Z-up lever 4 is moved downward to lower the base plate 7 by about 100 μm, and the probe 13 is overdriven.
[0020]
When the shield case 46 is used, the door 46A is closed.
[0021]
Next, measurement is performed.
[0022]
[Problems to be solved by the invention]
As the size of the semiconductor wafer 20 has increased in recent years, the size of the apparatus has increased, and the movement stroke of the stage portion 21 in the X and Y directions has increased. Thereby, when the stage part 21 moves to the back part on the base surface plate 2, the distance from an operator becomes long. Further, the field of view may be blocked by the shield case 46 or other covers. In addition, various devices may obstruct the field of view due to an increase in the number of devices. For this reason, it has become difficult to visually confirm the positioning target of the probe 13 or the like.
[0023]
As a result, the positioning of the stage portion 21 becomes difficult, and it takes time for the positioning work, and there is a problem that the efficiency of the measuring work is poor.
[0024]
The present invention has been made in view of these problems, and a manual prober that eliminates the difficulty of visual positioning of the stage portion. Alignment method The purpose is to provide.
[0025]
[Means for Solving the Problems]
Manual prober according to the first invention Alignment method Can be moved manually while supporting the base plate and the thin plate that is the object to be measured while visually checking the base plate. Position directly under the microscope The stage part fixed to the base surface plate and the guide mechanism which is provided on the base surface plate while supporting the stage part and guides the stage part to stabilize its movement in the X-axis direction and the Y-axis direction. When, Formed in the thin plate, Manual prober with various devices that block the view Alignment method A position detecting means for detecting the position of the stage portion that can be freely moved manually, and a display means for displaying the position of the stage portion detected by the position detecting means, wherein the stage portion is an air bearing. A stage base incorporating a mechanism, a Y fine adjustment mechanism for finely adjusting the Y-axis direction of the supported thin plate, an X fine adjustment mechanism for finely adjusting the X-axis direction, and a θ fine adjustment mechanism for finely adjusting the rotation direction. The stage part is manually adjusted while visually checking. To the position directly under the microscope A first step to move; The measurement position of the thin plate that is the measurement object is within the field of view of the microscope. Y fine adjustment mechanism of the stage part , X fine adjustment mechanism The stage is moved while viewing the display means that displays the position of the stage unit and can ignore the presence of the various devices that block the field of view during the third step of fine-tuning with To align the stage The second step is provided.
[0026]
With the above configuration, the stage unit is moved while checking the position of the stage unit detected by the position detection unit and displayed on the display unit. Thereby, even when the position where the various devices block the visual field is the target position, the stage unit can be easily moved to the target position.
[0027]
Manual prober according to the second invention Alignment method The guide mechanism guides the stage part and stabilizes movement in the X-axis direction. The X-axis guide part includes an X-axis guide and an X-axis rail, and guides the stage part in the Y-axis direction. An X-axis guide position detection unit that detects the position of the X-axis guide of the X-direction guide unit, and a Y-direction guide unit that includes a Y-axis guide and a Y-axis rail that stabilize the movement of And a Y-axis guide position detecting unit for detecting the position of the Y-axis guide of the Y-direction guide unit.
[0028]
With the above configuration, the position of the stage unit can be accurately specified by detecting the position of the X-axis guide by the X-axis guide position detection unit and detecting the position of the Y-axis guide by the Y-axis guide position detection unit. .
[0029]
Thereby, the stage part can be easily moved to the target position while confirming the position.
[0030]
Manual prober according to the third invention Alignment method The X-axis guide position detection part of the position detection means is attached to the X-axis wire with the tip attached to the X-axis guide and the X-axis rail, and winds up the base end side of the X-axis wire And an X-axis wire feed amount detection unit that detects the position of the X-axis guide from the X-axis wire feed amount that changes with the movement of the X-axis guide, and the Y-axis guide position detection unit of the position detection means A Y-axis wire whose tip is attached to the Y-axis guide, and a Y-axis that is attached to the Y-axis rail side, winds up the proximal end side of the Y-axis wire, and changes as the Y-axis guide moves It is characterized by comprising a Y-axis wire feed amount detection unit for detecting the position of the Y-axis guide from the wire feed amount.
[0031]
With the above configuration, the X-axis guide moves with the movement of the stage unit. The X-axis wire feed amount detection unit detects the amount of X-axis wire feed that changes with the movement of the X-axis guide, and detects the position of the X-axis guide.
