JP3788255B2 - Electrode pattern forming method and electro-optic device manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing an electro-optical device, and more particularly to a technique for forming an electrode pattern on a surface of a substrate.
[0002]
[Prior art]
In general, a liquid crystal device, which is a type of electro-optical device, includes a liquid crystal panel in which liquid crystal is sealed between a pair of substrates bonded together with a sealant. A predetermined electrode pattern is formed on the inner surfaces of the pair of substrates. This electrode pattern is made of a transparent conductor such as ITO (indium tin oxide). For example, in the case of a passive matrix type liquid crystal panel, a plurality of strip-shaped electrodes arranged in parallel in a stripe shape are formed. Wirings are integrally connected to the end portions of the electrodes, respectively, and the wiring has a pattern shape drawn to the terminal portions formed at the end portions of the substrate.
[0003]
When the electrode pattern is formed, the following is performed. First, as shown in FIG. 6A, a transparent conductor such as ITO is deposited on the surface of a substrate 10 made of glass or the like by sputtering or the like to form a transparent conductive layer 11, and FIG. As shown in the drawing, a photosensitive resist 12 is applied on the transparent conductive layer 11, and the photosensitive resist 12 is exposed with a predetermined exposure pattern and developed to form a mask 13 shown in FIG. 6C. To do. Next, the portion of the transparent conductive layer 11 exposed on the surface of the substrate 10 is etched through the mask 13 to form an electrode pattern including an electrode 111 having a predetermined shape as shown in FIG.
[0004]
In the electrode pattern formed in this way, for example, when dust is mixed in the photosensitive resist 12, the dust 15 is disposed in a portion to be an opening of the mask 13 as shown in FIG. In this case, since the etching is hindered by the dust 15, the adjacent electrodes 111 are short-circuited via the connecting portion 16 (indicated by a dotted line in FIG. 6D) generated due to defective etching.
[0005]
Therefore, conventionally, a short repair process for correcting a short circuit failure between electrodes has been performed. In this step, first, the mask 13 is removed as shown in FIG. 7A, and then a photosensitive resist 17 is applied on the electrode pattern as shown in FIG. Development is performed to form a repair mask 18 shown in FIG. However, the repair mask 18 covers the electrode 111 and is formed so as to slightly protrude around the electrode 111, and an opening 18 a is provided in a region between the electrodes 111. Then, by performing etching again through the repair mask 18, the connecting portion 16 is removed by etching through the opening 18a, and a gap 19 is formed as shown in FIG. Is resolved.
[0006]
As shown in FIG. 8, the repair mask 18 is configured so that the electrodes 111 and the wiring 112 are not changed in the plane shape of the electrodes 111 provided in the original electrode pattern and the wirings 112 connected thereto. It is formed so as to completely cover the surface and to protrude beyond the electrode 111 and the wiring 112 by a predetermined width around them. In the repair mask 18, an opening 18 a is formed between the electrodes 111 and an opening 18 b is formed between the wirings 112. By etching the regions exposed at these openings 18a and 18b, a short circuit between the electrodes 111 and between the wirings 112 is prevented.
[0007]
[Problems to be solved by the invention]
However, in the conventional method for manufacturing a liquid crystal device, for example, the gap between the electrodes 111 formed with a width of about 100 to 200 μm is about 10 to 30 μm, whereas the width of the wiring 112 is 20 to 60 μm. Further, the gap between the wirings 112 is conversely expanded to about 20 to 60 μm. For this reason, when etching is performed through the repair mask 18, there is a problem that disconnection failure due to side etching of the wiring 112 formed with a narrow width is likely to occur.
[0008]
Therefore, the present invention solves the above-described problems, and the problem is that a technique for manufacturing an electro-optical device that can reduce disconnection failure caused by etching in a short repair process for preventing short-circuit failure of an electrode pattern. Is to provide.
[0009]
[Means for Solving the Problems]
In order to solve the above problems, an electrode pattern forming method according to a first aspect of the present invention is an electrode pattern forming method for forming an electrode pattern including a plurality of pattern portions on a plane, and the electrode pattern is formed after the electrode pattern is formed. Forming a repair mask having a covering portion covering the pattern portion thereon, and a step of etching through the repair mask, wherein the repair mask is applied to the covering portion on the wide pattern portion. The amount of overhanging around the pattern portion in the covering portion on the pattern portion having a small width is larger than the amount of overhanging around the pattern portion.
