JP3797562B2 - 面屈折入射型受光素子及びその製造方法 - Google Patents
面屈折入射型受光素子及びその製造方法 Download PDFInfo
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- JP3797562B2 JP3797562B2 JP2004151285A JP2004151285A JP3797562B2 JP 3797562 B2 JP3797562 B2 JP 3797562B2 JP 2004151285 A JP2004151285 A JP 2004151285A JP 2004151285 A JP2004151285 A JP 2004151285A JP 3797562 B2 JP3797562 B2 JP 3797562B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 25
- 230000031700 light absorption Effects 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 23
- 230000003287 optical effect Effects 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 8
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 3
- 238000000206 photolithography Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 description 15
- 230000008878 coupling Effects 0.000 description 9
- 238000010168 coupling process Methods 0.000 description 9
- 238000005859 coupling reaction Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
Description
110 半導体基板
120 光吸収層
130 第1ウインドウ層
140 第2ウインドウ層
150 反射防止層(無反射層)
160,170 電極層
180 絶縁層
Claims (15)
- 半導体基板と、
前記半導体基板の上部に形成された光吸収層と、
前記光吸収層の上部に形成され、前記半導体基板とは異なる導電型の半導体からなる第1ウィンドウ層と、
前記第1ウィンドウ層の上部に選択的に形成され、入射光が前記光吸収層へ屈折して入射されるように少なくとも光の入射端面が任意の角度(θ)を有するように斜めに形成された第2ウィンドウ層と、
前記第2ウィンドウ層と少なくとも一部が接触するように形成されると共に、該第2ウインドウ層表面における入射端面を除いた側面及び上面を囲むように形成された第1電極層と、
前記半導体基板の底面に形成された第2電極層と、を備えてなることを特徴とする面屈折入射型受光素子。 - 少なくとも第2ウィンドウ層の入射端面に形成された反射防止層をさらに備える請求項1に記載の面屈折入射型受光素子。
- 第2ウィンドウ層は、側方4面が任意の角度(θ)を有するように斜めに形成されたメサ構造を有する請求項1に記載の面屈折入射型受光素子。
- 第2ウィンドウ層は、選択的エピタキシャル成長法により形成された(111)面を有する請求項1に記載の面屈折入射型受光素子。
- 半導体基板は、InPバッファ層を備えるn−InP半導体基板である請求項1に記載の面屈折入射型受光素子。
- 光吸収層は、吸収しようとする光信号の波長に応じてその波長のバンドギャップ(bandgap)エネルギーより小さい物質で構成される請求項1に記載の面屈折入射型受光素子。
- 光吸収層は、u−InGaAs物質で構成される請求項1に記載の面屈折入射型受光素子。
- 第1ウィンドウ層は、吸収しようとする光信号の波長に応じてその波長のバンドギャップエネルギーより大きい物質で構成される請求項1に記載の面屈折入射型受光素子。
- 第1ウィンドウ層は、p−InP物質で構成される請求項1に記載の面屈折入射型受光素子。
- 半導体基板の上部に光吸収層を形成する過程と、
前記光吸収層の上部に前記半導体基板とは異なる導電型の半導体からなる第1ウィンドウ層を形成する過程と、
入射光が前記光吸収層へ屈折して入射するように少なくとも光の入射端面が任意の角度(θ)を有するように前記第1ウィンドウ層の上部に選択的に第2ウィンドウ層を形成する過程と、
前記第2ウィンドウ層と少なくとも一部が接触するように形成すると共に、該第2ウインドウ層表面における入射端面を除いた側面及び上面を囲むように第1電極層を形成する過程と、
前記半導体基板の底面に第2電極層を形成する過程とを含むことを特徴とする面屈折入射型受光素子の製造方法。 - 少なくとも第2ウィンドウ層の入射端面に反射防止層を形成する過程をさらに含む請求項10に記載の面屈折入射型受光素子の製造方法。
- 第1ウィンドウ層の上部に選択的に第2ウィンドウ層を形成する過程は、
前記第1ウィンドウ層の上部に[110]又は[11−(上バー)0]方向へ選択的エピタキシャル成長マスクを形成する過程と、
前記エピタキシャル成長マスクを用いて露出した前記第1ウィンドウ層の上部にエピタキシャル層を成長させて第2ウィンドウ層を形成する過程とを含む請求項10に記載の面屈折入射型受光素子の製造方法。 - 第1ウィンドウ層の上部に選択的エピタキシャル成長マスクを形成する過程は、フォトリソグラフィー工程を通じて行われる請求項12に記載の面屈折入射型受光素子の製造方法。
- 第2ウィンドウ層は、選択的エピタキシャル成長法により形成された(111)面を有する請求項10に記載の面屈折入射型受光素子の製造方法。
- 前記第1電極層を形成する過程は、金属物質を蒸着することにより行われる請求項10に記載の面屈折入射型受光素子の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR10-2003-0033458A KR100532281B1 (ko) | 2003-05-26 | 2003-05-26 | 면굴절 입사형 수광소자 및 그 제조방법 |
Publications (2)
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JP2004356629A JP2004356629A (ja) | 2004-12-16 |
JP3797562B2 true JP3797562B2 (ja) | 2006-07-19 |
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JP2004151285A Expired - Fee Related JP3797562B2 (ja) | 2003-05-26 | 2004-05-21 | 面屈折入射型受光素子及びその製造方法 |
Country Status (3)
Country | Link |
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US (1) | US20040241897A1 (ja) |
JP (1) | JP3797562B2 (ja) |
KR (1) | KR100532281B1 (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100380596C (zh) | 2003-04-25 | 2008-04-09 | 株式会社半导体能源研究所 | 液滴排出装置、图案的形成方法及半导体装置的制造方法 |
US7655999B2 (en) * | 2006-09-15 | 2010-02-02 | Udt Sensors, Inc. | High density photodiodes |
US7256470B2 (en) * | 2005-03-16 | 2007-08-14 | Udt Sensors, Inc. | Photodiode with controlled current leakage |
US8035183B2 (en) * | 2003-05-05 | 2011-10-11 | Udt Sensors, Inc. | Photodiodes with PN junction on both front and back sides |
US7057254B2 (en) | 2003-05-05 | 2006-06-06 | Udt Sensors, Inc. | Front illuminated back side contact thin wafer detectors |
US7576369B2 (en) | 2005-10-25 | 2009-08-18 | Udt Sensors, Inc. | Deep diffused thin photodiodes |
US7656001B2 (en) * | 2006-11-01 | 2010-02-02 | Udt Sensors, Inc. | Front-side illuminated, back-side contact double-sided PN-junction photodiode arrays |