[0032]
In the Y-axis guide position detection unit, the Y-axis guide moves as the stage unit moves. The Y-axis wire feed amount detection unit detects the amount of Y-axis wire feed that changes with the movement of the Y-axis guide, and detects the position of the Y-axis guide.
[0033]
Thereby, the position of a stage part can be pinpointed correctly.
[0034]
Manual prober according to the fourth invention Alignment method The X-axis guide position detecting portion of the position detecting means is attached along the X-axis lead nut fixed to the X-axis guide side and the X-axis rail, and a screw thread is formed around the X-axis guide nut. An X-axis lead screw into which the shaft lead nut is screwed, and a rotary encoder connected to the X-axis lead screw and driven while accurately detecting the number of rotations. A Y-axis lead nut having a tip attached to the Y-axis guide and a Y-axis lead screw attached along the Y-axis rail and threaded around the Y-axis lead nut. And a rotary encoder connected to the Y-axis lead screw and driven while accurately detecting the rotational speed.
[0035]
With the above configuration, the X-axis lead nut is moved by the movement of the X-axis guide accompanying the movement of the stage portion. The X-axis lead screw is rotated by the movement of the X-axis lead nut. The rotation of the X-axis lead screw is detected by a rotary encoder, and the position of the stage portion in the X-axis direction is specified.
[0036]
Similarly, in the Y-axis direction, the Y-axis lead screw is rotated by the movement of the Y-axis lead nut. This rotation is detected by a rotary encoder, and the position of the stage portion in the Y-axis direction is specified.
[0037]
Thereby, the position of a stage part can be pinpointed correctly.
[0038]
Manual prober according to the fifth invention Alignment method The X-axis guide position detection unit of the position detection means is attached to the X-axis main scale disposed along the X-axis rail and the X-axis guide, and the X-axis guide is moved as the X-axis guide moves. An X-axis index scale that generates moire fringes with the main axis scale, and an X-axis moire fringe measuring unit that is provided on the X-axis index scale and detects the position of the X-axis guide by measuring the moire fringes. A Y-axis guide position detection unit of the position detecting means is attached to the Y-axis main scale disposed along the Y-axis rail and the Y-axis guide, and the Y-axis main is moved along with the movement of the Y-axis guide. Y-axis index scale that generates moire fringes with the scale, and Y-axis moire fringe measurement that is provided on this Y-axis index scale and detects the position of the Y-axis guide by measuring the moire fringes Consisting of
It is characterized by that.
[0039]
With the above configuration, the X-axis index scale moves with the movement of the X-axis guide, and moire fringes are generated with the X-axis main scale. This is measured by the X-axis moire fringe measuring unit to identify the position of the stage unit in the X-axis direction.
[0040]
Similarly, in the Y-axis direction, the Y-axis index scale moves with the movement of the Y-axis guide, and moire fringes are generated with the Y-axis main scale. This is measured by the Y-axis moire fringe measuring unit to identify the position of the stage unit in the Y-axis direction.
[0041]
Manual prober according to the sixth invention Alignment method The X-axis guide position detector of the position detector comprises an X-axis linear encoder that is provided in the X-axis guide and directly measures the amount of movement of the X-axis guide that moves along the X-axis rail, The Y-axis guide position detection unit of the position detection means is formed of a Y-axis linear encoder that is provided in the Y-axis guide and directly measures the amount of movement of the Y-axis guide that moves along the Y-axis rail. .
[0042]
With the above configuration, the movement amount of the X-axis guide is directly measured by the X-axis linear encoder. Further, the movement amount of the Y-axis guide is directly measured by the Y-axis linear encoder.
[0043]
Manual prober according to the seventh invention Alignment method Is characterized in that the display means displays a map imitating a thin plate to be inspected fixed on the display screen, and relatively moves the alignment point on the map in accordance with the manual movement of the stage unit. And
[0044]
With the above configuration, the alignment point relatively moves on the map as the stage portion moves. Thereby, a stage part can be aligned easily.
[0045]
Manual prober according to the eighth invention Alignment method Is characterized in that the display means displays the direction and distance of the alignment point.
[0046]
With this configuration, it is possible to easily and surely align the position by simply moving the stage unit according to the direction and distance displayed on the display screen.
[0047]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the manual prober according to the present invention. Alignment method Will be described with reference to the accompanying drawings.
[0048]
[First Embodiment]
1 is a perspective view showing a main part of a manual prober according to this embodiment, FIG. 5 is a front view showing the manual prober according to this embodiment, FIG. 6 is a side view showing the manual prober according to this embodiment, and FIG. These are top views which show the manual prober which concerns on this embodiment.