[0010]
According to the present invention, the repair mask is configured such that the amount of protrusion in the covering portion on the pattern portion having a small width is larger than the amount of protrusion in the covering portion on the pattern portion having a large width. Since side etching with respect to a pattern portion having a small width is less likely to occur, disconnection failure of the pattern portion having a small width can be reduced.
[0011]
The electrode pattern forming method of the second invention is an electrode pattern forming method for forming an electrode pattern including a plurality of pattern portions on a plane, and after the electrode pattern is formed, the pattern portion is covered on the electrode pattern. A step of forming a repair mask having a covering portion, and a step of etching through the repair mask, the repair mask having an opening in a region between the wide pattern portions, and a pattern portion having a small width. It is characterized in that it is configured to cover the area between them.
[0012]
According to the present invention, the repair mask has an opening in the region between the large pattern portions and covers the region between the small pattern portions, thereby reducing the width of the pattern portion during etching. Since side etching does not occur, it is possible to reduce the disconnection failure of the narrow pattern portion.
[0013]
According to a third aspect of the invention, there is provided an electro-optical device manufacturing method comprising an electrode pattern including a plurality of electrodes and a plurality of wirings on a surface of a substrate, wherein an electro-optical material is disposed along the substrate. A step of forming a repair mask having an electrode covering portion covering the electrode and a wiring covering portion covering the wiring on the electrode pattern formed on the surface of the substrate; Etching the surface of the substrate, and the amount of protrusion of the repair mask that protrudes around the wiring in the wiring covering portion is larger than the amount of protrusion that protrudes around the electrode in the electrode covering portion. It is characterized by comprising so that becomes larger.
[0014]
According to a fourth aspect of the invention, there is provided an electro-optical device manufacturing method including an electrode pattern including a plurality of electrodes and a plurality of wirings on a surface of a substrate, and an electro-optical material disposed along the substrate. And a step of forming a repair mask on the electrode pattern formed on the surface of the substrate, and a step of etching the surface of the substrate through the repair mask. It is characterized by having an opening in the region between the electrodes and covering the region between the wirings.
[0015]
In the present invention, it is preferable that the opening is formed so that a covering portion of the repair mask that covers the electrode protrudes from the electrode to the periphery with a predetermined protruding amount.
[0016]
In the present invention, the repair mask is preferably formed so as to cover all the gaps between the wirings.
[0017]
In the present invention, when the width of the wiring is smaller than the width of the electrode, it is particularly effective for preventing disconnection of the wiring.
[0018]
According to a fifth aspect of the present invention, there is provided a method for manufacturing an electro-optical device, comprising: an electrode pattern including a plurality of pattern portions on a surface of a substrate; and an electro-optical material disposed along the substrate. Forming a repair mask having a covering portion covering the pattern portion on the electrode pattern formed on the surface of the substrate; and etching the surface of the substrate through the repair mask. The repair mask is placed around the pattern portion in the covering portion on the pattern portion having a smaller width than the amount of the protrusion over the pattern portion in the covering portion on the pattern portion having a large width. It is characterized by comprising so that the overhang | projection amount may become large.
[0019]
A method for manufacturing an electro-optical device according to a sixth aspect of the present invention is the method for manufacturing an electro-optical device, comprising an electrode pattern including a plurality of pattern portions on a surface of a substrate, wherein an electro-optical material is disposed along the substrate. Forming a repair mask having a covering portion covering the pattern portion on the electrode pattern formed on the surface of the substrate; and etching the surface of the substrate through the repair mask. The repair mask is configured to have an opening in a region between the pattern portions having a large width so as to cover a region between the pattern portions having a small width.
[0020]
In each of the above inventions, the electro-optical device may be a liquid crystal device. In this case, the liquid crystal device includes a liquid crystal disposed between a pair of substrates, and the electrode pattern may be formed on the inner surface of the substrate.
[0021]
In each of the above inventions, the etching is not limited to wet etching, and dry etching such as reactive ion etching may be used.
[0022]
Further, the electro-optical device is not limited to the liquid crystal device described above, and any device using an electro-optical material and a substrate on which an electrode pattern is formed, such as an electroluminescence device, may be used.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of an electrode pattern forming method and an electro-optical device manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings.
[0024]
First, with reference to FIG. 5, a situation assumed by the inventors of the present invention for the above-described disconnection failure will be described.
