JP3797822B2 - ポリッシング装置 - Google Patents

ポリッシング装置 Download PDF

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Publication number
JP3797822B2
JP3797822B2 JP18535799A JP18535799A JP3797822B2 JP 3797822 B2 JP3797822 B2 JP 3797822B2 JP 18535799 A JP18535799 A JP 18535799A JP 18535799 A JP18535799 A JP 18535799A JP 3797822 B2 JP3797822 B2 JP 3797822B2
Authority
JP
Japan
Prior art keywords
polishing
wafer
top ring
pusher
transfer robot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP18535799A
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English (en)
Japanese (ja)
Other versions
JP2001009713A (ja
JP2001009713A5 (enExample
Inventor
哲二 戸川
暢行 高田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP18535799A priority Critical patent/JP3797822B2/ja
Priority to US09/605,989 priority patent/US6447385B1/en
Publication of JP2001009713A publication Critical patent/JP2001009713A/ja
Publication of JP2001009713A5 publication Critical patent/JP2001009713A5/ja
Application granted granted Critical
Publication of JP3797822B2 publication Critical patent/JP3797822B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP18535799A 1999-06-30 1999-06-30 ポリッシング装置 Expired - Fee Related JP3797822B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP18535799A JP3797822B2 (ja) 1999-06-30 1999-06-30 ポリッシング装置
US09/605,989 US6447385B1 (en) 1999-06-30 2000-06-29 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18535799A JP3797822B2 (ja) 1999-06-30 1999-06-30 ポリッシング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006076902A Division JP4413882B2 (ja) 2006-03-20 2006-03-20 ポリッシング装置

Publications (3)

Publication Number Publication Date
JP2001009713A JP2001009713A (ja) 2001-01-16
JP2001009713A5 JP2001009713A5 (enExample) 2004-12-24
JP3797822B2 true JP3797822B2 (ja) 2006-07-19

Family

ID=16169384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18535799A Expired - Fee Related JP3797822B2 (ja) 1999-06-30 1999-06-30 ポリッシング装置

Country Status (2)

Country Link
US (1) US6447385B1 (enExample)
JP (1) JP3797822B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200002928A (ko) * 2017-04-26 2020-01-08 액서스 테크놀로지, 엘엘씨 향상된 처리량과 공정 유연성을 가진 cmp 기계

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6780083B2 (en) * 2002-04-19 2004-08-24 Peter Wolters Cmp-Systeme Gmbh & Co. Kg Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers
US20100041316A1 (en) * 2008-08-14 2010-02-18 Yulin Wang Method for an improved chemical mechanical polishing system
JP5941763B2 (ja) * 2012-06-15 2016-06-29 株式会社荏原製作所 研磨方法
JP6370084B2 (ja) * 2014-04-10 2018-08-08 株式会社荏原製作所 基板処理装置
JP6971676B2 (ja) * 2016-08-29 2021-11-24 株式会社荏原製作所 基板処理装置および基板処理方法
CN107799436B (zh) * 2016-08-29 2023-07-07 株式会社荏原制作所 基板处理装置及基板处理方法
US20210323117A1 (en) * 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
CN114203574A (zh) * 2020-09-17 2022-03-18 长鑫存储技术有限公司 清洗机台以及清洗方法
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5649854A (en) 1994-05-04 1997-07-22 Gill, Jr.; Gerald L. Polishing apparatus with indexing wafer processing stations
US5562524A (en) 1994-05-04 1996-10-08 Gill, Jr.; Gerald L. Polishing apparatus
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5951373A (en) * 1995-10-27 1999-09-14 Applied Materials, Inc. Circumferentially oscillating carousel apparatus for sequentially processing substrates for polishing and cleaning
EP1281476A3 (en) * 1996-05-16 2003-08-13 Ebara Corporation Method for polishing workpieces and apparatus therefor
JP3679871B2 (ja) * 1996-09-04 2005-08-03 株式会社荏原製作所 ポリッシング装置及び搬送ロボット
US6241585B1 (en) * 1999-06-25 2001-06-05 Applied Materials, Inc. Apparatus and method for chemical mechanical polishing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200002928A (ko) * 2017-04-26 2020-01-08 액서스 테크놀로지, 엘엘씨 향상된 처리량과 공정 유연성을 가진 cmp 기계
KR102680584B1 (ko) * 2017-04-26 2024-07-03 액서스 테크놀로지, 엘엘씨 향상된 처리량과 공정 유연성을 가진 cmp 기계

Also Published As

Publication number Publication date
JP2001009713A (ja) 2001-01-16
US6447385B1 (en) 2002-09-10

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