[0049]
The manual prober 51 according to the present embodiment is configured as shown in FIGS. Since the entire configuration of the manual prober 51 according to the present embodiment is substantially the same as that of the conventional manual prober 1, the same parts are denoted by the same reference numerals and the description thereof is omitted. As for the manual prober 51 of this embodiment, the whole apparatus is enlarged with the enlargement of the semiconductor wafer 20.
[0050]
The feature of the manual prober 51 according to the present embodiment is that the position of the stage portion 21 can be accurately recognized when the operator inspects the semiconductor wafer 20. This is to prevent the positioning of the stage portion 21 with the naked eye with the increase in size of the apparatus due to the increase in size of the semiconductor wafer 20.
[0051]
For this reason, in the present embodiment, a position detection unit 52 that detects the position of the stage unit 21 that can be manually moved freely, and a display unit 53 that displays the position of the stage unit 21 detected by the position detection unit 52 are provided. Yes.
[0052]
The position detection means 52 detects the position of the X-axis linear encoder 55 as an X-axis guide position detection unit that detects the position of the X-axis guide 45 of the Y-direction guide unit 38 and the position of the Y-axis guide 42 of the Y-direction guide unit 38. And a Y-axis linear encoder 56 as a Y-axis guide position detecting unit.
[0053]
The X-axis linear encoder 55 is attached to the end of the X-axis rail 43 via an X-axis spacer 59A, and an X-axis wire 58, which is an X-axis wire attached to the X-axis guide 45 by a hook portion 57. X-axis wire material feed amount detection for detecting the position of the X-axis guide 45 from the feed amount or the take-up amount of the X-axis wire 58 that winds up the proximal end side of the X-axis wire 58 and changes as the X-axis guide 45 moves. And an X-axis linear scale encoder unit 59 as a unit.
[0054]
The X-axis linear scale encoder unit 59 winds and feeds the X-axis wire 58, and the X-axis wire 58 when winding and feeding the X-axis wire winding unit 60. And an X-axis wire feed amount detector 61 that detects the amount of movement and converts it into an electrical signal. The X-axis wire feed amount detection unit 61 is connected to the display unit 53, and the detection value from the X-axis wire feed amount detection unit 61 is transmitted to the display unit 53. The X-axis wire winding portion 60 is set so as to always pull the X-axis wire 58 with a constant tension. This is to minimize the measurement error of the position of the X-axis guide 45 due to the slack of the X-axis wire 58.
[0055]
The Y-axis linear encoder 56 is attached to the Y-axis wire 64 which is a Y-axis wire material whose tip is attached to the Y-axis guide 42 by the hook portion 63 and the base surface plate 2 on the Y-axis rail 41 side. As a Y-axis wire feed amount detection unit for winding the base end side of 64 and detecting the position of the Y-axis guide 42 from the feed amount or the take-up amount of the Y-axis wire 64 that changes as the Y-axis guide 42 moves. A Y-axis linear scale encoder unit 65 is included.
[0056]
The Y-axis linear scale encoder unit 65 winds and feeds the Y-axis wire 64, and the Y-axis wire 64 when winding and feeding the Y-axis wire winding unit 66. And a Y-axis wire feed amount detector 67 that detects the amount of movement and converts it into an electrical signal. The Y-axis wire feed amount detection unit 67 is connected to the display unit 53 similarly to the X-axis wire feed amount detection unit 61, and the detection value from the Y-axis wire feed amount detection unit 67 is transmitted to the display unit 53. It is like that. The Y-axis wire winding portion 66 is attached to a position facing the end of the Y-axis rail 41 via a Y-axis spacer 66A, and, like the X-axis wire winding portion 60, the Y-axis wire 64 is always attached. It is set to pull with a constant tension.
[0057]
The display means 53 is provided with an X-direction position display portion 71 and a Y-direction position display portion 72 arranged in the vertical direction. The X-direction position display unit 71 displays the position of the stage unit 21 in the X direction based on the detection value from the X-axis wire feed amount detection unit 61. The Y-direction position display unit 72 displays the position of the stage unit 21 in the Y direction based on the detection value from the Y-axis wire feed amount detection unit 67.
[0058]
[ Manual prober alignment method ]
In the manual prober 51 configured as described above, the semiconductor wafer 20 is inspected as follows.
[0059]
The overall operation of the measurement work by the manual prober 51 is almost the same as that of the conventional manual prober 1 described above. For this reason, it demonstrates centering on the characteristic part of this plan.
