JP3808236B2 - 平坦化加工装置 - Google Patents

平坦化加工装置 Download PDF

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Publication number
JP3808236B2
JP3808236B2 JP12673499A JP12673499A JP3808236B2 JP 3808236 B2 JP3808236 B2 JP 3808236B2 JP 12673499 A JP12673499 A JP 12673499A JP 12673499 A JP12673499 A JP 12673499A JP 3808236 B2 JP3808236 B2 JP 3808236B2
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JP
Japan
Prior art keywords
grindstone
dressing
tool
brushing
dressing tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP12673499A
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English (en)
Japanese (ja)
Other versions
JP2000317835A (ja
JP2000317835A5 (de
Inventor
秀夫 鹿島
邦男 原田
正文 金友
明広 古川
創一 片桐
茂夫 森山
貴康 古川
繁夫 大月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12673499A priority Critical patent/JP3808236B2/ja
Publication of JP2000317835A publication Critical patent/JP2000317835A/ja
Publication of JP2000317835A5 publication Critical patent/JP2000317835A5/ja
Application granted granted Critical
Publication of JP3808236B2 publication Critical patent/JP3808236B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP12673499A 1999-05-07 1999-05-07 平坦化加工装置 Expired - Fee Related JP3808236B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12673499A JP3808236B2 (ja) 1999-05-07 1999-05-07 平坦化加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12673499A JP3808236B2 (ja) 1999-05-07 1999-05-07 平坦化加工装置

Publications (3)

Publication Number Publication Date
JP2000317835A JP2000317835A (ja) 2000-11-21
JP2000317835A5 JP2000317835A5 (de) 2005-02-10
JP3808236B2 true JP3808236B2 (ja) 2006-08-09

Family

ID=14942579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12673499A Expired - Fee Related JP3808236B2 (ja) 1999-05-07 1999-05-07 平坦化加工装置

Country Status (1)

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JP (1) JP3808236B2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103522188A (zh) * 2012-07-02 2014-01-22 中芯国际集成电路制造(上海)有限公司 研磨垫整理方法、研磨垫整理器及研磨机台
CN109202692A (zh) * 2017-07-07 2019-01-15 3M创新有限公司 研磨装置和研磨操作方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60121292T2 (de) * 2001-04-02 2007-07-05 Infineon Technologies Ag Verfahren zur Konditionierung der Oberfläche eines Polierkissens
KR100462868B1 (ko) * 2001-06-29 2004-12-17 삼성전자주식회사 반도체 폴리싱 장치의 패드 컨디셔너
JP2003048147A (ja) * 2001-07-31 2003-02-18 Applied Materials Inc 研磨パッドのコンディショニング装置及びこれを用いた研磨装置
JP2003305643A (ja) * 2002-04-11 2003-10-28 Disco Abrasive Syst Ltd 研磨装置
KR100856324B1 (ko) * 2003-12-31 2008-09-03 동부일렉트로닉스 주식회사 화학기계적 연마장치용 브러쉬 클리너
JP5761943B2 (ja) * 2010-03-25 2015-08-12 株式会社東京精密 仕上研削装置および仕上研削方法
KR101362040B1 (ko) * 2012-02-22 2014-02-12 (주)대성하이텍 실리콘잉곳의 복합가공기
JP6869051B2 (ja) * 2017-02-27 2021-05-12 株式会社東京精密 研削装置
CN114029816B (zh) * 2021-11-17 2022-08-30 深圳焦点伟业科技有限公司 一种应用精密齿轮传动技术的高速菲涅尔透镜雕刻机

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103522188A (zh) * 2012-07-02 2014-01-22 中芯国际集成电路制造(上海)有限公司 研磨垫整理方法、研磨垫整理器及研磨机台
CN109202692A (zh) * 2017-07-07 2019-01-15 3M创新有限公司 研磨装置和研磨操作方法

Also Published As

Publication number Publication date
JP2000317835A (ja) 2000-11-21

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