[0025]
Although the cause of the above disconnection failure is not necessarily clear, for example, when a photosensitive resist 17 is applied as shown in FIG. 5A, a void portion 17a where the photosensitive resist 17 is not attached to the side of the wiring 112. As shown in FIG. 5B, a gap 18a remains on the side of the mask 18 formed by exposing and developing the film. For this reason, it is considered that side etching occurs on the wiring 112 during the etching process, and erosion 112a occurs, causing disconnection.
[0026]
Such a phenomenon seems to occur somewhat in the electrode 111, but it is considered that the electrode 111 has a larger width than the wiring 112, so that it is not substantially a problem.
[0027]
Further, since the gap between the wirings 112 with respect to the width of the wiring 112 is large, when the photosensitive resist 17 is applied by a spin coater, a roller, or the like, the resist that has entered the gap does not easily enter the side of the wiring 112. Since the gap between the electrodes 111 is smaller than the width of the electrode 111, when the photosensitive resist 17 is applied by a spin coater or a roller, the resist firmly enters the gap between the electrodes, and the gap 17a is formed. It may be difficult to be done.
[0028]
It should be noted that the situation shown in FIG. 5 and the description thereof is only virtual and conceptual, and does not represent an actual phenomenon as it is.
[0029]
[First Embodiment]
Next, a first embodiment according to the present invention will be described with reference to FIGS.
[0030]
The electro-optical device manufactured in this embodiment is a liquid crystal device including the liquid crystal panel 100 shown in FIG. This liquid crystal panel 100 is obtained by bonding a substrate 110 made of glass, plastic, or the like and a substrate 120 with a sealant 130 interposed therebetween. The substrate 110 is provided with a substrate overhanging portion 110T that projects outward from the outer shape of the substrate 120.
[0031]
On the inner surface of the substrate 110, a striped electrode pattern is formed by integrally forming a plurality of strip-shaped electrodes 111 made of a transparent conductor such as ITO and a plurality of wirings 112 electrically connected thereto. . On the inner surface of the substrate 120, a striped electrode pattern is formed by integrally forming a plurality of strip-shaped electrodes 121 and a plurality of wirings 122 conductively connected thereto. The wiring 122 is formed on the substrate overhanging portion 110T via the sealing material 130 itself or a separately provided vertical conduction portion (both are constituted by an anisotropic conductor having conductivity only in the substrate thickness direction). Conductive connection is made to each terminal of the terminal pattern 113 formed on the substrate.
[0032]
The electrode 111 and the electrode 121 extend in directions orthogonal to each other within the inner region of the sealant, and a region where the electrode 111 and the electrode 121 intersect in a plane is a pixel. A liquid crystal (not shown) is sealed in an inner region of the sealing material 130 between the substrate 110 and the substrate 120. The liquid crystal is aligned in a predetermined direction by an alignment film (not shown) or the like, and the alignment direction is changed by applying an electric field in a predetermined direction by the electrode 111 and the electrode 121. An optical state is realized.
[0033]
In this embodiment, the electrode pattern is formed on the substrate 110 and the substrate 120 in the same manner as in the conventional method shown in FIGS. 6A to 6D and FIGS. In order to prevent a short circuit between 111 and 121, a repair mask is formed by exposing a photosensitive resist using a short repair photomask, and etching is performed through this repair mask, thereby insulating between electrodes. Is secured. Since these steps are the same as the above-described conventional method, description thereof is omitted.
[0034]
The width of the electrode 111 is 100 to 200 μm, the gap between the electrodes is 10 to 30 μm, the width of the wiring 112 is 20 to 60 μm, and the gap between the wirings is 20 to 60 μm. The wiring 112 is formed to have a width narrower than that of the electrode 111, and is drawn out while gradually narrowing the interval toward the substrate overhanging portion 110T. Further, the thickness of the electrode pattern is about 150 to 300 nm when formed of ITO, for example. However, the thickness of the electrode pattern is appropriately set so that the electrode resistance and the wiring resistance generated according to the length of the electrode and the wiring, the resistivity of the transparent conductor, and the like meet the demands on the driving characteristics.
[0035]
FIG. 1 is a plan perspective view showing the repair mask 118 of the present embodiment in the region I shown in FIG. 3, and FIG. 2 is an enlarged cross-sectional view of a portion indicated by lines AA and BB in FIG. (A) and (b). The repair mask 118 of the present embodiment covers the electrode 111 and the wiring 112 as shown in FIGS. The repair mask 118 is formed so as to cover all the regions immediately above the electrodes 111 and the wirings 112 constituting the electrode pattern, and to protrude around the electrodes 111 and the wirings 112.