[0060]
The stage unit 21 is moved to the hand while being guided by the guide mechanism 22 and fixed on the base surface plate 2. In this state, the semiconductor wafer 20 is fixed to the chuck top 29 of the stage unit 21.
[0061]
Next, the grip switches 33 and 34 are pushed by hand, and the stage unit 21 is moved to a position directly below the microscope 19 as a first step. At this time, the stage unit 21 is supported by the Y-direction guide unit 38 and the X-direction guide unit 39 of the guide mechanism 22 and moves stably.
[0062]
Furthermore, the X-axis guide 45 of the X direction guide part 39 also moves with the movement of the stage part 21. By the movement of the X-axis guide 45, the X-axis wire 58 is fed out or wound up from the X-axis wire winding unit 60, and the feeding amount is detected by the X-axis wire feeding amount detection unit 61 and transmitted to the display means 53. The
[0063]
The display unit 53 displays the amount of movement of the stage unit 21 in the X-axis direction on the X-direction position display unit 71 based on the detection value from the X-axis wire feed amount detection unit 61. A number is displayed on the X-direction position display unit 71, and the number represents a moving distance of the stage unit 21. In this case, the starting point is set to 0 to display how many centimeters have been moved, or the moving target position is set to the origin of the coordinate axes, and how many centimeters to the origin are displayed.
[0064]
The same applies to the Y direction. That is, the Y-axis guide 42 of the Y-direction guide unit 38 moves as the stage unit 21 moves. By this movement of the Y-axis guide 42, the Y-axis wire 64 is fed out or wound up from the Y-axis wire winding unit 66, and the feed amount is detected by the Y-axis wire feed amount detection unit 67 and transmitted to the display means 53. The In the Y-direction position display section 72 of the display means 53, the Y-direction position of the stage section 21 is displayed as a change in the movement distance, as in the case of the X-direction position display section 71.
[0065]
As a second step, the operator performs positioning while holding the stage unit 21 with his hand and looking at the display means 53. When the positioning of the stage unit 21 is completed, the stage unit 21 is fixed by releasing the hand from the grip switches 33 and 34.
[0066]
Next, fine adjustment of the third step (second step of the conventional technique) is performed to align the microscope 19. At the time of high / low temperature measurement, the temperature of the chuck top 29 is set and filled with nitrogen gas or the like. Next, measurement is performed by bringing the probe 13 into contact with the measurement position of the semiconductor wafer 20.
[0067]
[effect]
As described above, since the accurate position of the stage unit 21 is displayed by the display unit 53 when the stage unit 21 is aligned, the alignment of the stage unit 21 can be performed in a short time without visual observation. It becomes possible to carry out accurately and extremely easily.
[0068]
As a result, even when the manual prober 51 increases in size as the size of the semiconductor wafer 20 increases, the alignment work of the stage portion 21 can be easily performed, and the measurement workability of the semiconductor wafer 20 is greatly improved. .
[0069]
[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 8 is a perspective view showing a main part of a manual prober according to the second embodiment.
[0070]
Since the entire configuration of the manual prober 75 according to the present embodiment is the same as that of the manual prober 51 of the first embodiment, description thereof is omitted. A feature of the manual prober 75 according to the present embodiment is the position detection means 76.
[0071]
The position detection unit 76 includes an X-axis guide position detection unit 77 and a Y-axis guide position detection unit 78.
[0072]
The X-axis guide position detection unit 77 is attached to the X-axis lead nut 80 fixed on the X-axis guide 45 side and is laid over the Y-axis guides 42 along the X-axis rail 43, and has a thread around the periphery. And an X-axis lead screw 81 to which an X-axis lead nut 80 is screwed, and a rotary encoder 82 connected to the X-axis lead screw 81 and accurately detecting the rotational speed. One X-axis lead screw 81 is rotatably supported by a bearing 83 and the other is rotatably supported by an encoder mounting bracket 84. Furthermore, a rotary encoder 82 connected to the X-axis lead screw 81 via a coupling 82A is attached to the encoder mounting bracket 84.
[0073]
With this configuration, when the X-axis lead nut 80 moves together with the X-axis guide 45, the X-axis lead screw 81 into which the X-axis lead nut 80 is screwed rotates, and the rotation is detected by the rotary encoder 82. It has become. The rotary encoder 82 is connected to the display means 53.