US8120023B2 (en) | 2006-06-05 | 2012-02-21 | Udt Sensors, Inc. | Low crosstalk, front-side illuminated, back-side contact photodiode array |
US8686529B2 (en) * | 2010-01-19 | 2014-04-01 | Osi Optoelectronics, Inc. | Wavelength sensitive sensor photodiodes |
US7279731B1 (en) | 2006-05-15 | 2007-10-09 | Udt Sensors, Inc. | Edge illuminated photodiodes |
US7709921B2 (en) | 2008-08-27 | 2010-05-04 | Udt Sensors, Inc. | Photodiode and photodiode array with improved performance characteristics |
US8519503B2 (en) | 2006-06-05 | 2013-08-27 | Osi Optoelectronics, Inc. | High speed backside illuminated, front side contact photodiode array |
US7880258B2 (en) * | 2003-05-05 | 2011-02-01 | Udt Sensors, Inc. | Thin wafer detectors with improved radiation damage and crosstalk characteristics |
US7462514B2 (en) * | 2004-03-03 | 2008-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same, liquid crystal television, and EL television |
US20050196710A1 (en) * | 2004-03-04 | 2005-09-08 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming pattern, thin film transistor, display device and method for manufacturing the same, and television apparatus |
US8158517B2 (en) | 2004-06-28 | 2012-04-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing wiring substrate, thin film transistor, display device and television device |
WO2006091741A2 (en) * | 2005-02-23 | 2006-08-31 | Georgia Tech Research Corporation | Edge viewing photodetector |
US9178092B2 (en) | 2006-11-01 | 2015-11-03 | Osi Optoelectronics, Inc. | Front-side illuminated, back-side contact double-sided PN-junction photodiode arrays |
US20100053802A1 (en) * | 2008-08-27 | 2010-03-04 | Masaki Yamashita | Low Power Disk-Drive Motor Driver |
WO2010031011A2 (en) | 2008-09-15 | 2010-03-18 | Udt Sensors, Inc. | Thin active layer fishbone photodiode with a shallow n+ layer and method of manufacturing the same |
US8399909B2 (en) | 2009-05-12 | 2013-03-19 | Osi Optoelectronics, Inc. | Tetra-lateral position sensing detector |
US8912615B2 (en) | 2013-01-24 | 2014-12-16 | Osi Optoelectronics, Inc. | Shallow junction photodiode for detecting short wavelength light |
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US4358676A (en) * | 1980-09-22 | 1982-11-09 | Optical Information Systems, Inc. | High speed edge illumination photodetector |
JP2970815B2 (ja) * | 1990-04-11 | 1999-11-02 | 株式会社東芝 | 半導体受光素子 |
US5054871A (en) * | 1990-07-02 | 1991-10-08 | Bell Communications Research, Inc. | Semiconductor waveguide and impedance-matched detector |
US5345075A (en) * | 1990-11-13 | 1994-09-06 | Sumitomo Electric Industries, Ltd. | Semiconductor photodetector with dielectric shielding |
KR950000522B1 (ko) * | 1991-11-25 | 1995-01-24 | 재단법인 한국전자통신연구소 | 수신용 광전집적 소자 및 그 제조방법 |
JPH07211692A (ja) * | 1994-01-12 | 1995-08-11 | Sumitomo Electric Ind Ltd | InP系化合物半導体の加工方法 |
JPH1022520A (ja) * | 1996-06-28 | 1998-01-23 | Nec Corp | 半導体受光素子及びその製造方法 |
US5721429A (en) * | 1996-07-23 | 1998-02-24 | Hughes Electronics | Self-focusing detector pixel structure having improved sensitivity |
US6218719B1 (en) * | 1998-09-18 | 2001-04-17 | Capella Microsystems, Inc. | Photodetector and device employing the photodetector for converting an optical signal into an electrical signal |
JP4765211B2 (ja) * | 2001-07-06 | 2011-09-07 | 住友電気工業株式会社 | pin型受光素子 |
KR100492980B1 (ko) * | 2003-03-28 | 2005-06-07 | 삼성전자주식회사 | 수직입사 수광소자를 이용한 광학장치 |
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2003
- 2003-05-26 KR KR10-2003-0033458A patent/KR100532281B1/ko not_active IP Right Cessation
- 2003-12-23 US US10/744,621 patent/US20040241897A1/en not_active Abandoned
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2004
- 2004-05-21 JP JP2004151285A patent/JP3797562B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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US20040241897A1 (en) | 2004-12-02 |
KR100532281B1 (ko) | 2005-11-29 |
KR20040101745A (ko) | 2004-12-03 |
JP2004356629A (ja) | 2004-12-16 |
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