[0036]
In a region (gap) between the adjacent electrodes 111, a slit-shaped opening 118a having a predetermined width is formed. The opening 118a is formed at the center of the gap between the adjacent electrodes 111, and as a result, the amount of protrusion from the electrodes 111 on both sides to the periphery of the repair mask 118 is made equal to each other.
[0037]
In this embodiment, no opening is formed in the region where the wiring 112 is formed, and the entire region is covered with the repair mask 118. Therefore, in the repair mask 118, the effect of preventing a short circuit failure with respect to the wiring 112 cannot be obtained, but since the gap between the wirings 112 is much larger than the gap between the electrodes 111, the occurrence rate of the short circuit failure is originally low. Therefore, by using the repair mask 118 of this embodiment, it is possible to completely prevent disconnection failure of the wiring 112 caused by etching using the conventional repair mask 18 having the opening 18b, and between the electrodes 111 having a small gap. The short circuit can be surely prevented.
[0038]
[Second Embodiment]
Next, a second embodiment according to the present invention will be described with reference to FIG. This embodiment relates to electrode patterns respectively formed on the substrates 110 and 120 constituting the liquid crystal panel 100 exactly the same as the first embodiment, and the liquid crystal panel 100 is manufactured by the same method. Only the repair mask 218 is different from the first embodiment.
[0039]
As shown in FIG. 4, the repair mask 218 of this embodiment completely covers the electrode 111 and the wiring 112 as in the first embodiment, and projects from the portion directly above the electrode 111 and the wiring 112 toward the periphery. It has a different shape. The repair mask 218 is provided with a slit-like opening 218a provided in a region between the electrodes 111 and a slit-like opening 218b provided between the wirings. These openings 218a and 218b are formed at the center position of the region between the electrodes 111 and the region between the wirings 112. As a result, the amount of protrusion of the repair mask 218 from the adjacent electrodes 111 to each other is mutually increased. And the projecting amount from the adjacent wirings 112 to the periphery is also equal to each other.
[0040]
The opening 218b extends in the drawing direction of the wiring 112, but is not provided over the entire length of the wiring 112, and is formed so as to disappear when the gap LG between the wirings 112 is reduced to some extent. In addition, the opening 218 b is formed such that the amount LT of the repair mask 218 protruding from the wiring 112 is always larger than the amount ET protruding from the electrode 111. The gap LG between the wirings 112 gradually becomes smaller due to the convergence of the wirings 112 as it advances in the drawing direction, and as a result, the opening 218b disappears at a point where the overhang amount LT has to be a predetermined value or less. is doing. The predetermined value may be the overhang amount ET from the electrode 111 or may be a value larger than the overhang amount ET.
[0041]
In the present embodiment, since the overhang amount LT from the wiring 112 in the repair mask 218 is larger than the overhang amount ET from the electrode 111, the occurrence of disconnection failure of the wiring 112 can be suppressed. At the same time, a short circuit failure of the wiring 112 can be reliably prevented.
[0042]
Here, as described above, the opening 218 b may be formed to extend over the entire length of the wiring 112 without losing the opening 218 b in the middle of drawing the wiring 112. In this case, since the gap EG between the electrodes 111 is usually smaller than the minimum value of the gap LG between the wires 112, the overhang LT is larger than the overhang ET over the entire length of the wire 112. The opening 218 b can be extended along the entire length of the wiring 112.
[0043]
Note that the method of manufacturing the electro-optical device of the present invention is not limited to the illustrated example described above, and various modifications can be made without departing from the scope of the present invention. For example, in the above-described embodiment, only the electrode pattern formed on the inner surface of one substrate 110 in the liquid crystal panel 100 has been described, but the electrode pattern formed on the inner surface of the other substrate 120 is repaired in the same manner as described above. A mask may be used to prevent a short circuit failure, or the above-described method may be used for both the substrate 110 and the substrate 120.
[0044]
Further, the electrode pattern forming method of the above embodiment may be used in an electrode pattern forming step other than that provided in the electro-optical device.
[0045]
【The invention's effect】
As described above, according to the present invention, it is possible to reduce the disconnection failure of the wiring pattern that occurs during etching in the short repair process.
[Brief description of the drawings]
1 is a plan perspective view showing a planar shape of a repair mask used in a first embodiment of an electrode pattern forming method and an electro-optical device manufacturing method according to the present invention in a region I in FIG. 3;
2 is an enlarged sectional view (a) showing a state cut along the line AA in FIG. 1 and an enlarged sectional view (b) showing a state cut along the line BB in FIG. 1;
FIG. 3 is a schematic perspective view schematically showing a schematic structure of a liquid crystal panel formed by each embodiment.