[0074]
The Y-axis guide position detection unit 78 is attached to the base surface plate 2 side along the Y-axis rail 41 and a Y-axis lead nut 85 fixed to the Y-axis guide 42, and a thread is formed around the Y-axis guide position detection unit 78. A Y-axis lead screw 86 to which a lead nut 85 is screwed, and a rotary encoder 87 connected to the Y-axis lead screw 86 and accurately detecting the rotational speed are configured. One of the Y-axis lead screws 86 is rotatably supported by a bearing 88, and the other is rotatably supported by an encoder mounting bracket 89. Further, a rotary encoder 87 connected to the Y-axis lead screw 86 via a coupling 87A is attached to the encoder mounting bracket 89.
[0075]
With this configuration, when the Y-axis lead nut 85 moves together with the Y-axis guide 42, the Y-axis lead screw 86 with which the Y-axis lead nut 85 is screwed rotates, and the rotation is detected by the rotary encoder 87. It has become. The rotary encoder 87 is connected to the display means 53.
[0076]
[ Manual prober alignment method ]
In the manual prober 75 configured as described above, the semiconductor wafer 20 is inspected as follows. Here, the operation of the position detector 76 will be mainly described.
[0077]
As the stage unit 21 moves, the X-axis guide 45 of the X-direction guide unit 39 and the Y-axis guide 42 of the Y-direction guide unit 38 move.
[0078]
By the movement of the X-axis guide 45, the X-axis lead nut 80 fixed to the X-axis guide 45 is moved in a state of being screwed to the X-axis lead screw 81. Thereby, the X-axis lead screw 81 is rotated. The rotation of the X-axis lead screw 81 is detected by the rotary encoder 82, and the detected value is transmitted to the display means 53.
[0079]
In the display unit 53, the movement amount in the X-axis direction of the stage unit 21 is displayed on the X-direction position display unit 71 as in the first embodiment.
[0080]
The same applies to the Y direction. That is, due to the movement of the Y-axis guide 42 accompanying the movement of the stage portion 21, the Y-axis lead nut 85 moves in a state of being screwed to the Y-axis lead screw 86. As a result, the Y-axis lead screw 86 is rotated. The rotation of the Y-axis lead screw 86 is detected by the rotary encoder 87 and the detected value is transmitted to the display means 53.
[0081]
The display unit 53 displays the amount of movement of the stage unit 21 in the Y-axis direction on the Y-direction position display unit 72 as in the first embodiment.
[0082]
The operator aligns the stage unit 21 while looking at the display means 53. When the positioning of the stage unit 21 is completed, the stage unit 21 is fixed and measurement is performed with the probe 13.
[0083]
[effect]
Also in this case, as in the first embodiment, since the accurate position of the stage unit 21 is displayed by the display means 53, the alignment of the stage unit 21 can be accurately performed in a short time without visual observation. And the measurement workability of the semiconductor wafer 20 is greatly improved.
[0084]
[Third Embodiment]
Next, a third embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 9 is a perspective view showing a main part of a manual prober according to the third embodiment.
[0085]
Since the entire configuration of the manual prober 91 according to the present embodiment is the same as that of the manual prober 51 of the first embodiment, description thereof is omitted. A feature of the manual prober 91 according to the present embodiment is the position detection means 92.
[0086]
The position detection unit 92 includes an X-axis guide position detection unit 93 and a Y-axis guide position detection unit 94.
[0087]
The X-axis guide position detection unit 93 moves the X-axis guide 45 in a state where the X-axis main scale 96 disposed along the X-axis rail 43 and the index attachment fitting 97 are attached to the X-axis guide 45. Accordingly, an X-axis index scale (not shown) that generates moiré fringes with the X-axis main scale 96 is provided integrally with the X-axis index scale. An X-axis moire fringe measuring unit (not shown) for detecting the position is included. The X-axis main scale 96 is fixed to each Y-axis guide 42 via the fixing base 100 while being supported by the main mounting bracket 99. The X-axis moire fringe measuring unit is connected to the display means 53.
[0088]
The Y-axis guide position detection unit 94 is attached to the Y-axis main scale 101 disposed along the Y-axis rail 41 and the Y-axis guide 42, and moves along with the Y-axis main scale 101 as the Y-axis guide 42 moves. Y-axis index scale 102 that generates moire fringes, and a Y-axis moire fringe measuring unit (not shown) that is provided on this Y-axis index scale 102 and detects the position of the Y-axis guide 42 by measuring the moire fringes. It consists of and. The Y-axis main scale 101 is fixed to the base surface plate 2 via the fixing base 105 while being supported by the main mounting bracket 104. The Y-axis index scale 102 is attached to the Y-axis guide 42 via an index attachment fitting 106. The Y-axis moire fringe measuring unit is connected to the display means 53.
[0089]
[ Manual prober alignment method ]
In the manual prober configured as described above, the semiconductor wafer 20 is inspected as follows. Here, the operation of the position detection unit 92 will be mainly described.
[0090]
As the stage unit 21 moves, the X-axis guide 45 of the X-direction guide unit 39 and the Y-axis guide 42 of the Y-direction guide unit 38 move.
[0091]
By the movement of the X-axis guide 45, the X-axis index scale fixed to the X-axis guide 45 with the index mounting bracket 97 is moved in a state of facing the X-axis main scale 96. As a result, moire fringes are generated. The X-axis moire fringe measuring unit measures the moire fringes and detects the position of the X-axis guide 45. Then, this detected value is transmitted to the display means 53.
[0092]
In the display means 53, the movement amount in the X-axis direction of the stage unit 21 is displayed on the X-direction position display unit 71 as in the first embodiment.
[0093]
The same applies to the Y direction. That is, the movement of the Y-axis guide 42 accompanying the movement of the stage unit 21 moves the Y-axis index scale 102 fixed to the Y-axis guide 42 in a state of facing the Y-axis main scale 101. As a result, moire fringes are generated. The Y-axis moire fringe measuring unit measures the moire fringes and detects the position of the Y-axis guide 42. Then, this detected value is transmitted to the display means 53.
[0094]
The display unit 53 displays the amount of movement of the stage unit 21 in the Y-axis direction on the Y-direction position display unit 72 as in the first embodiment.
[0095]
The operator aligns the stage unit 21 while looking at the display means 53. When the positioning of the stage unit 21 is completed, the stage unit 21 is fixed and measurement is performed with the probe 13.
[0096]
[effect]
Also in this case, as in the first embodiment, since the accurate position of the stage unit 21 is displayed by the display means 53, the alignment of the stage unit 21 can be accurately performed in a short time without visual observation. And the measurement workability of the semiconductor wafer 20 is greatly improved.
[0097]
[Fourth Embodiment]
A fourth embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 10 is a perspective view showing a main part of a manual prober according to the fourth embodiment.
[0098]
Since the entire configuration of the manual prober 111 according to the present embodiment is the same as that of the manual prober 51 of the first embodiment, description thereof is omitted. A feature of the manual prober 111 according to the present embodiment is the position detection means 112.
[0099]
The position detection unit 112 includes an X-axis guide position detection unit 113 and a Y-axis guide position detection unit 114.
[0100]
The X-axis guide position detection unit 113 is configured by an X-axis linear encoder 115. The X-axis linear encoder 115 is provided integrally with the X-axis guide 45 and directly measures the amount of movement of the X-axis guide 45 that moves along the X-axis rail 43. The X-axis linear encoder 115 is connected to the display means 53 and transmits a measurement value as a movement amount of the X-axis guide 45.
[0101]
The Y-axis guide position detection unit 114 is configured by a Y-axis linear encoder 116. The Y-axis linear encoder 116 is provided integrally with the Y-axis guide 42 and directly measures the amount of movement of the Y-axis guide 42 that moves along the Y-axis rail 41. The Y-axis linear encoder 116 is connected to the display means 53 and transmits a measurement value as a movement amount of the Y-axis guide 42.
[0102]
[ Manual prober alignment method ]
In the manual prober configured as described above, the semiconductor wafer 20 is inspected as follows. Here, the operation of the position detection unit 112 will be mainly described.
[0103]
As the stage unit 21 moves, the X-axis guide 45 of the X-direction guide unit 39 and the Y-axis guide 42 of the Y-direction guide unit 38 move.
[0104]
As the X-axis guide 45 moves, the X-axis linear encoder 115 provided integrally with the X-axis guide 45 detects the position of the X-axis guide 45. Then, this detected value is transmitted to the display means 53.
[0105]
In the display means 53, the movement amount in the X-axis direction of the stage unit 21 is displayed on the X-direction position display unit 71 as in the first embodiment.
[0106]
The same applies to the Y direction. That is, the position of the Y-axis guide 42 accompanying the movement of the stage unit 21 is detected by the Y-axis linear encoder 116, and the detected value is transmitted to the display means 53.
[0107]
The display unit 53 displays the amount of movement of the stage unit 21 in the Y-axis direction on the Y-direction position display unit 72 as in the first embodiment.
[0108]
The operator aligns the stage unit 21 while looking at the display means 53. When the positioning of the stage unit 21 is completed, the stage unit 21 is fixed and measurement is performed with the probe 13.