FIG. 4 is a plan perspective view showing a planar shape of a repair mask used in a second embodiment of an electrode pattern forming method and an electro-optical device manufacturing method according to the present invention.
FIGS. 5A to 5C are process diagrams (a) to (c) for explaining a process of occurrence of a disconnection failure of a wiring provided in a conventional electrode pattern.
6A to 6D are process explanatory views (a) to (d) showing a conventional method of forming an electrode pattern.
7A to 7D are process explanatory views (a) to (d) showing a conventional method of forming an electrode pattern.
FIG. 8 is a plan perspective view showing the shape of a conventional repair mask.
[Explanation of symbols]
100 Liquid crystal panel 110, 120 Substrate 111, 121 Electrode 112, 122 Wiring 118, 128 Repair mask 118a, 128a, 128b Opening EG Interelectrode gap ET Overhang amount on electrode in repair mask LG Wiring gap LT Repair mask Overhang on the wiring

Claims (10)

In the electrode pattern forming method of forming an electrode pattern including a plurality of pattern portions on a plane,
After forming the electrode pattern, forming a repair mask having a covering portion covering the pattern portion on the electrode pattern, and etching through the repair mask,
A tension projecting around the pattern portion in the covering portion on the pattern portion having a smaller width than the amount of the projecting projection of the repair mask around the pattern portion in the covering portion on the pattern portion having a large width. A method of forming an electrode pattern, characterized in that the output amount is increased. In the electrode pattern forming method of forming an electrode pattern including a plurality of pattern portions on a plane,
After forming the electrode pattern, forming a repair mask having a covering portion covering the pattern portion on the electrode pattern, and etching through the repair mask,
An electrode pattern forming method, wherein the repair mask is configured to have an opening in a region between wide pattern portions and cover a region between small pattern portions. In an electro-optical device manufacturing method comprising an electrode pattern including a plurality of electrodes and a plurality of wirings on a surface of a substrate, wherein an electro-optical material is disposed along the substrate.
Forming a repair mask having an electrode covering portion covering the electrode and a wiring covering portion covering the wiring on the electrode pattern formed on the surface of the substrate; and through the repair mask, Etching the surface, and
The repair mask is configured such that the amount of protrusion that protrudes around the wiring in the wiring covering portion is larger than the amount of protrusion that protrudes around the electrode in the electrode covering portion. A method for manufacturing an electro-optical device. In an electro-optical device manufacturing method comprising an electrode pattern including a plurality of electrodes and a plurality of wirings on a surface of a substrate, wherein an electro-optical material is disposed along the substrate.
Forming a repair mask on the electrode pattern formed on the surface of the substrate; and etching the surface of the substrate through the repair mask;
The repair mask is configured to have an opening in a region between the electrodes and cover a region between the wirings. 5. The electro-optical device according to claim 4, wherein the opening is formed so that a covering portion of the repair mask that covers the electrode protrudes from the electrode to the periphery with a predetermined protrusion amount. Method. 6. The method of manufacturing an electro-optical device according to claim 4, wherein the repair mask is formed so as to cover all gaps between the wirings. The method of manufacturing an electro-optical device according to claim 3, wherein a width of the wiring is smaller than a width of the electrode. In an electro-optical device manufacturing method comprising an electrode pattern including a plurality of pattern portions on a surface of a substrate, and an electro-optical material is disposed along the substrate,
Forming a repair mask having a covering portion covering the pattern portion on the electrode pattern formed on the surface of the substrate; and etching the surface of the substrate through the repair mask. And
The repair mask protrudes around the pattern portion in the covering portion on the pattern portion having a smaller width than the amount of protrusion extending around the pattern portion in the covering portion on the pattern portion having a large width. A method for manufacturing an electro-optical device, wherein the amount of overhang is large. In an electro-optical device manufacturing method comprising an electrode pattern including a plurality of pattern portions on a surface of a substrate, and an electro-optical material is disposed along the substrate,
Forming a repair mask having a covering portion covering the pattern portion on the electrode pattern formed on the surface of the substrate; and etching the surface of the substrate through the repair mask. And
The repair mask is configured to have an opening in a region between the pattern portions having a large width so as to cover a region between the pattern portions having a small width. The method of manufacturing an electro-optical device according to claim 3, wherein the electro-optical device is a liquid crystal device.

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