[0109]
[effect]
Also in this case, as in the first embodiment, since the accurate position of the stage unit 21 is displayed by the display means 53, the alignment of the stage unit 21 can be accurately performed in a short time without visual observation. And the measurement workability of the semiconductor wafer 20 is greatly improved.
[0110]
[Modification]
(1) In each of the above embodiments, the display means 53 is configured by the X-direction position display unit 71 that displays the position in the X direction as a number and the Y-direction position display unit 72 that displays the position in the Y direction as a number. However, in addition to the numerical display, the map may be displayed. For example, as shown in FIG. 11, a display unit is configured by a computer 118, and a map 120 imitating the semiconductor wafer 20 to be inspected is fixed and displayed on the display screen 119. Then, a point 121 representing the probe 13 that is an alignment point is moved relative to the fixed map 120 and displayed. Thereby, the measurement target position of the semiconductor wafer 20 and the probe 13 can be easily aligned.
[0111]
On the display screen 119, the direction of the target position to be aligned may be represented by an arrow or the like, and the distance to the target position may be represented by a number.
[0112]
In these cases, the same operations and effects as those of the above embodiment can be obtained.
[0113]
(2) The X-axis guide position detection unit and the Y-axis guide position detection unit may be configured using a light receiving element and a light emitting element in addition to the above embodiments. In this case, instead of the main scales 96 and 101 supported by the main mounting brackets 99 and 104 shown in FIG. 9, long plates provided with slits at regular intervals are provided along the rails 41 and 43 to guides 42 and 45. A light receiving element and a light emitting element may be provided on the side. The light receiving element and the light emitting element are arranged with a slit in the long plate, and the movement of the guides 42 and 45 can be detected by light connection / disconnection between the light receiving element and the light emitting element. The interval between the slits is set to about several mm or narrower as required.
[0114]
Further, a groove or the like for irregularly reflecting light is provided in a portion along the rails 41 and 43 on the surface of the base surface plate 2 at regular intervals. It may be arranged.
[0115]
In these cases, the same operations and effects as those of the above embodiments can be obtained.
[0116]
【The invention's effect】
As described above, according to the present invention, the following effects can be obtained.
[0117]
Since the accurate position of the stage unit is displayed by the display means when aligning the stage unit, the stage unit can be aligned accurately and extremely easily in a short time without visual inspection. become able to.
[0118]
As a result, even when the manual prober is enlarged with the increase in the size of the thin plate, the positioning operation of the stage portion can be easily performed, and the measurement workability of the thin plate is greatly improved.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a main part of a manual prober according to a first embodiment of the present invention.
FIG. 2 is a front view showing a conventional manual prober.
FIG. 3 is a side view showing a conventional manual prober.
FIG. 4 is a plan view showing a conventional manual prober.
FIG. 5 is a front view showing a manual prober according to the first embodiment.
FIG. 6 is a side view showing the manual prober according to the first embodiment.
FIG. 7 is a plan view showing a manual prober according to the first embodiment.
FIG. 8 is a perspective view showing a main part of a manual prober according to a second embodiment of the present invention.
FIG. 9 is a perspective view showing a main part of a manual prober according to a third embodiment of the present invention.
FIG. 10 is a perspective view showing a main part of a manual prober according to a fourth embodiment of the present invention.
FIG. 11 is a front view showing a modification of the display means.
[Explanation of symbols]
2: base surface plate, 20: semiconductor wafer, 21: stage unit, 41: Y-axis rail, 42: Y-axis guide, 43: X-axis rail, 51: manual prober, 52: position detection means, 53: display means, 55: X-axis linear encoder, 56: Y-axis linear encoder, 57: Hook part, 58: X-axis wire, 59: X-axis linear scale encoder part, 60: X-axis wire winding part, 61: X-axis wire feed amount Detection unit, 63: Hook unit, 64: Y-axis wire, 65: Y-axis linear scale encoder unit, 66: Y-axis wire winding unit, 67: Y-axis wire feed amount detection unit, 71: X-direction position display unit, 72: Y direction position display section.

Claims (8)

A base surface plate,
A stage unit that supports a thin plate as a measurement object and can be manually moved while visually checking the base surface plate, and is fixed to the base surface plate at a position directly under the microscope ,
A guide mechanism that is provided on the base surface plate in a state of supporting the stage portion, guides the stage portion, and stabilizes movement in the X-axis direction and the Y-axis direction;
In the manual prober alignment method comprising various devices that are formed on the thin plate and block the view,
Position detecting means for detecting the position of the stage part which can be manually moved freely;
Display means for displaying the position of the stage portion detected by the position detection means,
The stage unit has a stage base incorporating an air bearing mechanism, a Y fine adjustment mechanism that finely adjusts the Y axis direction of the supported thin plate, an X fine adjustment mechanism that finely adjusts the X axis direction, and a fine adjustment of the rotation direction. Is configured with a θ fine adjustment mechanism,
A first step of manually moving the stage part to a position directly below the microscope while visually confirming, and a Y fine adjustment mechanism of the stage part so that the measurement position of the thin plate as the measurement object enters the field of view of the microscope The stage portion is moved while viewing the display means that can display the position of the stage portion and ignore the presence of the various devices that obstruct the field of view during the third step of fine adjustment by the X fine adjustment mechanism. A manual prober alignment method comprising a second step of aligning the stage portion . The manual prober alignment method according to claim 1,
The guide mechanism guides the stage unit to stabilize the movement in the X-axis direction. The X-axis guide unit includes an X-axis guide and an X-axis rail, and the stage unit is guided to move in the Y-axis direction. Comprising a Y-direction guide and a Y-direction guide provided with a Y-axis rail.
The position detection means includes an X-axis guide position detection unit that detects the position of the X-axis guide of the X-direction guide unit, and a Y-axis guide position detection unit that detects the position of the Y-axis guide of the Y-direction guide unit. A manual prober alignment method characterized by In the manual prober alignment method according to claim 2,
The X-axis guide position detection unit of the position detection means has a tip attached to the X-axis guide, the X-axis wire attached to the X-axis rail side, winds up the base end side of the X-axis wire, and An X-axis wire feed amount detection unit that detects the position of the X-axis guide from the X-axis wire feed amount that changes with the movement of the X-axis guide,
The Y-axis guide position detection unit of the position detection means is attached to the Y-axis wire with the tip attached to the Y-axis guide and the Y-axis rail, winds up the base end side of the Y-axis wire, and A manual prober positioning method, comprising: a Y-axis wire feed amount detection unit that detects a position of the Y-axis guide from a feed amount of the Y-axis wire that changes with the movement of the Y-axis guide. In the manual prober alignment method according to claim 2,
An X-axis guide position detecting portion of the position detecting means is attached along the X-axis lead nut fixed to the X-axis guide side and the X-axis rail, and a screw thread is formed around the X-axis lead nut. It consists of an X-axis lead screw into which a nut is screwed and a rotary encoder that is connected to the X-axis lead screw and is driven while accurately detecting the number of rotations.
The Y-axis guide position detecting unit of the position detecting means is attached along the Y-axis rail with a Y-axis lead nut having a tip attached to the Y-axis guide, and a thread is formed around the Y-axis guide nut. A manual prober positioning method comprising: a Y-axis lead screw into which a lead nut is screwed; and a rotary encoder connected to the Y-axis lead screw and driven while accurately detecting the rotational speed. In the manual prober alignment method according to claim 2,
An X-axis guide position detection unit of the position detecting means is attached to the X-axis main scale disposed along the X-axis rail and the X-axis guide, and the X-axis main is moved along with the movement of the X-axis guide. An X-axis index scale that generates moire fringes with the scale, and an X-axis moire fringe measuring unit that is provided on the X-axis index scale and detects the position of the X-axis guide by measuring the moire fringes.
A Y-axis guide position detection unit of the position detecting means is attached to the Y-axis main scale disposed along the Y-axis rail and the Y-axis guide, and the Y-axis main is moved along with the movement of the Y-axis guide. A Y-axis index scale that generates moire fringes with the scale, and a Y-axis moire fringe measuring unit that is provided on the Y-axis index scale and detects the position of the Y-axis guide by measuring the moire fringes. The manual prober alignment method . In the manual prober alignment method according to claim 2,
The X-axis guide position detection unit of the position detection means is an X-axis linear encoder that is provided in the X-axis guide and directly measures the amount of movement of the X-axis guide that moves along the X-axis rail.
The Y-axis guide position detection unit of the position detection unit is formed of a Y-axis linear encoder that is provided in the Y-axis guide and directly measures the amount of movement of the Y-axis guide that moves along the Y-axis rail. How to align the manual prober. In the manual prober alignment method according to any one of claims 1 to 6,
The display means fixes and displays a map imitating a thin plate to be inspected on a display screen, and relatively moves an alignment point on the map in accordance with manual movement of the stage unit. Manual prober alignment method . In the manual prober alignment method according to any one of claims 1 to 6,
A manual prober alignment method , wherein the display means displays the direction and distance of an alignment point.

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